SOLDERING & SOLDERING

TECHNIQUES

ELECTRONIC WORKSHOP
(CC142)

B.V.M.ENGINEERING COLLEGE
V.V.NAGAR

PREPARED BY : KATAKIYA JAYKUMAR(16IT445)

* Process for join two or metal items by melting
& then flowing a filler metal into joint.
* Melting point of filler metal is low respectively.
* Used for permanent connection between
electronic components.

*SOLDERING
SOLDERING IRON

.Heats up the connection to be soldered

.25-40 watt needed for electronic use

.Various types : conical & chisel type

* EQUIPMENTS
 ROSIN CORE SOLDER
 filler metal to join.
 responsible for connection.

 alloy of tin and lead in ratio of 60/40.

 ROSIN coated : keeps oxides away from joint.

* EQUIPMENTS
 SOLDERING STAND
Holds the solder iron
“Always return solder iron to the stand
when not in use”
don’t put iron on bench for a moment.

* EQUIPMENTS
  SPONGE SOLDER BRAID
Used for desoldering.
 To clean solder iron
tip.
It is braided copper
To remove burnt flux. tape.
 To remove excess Absorbs solder when
solder.
heated.

* EQUIPMENTS
 STEEL WOOL HEAT SINK
Clean component Protects heat
leads. sensitive components
Removes moistures. Absorbs heat ,stop
heat flow to
component.
Ex. crocodile pin.

EQUIPMENTS
 *FLUX
IT IS A MATERIAL USED TO REMOVE
OXIDES FROM CONTACT OF PARTS TO
BE SOLDERED.
FLUX IS MADE UP OF LIKE
HYDROCHLORIC ACID , ZINC
CHLORIDE OR ROSIN.

* EQUIPMENTS
 * PROCEDURE--
PREPARATION
*Clean components by emery cloth or steel
wool.
*Remove dirt, oil, grease, oxidation-effect.
*Causes dry.
 solder tend to bead up
Components becomes bright and shiny.
*PLUG-IN
*Clean it by wet or dampen sponge.
*Apply solder to iron tip.(TINNING)
*Again wipe the tip.
*Giving silver shiny tip.
*Getting clean & deoxidised tip.
*PUT IRON TO THE STAND.

* PROCEDURE--PREPARE
SOLDERING IRON
*Place the component on prototype board.
Bend leads at 90 degree to fit it.
*Insert leads into proper holes of non
copper side.
(before execute soldering prepare circuit
diagram on board)
*Bend leads little outwards to holding.
*Attach heat sink if required.

* PROCEDURE-
-SOLDERING
*Clean solder iron by dampen sponge again.

*Apply tiny solder to tip(tinning solder iron)

*With hot iron tip ,touch the pad and lead

to be joined.(temperature )

* Procedure--
soldering
 APPLY SOLDER(HEART
OF ENTIRE PROCESS)
take required solder on tip of hot iron , solder
will melt.
Take iron to the opposite side from component.
(copper side).
Apply it on the point , letting solder flow.
Molten solder will feel up the joint because of
capillary action.
Hold the joint till cooling (<=3 sec)
Solder is done. within 5 seconds.

* Procedure--
soldering
Cut the excess length of leads.
Clean residual flux by alcohol.
Prevents oxidation
Prevents unwanted short circuiting.

* Procedure--
finishing
Process to coating solder on wire.
Attach heat sink below insulation.
Heat wire end , Touch solder to
wire from opposite side.
Solder would wick up wire.
don’t heat too much.

* Technique—
wire tinning
oSoldering iron heats up to 400 degree celcious.
oCause burn and fire , be care full.
oUnplug solder iron when not in use.
oGreat care to avoid touching tip with power line(cause burn ,
shock , fire).
oReturn solder iron to stand , not put it on bench.
oWork in vantilated area.
 Smoke by flux is irritating.
 Breathing problem.
oSolder with lead is poisonous , wash hands after soldering.

*SAFETY
*Pre-plan and collect all parts.
*Prepare circuit design.
*Some components placed correct way due
to function.(LED).
*SOLDER PARTS IN THIS SEQUENCE:
 Resistor
 Small then large capacitors
 Diode
 LED
 Transistor
 Wire
 IC ALWAYS AT LAST : orientation is important.

* TIPS
 * inspection
 Quality of joint should be checked.
BAD JOINT:
• Balled up or spiked.
• Dull coloured.
• Crystallised or grainy.
• Convex solder surface.
REASONS:
 dirty leads
 dirty pads
 joint moved during cooling.
 Over-heating.
GOOD JOINT:
 Always looks volcano or cone shaped.
 Looks shiny and bright.
 To do good joint , require practice.

* inspection
Unnecessarily bridges made sometimes.
They should be rapaired.
Excess solder unnecessarily connects two
leads , holes .(it is unwanted).
PROCEED TO REMOVE COMPONENTS(REMOVE
SOLDER)
 Place solder braid on that joint.
 Heat braid from opposite side of joint.
 Solder will absorbed by braid.
 Remove braid.

* DESOLDERING
 THANK YOU
PRESENTED BY : .
KATAKIYA JAYKUMAR (16IT445)
RAHI PATEL (16IT471)
MEHUL RATHOD (16IT442)

B.TECH(F.Y) IT :2016-17