THERMAL AND FLUID FLOW ANALYSIS OF A PIN FIN HEAT SINK Click to edit Master subtitle style

Agnihothra Sarma O (M.Tech) THERMAL ENGINEERING B.V.C.ENGG COLLEGE ODALAREVU

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Agenda
Introduction Literature Survey Objective Software approach Simulation References
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Introduction
Due to rapid developments in the electronic

industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical

dimensions of electronic packages, thermal management is one of the most critical areas in electronic product development.
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Literature Survey

Plate fin heat sinks are commonly used devices for enhancing heat transfer in electronics components..

The choice of an optimal heat sink depends on a number of geometric parameters such as fin height, fin length, fin thickness, number of fins, base plate thickness, space between fins, fin shape or profile, material etc

Optimizing the above parameters to achieve low thermal

resistance and low pressure drop is very difficult. 6/23/12

Contd..
In order to select the optimal geometric

parameters of a heat sink for a particular application, a designer requires more design tools to predict heat sink performance.

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PLATE FIN HEAT SINK

PINFIN HEAT SINK

Pin fin heat sinks, (see

Figure 1), which contain an array of vertically oriented round pins made of copper or aluminum, deliver substantially greater performance than standard heat sinks with flat fins.

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Objective
In

this research work the sink is designed by

thermal model of the pin fin heat and varying the pin fin angles the fluid flow, thermal flow characteristics of heat sinks have been studied. And compared
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with

simulation

results that can be obtained

Software approach
To select an optimal heat sink design,

preliminary studies on the fluid flow and heat transfer characteristics of a pin fin heat sink have been carried through CFD modelling and simulations.

The simulation is carried out with a

commercial CFD package provided by Fluent Inc.

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In CFD calculations, there are three main steps.

MODELING AND SIMULATION

1) PRE-PROCESSING 2) SOLVER EXECUTION 3) POST-PROCESSING

Pre-Processing is the step where the modelling

goals are determined and computational grid is created.

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References
Arularasan R. and Velraj R. CFD Analysis In a Heat Sink for Cooling of

Electronic Devices International Journal of The Computer, the Internet and Management Vol. 16.No.3 (September-December, 2008) pp 1-11.
R. Mohan1, and Dr.P. Govindarajan Experimental and CFD analysis of

heat sinks with base plate for CPU cooling

Seri Lee Optimum Design and Selection of Heat Sinks Aavid

Engineering Inc. Laconia, New Hampshire, Eleventh IEEE SEM1-THERMm Symposium.

R. Mohan1, and Dr.P. Govindarajan Thermal Analysis of CPU with

Composite Pin Fin Heat Sinks International Journal of Engineering Science and TechnologyVol. 2(9), 2010, 4051-4062 6/23/12

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