INDUSTRIAL TRAINING PRESENTATION

AT
UKB ELECTRONICS PVT. LTD.
ON

MANUFACTURING OF EARPHONES
&
STUDY OF SURFACE MOUNT TECHNOLOGY

BY
PRANAV YADAV
(1509131072)
Contents
• Introduction to Earphones
• Components of Earphones
• Process Flow of manufacturing of earphones
• What is Surface Mount Technology?
• SMT Process
• Types of SMT
• Difference between SMT and TH Technology
• SMD’s
• Advantages
• Disadvantages
• Conclusion
• References
Introduction to Earphones

• They are transducers, which convert

an electric signal to a corresponding
sound.
• They are of two types (based on
transducers)
1. Moving Coil Earphones
2. Electrostatic Earphones
Components of Earphones :-

• Jack : It takes electrical signals from the

audio output port of the devices like
mobile phones, laptop, music player etc.

• Housing: It is made up of rubber and is

designed to give a good grip while
connecting and disconnecting the
connectors.
Components of Earphones :-

• Connecting Wires: Each ear piece has two

wires out of which one is common/ground.
The other carries the electrical signal for
the respective ear piece.

• Filter : It protects the earwax and other

dust particles from entering into the
earpiece which in turn spoils the sound
quality.
Components of Earphones :-

• Driver Unit :The element inside a

headphone that converts an electrical
signal into sound is known as a driver unit.

• Diaphragm :A diaphragm is the thin, semi-

rigid membrane attached to the voice coil,
which moves in a magnetic gap, vibrating
the diaphragm, and producing sound.
Components of Earphones :-

• Voice Coil : A voice coil is the coil of wire

that provides the motive force to the cone
by the reaction of a magnetic field to the
current passing through it.

• Microphone : An instrument for

converting sound waves into electrical
energy variations which may then be
amplified, transmitted.
What is Surface Mount Technology ?

• It is method of producing electronic

circuits in which components are placed
directly onto the surface of PCB.

• It has largely replaced the Through Hole

technology.

• It was developed in the 1960s by IBM.

SMT Process

• Solder Paste Printing

• Solder Paste inspection
• Component Placement
• Pre-Reflow Automated Optical Inspection(AOI)
• Reflow Soldering
• Post-Reflow Automated Optical Inspection
• Visual Inspection
Types of SMT

• The Type I assembly contains only surface mount components. The assembly is
generally single-sided.

• Type II SMT assembly contains only discrete surface mount components

(resistors, capacitors, and transistors) glued to the bottom side.

• The Type III assembly is a combination of Type III and Type I. It generally does
not contain any active surface mount devices on the bottom side but may contain
discrete surface mount devices on the bottom side.
Difference between SMT and TH Technology
SURFACE MOUNT TECHNOLOGY
1. The mounting machine must
determine the placement of parts.
2. Solder joints are comparatively weak.
3.Solder joints only retain the
components (sometimes with adhesives )
4. Final Assembly easily damaged by
handling.
5. Inspection difficult.
6. Rework complicated
THROUGH HOLE TECHNOLOGY
1. The holes define the correct position
of the components
2. Solder joints are very strong.
3. Crimped leads can be used to retain
the components.
4. Final Assembly will withstand
handling
5. Inspection is possible.
6. Rework is not difficult
SMD’s

SMD Resistor SMD Capacitor SMD Inductor

SMD Transistor SMD QFP

Advantages

• Smaller, lighter components.

• Fewer holes need to be drilled through abrasive boards.
• Fully automated assembly.
• Components can be fitted to both sides of the circuit board.
• Lower lead resistance and inductance.
• SMT parts have less cost.
Disadvantages

• The manufacturing process of SMT is much more sophisticated than through hole.
• Difficulty in manual handling due to the very small sizes .
• SMT is unsuitable for large, high-power, or high-voltage parts.
• SMDs cannot be used directly with plug-in breadboards.
• They Require magnification to be read.
Conclusion

• Surface Mount Technology is the backbone technology for any field.

• It is one of the emerging technology which has change the outlook of gadgets.
• Surface mount technology offers significant advantages for the mass production of
electronic equipment
• A lot of research is still required in it.
References

• Wikipedia

• Ray P Prasad ,“ Surface Mount Technology: Principles and Practice ”, Second

Edition.

• N Zulkelpy ,“ A miniaturization using Surface Mount Technology” , IEEE, Sept.

2012.

• James K. Hollomon , Jr ,“Surface mount technology for pc boards”.