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About Us
• RUSH PCB Inc is your source for high quality Printed
circuit boards.
• Prices are among the best in the industry
• Committed to quality and customer satisfaction
• Our staff engineers work with our customers throughout
the initial design
• We believe that the right tools and a committed
workforce are essential to quality and long-term
success.
• We will continue to implement the latest technologies
MATERIAL CAPABILITIES FOR RIGID PCB
Laminates per IPC-4101
• FR-4,
• FR-5,
• FR-406,
• FR-408,
• FR-410,
• Nelco,
• Getek,
• Polyimide,
• Teflon,
• Rogers 4000 series,
• Rogers TMM series to name a few.
PRINTED CIRCUIT BOARD PRODUCTION:
•Single & Double sided(FR4 130Tg & 170Tg, Polyimide, Teflon, BT, &
Rogers
• Multi Layer Next Day. (2 to 30 Layers)
•Multi Layer(FR-4, G-Tek, Polyimide, Kapton, FR-4 170tg, Teflon).
•Multilayers for PCMCIA applications(Smart Cards).
(8 Layers with finished thickness of 0.024”).
•Multilayers for Flash Card applications (Smart Cards).(4 Layers of
finished thickness of 0.012).
•BGA (Flip Chip)/ Substrate -- 3 mil Trace width and 3 mil Air gap.
•Tab & Route, Scoring,, Control Impedance and Dielectrics.
•Selective & Wire Bondable Gold.
•Soft and Hard Gold Body, Electroless Nickle and Gold.
•SMOBC, LPI, Blind & Buried Vias.
Maximum Board Size 22 x 35
Maximum number of Layers 30
Maximum Board Thickness 0.250
Minimum Board Thickness (4 layers mask to mask) 0.012 Thickness Tolerances
Minimum Inner layer Core Thickness 0.004
Minimum Dielectric thickness 0.003
Maximum Inner Layer Base Copper Weight 5 Oz
Minimum Inner Layer Base Copper Weight 1/4 Oz
Maximum Outer Layer Base Copper Weight 6 Oz
Minimum Outer Layer Base Copper Weight 1/4 Oz
Minimum Trace Width 0.003 Minimum Air gap (Space between Traces) 0.003
Minimum Finished hole size 0.004 Laser Drill
Maximum Aspect ratio 10 to 1
Standard Plated Thru hole size tolerance +/- 0.003
Minimum Plated Thru hole size tolerance +/- 0.002 Minimum outline dimension
tolerance (Special case +/- 0.003) +/- 0.005
Probe Card
Probe Card
Burn in Board
Impedance Control Board
Socket Board
Hi-Fix Board
Leakage board
Impedance board
Mother Board
HDI(HIGH DENSITY INTERCONNECT) –
Copper (thickness) 0.25 oz. (9 um), 0.33 oz. (12 um), 0.5 oz. (17
um), 1 oz. (35 um), 2 oz. (70 um)
* Trace to edge distance should be greater than 0.003" for proper copper
insulation ** Laser defined apertures created by ablating cover layer material
ADVANTAGES I
Performance Not Promises
• Lead-free Compliant
• On-Time Delivery
• NASA –
• FIBIT –
• AURORA –
• INTERSIL
• SALE 2011 • SALE 2012
Much appreciated.
Regards,
Joe
Senior Design Enginner
2151-20 O’Toole Ave
Tel: 408-496-6013
Fax: 408-988-7424
Email: sales@rushpcb.com
URL: http://www.rushpcb.com