A

Presentation
On
3D ICs
Presented in partial fulfillment of Bachelors Degree in Technology
Rajasthan Technical University
Kota

Session: 2011-2012
PRESENTED TO:
PRESENTED BY:
Garima Mathur
HOD, Deptt. of ECE

Dinesh Kumar
(EC08033)

Department of Electronics and Communication

CONTENTS
INTRODUCTION
IDEA FOR 3D IC
LIMITED PERFORMANCE OF 3D IC
3D ARCHITECTURE
MANUFACTURING TECHNOLOGY OF 3D ICs
ADVANTAGES OF 3D ARCHITECTURE
PERFORMANCE CHARACTERISTICS
CONCERNS IN 3D CIRCUITS
PRESENT SCENARIO IN 3D IC INDUSTRY
CONCLUSION

INTRODUCTION

In electronics, a three-dimensional integrated circuit

is a chip in which two or more layers of active electronic
components are integrated both vertically and
horizontally into a single circuit.
In contrast, a 3D IC is a single chip in which all
components on the layers communicate using on-chip
signaling, whether vertically or horizontally.

IDEA FOR 3D IC
The large growth of computer and information
technology industry is depending on VLSI circuits with
increasing functionality and performance at minimum
cost and power dissipation and 2D ICs generate
various gate delays and interconnection delay.
So to reduce these delays and total power
consumption,
3D IC technology is introduced.
Intel introduced 80 core chip in 2007 which run on the

frequency of 1.4GHz.

LIMITED PERFORMANCE OF 2D ICs

As we try to increase the performance and
efficiency of chip, the complexity of chip
design increases and this requires more
and more transistors. So the final size of
the circuit and delays increases.
The losses increases with large
interconnection because the capacitance
and resistances are generated in between
the clad and copper.

3D IC ARCHITECTURE

3D IC is a concept that can significantly : Improve interconnect performance,

Increase transistor packing density,
Reduce chip area
Power dissipation
In 3D design structure the entire chip Si
is divided by number of layers of oxide and
metal, to form transistors.

MANUFACTURING TECHNOLOGY OF 3D ICs

There are four ways to built 3D ICs :1. Monolithic

2. Wafer on wafer
3. Die on wafer
4. Die on die

1. Monolithic
Electronic components and their
connections (wiring) are built in layers on a
single semiconductor wafer, which is then
diced into 3D ICs. There is only one
substrate, hence no need for aligning,
thinning, bonding, or through-silicon vias.

2. Wafer on wafer
Electronic components are built on two or
more semiconductor wafers, which are then
aligned, bonded, and diced into 3D ICs.

3. Die on wafer
Electronic components are built on two
semiconductor wafers. One wafer is diced
aligned and bonded onto die sites of the
second wafer.

4.Die on die
Electronic components are built on multiple
dice, which are then aligned and bonded.
One advantage of die-on-die is that each
component die can be tested first, so that
one bad die does not ruin an entire stack

AVANTAGES OF 3D ARCHITECTURE
3D integration can reduce the wiring,

thereby reducing the capacitances, power

dissipation and chip area improves
performance.
Digital and analog circuits can be formed
with better noise performance.
It more cost effective then 2D integration.

PERFORMANCE CHARACTERISTICS
1. TIMING
2. ENERGY

With shorter interconnects in 3D ICs,

both switching energy and cycle time
are expected to be reduced

1. TIMING
The graph shows the

results of a reduction
in wire length due to
3D routing.
Reduction in the

interconnect lengths
reduces RC delays
and increase chip
timing performance

2. ENERGY PERFOMANCE
The graph shows

the reduction in a
normalized
energy
consumption with
number of wire
layers.

CONCERNS IN 3D CIRCUIT
Thermal Issues in 3D-circuits
Reliability Issues

PRESENT SCENARIO IN 3D IC INDUSTRY

Many companies like MIT (USA), IBM are
doing research on 3D IC technology and
they are going to introduce cheaper chips
for certain applications, like memory used
in digital cameras, cell phones, handheld
gaming devices etc.
The original cost will be 10 times lesser than
the current ones.

CONCLUSION
3D ICs will be the first of a new generation
of dense, inexpensive chips having less
delay and interconnection losses that will
replace the conventional storage and
recording media.

QUERIES???