ORGANIC FIELD EFFECT

TRANSISTOR

BY:
N.SHIVAPRASAD
18204105
TOPICS:
• INTRODUCTION TO ORGANIC ELECTRONICS
• OFET VS MOSFET
• STRUCTURE OF OFET
• OPERATION
• MATERIALS FOR OSC AND DIELECTRIC
• APPLICATIONS
• CHALLENGES
ORGANIC ELECTRONICS:

• Electronic devices in which semiconductor is an organic material.

• Very often these days not only the semiconductor, we find that even insulator
and metal is also organic, is also an organic material. So, at least in order to
get qualified as a organic electronics in a device at least one layer should be
made of organic material, mainly the semiconductor and then we would call
that as organic electronics.
The work of Alan MacDiarmid, Hideki Shirakawa and Alan Heeger in 1977 where
they showed that polyacetylene which was known as a polymer, which is generally
we expect it to be an insulator can be made very conducting and then they
explained the behaviour how a polymer can be very conducting
DIFFERENCES BETWEEN ORGANIC AND INORGANIC
SEMICONDUCTOR
• The main difference in inorganic semiconductors is that these materials, the
bonding is of the type for example, silicon silicon semiconductors, silicon silicon
bonding is covalent or coordinate bonding.
• Inorganic semiconductors the materials are one which require very high
temperature to make changes into them because they are, they are made by
primary bonds.
• On the other hand organic semiconductor which are basically molecular in nature
when we make materials out of them, they are bonded by the Van der Waal
forces and require very little energy in order to make them
APPLICATIONS OF ORGANIC ELECTRONICS
OFET DEVICE STRUCTURES
• Each of the four structures presents advantages and disadvantages, and the type of
structure to be adopted is a direct consequence of its purpose.
• For instance, the BGBC structure allows for quick examination of new semiconductor
materials and processing methods because the gate electrode, gate dielectric, and
source and drain contacts are pre-fabricated, and the semiconductor is deposited in
the last step of the process.
• This also has the advantage of maintaining a pristine semiconductor dielectric
interface as no additional steps are required after deposition of the semiconductor.
However, this structure leaves the semiconductor exposed to ambient conditions which
may accelerate degradation due to oxygen, water, and other factors.
• The structures which involve a top-gate electrode, TGBC, and TGTC, can reduce
environmental degradation of the semiconductor as the dielectric also acts as an
encapsulation layer, however the dielectric must be chosen carefully to preserve the
integrity of the semiconductor.
WORKING OF OFET:

• Conduction of current through the OFET is dependent on the charge carriers at the organic
semiconductor and dielectric interface. When a small negative gate to source voltage is
applied, some holes start to accumulate in the organic semiconductor. As this voltage gets
more negative, more of these holes are formed and hence increasing the conductivity of the
organic semiconductor. Similar to the n-type transistors, the p-type organic transistor can
operate in 2 regions, either in the saturation (active) or the linear region
OPERATION OF OFET
MATERIALS FOR OSC:
• SMALL MOLECULES
Small molecules are oligomers made up of a finite number of conjugated
monomer units
The most well-known molecule used in OFET production is probably
rubrene, with the highest carrier mobility among the rest of the organic
materials that have been characterized.
Besides Rubrene’s high carrier mobility, also has high photoconductivity
and large exciton diffusion length.
However, the main problem with rubrene is that production of thin films of
rubrene is the inability to form thin films despite the ease of formation of small
crystals. Rubrene also oxidizes easily under light.
STRUCTURES OF SMALL MOLECULES
• POLYMERS:
Polymers consist of several conjugated monomer units forming long chains
and sometimes more complicated structures. The structure of the fundamental
repeating monomer units dictates the processability and properties of polymers.
Polymers typically exhibit a lower degree of crystallinity, and show inferior
performance compared to small molecule semiconductors
• DOPED ORGANIC SEMICONDUCTOR:
One way of tuning the electrical conductivity of organic semiconductors is by
doping, i.e., the addition of impurities to a semiconductor material to shift its
Fermi level.
The impurity added to the host material can either donate electrons to the
LUMO of the host (n-type doping) or accept electrons from the HOMO of the
host, leaving holes behind (p-type doping).
 DEPOSITION METHODS OF OSC :
• OSC can be deposited by
1.Vapour Phase
2.Solution Phase
• SINGLE CRYSTAL GROWTH: Grown through vapour phase are very high purity
due to lack of solvents. This can be achieved by
1.Vaccum Sublimation 2.Physical Vapour Transport
• It is very difficult in growing large sized crystals
• THERMAL DEPOSITION: Material is placed under high vacuum and heated to cause
sublimation on a substrate.
• The vacuum ensures vapour particles travel directly to substrate without deflection
• This deposition have uniformity and good reproducibility
• SOLUTION DEPOSITION: Compatible with ambient temperature and pressure
1.Spin coating: Small pool of semiconductor solution onto a centre of the
substrate and spinning the substrate at high speed.
2.Drop casting: Drop the semiconductor solution onto substrate and letting the
solution evaporate spontaneously leaving behind individual crystal on film
APPLICATIONS:
• FLEXIBLE DISPLAY
• SENSORS
1.GAS SENSOR
2.HUMIDITY SENSOR
3.PRESSURE SENSOR
• MECHANICAL SENSORS
CHALLENGES:

• STABILITY : The OSC are easily oxidised and reduced by water which
contains H+,OH- ions as such they are not very stable under ambient
conditions.
• HIGH TEMPERATURE : Another challenge in the reproduction of OFETS is
reactions due to high temperature used for deposition of materials.
• STERILE ENVIRONMENT : The glass substrate used in OFETs need to be very
clean to prevent shorting due to incomplete coating with dielectric layer
THANK YOU