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Experimental Set-up
1 mm
Figure 3: (a) Schematic of experimental set-up; pressurized water forces flow through channel while mass flow controller regulates water flow rate. Cartridge and film heaters connected to power supply heats channel while thermocouples track temperature fluctuation along length of channel. A high-speed camera capture flow regimes. (b) Actual experimental set-up. (c) Microchannel test device with five thermocouples equally distributed over channel length.
(a)
(b)
(c)
Results
Flat Copper Channel TMV-coated Copper Channel
(a) 0 s (a)
(a) 0 s
18 mm t (b)
Liquid Boundary Layer
(c) 2.4 s
(c) 0.38 s
(d) 2.7 s
2 m
Slug 18 nm
Figure 6: Comparison of flow at 1 ccm and 25 W on two channels.(a) In the flat copper channel, greater heat eventually leads to a dryout phenomenon, preventing heat removal from the channel. (b) In the TMV-coated channel, the wicking properties keep the walls of the channel wetted; annular flow with a liquid boundary layer is developed, preventing dryout.
Two microchannels, flat copper and nickel coated TMV, are subjected to two-phase flow. The super hydrophilic TMV-coated channel should keep the walls significantly more wetted, promoting the heat removal quality of the device and preventing a dryout phenomenon.
Figure 4: Two-phase flow through flat copper microchannel at 1.5 ccm and 15 W. The flow goes through a cycle described by: (a) Vapor bubble formation growth; (b) Further growth of bubble; (c) Development of elongated bubble; (d) Slug formation. The cycle occurs within 3 s.
Figure 5: Two-phase flow through TMV-coated copper microchannel at 1.5 ccm and 17.4 W. (a) Vapor bubble nucleation; (b) Bubble growth; (c) Bubble coalescence and departure. This cycle occurs much faster than flat copper s, and bubble departure size is significantly smaller.
Copper channel for uniform heat Teflon Case for insulation Polycarbonate cover Cartridge heater inserted in Cu Thin Film Heater under Cu Dimensions:1mm x 1mm x 30mm
TMV
References
[1] Ting Y. Liu. Int. J. Heat and Mass Trans. 54 (2011) 126-134 [2] Gerasopoulos, K. J. Micrmech. Microeng. 18 (2008) 104003 (8pp)