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1.Background
2.Research Route
3.Problem Statement
4.Objective
5.Scope
6.Literature Review
7.Methodology
8.References
Curing
• Hotplate curing with the aid of DLP (fabric
substrates)
• Oven curing (Curvature Substrates)
• Curing time and curing temperature as
controlled parameter.
Morphological Analysis
• Line width
• Line thickness
• Cross sectional area
• Total length
Electrical Analysis
• Resistance (Digital Multi-meter)
• Resistivity (IV test station)
• Conductivity (Calculation)
Functional Test
• Bending angle test (Fabric substrates)
• Bending curvature radius (curvature
substrates)
• Relationship between electrical, mechanical
and morphological analysis
Inkjet Printing:
• High solid fractions in nozzles may inevitably results
in clogging.
• Non-uniform surface morphology and bad shape
fidelity
• UHF RFID Antenna printed on Polyimide (PI) (Hu et al.,
2014).
Flexography Printing:
• Substrates will undergoes a series of station for the
image to be printed
• Printing process that limited only to flat and flexible
surface.
• Flexible strain gauge on paper substrates (Maddipatla
et al., 2015).
Screen Printing:
• Based on stencil process, also as one of the prominent
technique for non-contact alongside inkjet and die
coating.
• Wide range of substrates
• Flexible strain gauge on Polyethyleneterephtalate
(PET) substrates (Moorthi et al., 2012).
Master Project 2 - Master of Mechanical Engineering (MDM)
Literature Review
3. Conductive Ink
Similarities
Using bending movement
Differences
Focusing in determine the overall Focusing only in determining the
electrical properties. changes of resistance occur in the
Most selected procedure use by strain gauge
researcher for flexible strain gauge. Often use by industries in calibration
of conventional strain gauge
Experiment Speed Height Temperature Time Experiment Speed Pressure Temperature Time
(mm/s) (mm) (ºC) (min) (mm/s) (bar) (ºC) (min)
1 3 0.5 110 15 1 4 0.6 140 30
2 3 1 130 30 2 4 0.7 160 40
3 3 1.5 150 45 3 4 0.8 180 50
4 4 0.5 130 45 4 5 0.6 160 50
5 4 1 150 15 5 5 0.7 180 30
6 4 1.5 110 30 6 5 0.8 140 40
7 5 0.5 150 30 7 6 0.6 180 40
8 5 1 110 45 8 6 0.7 140 50
9 5 1.5 130 15 9 6 0.8 160 30
4 parameter, 3 level, 2
substrates
5 5cm 2 1.12 - -
4cm 6 2.21 - -
4 3cm
1 2.48 - -
2cm
3 3 3.68 - -
2
1
0
Sample Sample Sample Sample Sample Sample Sample Sample Sample
1 2 3 4 5 6 7 8 9
Number of Sample
Strain introduced are in form of curvature bending radius. The lower the bending
curvature radius, the higher the strain of the ink track. Four of the sample break
on the first bending test. The one manage to past the bending test exhibit the
same trend as fabric substrates. As mention, the flexibility of the sample are
depending on the cross section area and the hardness value of ink track.
ABSTRACT - Smart textile requires flexible electronics that can withstand everyday typical
stress. Printing technology gives the leisure of flexibility properties on electronic thus allowing it to
be used on smart textiles. However, current printing techniques suffer from ink incompatibility
and limited of substrates to be printed with. An alternative of fabrication flexible printed
electronics are being propose are automatic fluid dispensing system. Strain gauge fabricated
using this method are proven functional. It can detect different strain induced to it through the
changes of resistance in it. Average resistance of the strain gauge may increase more than 200%
of its original value before the elasticity of the strain gauge start to break. The strain gauge also
exhibit an excellence value in elasticity of the strain gauge. The strain gauge can be bend up to
80° bending angle.
Khan, S., Lorenzelli, L., Dahiya, R. S., & Member, S. (2015). Technologies for
Printing Sensors and Electronics Over Large Flexible Substrates : A Review,
15(6), 3164–3185.
Leenen, M. A. M., Arning, V., Thiem, H., Steiger, J. and Anselmann, R. (2009),
Printable electronics: flexibility for the future. Phys. Status Solidi A, 206:
588–597. doi: 10.1002/pssa.200824428
Maddipatla, D., Narakathu, B. B., Guruva, S., Avuthu, R., Emamian, S., &
Eshkeiti, A. (2015). A Novel Flexographic Printed Strain Gauge on Paper
Platform, 8–11.
Moorthi, A., Narakathu, B. B., Reddy, A. S. G., Eshkeiti, A., Bohra, H., &
Atashbar, M. Z. (2012). A novel flexible strain gauge sensor fabricated using
screen printing, 765–768.
Abhinav K, V., Rao R, V. K., Karthik, P. S., & Singh, S. P. (2015). Copper
conductive inks: synthesis and utilization in flexible electronics. RSC Adv.,
5(79), 63985–64030. http://doi.org/10.1039/C5RA08205F
Roberson, D. A., Wicker, R. B., Murr, L. E., Church, K., & MacDonald, E.
(2011). Microstructural and process characterization of conductive traces
printed from Ag particulate inks. Materials, 4(6), 963-979.
Cheng, J., Lukowicz, P., Henze, N., Schmidt, A., Amft, O., Salvatore, G. A., &
Tröster, G. (2013). Smart Textiles : From Niche to Mainstream, 81–84.
Master Project 2 - Master of Mechanical Engineering (MDM)
References
Soukup, R., Blecha, T., Hamacek, A., & Reboun, J. (2014). Smart Textile-
Based Protective System for Firefighters.
D, Angelo L. T., & Kreber, K. (2010). FBG-based smart textiles for continuous
monitoring of respiratory movements for heaIthcare applications.
Singh, B. M., Haverinen, H. M., Dhagat, P., & Jabbour, G. E. (2010). Inkjet
Printing — Process and Its Applications, 90014, 673–685.
http://doi.org/10.1002/adma.200901141
Kim, D., Jeong, S., Park, B. K., & Moon, J. (2006). Direct writing of silver
conductive patterns : Improvement of film morphology and conductance by
controlling solvent compositions, 2006–2008.
http://doi.org/10.1063/1.2424671
Thompson, A. B., Tipton, C. R., Juel, A., Hazel, A. L., & Dowling, M. (2014).
Sequential deposition of overlapping droplets to form a liquid line.
Novaković, D., Kašiković, N., Vladić, G., & Pál, M. (2016). 15 - Screen
Printing. In J. Izdebska & S. Thomas (Eds.), Printing on Polymers (pp. 247–
261). William Andrew Publishing.
http://doi.org/http://dx.doi.org/10.1016/B978-0-323-37468-2.00015-4
Zhao, YX., Li, HX., Ding, H. et al. Int J Adv Manuf Technol (2005) 26: 1.
doi:10.1007/s00170-003-1978-2
Quinones, H., Babiarz, A., & Fang, L. (2002). Jetting technology: a way of the
future in dispensing. In Proceedings of the 4th International Symposium on
Electronic Materials and Packaging, 2002. (pp. 7–14).
http://doi.org/10.1109/EMAP.2002.1188806
Inoue, M., Tada, Y., Muta, H., Hayashi, Y., & Tokumaru, T. (2012).
Development of Highly Conductive Inks for Smart Textiles.
Li, J., An, B., Qin, J., & Wu, Y. (2011). Nano Copper Conductive Ink for RFID
Application, (Apm), 91–93.
Li, Y., Qi, T., Cheng, Y., & Xiao, F. (2015). new copper ink with low sintering
temperature for flexible substrates, 848–851.
Soltani, A., Kumpulainen, T., & Mäntysalo, M. (2014). Inkjet P rinted N ano-
particle Cu P rocess fo r F abrication of R e-distribution L ayers on S ilicon W
afer, 1685–1689.
I, Huaxiang. L., Lui, X., Chen, S., Fu, C., & I, J. L. (2010). A Novel Isotropic
Conductive Adhesive with Ag Flakes , BN and SiC Nanoparticles, 49–53.
Master Project 2 - Master of Mechanical Engineering (MDM)
References
Hrehorova, E., Rebros, M., Pekarovicova, A., Bazuin, B., Ranganathan, A.,
Garner, S., … Boudreau, R. (2011). Gravure Printing of Conductive Inks on
Glass Substrates for Applications in Printed Electronics, 7(6), 318–324.
Shang, S., Fearon, E., Perrie, W., Edwardson, S., Dearden, G., & Watkins, K.
(2012). A thermal investigation on conductive silver ink tracks cured on
flexible substrates by repeating irradiations of ND: YAG laser at the
wavelength of 532 nm. In ICALEO Congress Proceedings (pp. 1304-1310).