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Optical Absorption
Solar Cell
The energy absorbed per unit time in the distance dx is: Iv(x)dx
Where is the absorption coefficient is the relative number of
photons absorbed per unit distance.
We get Iv(x+dx) -Iv(x) = = -Iv(x)dx
= -Iv(x)
If Iv(0) = Iv0
Then the solution is given by; Iv(x) = Iv0e-x
5
Photodetectors
A photodetector is a device which absorbs light and
converts the optical energy to measurable electric
energy.
Photon detectors
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Thermal detectors
7
Photon detectors
Photon detectors work on the principle of conversion
of photons to electrons. Unlike the thermal detectors,
such detectors are based on the rate of absorption of
photons rather than on the rate of energy absorption.
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Light Detection Process
Photoconductivity
Photovoltaic effect
Photoemissive effect
9
Photoconductivity
A consequence of small band gap (Eg) in
semiconductors is that it is possible to generate
additional carriers by illuminating a sample of
semiconductor by a light of frequency greater than Eg/h.
This leads to an increased conductivity in the sample
and the phenomenon is known as: Intrinsic
photoconductivity
11
Photoconductivity
p =
13
Photovoltaic Effect
15
Photoemissive Process
In a photoemissive process incident radiation
causes electron emission from photocathode which are
to be collected by an anode.
Responsivity
18
Spectral Response
The spectral response of a detector is given by the manner in
which the output signal of the detector varies with the change in
the wavelength of the incident radiation. As the quantum
efficiency depends on the wavelength, the response is not linear
as would be the case if = 1
The energy of the photon must be sufficient to excite an electron
across the energy barrier Eg. If Eg is in eV, the maximum
wavelength that the detector would respond to is
However, the response does not fall off abruptly to zero for
values of above the threshold. This is because, due to thermal
energy of the molecules, the absorption coefficent of the
material of the device is found to be given by:
E is the incident photon energy. For > max ,
and E<Eg. so that the absorption of radiance
becomes smaller. 19
Performance Parameters
Spectral Response
20
Noise Equivalent Power (NEP)
Source of noise in a detector is thermal fluctuation. Charged
particles are always in a state of motion. Even when no
radiation is incident on a device, a background current, whose
magnitude could be in nano-amperes or pico-amperes, is
generated. This is known as dark current . In order that a
detector may be able to differentiate between such random
noise and an incoming signal, the power of the signal must be
greater than the noise signal. In a detector design, one defines
signal to noise ratio (SNR) as: signal power/Noise power
Noise equivalent power (NEP) is an important figure of merit
for a detector. NEP is defined as the rms incident power which
gives rise to a current (or voltage) whose rms value is equal to
the rms value of the current (voltage) due to noise effects.
For a detector, the NEP is usually specified at particular
wavelength and temperature. The bandwidth for the incident
radiation for the measurement of NEP is generally taken as 1
Hz. 21
Detectivity and Dee Star (D* )
22
Photodiode
25
Photodiode
26
Photodiode
29
P-I-N Photodiode
Like p-n diode,the electric
field in the intrinsic region is
uniform as:
30
Avalanche Photodiode (APD)
A major disadvantage of a p-n or a p-i-n diode is that each photon
generates only one pair of electron and hole and there is no internal
gain. Amplifying the output current after the detector stage introduces
significant noise. One of the ways to deal with this problem is to
design a detector with an internal gain (the other is to amplify the
optical signal itself). An avalanche photodiode (APD) is a device with
internal gain which could be as high as 100. Si APDs have
sensitivities in the range 400 to 1100 nm while Ge-APDs have their
spectral sensitivities in 800 to 1550 nm. InGaAs and InP APDs
provide better sensitivity and spectral response.
Avalanche photodiode (APD) is a highly sensitive semiconductor
electronic device that can be thought of as photodetectors but provide
a built-in first stage of gain through avalanche multiplication. From a
functional standpoint, they can be regarded as the semiconductor
analog to photomultipliers. By applying a high reverse bias voltage
(typically 100-200 V in silicon), APDs show an internal current gain
effect (around 100) due to impact ionization (avalanche effect).
31
Avalanche Photodiode (APD)
APDs are essentially p-n photodiodes operated under reverse
bias near the breakdown voltage. The configuration consists of
an n+ layer followed, in sequence, by
(i) a thin p layer,
(ii) an intrinsic layer (in reality, a lightly doped p layer) and
(iii) a heavily doped p layer.
Avalanche process occurs when carriers in the transition
region are accelerated by the electric field with high
energies that these carriers collide with other bound
carriers and free them to generate higher current.
32
Structures for InGaAs APDs
Separate-absorption-and multiplication (SAM) APD
light
InP substrate
InP buffer layer
INGaAs Absorption layer
Metal contact
35
Sources of Noise in Detectors
Johnson Noise
A module efficiency of 25 %
is wanted to enable the
installation cost reductions.
Solar Cells (P-N)
Is a PN junction device without any applied voltage across
the junction.
It converts photon power into electrical power and delivers
to load.
hv
P E- Field
N
IF IL
I + V -
R 39
Solar Cells
Without any bias, there is a space charge region and an
electric field exists.
Electron-hole pairs generated due to incident photon are
swept away by this electric field and generates photocurrent IL
is the reverse bias direction.
This photocurrent produces a voltage drop across the
resistive load.
This voltage forward biases the P-N junction and produces a
forward bias current IF.
The net P-N junction current in the reverse bias direction is
given by:
I = IL-IF= IL-Is [ exp(]
ISC
V VOC 41
Power of Solar
Cells
Power delivered to the load P= VI
P =VI = ILV - Is [ exp(] .V
For maximum power
0= IL-Is [ exp(] IsVm () exp(
(1 - exp( = 1+
where Vm is the voltage at ISC
maximum power delivered Im
and Vt =KT/e
I
V Vm VOC
Maximum power Rectengle of Solar cell
42
Efficiency of Solar
Cell
The conversion efficiency of solar cell is given by:
= * 100 % = 100 %
For Silicon solar cell, Maximum Efficiency is about 28%.
But
Series resistance and reflection from the surface reduce to 15%
More Losses: Junction and contact voltage loss,
Recombination loss
Large optical lens can be used to increase light intensity
Fill Factor = (ranges between 0.7 and 0.8)
For a single semiconductor solar cell
If Photon energy E<Eg, then there is no effect of Photon E.
And if E >Eg, then extra energy dissipated as heat.
As the photon energy increases, more energy will be absorbed
in a very narrow region of the surface of the SC than the
deeper area of SC.
So there will be non-uniform carrier generation. 43
Air Mass
First Solar is the leader. It takes them 2.5 hours to make a 13.4 % module.
Average Manufacturing
Cost
2006: $1.40/watt
2007: $1.23/watt
2008: $1.08/watt
2009: $0.87/watt
2010: $0.77/watt
2011: $0.74/watt
2012: $0.64/watt
2013: $0.53/watt
Si GaAs
G a In P G a Gn aP I n P G a IGn
I
G a In P G a In P G a In P
11 . .88 e eV V 1 . 81 .e8 V1 e. 8V e 1 V. 8 1e V. 8 1 e
GG aaA As s G a A Gs a AGs a A
11 . .44 e eV V 1 . 12 5. 2 e5 1V e. 4V e 1V. 4 1e V. 41 .e
Ge GaInNAs
GG e e
0.7 eV G e 1 . 0 1e V. 0 e
00 . .77 e eV V 0 . 7 e V01.0 eV
0 . 7 e V 0 V. 7 0e .V7 0e
. 7 e
4 5 6 7 8 9
1
2 3 4
in New Solar
fu tu r e g e n e r a tio n
E n er g y (eV ) pConventional l er ei ns tgr ue cn t ue rr ea stf iu
r o d ui nc t i o n e x af mu t puJunction
p r o d u c t i o n e px ar omd pu lce t i so tnr u c et ux
MJ Cell
Multi Junction multi band cell
Ideal
efficiency for infinite stack is 86.8%
GaInP/GaAs/Ge tandem cells (efficiency 40%)
Multijunction Cells are Very Expensive
Efficiency =>50%
These complex
structures are grown
very slowly under high
Ga0.50In0.50P: vacuum.
Ge substrate:
Bottom Cell R.R. King; Spectrolab Inc., AVS 54th
International Symposium, Seattle 2007
References
1. Device Electronics for Integrated Circuits, by Muller and Kamins,
Wiley, New York, 1986.
2. GaAs Semiconductor Manufacturing,
http://www.mse.vt.edu/faculty/hendricks/mse4206/GaAsTEK/
default.htm
(Nov. 26, 2007)
57