PRESENTED BY

NISHIYA VIJAYAN
S1 MTech
SNGCE
CONTENTS
About MEMS
Basic block diagram
1. Micro actuator
2. Micro sensor
Classification
Fabrication
Advantages
applications
ABOUT MEMS
Mechatronic s/ms with mechanical and
electrical components, driven by electricity
MEMS are also referred to as micro machines
or Micro Systems Technology
micro scale dimensions (1mm = 1000
microns)sub micrometer to millimeter
COMPONENTS OF MEMS
BASIC BLOCK DIAGRAM
i/p signals: signals admitted to the
MEMS from various sourses/systems-
electrical/mechanical/chemical/optical
MEMs package's chip fabricated by
micromachining technique/ fabrication
technology
O/P signals:Signals interacted with the
s/m to be controlled/monitored
MICROACTUATOR
Mechanical device
For controlling or moving something
Converts Electrical signal to physical
signals
TRANSDUCTION UNIT:converts i/p power
supply to voltage
Driving supply varies depending on
applications
MICROSENSOR
Sensor:one form of energy into
another and provides the user with a
usable energy o/p in response to
specific measurable i/p
Used to sense diff.physical
parameters like
temp,pressure,sound,force,humidity
and so on
CLASSIFICATION
Classified by electromagnetic systems and geometry
According to em
1.open ended
2.endless/closed
3.integrated type
According to geometry
Plate,Spherical,Torroidal,conical,cylindrical,
asymmetrical
MATERIALS N PROCESS
MATERIALS FOR MEMS MANUFACTURING
Silicon
Polymers
Metals
Basic Process
Deposition
Patterning
Etching
FABRICATION
Originally used IC fabrication
techniques and materials
More MEMS-specific fabrication
techniques and materials are now in
use
Micromachining is key fabrication
technology
3 main categories of MEMs fabrication
1.Bulk micromachining
2.Surface micromachining
3.LIGA technology(lithographic-
galvanic Abformung
BULK MICROMACHINING
It uses modified CMOS technology
Uses wet/dry etching techniques from
Si substrate
3-D microstructures are formed by
etching away the bulk of Si wafer and
areas of Si substrate
3 etching process
SURFACE MACHINING
It’s a thin film process
It uses standard CMOS process
Used to produce microscale actuators,sensors and
MEMS
LIGA
To produce high aspect ratio MEMS
Divided into 3 steps
1.deep xray lithography
2.photoresist with desired pattern
3.electroplating
Produce micro gears and microstructures
Produce nonsilicon based microstructures
Produce flat and parallel surfaces
ADVANTAGES
Leads to miniaturisation
Mass fabrication
Higher accuracy
Better stability
APPLICATIONS
Used in instrumentation
Process control system
Industry
Medical applications
Biomedical applications
FUTURE APPLICATIONS
Biological applications:
Lab-on-a-Chip
Micro pumps
Resonant microbalances
Micro Total Analysis systems
Mobile communications:
Micromechanical resonator for resonant circuits
and filters
Optical communications:
Optical switching
REFERENCE
www.google.com
MEMS AND MOEMS BY ROY CHAUDHARY
Wikipedia
??
1947 Shockley et al./Bell Labs – Invention of the transistor
1958 Kilby/Texas Instrument – Invention of the integrated
circuit
1959 Feynman – “There Is Plenty of Room at the Bottom”1
1962 Tufte et al./Honeywell – First etched silicon
membrane
1972 National Semiconductor, Inc. – Commercial silicon
pressure sensor

 
• 1977 Texas Instrument – Thermal print head
1977 IBM – Ink jet nozzle
1982 Petersen – “Silicon as a Mechanical
Material”2
1983 Angel, et. al. – “Silicon Micromechanical
Devices”3
1980–1990 Beams, motors, valves
1990–2000 Accelerometers, gyroscopes, hinges,
automotive applications