MURI Progress Review:: Electromagnetic Simulation of Antennas and Arrays With Accurate Modeling of Antenna

MURI Progress Review:
Electromagnetic Simulation of Antennas and

Arrays with Accurate Modeling of Antenna
Feeds and Feed Networks
PI: J.-M. Jin
Co-PIs: A. Cangellaris, W. C. Chew, E. Michielssen
Center for Computational Electromagnetics
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
Urbana, Illinois 61801-2991
Program Manager: Dr. Arje Nachman (AFOSR)
May 17, 2005

Problem Description
Problem configuration Problem characteristics
 Very large structures

Antenna/platform
 Space/surface waves
interactions  Conformal mounting
 Complex structures
Antenna array  Complex materials
elements  Active/nonlinear devices
 Antenna feeds
 Complex structures
Distributed feed  Complex materials
network  Multi-layers
 Passive/active circuit elements
Solution Strategy
Problem configuration Simulation techniques
Antenna/platform MLFMA/PWTD coupled

interactions with ray tracing
FE-BI
coupling
Antenna array Time/frequency-

elements domain FEM & IE
Broadband
macromodel
Distributed feed Time/frequency-

network domain FEM
Accurate Antenna Feed Modeling
Using the Time-Domain Finite
Element Method
Z. Lou and J.-M. Jin
j-jin1@uiuc.edu
Typical Feed Structures
 Antenna element (opened for
visualization of interior structures)
 Details showing
coaxial cable,
microstrip line and
radial stub.
Feed Modeling
1. Probe model (Simple & approximate)
2. Coaxial model (Accurate)
At the port:

E  E   a m e m ( x, y ) e  m z
inc
m 0
 
E inc
a eTEM
0 0 ( x, y ) e jkz
  a e ( x, y ) e
TE
m m
 mz
  bmeTM
m ( x, y ) e
 mz
m 1 m 1
Mixed boundary condition:
nˆ    E  P(E)  Uinc on S
Feed Modeling
Waveguide Port Boundary Condition
nˆ    E  P(E)  Uinc on S
By mode decomposition:

P(E)   e TEM
0 0  e
TEM
0  E dS    me TE
m  e m  E dS
TE
S m 1 S

k2
 e TM  e
TM
 E dS
m 1  m
m m
S
 
U inc  nˆ    Einc   0e TEM
0  e TEM
0  E inc
dS
S
 
k2
  e TE
 e  E dS  
TE inc
e TM  e TM
 E inc
dS
m
m m m m m
m 1 S m 1 S
Conversion to Time Domain
Frequency-domain operators: Time-domain operators:
s 1
  0  
c c t
Inverse Laplacian
Transform 1
   m  k  s / c   m   hm (t ) *
2 2
cm
c t
k2 k2 1
  m    g m (t ) *
m 2
kcm  s / c 
2 c t
kcm
s  j hm (t )  J1 (kcm ct )u (t )
t
kcm : cutoff frequencie s kcm
g m (t )   J1 (kcm ct )u (t )  kcm
2
cJ 0 (kcm ct )u (t )
t
Time-Domain WPBC
Time-Domain Formulation: nˆ    E  P(E)  Uinc

P(E)  e TEM
0  e
TEM
0  (E) dS   e TE
m  e m   (E) dS
TE
S m 1 S

  e TM
m  m  (E) dS
e TM
m 1 S
 
U inc  nˆ    Einc  e0TEM  eTEM
0  L (Einc ) dS
S

  eTE
m  e m H (E ) dS
TE inc
m 1 S

  eTM
m  e m  G (E ) dS
TM inc
m 1 S
Assume dominant mode  2 e TEM

0 ( f inc ) TEM incidence

incidence: U inc   2 e1TE  ( f inc ) dominant TE incidence
  2 e TM  ( f inc ) dominant TM incidence
 1
Monopole Antennas
a  1.0 mm
a  1.0 mm
b  2.3 mm
b  2.3 mm
h  23.1 mm
h  32.8 mm
h '  2.0 mm
  30 o
Measured data: J. Maloney, G. Smith, and W. Scott, “Accurate computation of the radiation from simple
antennas using the finite difference time-domain method,” IEEE Trans. A.P., vol. 38, July 1990.
Five-Monopole Array (Geometry)
Finite Ground Plane:
• 12’’ X 12’’
• Thickness: 0.125’’
SMA Connector:
unit: inch • Inner radius: 0.025’’
• Outer Radius: 0.081’’
• Permittivity: 2.0
Monopole Array (Impedance Matrix)
1 2 3 4 5
1
2
3
4
5
Monopole Array (Gain Pattern)
Feeding mode: Port V excited, Ports I-IV terminated. Freq: 4.7GHz
f = 0o (x-z plane) f = 45o
f = 90o (y-z plane) f = 135o

2 X 2 Microstrip Patch Array
Substrate:
• 12’’ X 12’’
unit: inch
• Thickness: 0.06’’
SMA Connector:
• Inner radius: 0.025’’
• Outer Radius: 0.081’’
Patch Array (Impedance Matrix)
1 2 3 4
1
2
3
4
Impedance Matrix (FETD vs FE-BI)
Z11
Real(Z11) Z12
Real(Z12) Z13
Real(Z13) Z14
Real(Z14)
600 600 600 600
200
Re(Z) - FEBI 200
Re(Z) - FEBI 200
Re(Z) - FEBI 200
Re(Z) - FEBI
500 Im(Z) - FEBI 500 Im(Z) - FEBI 500 Im(Z) - FEBI 500 Im(Z) - FEBI
Re(Z) - FETD Re(Z) - FETD Re(Z) - FETD Re(Z) - FETD
Input Impedance(Ohm)
400
150
Im(Z) - FETD 400
150
Im(Z) - FETD 400
150
Im(Z) - FETD 400
150
Im(Z) - FETD
300 300 300 300

100 100 100 100
200 200 200 200
100
50
100
50
100
50
100
50
0 0 0 0
-1000 -1000 -1000 -1000
-200 -200 -200 -200
-50 -50 -50 -50
-300 -300 -300 -300

2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6
2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.7 2.9 2.8
2.952.9 3 3 3.1
3.05 3.2
3.1 3.3
3.15 3.4
Frequency(GHz)
Frequency(GHz) Frequency(GHz)
Frequency(GHz)
Z21
Real(Z21) Z22
Real(Z22) Z23
Real(Z23) Z24
Real(Z24)
600 600 600 600
200
Re(Z) - FEBI 200
Re(Z) - FEBI 200
Re(Z) - FEBI 200
Re(Z) - FEBI
400
150
Im(Z) - FETD 400
150
Im(Z) - FETD 400
150
Im(Z) - FETD 400
150
Im(Z) - FETD
300 300 300 300

100 100 100 100
200 200 200 200
100
50
100
50
100
50
100
50
0 0 0 0
-1000 -1000 -1000 -1000
-200 -200 -200 -200
-50 -50 -50 -50
-300 -300 -300 -300

2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6
2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.7 2.9 2.8
2.952.9 3 3 3.1
3.05 3.2
3.1 3.3
3.15 3.4
Frequency(GHz)
Frequency(GHz)
Z31
Real(Z31) Z32
Real(Z32) Z33
Real(Z33) Z34
Real(Z34)
600 600 600 600
200
Re(Z) - FEBI 200
Re(Z) - FEBI 200
Re(Z) - FEBI 200
Re(Z) - FEBI
400
150
Im(Z) - FETD 400
150
Im(Z) - FETD 400
150
Im(Z) - FETD 400
150
Im(Z) - FETD
300 300 300 300

100 100 100 100
200 200 200 200
100
50
100
50
100
50
100
50
0 0 0 0
-1000 -1000 -1000 -1000
-200 -200 -200 -200
-50 -50 -50 -50
-300 -300 -300 -300

2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 2.6
2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.9 2.95 3 3.05 3.1 3.15 2.85 2.7 2.9 2.8
2.952.9 3 3 3.1
3.05 3.2
3.1 3.3
3.15 3.4
Frequency(GHz)
Frequency(GHz)
Z41
Real(Z41) Z42
Real(Z42) Z43
Real(Z43) Z44
Real(Z44)
600 600 600 600
200
Re(Z) - FEBI 200
Re(Z) - FEBI 200
Re(Z) - FEBI 200
Re(Z) - FEBI
400
150
Im(Z) - FETD 400
150
Im(Z) - FETD 400
150
Im(Z) - FETD 400
150
Im(Z) - FETD
300 300 300 300

100 100 100 100
200 200 200 200
100
50
100
50
100
50
100
50
0 0 0 0
-1000 -1000 -1000 -1000
-200 -200 -200 -200
-50 -50 -50 -50
-300 -300 -300 -300

2.6
2.85 2.7 2.9 2.8
2.952.9 3 3 3.1
3.05 3.2
3.1 3.3
3.15 3.4 2.6
2.85 2.7 2.9 2.8
2.952.9 3 3 3.1
3.05 3.2
3.1 3.3
3.15 3.4 2.6
2.85 2.7 2.9 2.8
2.952.9 3 3 3.1
3.05 3.2
3.1 3.3
3.15 3.4 2.6
2.85 2.7 2.9 2.8
2.952.9 3 3 3.1
3.05 3.2
3.1 3.3
3.15 3.4
Frequency(GHz)
Frequency(GHz)
Patch Array (Gain Pattern at 3.0GHz)
x-z plane
Feeding mode:
_
+
_ +
y-z plane
Phasing Pattern:
 0o 180o 
 o o 
180 0 
Antipodal Vivaldi Antenna
Reflection at the TEM port
“The 2000 CAD benchmark unveiled,”

Microwave Engineering Online, July 2001
Antipodal Vivaldi Antenna
E-plane
Radiation patterns
at 10 GHz
H-plane
Layer-by-Layer Finite Element
Modeling of Multi-Layered
Planar Circuits
H. Wu and A. C. Cangellaris
cangella@uiuc.edu
Layer-by-Layer Decomposition
 3D global meshing replaced by much simpler

layer-by-layer meshing
 2D-meshing used as footprint for 3D mesh in each
layer
 3D mesh developed from its 2D footprint through
vertical extrusion
 If ground planes are present, they serve as
physical boundaries between the layers
 Otherwise mathematical planar surfaces are used to
define boundaries between adjacent layers
Example of Layer-by-Layer Mesh Generation
Layer-by-Layer FEM Solution
 FEM models developed for each layer
 Overall solution obtained is developed through enforcement
of tangential electromagnetic field continuity at layer
boundaries
 Assuming solid ground plane boundaries, layers interact through
via holes and any other apertures present in the model
 Direct Domain Decomposition-Assisted Model Order
Reduction (D3AMORe)
 Reduced-order multi-port” macromodels developed for each
layer with tangential electric and magnetic fields at the via
holes and apertures in the ground planes as “port
parameters”
 On-the-fly Krylov subspace-based broadband multi-port
reduced-order macromodel generation
 Overall multi-port macromodel constructed through the
interconnection of the individual multi-ports
Demonstration
Tunable bandpass filter with surface-mounted caps:
Absorbing boundary box
50-Ohm microstrip
Surface-mount cap
Via hole
gap
50-Ohm stripline
Two Signal Layers
Pins used to strap together top and
bottom ground planes
Input/output ports
Connecting ports
Connecting ports
microstrip layer (top) stripline layer (bottom)
The filter is decomposed into a microstrip layer and stripline layer.

Ground planes are solid; hence, coupling between layers occurs
through the via holes.
Tunable band-pass filter (cont.)
Reference Solution: Transmission line D3AMORe FEM Solution (w/o
model with ideal 10 fF caps for modeling the surface-mounted cap)
gaps. Impact of vias is neglected.
1 1
0.9 0.98
0.8 0.96
0.7 0.94
0.6 0.92
S11
S11
0.5 0.9
0.4 0.88
0.3 0.86
0.2 0.84
0.1 0.82
0 0.8
2 2.5 3 3.5 4 2 2.5 3 3.5 4
Frequency(Hz) 9
x 10 Frequency (Hz) 9
x 10
Tunable band-pass filter (cont.)
Use of surface-mounted caps help alter the pass-band
characteristics of the filter
1
0.9
0.8
0.7
0.6
S11
0.5 Open
0.2pF, 0.05nH
0.4 0.5pF, 0.05nH
1pF, 0.05nH
0.3
0.2
0.1
0
2 2.5 3 3.5 4
Frequency (Hz) 9
x 10
Hybrid Antenna/Platform Modeling
Using Fast TDIE Techniques
E. Michielssen, J.-M. Jin, A. Cangellaris,

H. Bagci, A. Yilmaz
emichiel@uiuc.edu
Progress in TDIE Schemes
Resulting from this MURI Effort
 Higher-order TDIE solvers

 TDIE solvers for material scatterers
 TDIE solvers for surface-impedance scatterers
 TDIE solvers for periodic applications Previous
 TDIE solvers for low-frequency applications code
 Parallel TDIE solvers
 PWTD based accelerators
 TD-AIM based accelerators
 More accurate (nonlinear) antenna feed models

 More complex nonlinear feeds
 More accurate S- / Z- parameter extraction schemes Added
 Symmetric coupling schemes between different solvers
(including cable – EM interactions)
Code Characteristics
1) A higher-order MOT algorithm for solving a hybrid
surface/volume time domain integral equation pertinent to
the analysis of conducting/inhomogeneous dielectric bodies
has been developed
2) This solver is stable when applied to the study of mixed-
scale geometries/low frequency phenomena
3) This algorithm was accelerated using PWTD and TDAIM
technology that rigorously reduces the computational
2 2
complexity of the MOT solver from O ( NT N S ) to O( NT N S log N S )
4) H1: Linear/Nonlinear circuits/feeds in the system are
modeled by coupling modified nodal analysis equations of
circuits to MOT equations
5) H2: A ROM capability was added to model small feed details
6) H3: Cable feeds are modeled in a fully consistent fashion by
wires (outside) and 1-D IE or FDTD solvers (inside)
Nonlinear Feed:
Active Patch Antennas
Ground plane
Dielectric substrate *B. Toland, J. Lin, B. Houshmand, and T. Itoh, “Electromagnetic

 r  2.33 simulation of mode control of a two element active antenna,”
IEEE MTT-S Symp. Dig. pp. 883-886, 1994.
Nonlinear Feed:
Reflection-Grid Amplifier
Amplifier built at University of Hawaii, supported through ARO Quasi-Optic MURI program.
Pictures from A. Guyette, et. al. “A 16-element reflection grid amplifier with improved heat sinking,”
IEEE MTT-S Int. Microwave Symp., pp. 1839-1842, May 2001.
Nonlinear Feed:
Reflection-Grid Amplifier
OUT RF Output &
E Bias
280 
RF
input Bias
IN 355 
E 1 pF
30
30 1 pF
355 
Bias RF
input
280 
Bias &
RF Output
Each chip is a 6-terminal
*A. Guyette, et. al. “A 16-element
reflection grid amplifier with differential-amplifier that
improved heat sinking,” IEEE is 0.4 mm on a side
MTT-S Int. Microwave Symp., pp.
1839-1842, May 2001.
Interfacing with ROMs:
Mixed Signal PCB with Antenna
Footprint of
1
Digital Chip 2 3
4 Ground layer
Top metallization (Antenna array)
Microwave
signal traces
Signal Layer
Dielectric Ground island for

substrate  r  2.2 microwave sources
4 mm
Power layer
6
7 9 10 Microwave
11 generators
5
Digital 8 Bottom layer
switching (electronics)
currents
Ex 1000 V/m
Ey 1000 V/m inc
E
f  4 GHz 3 GHz
k̂
y x
- Full-wave solution only at the

top layer
- Dimension of the 11-port
macro-model: 623
- Bandwidth of macro-model
validity: 8 GHz
- Plane wave incidence & digital
switching currents
Glass windows
thickness: 2.5 cm
 r  2.25
8 cm
1.5 m
k̂
inc
Ez -1000 V/m
E f  0.6 GHz 0.4 GHz
k̂
inc
Ez -1000 V/m
E f  0.6 GHz 0.4 GHz
Received at port 8
Cable Feeds:
TD LPMA Analysis
Glass windows,  r  2.25
thickness: 3 cm
King Air 200
3.4 m
16.6 m
Coaxial cables
Shield radius: 3 mm
Cable Feeds:
TD LPMA Analysis
Antenna feed-point
Antenna feed-network
Cable Feeds:
TD LPMA Analysis
25 MHz 52 MHz * Dielectrics not shown
61 MHz 88 MHz
Using Loop Basis to Solve VIE, Wide-
Band FMA for Modeling Fine Details,
and a Novel Higher-Order Nystrom
Method
W. C. Chew
w-chew@uiuc.edu
Volume Loop Basis
 Advantages:
 Divergence free
 Less number of unknowns (A reduction of 30-40%)
 Reduction in computation time
 Easier to construct and use than other solenoidal
basis, e.g. surface loop basis; no special search
algorithm is needed.
 Stable in convergence of iterative solvers even with the
existence of a null space
RWG Basis Loop Basis

Volume Loop Basis
Example:
Ra  0.25m
Rb  0.1m
h  0.1m
Volume Loop Basis
Bistatic RCS:
Incident Wave: 1 GHz, –z to +z

Relative permittivity: 4.0
No of tetrahedrons: 3331
No of RWG basis: 7356 (11.5)
No of loop basis: 4965 (10.05)
Basis reduction: 32.5%
No of iterations:
RWG: 159; Loop: 390
Full-Band MLFMA
Incident Wave: 1 MHz
θ = 45deg, Φ = 45deg
No of triangles: 487,354
No of unknowns: 731,031
7 x 7 fork structure
Novel Nystrom Method
Scattering by a pencil target:
20
a=0.1 m
10 d=3 m
t=0.173 m
0
f=1.0 GHz
-10
Bistatic RCS (dBsm)
-20
-30
t d Z
-40
-50
X a O
-60 Y
-70
0 50 100 150 200 250 300 350
f (degrees)
Scattering by an ogive:
-10
HH
-15 VV
-20
-25
Monostatic RCS (dBsm)
-30
a=1 inch
d=5 inchs
-35 f=1.18 GHz
-40
Z
-45 d
-50 a
X O
-55 Y
-60
0 20 40 60 80 100 120 140 160 180
f (degrees)
Scattering by a very thin diamond:
10
-10
a  0.4 Nystrom
Z MoM
-20 h  0.02
Bistatic RCS (dB)
-30
-40 h
O
-50 Y
-60
a a
-70
X
-80
-90
0 20 40 60 80 100 120 140 160 180
 (degrees)
Higher-order convergence for ogive scattering:
1
10
HH, rule1
HH, rule2
HH, rule3
0
10 VV, rule1
VV, rule2
RMS Error (dB)
VV, rule3
-1
10
-2
10
-3
10
1
10
Unknowns per wavelength
Higher-order convergence for pencil scattering:
1
10
HH, rule1
HH, rule2
HH, rule3
VV, rule1
0
10 VV, rule2
RMS Error (dB)
VV, rule3
-1
10
-2
10
1
10
Unknowns per wavelength
Conclusion
Past progresses:
 FEM & ROM modeling of multilayer, distributed feed
network (Cangellaris)
 Accurate, broadband antenna/array modeling with
frequency- and time-domain FEM (Jin)
 Linear/nonlinear feeds, cable feeds, antenna/platform
interaction, & TDIE/ROM integration (Michielssen)
 Full-band MLFMA, loop-basis for VIE, and higher-order
Nystrom method (Chew)
Future work:
 Hybridization of FEM and ROM to interface antenna feeds
and feed network
 Hybridization of FEM and TDIE (TD-AIM & PWTD) or MLFMA
to model antenna/platform interaction
 Parallelization to increase modeling capability

MURI Progress Review:: Electromagnetic Simulation of Antennas and Arrays With Accurate Modeling of Antenna

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MURI Progress Review:

Electromagnetic Simulation of Antennas and

Program Manager: Dr. Arje Nachman (AFOSR)

May 17, 2005

 Very large structures

Antenna/platform MLFMA/PWTD coupled

Antenna array Time/frequency-

Distributed feed Time/frequency-

2. Coaxial model (Accurate)

Mixed boundary condition:

Assume dominant mode  2 e TEM

f = 0o (x-z plane) f = 45o

f = 90o (y-z plane) f = 135o

300 300 300 300

-300 -300 -300 -300

300 300 300 300

-300 -300 -300 -300

300 300 300 300

-300 -300 -300 -300

300 300 300 300

-300 -300 -300 -300

“The 2000 CAD benchmark unveiled,”

 3D global meshing replaced by much simpler

Absorbing boundary box

microstrip layer (top) stripline layer (bottom)

The filter is decomposed into a microstrip layer and stripline layer.

E. Michielssen, J.-M. Jin, A. Cangellaris,

 Higher-order TDIE solvers

 More accurate (nonlinear) antenna feed models

Dielectric substrate *B. Toland, J. Lin, B. Houshmand, and T. Itoh, “Electromagnetic

Dielectric Ground island for

- Full-wave solution only at the

King Air 200

25 MHz 52 MHz * Dielectrics not shown

RWG Basis Loop Basis

Incident Wave: 1 GHz, –z to +z

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