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(LEFM)
By
s x t xy s y t xy
0 ; 0
x y y x
Crack and stress intensity approach
K I s a
The unit of Ki is MPam’
dır.
Opening mode analysis or Mode I
Boundary Conditions :
• At infinity | z | sx sy s, txy 0 y s
• On crack faces
a x a;y 0 sx txy 0 2a
x
s
3
cos 1 sin sin
KI
sx
2r 2 2 2
3
cos 1 sin sin
KI
sy
2r 2 2 2
3
sin cos cos
KI
t xy
2r 2 2 2
2(1 ) 1
cos sin 2
r
u KI
E 2 2 2 2
2(1 ) 1
sin cos2
r
v KI
E 2 2 2 2
where u, v = displacements in x, y directions
(3 4) for plane stress problems
3
for plane strain problems
1
The vertical displacements at any position along x-axis ( 0 is
given by s
v
E
2
a
2
x y
for plane stress
v
s(1 2 )
a
x
v 2
x 2
for plane strain x
E
The strain energy required for creation of crack is given by the
work done by force acting on the crack face while relaxing the
stress s to zero 1
U a Fv
2
For plane stress For plane strain
s s(1 2 )
a x dx a x 2 dx
a a
Ua 4 s 2 2
Ua 4 s 2
0 E 0 E
s2 a 2 s2 a 2 (1 2 )
E E
The strain energy release rate is given by G dU a da
s2 a s2 (1 2 )a
GI = GI =
E E
K 2I K 2I (1 2 )
GI = GI =
E E
Sliding mode analysis or Mode 2
Boundary Conditions :
• At infinity | z | sx sy 0, txy t0
• On crack faces a x a;y 0 sx txy 0
t0
3
cos cos 2 cos cos
K II
sx
2r 2 2 2 2
y
3
cos sin cos
K II
sy
2r 2 2 2 2a
K II 3
t xy cos 1 sin sin
2r 2 2 2
t0
Displacement components are given by
(1 )sin 2 cos
K II r
u
E 2 2
(1 )cos 2 cos
K II r
v
E 2 2
K II to a
K 2I
GI = for plane stress
E
K 2I (1 2 )
GI = for plane strain
E
Tearing mode analysis or Mode 3
e x e y xy yx 0
w w
xy yx and yz zy
x y
the equilibrium equation is written as
t xz t yz
0
x y
Strain displacement relationship is given by
2 w 2 w
2
w0
x 2 y2
The stresses are given by
sin
K III
t xz
2 r 2
t yz III cos
K
2 r 2
s x s y t xy 0
and displacements are given by
K III 2r
w sin
G 2
uv0
K III to a
Stress Intensity Factor
K I s a = mode 1 stress
intensity factor
Constant
Average stress Crack size
depending on
(i.e. away from
geometry/load
crack)
ing
Elliptic Crack
Elliptic Crack
Semi eliptic Surface crack
Problems
1.Assume that an advanced ceramic, SiAlON (silicon aluminum oxynitride),
has a tensile strength of 414 MPa.
Let us assume that this value is for a flaw-free ceramic. (In practice, it is almost
impossible to produce flaw-free ceramics.)
A crack 0.025 cm deep is observed before a SiAlON part is tested.
The part unexpectedly fails at a stress of 3.5 MPa by propagation of the crack.
Estimate the radius of the crack tip.
20
Problems
2. Consider a circular hole in a plate loaded in tension. When will material near
the hole yield?
What is
KI 1
ASTM: a,B, W-a 2.5 ( )2 , i.e. rp of specimen dimension.
s ys 50
Damage tolerance
Critical crack lengths are a measure of the
damage tolerance of a material
Yield-before-break Leak-before-break
Requires that the crack will Requires that a crack
not propagate even if the just large enough to
stress causes the part to yield penetrate both the inner
and outer surface of the
vessel is still stable
28
Design using fracture mechanics
wall stress
29
Design process – yield-before-fracture
Requirement:
The stresses are everywhere less that
required to make a crack of critical
length to propagate.
BUT!!! It is not safe…
Requirement:
Crack should not propagate even if
the stress is sufficient to cause
general yield – for then the vessel
will deform stably in a way that can
be detected.
2a = t
where B is thickness
of the vessel
Damage-tolerant Design
1.KIC = fracture toughness; E = Young's modulus; σf = failure strength (the yield strength for metals and ductile polymers, the tensile strength for ceramics,
glasses and brittle polymers loaded in tension; the flexural strength or modulus of rupture for materials loaded in bending).
Design of a ceramic support
Determine the minimum allowable thickness for a 7.5 cm wide plate
made of sialon (SiAlON or silicon aluminumoxynitride) that has a
fracture toughness of 9.9 Mpa m1/2.
The plate must withstand a tensile load of 177 920 N.
The part will be non-destructively tested to ensure that no flaws are
present that might cause failure.