You are on page 1of 17

Special cells

• Decap cells
• Endcap cells
• Tap cells
• Spare cells
• Antenna diode
• Filler cells
• Tie cells
Decap cells
– Charge Sharing;To avoid the Dynamic IR drop ,charge stores in
the cells and release the charge to Nets.
– Decoupling capacitor cells , or Decap cells, are cells that have a
capacitor placed.
– Between the Power rail and Ground rail to Over come Dynamic
voltage drop.
– Dynamic IR Drop happens at the active edge of the clock at
which a High currents is drawn from the Power Grid for a small
Duration.
– If the Power is far from a flop the chances are there that flop
can go into Metastable State.
– To overcome decaps are added , when current requirements is
High this Decaps discharges and provide boost to the power
grid.
Endcap cells
– To Know the end of the row,and At the edges endcap cells are
placed to avoid the cells damages at the end of the row to
avoid wrong laser wavelength for correct manufacturing.
– You can add Endcap cells at both Ends of a cell row.
– placed at the edge of row.
– The library cells do not have cell connectivity as they are only
connected to Power and Ground rail,
– Thus ensure that gaps do not occure between "WELL" and
"IMPLANT LAYER" and to prevent the DRC violations by
satisfying "WELL TIE - OFF" requirements for core rows we use
End cap cells.
– Usually adding the "Well Extension" for DRC correct designs.
– End caps are a "POLY EXTENSION" to avoid drain source SHORT
Tap cells
– Avoids Latch up Problem(Placing these cells with a
particular distance).
– Cells are physical-only cells that have power and ground
pins and dont have signal pins.
– Tap cells are well-tied cells that bias the silicon
infrastructure of n-wells or p-wells.
– They are traditionally used so that Vdd or Gnd are
connected to substrate or n-well respectively.
– This is to Help TIE Vdd and Gnd which results in lesser
drift and prevention from latchup.
– Required by some technology libraries to limit resistance
between Power or Ground connections to well of the
substrate.
Spare cells

– Used at the ECO.


– Spare cells are standard cells in a design that are
not used by the netlist.
– Placing the spare cells in your design provides a
margin for correcting logical error that might be
detected later in the design flow, or for adjusting
the speed of your design.
– Spare cells are used by the fix ECO command
during ECO process.
Antenna diode
• Antenna violation:
Filler cells
– Filler cells are used to connect the gaps between the cells
after placement.
– Filler cells are used to establish the continuity of the N-
Wells and the IMPLANT LAYERS on the standard cells
rows, some of the cells also don't have the Bulk
Connection (Substrate connection) Because of their small
size (thin cells).
– In those cases, the abutment of cells through inserting
filler cells can connect those substrates of small cells to
the Power/Ground nets.
– i.e. those tin cells can use the Bulk connection of the
other cells(this is one of the reason why you get stand
alone LVS check failed on some cells)
Tie cells
• It is used for preventing Damage of cells; Tie High
cell(Gate One input is connected to Vdd, another input is
connected to signal net);Tie low cells Gate one input is
connected to Vss, another input is connected to signal .
• Tie - high and Tie - low cells are used to connect the gate of
the transistor to either Power and Ground.
• In lower technology nodes, if the gate is connected to
Power or Ground. The transistor might be turned
"ON/OFF" due to Power or Ground Bounce.
• These cells are part of the std cell library.
• The cells which require Vdd(Typically constant signals tied
to 1) conncet to tie high cells.
• The cells which require Vss/Vdd (Typically constant signals
tied to 0) connect to tie low cells.