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No-0901209356
DIAMOND CHIP
INTRODUCTION
Electronics without silicon is unbelievable,
but it will come true in the years to come with the evolution of diamond or carbon chip. Now-a-days we are using silicon for manufacturing of electronic chips. But, it has many disadvantages when it is used in power electronics applications, such as bulk size, slow operating speeds, etc By using carbon as manufacturing material, we can achieve smaller, faster and stronger chips
Carbon chip is an electronic chip manufactured on a diamond structural carbon wafer. Or it can also be defined as the electronic component manufactured using carbon as the wafer.
The major component using carbon is CARBON NANOTUBE which is a nano-dimensional tube made of carbon. How????
discovered in 1991. It is a nano-sized cylinder of carbon atoms, allotropes of carbon with a cylindrical nanostructure. They are made of one or several concentric walls in which carbon atoms are arranged in hexagonal patterns, measuring several tens of microns in length and less than a few nanometres in diameter. Have many novel propertiespotentially useful in many apps.
1. 2. 3. 4.
into a tube, you'd have a carbon nanotube. The properties of Carbon nanotube depend on how you roll the sheet.
CARBON FEATURES.
Carbon will succeed silicon
as the predominant semiconducting material for the integrated circuits of the future. Carbon--which sits just above silicon on the periodic table can surpass silicons abilities in thermal performance, frequency range and perhaps even superconductivity.
One-dimensional carbon-
1nm-diameter nanotubes-could solve digital silicon's speed woes. Nanotubes will appear first as printable "inks" that are 10 times faster than competing organic transistors. zero-dimensional carbon-60-atom, hollow spheres of carbon called fullerenes-could answer silicon's inability to attain hightemperature superconductivity
was placed on top of silicon and was positioned over a metallic grate. Acid was used to dissolve the silicon, leaving graphene suspended across 500 nm gaps. A transmission electron microscope then revealed it is covered in tiny ripples, which keep the material stable. The ripples extend about 1 nm up and down and are around 25 nm across. It's not flat at all.
Advantages
SMALLER COMPONENTS ARE POSSIBLE-
As the size of the carbon atom is small compared to that of silicon atom, it is possible to etch very small lines through the diamond structural carbon. We can realize a transistor whose size is one in hundredth of the silicon transistor.
IT WORKS AT HIGHER TEMPERATURE-
Diamond is very strongly bonded material. It can withstand higher temperatures compared with that of silicon. At very high temperatures, the crystal structure of the silicon will collapse. But diamond chip can function well in these elevated temperatures. Diamond is a very good conductor of heat. So if there is any heat dissipation inside the chip, heat will very quickly get transferred to the heat sink or other cooling mechanics.
FASTER THAN SILICON CHIP Carbon chip works faster than silicon chip. The mobility of the electrons inside the doped diamond
structural carbon is higher than that in the silicon structure. As the size of the silicon is higher than that of carbon, the chance of collision of electrons with larger silicon atoms increases. But the carbon atom size is small, so the chances of collision are very less.
For power electronics applications silicon is used, but it has many disadvantages such as bulky in size, slow operating speed, less efficiency, lower band gap etc. So as a result, at very high voltages silicon structure will collapse. Diamond has a strongly
CONCLUSION
Thus diamond chip replaces the need of silicon in every aspect in future generations.
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