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■ Scaling
■ Moore’s Law
■ 3D VLSI
The beginning
Microprocessors are essential to many of the
products we use every day such as TVs, cars, radios,
home appliances and of course, computers.
Transistors are the main components of
microprocessors.
Wafer size: Wafers, which are round polished disks made of silicon, provide the base
on which chips are manufactured. Use a bigger wafer and you can reduce
manufacturing costs. Intel has begun using a 300 millimeter (about 12 inches)
diameter silicon wafer size, up from the previous wafer size of 200mm (about 8
inches).
Major Design Challenges
■ Microscopic issues ■ Macroscopic issues
– ultra-high speeds – time-to-market
– power dissipation and – design complexity (millions
of gates)
supply rail drop
– high levels of abstractions
– growing importance of
– design for test
interconnect
– reuse and IP, portability
– noise, crosstalk
– systems on a chip (SoC)
– reliability,
– tool interoperability
manufacturability
– clock distribution
Year Tech. Complexity Frequency Staff Size Staff Costs
1997 0.35 13 M Tr. 400 MHz 210 $90 M
1998 0.25 20 M Tr. 500 MHz 270 $120 M
1999 0.18 32 M Tr. 600 MHz 360 $160 M
2002 0.13 130 M Tr. 800 MHz 800 $360 M
Integrated Circuits
■ Digital logic is implemented using transistors in integrated circuits
containing many gates.
– small-scale integrated circuits (SSI) contain 10 gates or less
– medium-scale integrated circuits (MSI) contain 10-100 gates
– large-scale integrated circuits (LSI) contain up to 104 gates
– very large-scale integrated circuits (VLSI) contain >104 gates
■ Improvements in manufacturing lead to ever smaller transistors
allowing more per chip.
– >107 gates/chip now possible; doubles every 18 months or so
■ Variety of logic families
– TTL - transistor-transistor logic
– CMOS - complementary metal-oxide semiconductor
– ECL - emitter-coupled logic
– GaAs - gallium arsenide
What are shown on previous diagrams cover only the so called front‑end
processing ‑ fabrication steps that go towards forming the devices and
inter‑connections between these devices to produce the functioning IC's. The
end result are wafers each containing a regular array of the same IC chip or
die. The wafer then has to be tested and the chips diced up and the good chips
mounted and wire‑bonded in different types of IC package and tested again
before being shipped out.
100
Die size (mm)
P6
486 Pentium ® proc
10 386
286
8080 8086
8085 ~7% growth per year
8008
4004 ~2X growth in 10 years
1
1970 1980 1990 2000 2010
Year
Courtesy, Intel
Clock Frequency
Lead microprocessors frequency doubles every 2 years
10000
P6
100
Pentium ® proc
486
10 8085 386
8086 286
1 8080
8008
4004
0.1
1970 1980 1990 2000 2010
Year
Courtesy, Intel
Examples of Cost Metrics (1994)
Chip Metal Line Wafer Defects/c Area Dies/wa Yield Die
layers width cost m2 (mm2) fer cost
386DX 2 0.90 $900 1.0 43 360 71% $4
486DX2 3 0.80 $1200 1.0 81 181 54% $12
PowerPC 4 0.80 $1700 1.3 121 115 28% $53
601
HP PA 7100 3 0.80 $1300 1.0 196 66 27% $73