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GERAN 2006 Workshop

eBSC Hardware & eTRAU outlook

© Siemens AG, October 2004


Communications
BR9.0 Technical Sales Workshop
eBSC Hardware

© Siemens AG, October 2004


Communications
What is eBSC?

 A new Siemens BSC Platform introduced in BR9.0 based


on ATCA standard:
1. Up to 4-fold capacity *) and lower footprint compared
to BSC120
2. All in one rack
3. STM-1/OC3 connectivity
4. Adopt state of the art technology
5. Independent scalability for U, T, C Plane
6. Wall mounting
7. Enhanced Flexibility, Scalability, Operability and
Serviceability

© Siemens AG, October 2004


8. Dimension: 2000 x 600 x 450 mm

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 3 Communications
Overview Siemens’ eBSC

Siemens eBSC(*):
Capacity
• 2000 TRX
• 1000 Cells
• 10.000 Erlang
• 400.000 BHCA
Protocols Deployment BYB501 (example) Deployment BYB501 (example) Deployment BYB501 (example) Deployment BYB501 (example) Deployment BYB501 (example)

• STM-1/OC-3
• E1/T1
• Gigabit Ethernet
Siemens eBSC : Competitor BSC Equipment:
• Most Compact BSC on the market • Three to ten times more footprint required
• Complete set of protocols supported • Some interfaces only realized by external
equipment
• Based on state-of-the-art ATCA platform
• Legacy platforms still widely used

© Siemens AG, October 2004


(*) Available 03/07

Competitors need up to 5 racks to achieve the same BSC capacity


 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 4 Communications
BSC capacity evolution overview

HC BSC /72 HC BSC/120 eBSC

BR6.0 BR 7.0/8.0 BR 9.0


Controlled TRXs 500 900 2000

Controlled Cells 250 400 1000

Controlled BTSE 200 200 500

Controlled TRAUs 32 48 100

PCM lines (Abis + 72 120 540 equivalents;


Asub+Gb) 288 E1 + 4 x 63 on
STM1*)
LAPD (Abis + Asub) 240 240 1300

SS7L 8 16 8 x 16

GPRS Channels 1280+256 2816+256 7650+850


(16kb/s channel on Abis)
Processing Capacity 3200/128000 4800/192000 10000/400000

© Siemens AG, October 2004


(Erl/BHCA) (Siemens TM)

*) More connectivity (PCM Lines) details on the next slide!

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 5 Communications
BSC Capacity Evolution - Static Capacity

PCM Lines (equivalent)


Controlled Cells

1000 144 540


(with
400
250 120 HS
72
Gb)
BR 6.0 BR 7.0/8.0 BR 9.0 BR 6.0 BR 7.0 BR 8.0 BR 9.0
BSC/72 BSC/120 eBSC BSC/72 BSC/120 BSC/120 eBSC

Data Throughput
GPRS Channels

136
8500
Mb/s
48
3072
24 Mb/s

© Siemens AG, October 2004


1536 Mb/s
BR 6.0 BR 7.0/8.0 BR 9.0 BR 6.0 BR 7.0/8.0 BR 9.0
BSC/72 BSC/120 eBSC BSC/72 BSC/120 eBSC
 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 6 Communications
eBSC Connectivity – PCM Lines

540 equivalent E1 ports achievable with 288 E1 ports + 4 STM1

 Three main configuration cases

 Abis/Asub on physical PCM only


 288 physical PCM lines supported via E1/T1 and Gb over Ethernet

 Mixed optical/physical PCM connectivity for Abis/Asub


 288 physical E1/T1 PCM ports as PCMB + PCMG
 252 E1/336 T1 equiv. PCM ports via channelized STM1/OC3 as PCMB + PCMS
 Gb also via STM1/OC3 or via Ethernet

 Full optical connectivity for Abis/Asub


 504 PCM E1 equivalents via channelized STM1/OC3 as PCMB+PCMS

© Siemens AG, October 2004


 Gb via STM1/OC3 or via Ethernet

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 7 Communications
Block Diagram

 LM-E1/T1 terminates PCM and L2 for Abis, Asub, Gb


GboIPoEth eBSC  LM-STM1 supports also Gb, Abis and Asub (VC-12)
 Gb is also supported via Ethernet
ShMC  MCP is O&M master
ShMC
UPM  Ethernet for IP-based O-link and LMT
LM-E1/T1
 X.25 for “legacy” O-link

UPM  Several APs support distributed Call Processing


LM-E1/T1
Abis  AP-M: SS7 for BSCMSC+RRM for selected cells
Asub
Gb
LM-E1/T1  AP-D(s): RRM for selected cells
X.25A AP-M
SM  Several UPMs support PS services
Lb LM
STM1/OC3 AP-D  SMAC provides
 Ethernet backbone for all blades in the same shelf
LM
STM1/OC3 MCP AP-D  Inter-shelf connections & Main Clock Generator
 Internal transport:
IP-based O-link  Signaling and O&M carried over IPC

© Siemens AG, October 2004


X.25-based O-link
 Voice and PS data carried over Ethernet
(X.25D)

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 8 Communications
Call Processing Signaling Flow (example)

eBSC UPM
LM-E1/T1
Asub
UPM
LM-E1/T1
= LAPD termination
Abis LM-E1/T1 = MTP2 termination
SMAC = L3
LM
STM1 AP
= SS7

LM
MCP AP
STM1

IP-based O-link X.25-based O-link

© Siemens AG, October 2004


N.B. Simplified picture (all inter-blade traffic has to go through SMAC; not
always shown for simplicity

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 9 Communications
Traffic Flow for Voice (example)

eBSC UPM
LM-E1/T1
Asub
UPM
LM-E1/T1
= TDM  conversion
Abis LM-E1/T1 PPPmux over Ethernet termination

SMAC
LM
STM1 AP

LM
MCP AP
STM1

IP-based O-link X.25-based O-link

© Siemens AG, October 2004


N.B. Simplified picture (all inter-blade traffic has to go through SMAC; not
always shown for simplicity

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 10 Communications
Example of packet data flow

eBSC UPM
LM-E1/T1
Gb
UPM
LM-E1/T1
= TDM  conversion
Abis PPPmux over Ethernet termination
LM-E1/T1

SMAC = PPPmux over Ethernet termination


LM Termination of Abis/Um/Gb_Application protocols
STM1 AP
= Termination of internal transport for PS data
LM (being defined)
Gb MCP AP Termination of Gb transport protocols
STM1

IP-based O-link X.25-based O-link

© Siemens AG, October 2004


Please note:
Simplified picture (all inter-blade traffic has to go through SMAC; not
always shown for simplicity
 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 11 Communications
HW components
 Functional modules designed for eBSC
 SMAC Switching Module And Clock
 LM-E1/T1 Line Interface E1/T1
 LM-STM1 Line Interface STM-1
 AP Application Processor
 MCP Main Central Processor
 UPM User Plane Module
 Flexible design allows a large variety of configurations
 Board position can be used for different board type
 Different line modules can be used for Abis, Asub and Gb
 Same HW module (General Purpose Processor) is reused for different

© Siemens AG, October 2004


applications (AP,MCP,UPM,LM-STM1) with different mezzanine

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 12 Communications
eBSC Redundancy Concept

 Functional modules designed for eBSC


 SMAC 1+1 Hot Redundancy
 LM-E1/T1 N+1 Hot Redundancy
 LM-STM1 1+1 Hot Redundancy
 AP 1+1 Hot Redundancy per each AP couple
 MCP 1+1 Hot Redundancy
 UPM N+1 Load Sharing

© Siemens AG, October 2004


 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 13 Communications
eBSC Equipment practice

ACFC Alarm
Panel
I/O
modules
FANS
Upper
shelf Shelf Manager, PEM, SAP
ATCA
blades

DC Panel
I/O
modules FANS
PEM Power Entry Module
SAP Shelf Alarm Panel
ATCA Lower
ACFC Alarm Collector &

© Siemens AG, October 2004


blades shelf
Fan Control

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 14 Communications
Rack view - Basic configuration (single shelf)

ALARM PANEL
Single Shelf configuration providing:
Ethernet
• up to 5 UPMs for (E)GPRS service
E1 E1
E1 E1 E1 E1 T1 S S T1
based Gb T1
0
T1 T1 T1 4
1 2 3 Or
M M 5
Or
e
m
p
I
/
O
I
/
O
e
m
p
• up to 6+1 LM-E1/T1
Upper
t

• 1+1 APs
t
y y

shelf Fan box


E1 E1E1 E1 E1 U U S S
/ / / / / P P MM U U UM MA A
T1 T1T1 T1 T1 M M
S P P P C C P P • 850 PDTCH/UPM
p or or M M MP P
a E1 E1
r 1 2 3 4 / / 0 1 2 1 0 0 1 0 1
• 128 PCM ports as PCMB+PCMG+PCMS
e T1 T1

Air inlet + supply inlet • Ethernet Gb via SMAC available


DC panel, filtering and distribution
Exhaust air channel
• Up to 1008 LAPD channels

• Up to 8*16 SS7 links (or equivalent


bandwidth)

© Siemens AG, October 2004


• STM-1 blades not planned in Basic
Rack (example) configuration

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 15 Communications
Rack view - Max connectivity, max GPRS capacity configuration
= “n” GE lines for
inter-shelf connections • 2000 TRX
ALARM PANEL • 8500 PDTCH
• 1700 EDGE Channels @ MCS9
E1
T1
• 136 Mbit/s max Abis packet bandwidth
(122.4 Mbit/s guaranteed)
E1 E1 E1 E1 E1 S S E1 E1 E1 E1 9
T1 T1 T1 T1 T1 M M T1 T1 T1 T1 Or
0 1 2 3 4 5 6 7 8 e
I I

• up to 540 PCM ports


m
/ / p
Upper O O t
y
shelf
Fan box
as Abis + Asub + Gb (288 E1/T1 + 4
E1 E1E1 E1 E1 E1 E1S S E1 E1U S S
/ / / / / / / MM/ / P
S
T
S
T
STM-1 links, providing 252 equivalent
T1 T1T1 T1 T1 T1 T1 T1 T1M T T
S
p
or
M M
E1 1 1
M
1
M
1
PCM links)
• Ethernet Gb via SMAC available
a
r /
0 1 2 3 5 6 0 1 7 8 T1 3 2 1 0
e

Air inlet + supply inlet


DC panel, filtering and distribution
Exhaust air channel
• 1300 LAPD
SM I/O SM I/O

S S
Fan box
• Processing capacity
Lower
A AU U U UU MM U UU U U MM
P P P P P P P P P P P P C C • 10000 Erlang (multiprocessor

© Siemens AG, October 2004


M M M MM M MM M M P P
shelf configuration possible)
0 1 9 8 7 6 5 0 1 4 3 2 1 0 0 1

Air inlet + supply inlet Rack (example)

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 16 Communications
eBSC Rack view - max processing capacity configuration

= “n” GE lines for


inter-shelf connections • 2000 TRX
ALARM PANEL • 8500 PDTCH
Ethernet • 1700 EDGE Channels @ MCS9
Based Gb
S S
• 136 Mbit/s max Abis packet bandwidth
(122.4 Mbit/s guaranteed)
M M

I I
/ /

Upper
O O
• up to 540 equivalent PCM ports
shelf Fan box as Abis + Asub + Gb (8 STM-1 links,
S S S S S S S S
U U U U U S T M MT T T T T
P P P P P P M
S
T
S
T providing 540 equivalent PCM links)
M M M MM M M
MMMM M A 1
R
1 1 1 1 1 1 1 • Ethernet Gb via SMAC available
10 9 8 7 6 E 73 0 1 6 5 4 3 2 1 0

Air inlet + supply inlet • 1300 LAPD


DC panel, filtering and distribution
Exhaust air channel
SM I/O SM I/O
• Processing capacity
Fan box
S S
• 10000 Erlang (multiprocessor
Lower A A A A A A U MMU U UU U MM
P P P P P C C configuration possible)

© Siemens AG, October 2004


P P P P P P P
shelf - - - - - - M M M MM M P P
MMD D D D
0 1 2 3 5 0 1 4 3 2 1 0 0 1
4 5

Air inlet + supply inlet


Rack (example)
 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 17 Communications
eBSC Main Customer’s benefits

 Decrease CAPEX due to:


 Lower number of NE due to Higher Capacity
 Avoid external equipments in case High Speed interfaces (STM-1/OC3)
are used on Abis/Asub/Gb
 Decrease OPEX due to:
 Reduced footprint and volume
 Large scale integration (reduced number of spare parts)
 High Speed interfaces (STM-1/OC3) usage for reducing transport costs
 Future proof product, ready to grow
 Reuse eBSC HW modules for different products (currently in planning)

© Siemens AG, October 2004


 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 18 Communications
BR9.0 Technical Sales Workshop

eTRAU outlook

© Siemens AG, October 2004


Communications
eTRAU Highlights
 Based on same Hardware as eBSC
 Just inserting MSB (Media Stream Board)
 Common pool of spare parts – eBSC and eTRAU
 Apply eBSC and eTRAU in the same rack

insert

Capacity: 11000 codecs per rack


2 - fold capacity compared to competition
MSB board

eBSC eTRAU
Main Benefits
 savings on site leases
 savings on Installation and commissioning

© Siemens AG, October 2004


 savings on Operation and Maintenance
 Savings due to reduced spare part

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 20 Communications
eTRAU – Boost your Capacity by Saving Footprint

More than 10 times codec capacity per rack,


or …

© Siemens AG, October 2004


Cut the required footprint to less than 1/10

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 21 Communications
eTRAU Block Diagram

 Transcoder Card: MSB capacity is 1000 codec per board


 Same blade as MGW project
 Line Interfaces
 LM-E1/T1: 32 E1/T1 PCM lines/board (reused from eBSC)
 STM1/OC3: 126 E1/168 T1 PCM lines/board (reused from eBSC)
 Switching unit: SMAC v3 (reused from eBSC)
 Controller: Main Control Processor MCP (reused from eBSC)

Nx4 MCP
MCP
A MSB
LM-E1/T1
LM-E1/T1
MSB
Asub N MSB LM Line Module
LM-E1/T1 SMAC AP Application Processor
SMAC MSB
MCP Main Control Proc.
A Nx4 MSB UPM User Plane Module

© Siemens AG, October 2004


STM1/ MSB
STM1/ MSB Media Stream Board
OC3 MSB
Asub N OC3 SMAC Switch a. Clock Module

 Com MN APAC TS MR 3/4 August 2006


eBSC Hardware & eTRAU outlook
Page 22 Communications
eTRAU Application – Integrated into eBSC Rack

ALARM PANEL
• Supports all functionalities of eTRAU
standalone
E1 E1
• Complete reuse of eTRAU hardware
• STM-1/OC3 interface support @ A interface
E1 E1 E1 E1 T1 S S T1
T1 T1 T1 T1 4 M M 5
0 1 2 3 Or Or
I I

• Capacity of integrated eTRAU is sufficient


e e
m / / m
p O O p
t t
y y
to cover the eBSC needs
Fan box
E1 E1E1 E1 E1 U U S S • SW/HW prepared to support new features
/ / / / / P P MM UU U M MA A
T1 T1T1 T1 T1 M M P P P C C P P
S
p or or MM MP P
a E1 E1
r 1 2
3 4 / / 0 1 2 1 0 0 1 0 1
e T1 T1
Air inlet + supply inlet
DC panel, filtering and distribution
Exhaust air channel
SM I/O SM I/O

Fan box
M
M M MM M M S S M M M
SS S S S S S M M S C C
B
B B B B B B B P P

S
00 1 2 3 4 5 0 1 P 0 1

© Siemens AG, October 2004


Air inlet supplyinlet

eTRAU Shelf
eBSC (Basic)
 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 23 Communications
Capacity
Same architecture for eBSC and eTRAU

ATCA - Advanced Telecom. Computing Architecture

high availability: >99.999% - “the five nines”

open multi vendor architecture

transport support for TDM, ATM and IP


same platform for the upcoming eTRAU
allows BSC and TRAU in one rack

wall mounting option

© Siemens AG, October 2004


 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 24 Communications
Thank you for your attention
Any Questions?

© Siemens AG, October 2004


 Com MN APAC TS MR 3/4 August 2006
eBSC Hardware & eTRAU outlook
Page 25 Communications

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