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15D100021
CONTENTS
BONDING IN METALS
Metals easily give away their outer-most electrons. So in a
metallic crystal with many such atoms, electrons move freely
over the entire crystal.
Thus all the metals together form a large molecular orbital.
Every metal atom is held in its position by the attractions
between the metal nucleus and delocalized electron cloud.
Due this delocalization metals are good conductors of heat and
electricity.
BONDING IN METALS
As the number of valence electrons increase, more electrons
are available for sharing and thus stronger bonds are formed.
This explains the higher melting points of d-block elements
compared to s-block elements.
Such type of bonding is called metallic bonding and is
responsible for the characteristics of metal like high strength,
high melting points, high thermal and electrical conductivities
etc.
CRYSTAL STRUCTURE OF
METALS
Bonding in metals in metallic. This is non-directional in
nature.
Thus metals have very minimum restrictions on number of
neighbours and their positions.
This enables close packing in metals.
This in turn is responsible for their high densities and
strength.
CRYSTAL STRUCTURE OF
METALS
Most of the metals are found in the following lattices :
FCC (face-centered cubic) also called CCP (cubic closed
packing)
BCC (body centered cubic)
HCP (hexagonal closed packing)
We will be looking at their general properties.
UNIT CELL-SOME
PARAMETERS
A unit cell is an element which when repeated in an
ordered way in 3 dimensions gives the entire lattice.
Packing factor (pf) or atomic packing factor (apf):
It is defined as
(volume of metals in the unit cell)/ (volume of the
unit cell)
UNIT CELL-SOME
PARAMETERS
Co-ordination number: It is the number of nearest
neighbour or number of atoms touching a given atom.
This number is same for all the atoms in a unit cell.
The radius of atom is generally represented by R. If the
lattice is cubic then the edge length is denoted by a.
FCC or CCP
In this lattice, the following lattice points of a
cube are occupied by metal atoms:
1. All corners of the cube
2. All centers of the (6) faces of the cube.
Examples: copper, gold , lead , aluminium ,
nickel.
FCC or CCP-Properties
Consider the face diagonal, Length of face diagonal=1.4142x(a). But
BCC
In a BCC lattice the following lattice points are occupied
by atoms of metals:
1. All corners of the unit cell
2. The midpoint of body-diagonal ( the center of unit cell)
BCC-Properties
Consider the length of body diagonal. Write it in terms of a
and R. We get the following relation:
HCP
HCP can be visualized by considering 3 layers of atoms.
The bottom and top layers are directly above each other.
The middle layer is placed in complementary positions to
bottom layer.
HCP-PROPERTIES
Inferring to the above figure, a must be equal to 2R. The
relation between a and c in given by c=1.633a.
Packing factor for HCP is same as that of CCP-0.74
Co-ordination number is also the same-12
Examples: cadmium , magnesium , titanium , zinc , cobalt
etc.
BRAVAIS LATTICES
Theoretically although there are many kinds of lattices possible,
practically only a few of them are stable in nature.
The set of lattices which are possible are called Bravais lattices.
A 3 co-ordinate axis system is set-up such that
the axes are along the edges of the parallelepiped.
This parallelepiped will be called the unit-cell.
A unit cell is the unit which when repeated in 3-dimensions in an
ordered way gives the entire structure of lattice.
LATTICE SYSTEMS-1
TRICLINIC:
abc; ,,90
degrees
Eg: microcline
MONOCLINIC:
abc; ==90
degrees and
90 degrees.
Eg: orthoclase.
LATTICE SYSTEMS-2
Orthorhombic: ,,=90 degrees, abc.
Eg : olivine, aragonite.
Tetragonal
,,=90 degrees,
a=bc.
Eg: wulfenite.
LATTICE
SYSTEMS-3
Rhombohedral
a=b=c, == 90 degrees.
Eg: quartz, dolomite.
LATTICE SYSTEMS-4
Hexagonal
==90, =120
degrees , a=bc.
Eg: beryl
Cubic
Eg: FeS2.
HCP
Packing factor=0.74
Co-ordination
number=12
FCC
Packing factor=0.74
Co-ordination
number=12
BCC
Packing
factor=0.68
Co-ordination
number=8
STACKING SEQUENCE
The order in which individual layers should be arranged
STACKING IN FCC
FCC can be formed by stacking 3 different layers on one
other in same sequence.
These pictures show the arrangement of different layers.
Green-atoms: layer A
blue-atoms: layer B
yellow-atoms: layer C
STACKING IN FCC
These pictures depict the visualization of the unit cell in
the layers. The layers are aligned along the body diagonal.
STACKING IN HCP
HCP follows ABAB type.
EFFECT OF TEMPERATURE ON
MODULI
Increasing the temperature in general decreases the youngs
modulus.
This is because the atoms start vibrating at higher frequencies
causing decrease in bond strength.
The studying this variation is important because:
Modulus decreases
with temperature
Strength
decreases with
temperature
EFFECT OF TEMPERATURE ON
MODULI
1.The temperature of train tracks fluctuates highly due to movement of
trains. One must have a nice idea of the strength of tracks at any
temperature.
2.Many machine parts go to high temperature while working. It is
essential to know their strengths at such temperatures.
3.High temperature analysis of circuit elements is essential while
designing circuits. Otherwise they may just break.
Some materials are there which dont undergo too much change with
rise in temperature. They are of much importance in machines.