} Definition

of

Wafers } Pure Silicon } wafer formation process

1.

2.

3. 4.

Silicon Ingot growth Crystal Shaping process Wafer slicing Wafer inspection and Packing

Formation of silicon wafers

A 300mm silicon wafer

A thin disk of pure silicon ( 99.99% purity) semiconductor used as a substrate material for Integrated Circuits ( ICs).

Silica SiO2

99.99% pure Poly crystalline Silicon (EG-Si)

Reduction of silica with carbon and reacting the obtained MG-Si with gaseous HCL to get MGEG-Si the pure EG-Si.

Step 1
Silicon Crystal Growth

Step 2
Crystal Shaping Process

Step 3
Wafer Slicing

Step 4
Wafers preparatio n steps

Polysilicon 2500oC

Seed crystal

Czochralski Process

Cropping

Testing

Grinding

Flats grinding

Crystal Shaping process

Cropping
Tang

Testing

Grinding

Flats grinding
Crown

Cropping

Cropping

Testing

Grinding
Testing Slice

Flats grinding

Testing

Cropping

Testing

Grinding

Flats grinding

Centerless grinding

Center grinding

Grinding
This process aims to obtain the specified diameter of the wafer

Cropping

Testing

Grinding

Flats grinding

Flat

Flats grinding
Flats are a straightened parts of the wafers that have below 200mm diameters.

Edge Contouring

Wafer lapping

Wafer etching

Wafer polishing

Wafer cleaning

Edge Contouring

Wafer lapping

Wafer etching

Wafer polishing

Wafer cleaning

Counter Rotating Lapping machine

Edge Contouring

Wafer lapping

Wafer etching

Wafer polishing

Wafer cleaning

Etching purpose is to remove any damaged layers which may be 10 m deep

Edge Contouring

Wafer lapping

Wafer etching

Wafer polishing

Wafer cleaning

Slurry consists of SiO2 and NaOH The purpose of polishing is to produce a smooth, specular surface on which device features can be defined by photolithography.

Edge Contouring

Wafer lapping

Wafer etching

Wafer polishing

Wafer cleaning

Wafer cleaning is meant to clean wafers from any contamination source: 1. Airborne bacteria 2. Grease and wax from physical handling. 3. Metals and abrasive elements such as : silica , diamond dust and alumina from lapping ,sewing and polishing processes.

o Some wafers properties such as: flatness, thickness, resistivity and type are inspected to meet customers specifications. o Wafers are then packed in cassettes and shipped to the customer such as AMD or Intel

en.wikipedia.org/wiki/Wafer_(electronics) http://en.wikipedia.org/wiki/Seed_crystal http://en.wikipedia.org/wiki/Crystal_structure http://www.xtal.iqfr.csic.es/Cristalografia/index-

en.html http://www.semi.org/en/ http://en.wikipedia.org/wiki/Czochralski_process www.youtube.com/watch?v=aWVywhzuHnQ http://cleanroom.byu.edu/EW_formation.phtml http://cnx.org/content/m16627/latest/

Any Questions?