MACHINE VISION BASICS

Presented By
K.SENTHILKUMAR,
AP-I, MCT
 MACHINE VISION SYSTEMS

• Sophisticated sensing mechanism that allows the machine to responds to its

environment in an intelligent and flexible manner.

• Robot vision, Computer vision, Artificial vision

• It is the process of extracting , Characterizing, Interpreting information from the

images of a three dimensional world

Major components:

• Camera
• Digitizing Hardware
• Computer
 MACHINE VISION SYSTEMS
• Machine vision is the technology to replace or complement manual inspections
and measurements with digital cameras and image processing
• Machine vision in operation can be described by a four-step flow:

1. Imaging: Take an image.

2. Processing and analysis: Analyze the image to obtain a result.
3. Communication: Send the result to the system in control of the process.
4. Action: Take action depending on the vision system's result
 OPERATIONS OF A MACHINE VISION SYSTEMS
1. Sensing and Digitizing image data

2. Image processing and Analysis

3. Applications
MACHINE VISION BLOCK DIAGRAM
MACHINE VISION BLOCK DIAGRAM
MACHINE VISION BLOCK DIAGRAM
 MACHINE VISION SYSTEM CLASSIFICATION

Based on the model of the scene

• Two dimensional vision systems
- Thresholding Technique-Binary image
• Three dimensional vision systems
- Special lighting technique and sophisticated image processing Technique required
- Two cameras

According to the number of grey levels used to characterize the image

• Binary scale Image
• Grey scale Image
• Colour Image
 APPLICATIONS

• Selecting the parts that are randomly oriented from a conveyer

• Part identification

• Limited Inspection

• Vision based guidance of robotic arm

• Complex inspection for close dimensional tolerances

• Improved recognition
 IMAGE ACQUISITION
• Image sensing requires image formation device(camera), digitizer

Types:

• Television Cameras

Vidicon camera

• Solid state Cameras

CCD- Charge Coupled Device

CID- Charge Injection Device
Silicon Bipolar Sensor
 VIDECON CAMERA TUBE

• The tube is used in a television camera to generate a train of electrical pulses

representing the light intensities present in an optical image focused on the tube.

• Photoconductive principle
• In some metal , when light photon fall on it then its conductivity / resistivity
change.
• Semiconductor metals like selenium, tellurium and lead with their oxide have this
property known as photoconductivity.
• The variation of resistance at each point across the surface of the material is
utilized to develop a varying signal by scanning it uniformly with an electron beam.
• Sections
• Target section
• Scanning section
• Electron gun
 CONSTRUCTION & WORKING
• The target consists of a thin photo conductive layer of either selenium or anti-
mony compounds.
• This is deposited on a transparent conducting film, coated on the inner surface of
the face plate. This conductive coating is known as signal electrode or plate
• Image side of the photolayer, which is in contact with the signal electrode, is
connected to DC supply through the load resistance.
• The beam that emerges from the electron gun is focused on surface of the photo
conductive layer by combined action of uniform magnetic field of an external coil
and electrostatic field of grid No 3.
• Grid No. 4 provides a uniform decelerating field between itself, and the photo
conductive layer, so that the electron beam approaches the layer with a low
velocity to prevent any secondary emission.
• The photolayer has a thickness of about 0.0001 cm, and behaves like an insulator
with a resistance of approximately 20 MΩ when in dark.
• With light focused on it, the photon energy enables more electrons to go to the
conduction band and this reduces its resistivity. When bright light falls on any area
of the photoconductive coating, resistance across the thickness of that portion
gets reduces to about 2 MΩ.
CROSS SECTION
 TARGET SECTION

charge-density pattern is formed by the imaged scene radiation

on photoconductive surface which is then scanned by a beam of low-
velocity electrons.
PRINCIPLE OF OPERATION
 CHARGE COUPLED DEVICE(CCD)
• CCD Cameras are very useful devices used for high resolution imaging

• converts an optical image into electrical signal

• The CCD chip is an array of Metal-Oxide-Semiconductor capacitors (MOS

capacitors), each capacitor represents a pixel

• Each pixel acts like a bucket for electrons. A CCD chip acquires data as light or
electrical charge.
• The charges are stored in the depletion region of the MOS capacitors.
• During an exposure, each pixel fills up with electrons in proportion to the amount
of light that enters it.
• Charges are moved in the CCD circuit by manipulating the voltages on the gates of
the capacitors so as to allow the charge to spill from one capacitor to the next
(thus the name “charge-coupled” device).
• The electronic signal is then processed by some other equipment and/or software
to either produce an image or to give the user valuable information.
 CHARGE COUPLED DEVICE(CCD)
• Solid State Device or Opto electronic component
• Array of Photo sites ( Silicon Elements)
• Number of electrons released depends on intensity and wavelength
• Photoelectric Effect: Photons to Electrons
Light photons hitting a Silicon surface will dislodge electrons

• A charge-coupled device (CCD) is a light-sensitive integrated circuit that stores and

displays the data for an image in such a way that each pixel (picture element) in
the image is converted into an electrical charge.
• Amount of charge collected at each photosite is proportional to illumination of
intensity at that location
 CCD TYPES

• CCD Line Sensor

- Line of photosites are exposed to the reflected light from object(image)

- Resolution is ranging from 256 to 2048 elements
 CCD TYPES

• CCD Area Sensor

- Photosites in matrix form
- Photosites are sequentially gated
- Resolution: 32X32 or 256 X 256
Max: 1024 X 1024 elements
 CCD (Charged-Coupled Device) cameras
• Tiny solid state cells convert light energy into electrical
charge.
• The image plane acts as a digital memory that can be read
row by row by a computer.
 Frame grabber
• Usually, a CCD camera plugs into a computer board (frame
grabber).
• The frame grabber digitizes the signal and stores it in its
memory (frame buffer).
 MACHINE VISION APPLICATIONS TYPES
• Machine vision applications can be divided into four types from a technical point of
view: Locate, measure, inspect, and identify
• LOCATE
In locating applications, the purpose of the vision system is to find the object and
report its position and orientation

• MEASURE
In measurement applications the purpose of the vision system is to measure physi-
cal dimensions of the object
 MACHINE VISION APPLICATIONS TYPES
• INSPECT
Presence or absence of a correct label on a bottle, screws in an assembly, chocolates in a
box, or defects.

• IDENTIFY
In an identification application the vision system reads various codes and alphanumeric
characters