REFRIGERATION & AIR

CONDITIONING
Presented to:
Engr. Waqas Arshad
Presented by:
Hassan Idrees

Department of Mechanical Engineering

Chenab College of Engineering & Technology, Gujranwala
THERMAL PERFORMANCE
OF HEAT SPREADER FOR
ELECTRONICS COOLING
WITH INCORPORATED
PHASE CHANGE MATERIAL
Agenda
Abstract
Introduction
Heat spreader with PCM
Thermal resistance
Thermal behavior
Comparison
Conclusion
abstract
Thin wall pipes of small diameter form a heat transfer surface.
The pipes are filled with phase change material (PCM).
This design combines two important features of heat spreader
high heat transfer surface
high thermal capacity
Such heat sink is very effective in
removing heat from electronic devices in steady states
stabilize the temperature of the cooling element

Thermal performances determined by numerical simulation of

transient heat transfer
1. Introduction
There are widely use of heat sink in electronics devices.
For low level power conventional heat spreaders with or
without fans are still sufficient.
High heat flux density is specific for nuclear fuel cells or jet
engines surfaces.
These material absorb heat due to high thermal conductivity.
PCM keeps the temp in limit until completely melt.
Heat sinks with PCM have also ability to suppress fluctuations
of microprocessors temperature during variation of its
power, which can lead to thermal fatigue.
Continue
organic phase change material are primarily
considered. These are basically paraffin and other
hydrocarbons.
The major disadvantage of these materials is low
thermal conductivity.
Heat sink performance increased by
special designs of PCM
thermal conductivity of PCM through metallic or graphite
additives.
Continue
Design (a)
Such design is only possible in
mobile phones
The disadvantage of this solution is
low volume of PCM and therefore
low ability to absorb excess heat.
A simple increase in volume does
not improve performance, due to
mentioned above low thermal
conductivity.
Continue
Design (b)
Better than design a
Capacity to removing heat
increased
Change is that pin fins
inserted
Design (c)
high porosity
made of expanded graphite,
copper or aluminum foam
Modern Air-Cooled Heat Spreaders

In modern air-cooled
heat spreaders heat
pipes are used to
remove heat from
small area near
microprocessor to
remote space
2. Heat spreader with PCM
 3. Thermal resistance of heat spreader
Thermal resistance is a basic parameter of heat spreaders.

total heat flow through the spreader

Am contact area
k thermal conductivity
z e coordinate perpendicular to
the surface.
Continue
made of two different
metals; copper of
good thermal
conductivity provides
better heat
distribution in the
base,
aluminum that is
chipper and
lightweight.
 Continue

The above equation takes into account convection

from the side surface of pipes of diameter dout, length
l and pitch parameter s

Convective heat transfer coefficient

Continue
Continue
4. Thermal behavior of heat spreader
in transient conditions
5. Conclusions
PCM is placed inside thin walled pipes that work as fins.
in case of variable heat loads of radiator (heat is partially
absorb by PCM during phase change e melting).
The calculated values of thermal resistance are several
times lower
compared to PCM-based heat sinks with simple PCM
containers.
This heat spreader dissipate few tens of watts keeping
microchips temperature at the level below 50 C.
Simultaneously, due to the PCM content, they are able to
protect microprocessor from overheating in case of rapid
variations of heat load.
Continue
And in case of accidental fan failure they substantially
slow down the rise of temperature.
Such a good characteristics in unsteady states are
achieved with relatively small amount of PCM.
However, heat transfer to the PCM is very efficient
and nearly whole amount of phase change material
absorb excess heat immediately after thermal
disturbance.
Thank
Thank
You
You