IPC/JEDEC

INDUSTRY MAPPING
Agenda Item 6.2

4th JIC meeting Regensburg, Germany June 17, 2003

Minimum IPC Standards Tool Kit

Design
2221 Generic
2222 Rigid
2223 Flex
2224 PCMCIA
2225 MCM-L
2226 HDI
2227 Discrete wiring

Materials
SM-840 Solder mask
FD-2231 Flex material
FD-2232 Coated material
MF-150 Copper foil
CF-148 Coated copper foil
CC-830 Conformal coating
SM-817 Adhesive
4101 Rigid materials
4104 HDI materials

Minimum Tool Kit

Performance
6011 Generic
6012 Rigid
6013 Flex
6014 PCMCIA
6015 MCM-L
6016 HDI
6017 Discrete wiring

Component Mounting
7071 Generic
7072 Through-hole
7073 Standard SMT
7074 Fine pitch
7075 Array product
7076 Chip scale
7077 Chip wire bonding
7078 Flip chip

Workmanship
A-600 Printed board
A-610 Printed board assembly
R-700 Modification and repair

Quality Assessment
TM-650 Test methods
SPC 9190
9191 Generic
9192 Base materials
9193Board
9194 Assembly

Attachment
J-STD-001 Soldering requirements
J-STD-002 Solderability testing of parts
J-STD-003 Solderability of boards
J-STD-004 Solder Flux
J-STD-005 Solder paste
J-STD-006 Solid solder

IPC STANDARDS MAP

IPC STANDARDS MAP (cont.)

ASSEMBLY
J-STD-001
Soldering Electrical and Electronic Assemblies

IPC-HDBK-001
Handbook & Guide to Supplement J-STD-001

IPC-9261
In-Process DPMO and Estimated Yield for PWAs

IPC-7912
Calculation of DPMO & Manufacturing Indices for Printed
Board Assemblies

ACCEPTANCE
IPC-DRM-40
Through-Hole Solder Joint Evaluation Desk Reference Manual

IPC-A-610
Acceptability of Electronic Assemblies

IPC-9191
General Guidelines for Implementation of Statistical Process
Control (SPC)

IPC-DRM-SMT
Surface Mount Solder Joint Evaluation Desk Reference Manual

SOLDERABILITY
IPC-WP-001
Soldering Capability White Paper Report

J-STD-002
Solderability Tests for Component Leads, Terminations, Lugs,
Terminals and Wires

J-STD-003
Solderability Tests for Printed Boards

IPC-WP-005
PWB Surface Finishes

IPC-TR-461
Solderability Evaluation of Thick & Thin Fused Coatings

IPC-TR-462
Solderability Evaluation of Printed Boards with Protective
Coatings Over Long-Term Storage

SOLDERABILITY (cont.)
IPC-TR-464
Accelerated Aging for Solderability Evaluations
IPC-TR-465-1
Round Robin Test on Steam Ager Temperature Control Stability
IPC-TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability
Test Results
IPC-TR-465-3
Evaluation of Steam Aging on Alternative Finishes, Phase 11A
IPC-TR-466
Wetting Balance Standard Weight Comparison Test

ADVANCED

IPC-TR-001
An Introduction to Tape Automated Bonding Fine Pitch Technology
IPC-WP-003
Chip Mounting Technology
J-STD-012
Implementation of Flip Chip and Chip Scale Technology
J-STD-013
Implementation of Ball Grid Array & Other High Density Technology
J-STD-026
Semiconductor Design Standard for Flip Chip Applications
J-STD-028
Performance Standard for Construction of Flip Chip and Chip Scale
Bumps
IPC-SM-784
Guidelines for Chip-on-Board Technology Implementation
IPC-MC-790
Guidelines for Multichip Module Technology Utilization

WIRE HARNESS
IPC-WHMA-A-620
Requirements & Acceptance for Cable & Wire
Harness Assemblies

OPTOELECTRONICS
IPC-0040
Optoelectronic Assembly and Packaging Technology

ASSEMBLY SUPPORT
SMC-WP-002
Solderability Tests for Component Leads, Terminations, Lugs,
Terminals and Wires

IPC-DRM-18
Component Identification Desk Reference Manual

IPC-DW-426
Specification for Assembly of Discrete Wiring

IPC-TR-581
IPC Phase III Controlled Atmosphere Soldering Study

IPC-TA-722
Technology Assessment Handbook on Soldering

IPC-TA-723
Technology Assessment Handbook on Surface Mounting

IPC-CM-770
Component Mounting Guidelines for Printed Boards

ASSEMBLY SUPPORT(cont.)
IPC-SM-780
Component Packaging and Interconnecting with Emphasis on
Surface Mounting

IPC-SM-785
Guidelines for Accelerated Reliability Testing of Surface Mount
Attachments

IPC-S-816
SMT Process Guideline & Checklist

IPC-AJ-820
Assembly & Joining Handbook

IPC-TP-1115
Selection and Implementation Strategy for A Low-Residue NoClean Process

IPC-1720
Assembly Qualification Profile

ASSEMBLY SUPPORT(cont.)

IPC-7095
Design and Assembly Process Implementation for BGA's

IPC-7525
Stencil Design Guidelines

IPC-7530
Guidelines for Temperature Profiling for Mass Soldering (Reflow &
Wave) Processes

IPC-7711
Rework of Electronic Assemblies

IPC-7721
Repair and Modification of Printed Boards and Electronic Assemblies

IPC-9701
Performance Test Methods and Qualification Requirements for Surface Mount
Solder Attachments

IPC-9851
Equipment Interface Specification

ASSEMBLY MATERIALS
FLUX/SOLDER
J-STD-004
Requirements for Soldering Fluxes

J-STD-005
Requirements for Soldering Pastes

J-STD-006
Requirements for Electronic Grade Solder Alloys and Fluxed
and Non-Fluxed Solid Solders

IPC-TP-1043
IPC Cleaning and Cleanliness Test Program Phase 3 Water
Soluble Fluxes Part 1

IPC-TP-1044
IPC Cleaning and Cleanliness Test Program Phase 3 Water
Soluble Fluxes Part 2

ASSEMBLY MATERIALS (cont.)

ADHESIVES
IPC-SM-817
General Requirements for Dielectric Surface Mounting
Adhesives

IPC-CA-821
General Requirements for Thermally Conductive Adhesives

IPC-3406
Guidelines for Electrically Conductive Surface Mount
Adhesives

IPC-3408
General Requirements for Anisotropically Conductive
Adhesives Films

ASSEMBLY MATERIALS (cont.)

COAT/MASK
IPC-CC-830
Qualification and Performance of Electrical Insulating
Compound for Printed Wiring Assemblies

IPC-HDBK-830
Guidelines for Design, Selection and Application of
Conformal Coatings

IPC-SM-840
Qualification and Performance of Permanent Solder
Mask

PCB / ACCEPTANCE
IPC-DW-425A
Design and End Product Requirements for Discrete Wiring
Boards

IPC-QE-605
Printed Board Quality Evaluation Handbook

IPC-TF-870
Qualification and Performance of Polymer Thick Film Printed
Boards

IPC-MC-960
Qualification and Performance Specification for Mass
Lamination Panels for Multilayer Printed Boards

IPC-1710
OEM Standard for Printed Board Manufacturers' Qualification
Profile (MQP)

PCB / ACCEPTANCE (cont.)

IPC-6011
Generic Performance Specification for Printed Boards

IPC-6012
Qualification and Performance Specification for Rigid Printed
Boards

IPC-6013
Qualification & Performance Specification for Flexible Printed
Boards

IPC-6015
Qualification & Performance Specification for Organic Multichip
Module Mounting and Interconnecting Structures

IPC-6016
Qualification & Performance Specification for High Density
Interconnect (HDI) Layers or Boards

IPC-6018
Microwave End Product Board Inspection and Test

PCB / ACCEPTANCE (cont.)

IPC/JPCA-6202
Performance Guide Manual for Single- and Double-Sided
Flexible Printed Wiring Boards

IPC/JPCA-6801
Terms & Definitions, Test Methods, and Design Examples for
Build-Up/High Density Interconnect (HDI) Printed Wiring
Boards

IPC-9191
General Guidelines for Implementation of Statistical Process
Control (SPC)

IPC-9252
Guidelines and Requirements for Electrical Testing of
Unpopulated Printed Boards

IPC-A-600
Acceptability of Printed Boards

COMPONENTS
J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices
J-STD-032
Performance Standard for Ball Grid Array Balls
J-STD-033
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
J-STD-035
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic
Components

COMPONENTS (cont.)
IPC-9501
PWB Assembly Process Simulation for Evaluation of Electronic
Components

IPC-9502
PWB Assembly Soldering Process Guideline for Electronic
Components

IPC-9503
Moisture Sensitivity Classification for Non-IC Components

IPC-9504
Assembly Process Simulation for Evaluation of Non-IC
Components (Preconditioning Non-IC Components)

CLEANING/ CLEANLINESS
IPC-SC-60
Post Solder Solvent Cleaning Handbook

IPC-SA-61
Post Solder Semi-Aqueous Cleaning Handbook

IPC-AC-62
Aqueous Post Solder Cleaning Handbook

IPC-CH-65
Guidelines for Cleaning of Printed Boards & Assemblies

IPC-TR-468
Factors Affecting Insulation Resistance Performance of Printed
Boards

IPC-TR-476
Electrochemical Migration: Electrically Induced Failures in
Printed Wiring Assemblies

CLEANING/ CLEANLINESS (cont.)

IPC-TR-580
Cleaning and Cleanliness Test Program Phase 1 Test Results

IPC-TR-581
IPC Phase III Controlled Atmosphere Soldering Study

IPC-TR-582
Cleaning & Cleanliness Test Program for: Phase 3-Low Solids
Fluxes & Pastes Processed in Ambient Air

IPC-TR-583
An In-Depth Look At Ionic Cleanliness Testing

IPC-SM-839
Pre & Post Solder Mask Application Cleaning Guidelines

IPC-9201
Surface Insulation Resistance Handbook

LAMINATE
FLEX
IPC-FC-234
PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed
Circuits

IPC-4202
Flexible Base Dielectrics for Use in Flexible Printed Circuitry

IPC-4203
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible
Printed Circuitry and Flexible Adhesive Bonding Films

IPC-4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible
Printed Circuitry

IPC-4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for
Printed Circuit Boards

LAMINATE (cont.)
RIGID
IPC-4101
Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-4103
Specification for Base Materials for High Speed/High Frequency Applications

IPC-1730
Laminator Qualification Profile

HDI
IPC-DD-135
Qualification Testing for Deposited Organic Interlayer Dielectric Materials
for Multichip Modules

IPC-4104
Specification for High Density Interconnect (HDI) and Microvia Materials

IPC-SM-840
Qualification and Performance of Permanent Solder Mask

LAMINATE (cont.)
FOIL

IPC-CF-148
Resin Coated Metal for Printed Boards

IPC-CF-152
Composite Metallic Materials Specification for Printed Wiring
Boards

IPC-1731
Strategic Raw Materials Supplier Qualification Profile

IPC-4562
Metal Foil for Printed Wiring Applications

FABRICATION
IPC-DR-570
General Specification for 1/8 inch Diameter Shank Carbide
Drills for Printed Boards

IPC-DR-572
Drilling Guidelines for Printed Boards

IPC-OI-645
Standard for Visual Optical Inspection Aids

IPC-TA-724
Technology Assessment Series on Clean Rooms

IPC-PE-740
Troubleshooting for Printed Board Manufacture and Assembly

REINFORCEMENT
IPC-4412
Specification for Finished Fabric Woven from "E" Glass for
Printed Boards

IPC-SG-141
Specification for Finished Fabric Woven from "S" Glass for
Printed Boards

IPC-A-142
Specification for Finished Fabric Woven from Aramid for Printed
Boards

IPC-QF-143
Specification for Finished Fabric Woven from Quartz (Pure Fused
Silica) for Printed Boards

IPC-1731
Strategic Raw Materials Supplier Qualification Profile

REINFORCEMENT (cont.)
IPC-4110
Specification and Characterization Methods for Nonwoven
Cellulose Based Paper for Printed Boards

IPC-4121
Guidelines for Selecting Core Construction for Multilayer Printed
Wiring Board Applications

IPC-4130
Specification & Characterization Methods for Nonwoven "E" Glass
Mat

IPC-4411
Specification and Characterization Methods for Non-Woven ParaAramid Reinforcement

ASSEMBLY
IPC-D-279
Design Guidelines for Reliable Surface Mount Technology
Printed Board Assemblies

IPC-D-326
Information Requirements for Manufacturing Electronic
Assemblies

IPC-C-406
Design & Application Guidelines for Surface Mount Applications
Connectors

IPC-C-408
Design & Application Guidelines for the Use of Solderless
Surface Mount Connectors

IPC-SM-782
Surface Mount Design & Land Pattern Standard

INTERFACES
IPC-D-310
Guidelines for Phototool Generation and Measurement Techniques

IPC-A-311
Process Controls for Phototool Generation and Use

IPC-D-350
Printed Board Description in Digital Form

IPC-D-351
Printed Board Drawings in Digital Form

IPC-D-356
Bare Substrate Electrical Test Data Format

IPC-D-390
Automated Design Guidelines

INTERFACES
IPC-2511
Generic Requirements for Implementation of Product Mfg.
Description Data & Transfer Methodology

IPC-2531
Standard Recipe File Format Specification

IPC-2541
Generic Requirements for Electronics Manufacturing Shop Floor
Equipment Communication (CAMX)

IPC-2571
Generic Requirements for Electronics Mfg. Supply Chain
Communication - Product Data eXchange (PDX)

PCB
SMC-WP-004
Design for Success

IPC-2252
Design Guide for RF/Microwave Circuit Boards

IPC-D-317
Design Guidelines for Electronic Packaging Utilizing High
Speed Techniques

IPC-D-859
Design Standard for Thick Film Multilayer Hybrid Circuits

IPC-1902
Grid Systems for Printed Circuits

IPC-2141
Controlled Impedance Circuit Boards & High Speed Logic
Design

PCB (cont.)

IPC-2221
Generic Standard on Printed Board Design

IPC-2222
Sectional Standard on Rigid Organic Printed Boards

IPC-2223
Sectional Design Standard for Flexible Printed Boards

IPC-2224
Sectional Standard of Design of PWB for PC Cards

IPC-2225
Sectional Design Standard for Organic Multichip Modules (MCM-L) and
MCM-L Assemblies

IPC-2315
Design Guide for High Density Interconnects & Microvias

IPC-2615
Printed Board Dimensions and Tolerances

JEDEC: IEC PAS ACTIVITY

EIA/JESD22-B102C
47/1446/PAS IEC 62173 Ed. 1:
Solderability test method

JESD22-B106-B
47/1447/PAS: IEC 60749-15, Ed. 1:
Resistance to soldering temperature for through-hole mounted devices

EIA/JESD-22-B107-A
47/1448/PAS: IEC 62175, Ed. 1:
Marking Permanency
47/1629/MCR: Published as part of IEC 60749-9, Ed. 1

EIA/JESD22-B116
47/1449/PAS: IEC 62176, Ed. 1:
Wire bond shear test method
47/1482A/RVD Withdrawal of 47/1449/PAS

JEDEC: IEC PAS ACTIVITY

JESD22-A110B-B
47/1450/PAS: IEC 62177, Ed. 1:
Highly-accelerated temperature and humidity stress test (HAST)
47/1627/MCR Published as part of IEC 60749-4, Ed. 1

JESD22-A104-A
47/1451/PAS: IEC 62178, Ed. 1:
Temperature cycling

EIA/JESD22-A114-A
47/1452/PAS: IEC 62179, Ed. 1:
Electrostatic discharge (ESD) sensitivity testing human body model (HBM)

EIA/JESD22-A115-A
47/1453/PAS: IEC 62180, Ed. 1:
Electrostatic discharge (ESD) sensitivity testing machine model (MM)

JEDEC: IEC PAS ACTIVITY

JESD78
47/1454/PAS: IEC 62181, Ed. 1:
IC latch-up test

JESD22-A113-B
47/1455/PAS: IEC 62182, Ed. 1:
Preconditioning of nonhermetic surface mount devices prior to reliability testing

JESD22-A107-A
47/1456/PAS: IEC 62183, Ed. 1:
Salt atmosphere
47/1633/MCR: Published as part of IEC 60749-13, Ed. 1

JESD22-B105-B
47/1457/PAS: IEC 62184, Ed. 1:
Lead integrity

JEDEC: IEC PAS ACTIVITY

JESD22-A106-A
47/1458/PAS: IEC 62185, Ed. 1:
Thermal shock
47/1631/MCR: Published as part of IEC 60749-11, Ed. 1

JESD22-B104-A
47/1459/PAS: IEC 62186, Ed. 1:
Mechanical shock
47/1630/MCR: Published as part of IEC 60749-10. Ed. 1

JESD22-B103-A
47/1460/PAS: IEC 62187, Ed. 1:
A vibration, variable frequency
47/1632/MCR: Published as part of IEC 60749-12, Ed. 1

JESD22-A101-B
47/1461/PAS: IEC 62161, Ed.1:
Test method A101-B Steady state temperature humidity bias life test
47/1680/MCR: Published as IEC 60749-5, Ed. 1

JEDEC: IEC PAS ACTIVITY

JESD22-C101
47/1462/PAS: IEC 60749-28, Ed. 1:
Test method C101 Electrostatic Discharge (ESD) Sensitivity Testing
Charged device model (CDM)

JESD22-B101
47/1463/PAS: IEC 62163, Ed. 1:
Test method B101 External Visual
47/1626/MCR: Published as part of IEC 60749-3, Ed. 1

JEP118
47/1464/PAS: IEC 62164, Ed. 1:
Guidelines for GaAs MMIC and FET life testing

JEP110
47/1465/PAS: IEC 62165, Ed. 1:
Guidelines for the measurement of thermal resistance of GaAs FETs

EIA/JESD46-A
47/1466/PAS: IEC 62166, Ed. 1:
Guidelines for user notification of product/process changes by semiconductor
suppliers

JEDEC: IEC PAS ACTIVITY

EIA/JESD48
47/1467/PAS: IEC 62167, Ed. 1:
Product discontinuance

JEP 113-B
47/1468/PAS: IEC 62168, Ed. 1:
Symbols and labels for moisture-sensitive devices

IPC/JEDEC J-STD-033
47/1469/PAS: IEC 62169, Ed. 1:
Standard for handling, packing, shipping and use of moisture/reflow sensitive
surface mount devices

EIA/JESD59
47/1470/PAS: IEC 62170, Ed. 1:
Bond wire modeling standard

JEP114
47/1471/PAS: IEC 62171, Ed. 1:
Guidelines for particle impact noise detection (PIND) testing, operator training
and certification
47/1681/MCR: Published as 60749-16, Ed. 1

JEDEC: IEC PAS ACTIVITY

JESD22-A102-B
47/1472/PAS: IEC 62172, Ed. 1:
Accelerated moisture resistance Unbiased autoclave

JESD22-A108-A
47/1474/PAS: IEC 62189, Ed. 1:
Bias Life

J-STD-020A (IPC/JEDEC)
47/1475/PAS: IEC 62190, Ed. 1:
Moisture/reflow sensitivity classification for nonhermetic solid state surface
mount devices
47/1592/MCR: Publication Withdrawn Topic is now covered by IEC 60749,
Amendment 2, Ed. 2 (2001-10) and IEC 60749, Ed. 2.2 (2001-12).

J-STD-035
47/1476/PAS: IEC 62191, Ed. 1:
Acoustic microscopy for nonhermetic encapsulated electronic components
47/1593/MCR: Publication Withdrawn Topic is now covered by IEC 60749,
Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)

JEDEC: IEC PAS ACTIVITY

JEP119
47/1506/PAS: IEC 62201, Ed. 1:
A procedure for executing sweat

EIA/JEP122
47/1507/PAS: IEC 62202, Ed. 1:
Failure mechanisms and models for silicon semiconductor devices

EIA/JEP128
47/1508/PAS: IEC 62203, Ed. 1:
Guide for standard probe pad sizes and layouts for wafer-level electrical
testing

EIA/JESD33-A
47/1509/PAS: IEC 62204, Ed. 1:
Measuring and using the temperature coefficient of resistance to determine the
temperature of a metallization line

JESD-A103-A
47/1513/PAS: IEC 60749-6 Ed. 1:

High temperature storage life

47/1628/MCR: Published as part of IEC 60749-6, Ed. 1

JEDEC: IEC PAS ACTIVITY

EIA/JESD22-A105-B
47/1514/PAS: IEC 62206, Ed. 1:
Test Method A105-B Power and temperature cycling

JESD22-A109
47/1515/PAS: IEC 62207, Ed. 1:
Test Method A109 Hermeticity
47/1594/MCR: Publication Withdrawn Topic is now covered by IEC 60749,
Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)

JESD22-A120
47/1595/PAS: IEC 62307
Test Method for the Measurement of Moisture Diffusivity and Water Solubility in
organic Materials Used in Integrated Circuits

JESD22-A118
47/1635/PAS: IEC PAS 62336:
Accelerated Moisture Resistance Unbiased HAST

IPC: IEC PAS ACTIVITY

IPC-EIA/J-STD-012
IEC/PAS 62084
Flip chip and chip scale technology implementation

IPC-EIA/J-STD-013
IEC/PAS 62085
Implementation of ball grid array and other high density technology

IPC-2511
IEC/PAS 62119
Generic requirements for implementation of product manufacturing description
data and transfer methodology

IPC-6202
IEC/PAS 62123 Ed. 1.0
Performance guide Manual for single- and double-sided flexible printed wiring
boards

IPC-4130
IEC/PAS 62212
Specification and characterization methods for nonwoven "E" glass mat

IPC: IEC PAS ACTIVITY

IPC-4411
IEC/PAS 62213
Specification and characterization methods for nonwoven paraaramid reinforcement

IPC-6011
IEC/PAS 62214
Generic performance specification for printed boards

IPC-1710
IEC/PAS 62158 Ed. 1.0
Manufacturers qualification profile (MQP)

IPC-1720
IEC/PAS 62159 Ed. 1.0
Assembly qualification profile (AQP)

IPC: IEC PAS ACTIVITY

IPC-1730
IEC/PAS 62160 Ed. 1.0
Laminator qualification profile

IPC-6013 (with amendment)

IEC/PAS 62249 /ED, 1,9
Qualification and performance specification for flexible printed boards

IPC-6012 (with amendment)

IEC/PAS 62250
Qualification and performance specification for rigid printed boards