Diagrama Celular LG-D722V

Internal Use Only
Service Manual
LG-D722V
Date: August, 2014 / Issue 1.0

Table Of Contents
1. INTRODUCTION�� 3 4. DOWNLOAD�� 132
1.1 Purpose��3
5. BLOCK DIAGRAM�� 149
1.2 Regulatory Information��3
1. 3 Specifications��5 6. CIRCUIT DIAGRAM�� 157
2. PERFORMANCE�� 10 7. BGA PIN MAP�� 178

2.1 Product Name�� 10
8. PCB LAYOUT�� 183
2.2 Supporting Standard�� 10
2.3 Main Parts : Main Chipset Solution�� 11 9. CALIBRATION�� 187
2.4 HW Features�� 11
2.5 SW Features�� 14 10. HIDDEN MENU�� 206
3. TROUBLE SHOOTING�� 26 11. DISASSEMBLE GUIDE�� 214

3.1 Checking XO Block�� 26 12. EXPLODED VIEW & REPLACEMENT PART LIST �� 218
3.2 Checking Transceiver DC Power Supply Circuit Block�� 28 12.1 Exploded View��218
3.3 Checking DC-DC Block�� 30 12.2 Replacement Parts��219
3.4 Checking FEMiD Block (GSM, W B1/2/5/8, LTE B1/2/3/7/8/20) 12.3 Accessory��251
�� 32
3.5 GSM RF Part�� 34
3.6 WCDMA RF Part�� 46
3.7 LTE RF Part�� 62
3.8 BT&WIFI PART�� 89
3.9 GPS Part�� 93
3.10 Power�� 99
3.11 Charger��103
3.12 Audio��106
3.13 LCD��119
3.14 Touch��121
3.15 Sensor��123
3.16 USB��127
3.17 Camera��129
LGE Internal Use Only -2- Copyright © 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1. 1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.
1. 2 Regulatory Information
A. Security
Tollll ffraud,
d the
h unauthorized
h d use off telecommunications
l system b
by an unauthorized
h d part (for
f example,
l
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring
the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is
immune from the above case but will prevent unauthorized use of common carrier
telecommunication service of facilities accessed through or connected to it. The manufacturer will not
be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone
l h company d
determines
i that
h the
h equipment
i provided
id d to customer iis ffaulty
l and
d possibly
ibl
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as repair
is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net work,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitation
Maintenance limitations on the p
phones must be p
performed onlyy byy the manufacturer or its authorized agent.
g
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.
1. INTRODUCTION
E. Notice of Radiated Emission

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
d ff
different.
G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. information is ESD
handling: Following
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
1. INTRODUCTION
1. 3. Specifications
1.3 Specifications
KEY FEATURES
• Android 4.4.2 - Powered Smartphone
• Up to 3 Customizable Home Screens
• 5” Touch Screen
• 8MP AF with flash, 1
1.3MP
3MP VT
• 1.2GHz Quad Core
• GSM/UMTS/LTE
• H.264, H.263, MPEG-4 Capable
ENHANCED USER EXPERIENCE

• Android 4.4.2 KitKat
• Home Screens – customize 3 screens with shortcuts to apps, favorites, and widgets
• Qremote – controls TV, DVD, Projector, etc with IrRC(remocon feature)
• Qslide – allows users to run an application in a mini window on top of any other application
• Quick memo – easy to take a note or capture screen
• Proximity Sensor – locks the touch screen and buttons while talking on the phone
• Motion Sensor – Digital compass , Accelerometer
• USB Charging via Computer
• Airplane Mode (RF Off)
• Knock on / knock code – easy to unlock with knock on or knock code
DESIGN
• Sleek and Stylish Design
• 5” HD LCD Display
• Capacitive Touch Screen – Glass with fast and accurate response
• Touch Vibration for Tactile Feedback
• Micro USB Charging Port
1. INTRODUCTION
1. Introduction
MOBILE MEDIA
• Android Market™ – browse and download thousands of free and paid apps from around the world
• Live Wallpaper – dynamic, animated backgrounds
• Full Web Browsing
• Connect to Social Networks – can download from Android market Twitter™*, Facebook®*,
MySpace™,* or added social networks
• Mobile Instant Messaging – Hangout™, AIM®,* Yahoo!® Messenger,* Windows Live™*
• Gmail™ and Email – mobile personal and corporate email
• Camera, Video, Gallery and ThinkFree viewer , File manager
*Applications downloaded from Android Market.
CAMERA/VIDEO
• 8MP AF with flash, 1.3MP VT CMOS Image sensor and Camcorder*

• Camera Resolutions: 8M(3264 x 2448), W6M(3264 x 1836), 5M(2448 x 2448), 3M(2048 x 1536)
• Camera and Video Zoom: up to 4x
• Cheese shutter, HDR, Gesture shot , Self-Timer, Panorama shot, Beauty shot
• Video Resolutions: FHD(1920 x 1080)(30fps), HD(1280 x 720),
• *Available in both video and camera modes.
MULTIMEDIA
• Video Player for MPEG-4,
• Music Player for MP3, AMR, AAC, AAC+, WAV
• Stereo Sound via Headset or Bluetooth
• Multitask While Playing Music in the Background
• Music Library – Organized by Artists, Albums, Songs, Folders and Playlists
• Repeat and Shuffle Music Playback Modes
• microSD Memory Slot with Support for up to 32GB Storage
• MTP – transfer files between microSD™ card and PC*
*USB cable (sold separately) and microSD card (included) required.
1. INTRODUCTION
1. Introduction
BLUETOOTH®
• Version: 4.0
• Save up to 100 Bluetooth Pairings*
• Supported Profiles: headset, hands-free, object push, advanced audio distribution (stereo), audio/video
remote control, file transfer, phone book access, message access, serial port
• Listen to Music with Optional Stereo Bluetooth Headset**
• Send User-Generated Pictures (JPEG) and Videos via Bluetooth Wireless Technology
*Depends on available memory.
**Accessories sold separately.
VOICE/AUDIO
• One-Touch Speakerphone*
• Text to Speech
• MP3 Music Ringer Support (clips from hit songs)
• Voice Memo Recording
• 20 Unique Ringtones + Vibrate and Silent Modes
*Only available during a call.
TOOLS & DATA
• Android Apps: Browser, Calculator, Calendar (Corporate or Google), Camera, Clock, Contacts, Email, Gallery,
Gmail, Market, Messaging, Music, Phone, Settings, Voice Recorder, Voice Search
• Wi-Fi Connectivity – IEEE 802.11b/g/n
1. INTRODUCTION
•
1. Introduction
Phone Book – unlimited fields* for numbers, emails, physical addresses, notes, nickname, web addresses,
events,, and a p
picture ID**
• FOTA Capable – upgrade firmware over the air
• GNSS and A-GPS Support for Enhanced Location Accuracy
*Depends on available memory.
**Dependent on photos stored in your gallery.
SPECIFICATIONS
• Technology: GSM/ WCDMA /LTE/GPS/BT/WiFi

• Frequencies:
Support Band TX Freq (MHz) RX Freq (MHz)
GSM850 824-849 869-894
GSM900 880-915 925-960
DCS1800 1710-1785 1805-1880

PCS1900 1850-1910 1930-1990
W2100(B1) 1920-1980 2110-2170

W1900(B2) 1850-1910 1930-1990
W850(B5) 824-849 869-894

W900(B8) 880-915 925-960
LTE B1 1920-1980 2110-2170
LTE B3 1710-1785 1805-1880
LTE B7 2500-2570 2620-2690

LTE B8 880-915 925-960
LTE B20 832-862 791-821
BT/WiFi 2400 MHz ~ 2483.5 MHz
GPS 1574.42 MHz ~ 1576.42 MHz
1. INTRODUCTION
• Data Transmission: EDGE, GPRS (Class 33) , HSPA+(Cat. 24), LTE(Cat 4)

• Dimensions: 127.95 X 65.9 X 10.25 mm
• Weight: 125.75g ( with Battery)
• Display: 5”, HD 1280 x 720 pixels, TFT
• Standard Battery: 2,540[mAh]
• Internal Memory Size: 8 GB
• MicroSD™ Memory Slot: up to 32GB memory card*
ACCESSORIES
• Standard Battery*
• Travel Adapter and USB Data Cable*
• Bluetooth Headset (Optional)
• Bluetooth Hands-free kit (Optional)
• Stereo Headset (Optional)
• Vehicle Power Charger (VPC) (Optional)
• Quick Window Cover (Optional)
2. PERFORMANCE
LG-D722v Product SPEC
2. PERFORMANCE
2.1 Product Name
2.1 Product Name
LG-D722v:LTE(FDD1/3/7/8/20)+WCDMA(FDD1/2/5/8)+EGSM/GSM850/DCS/PCS with seamless handover
LG-D722v : LTE(FDD1/3/7/8/20)+WCDMA(FDD1/2/5/8)+EGSM/GSM850/DCS/PCS with seamless handover Phase
Phase 2+(include AMR)
2+(include AMR)
2.2Supporting
2.2 Supporting Standard
Standard
Item Feature Comment
LTE(FDD1/3/7/8/20)+WCDMA(FDD1/2/5/8)+EGSM/GSM85
0/DCS/PCS with seamless handover
Supporting Standard Phase 2+(include AMR)
(LTE Cat. 4 / HSDPA Cat. 10 / HSUPA Cat.6 /HSPA+ Cat. 24/
EDGE,GPRS Multislot class 12)
LTE1 TX: 1920~1980 MHz
LTE1RX: 2110~2170 MHz
LTE3 TX: 1710~1785 MHz
LTE3 RX : 1805~1880 MHz
LTE7 TX : 2500~2570 MHz
LTE7 RX : 2620~2690 MHz
LTE8TX : 880~915 MHz
LTE8 RX : 925~960 MHz
LTE20 TX : 832~862 MHz
LTE20 RX : 791~821 MHz
WCDMA2100 TX: 1920~1980 MHz
Frequency Range WCDMA2100 RX: 2110~2170 MHz
WCDMA1900 TX: 1850~1910 MHz
WCDMA1900 RX: 1930~1990 MHz
WCDMA850 TX: 824~849 MHz
WCDMA850 RX: 869~894 MHz
WCDMA900 TX: 880~915 MHz
WCDMA900 RX: 925~960 MHz
EGSM TX : 880 – 915 MHz
EGSM RX : 925 – 960 MHz
GSM850 TX : 824 – 849 MHz
GSM850 RX : 869 – 894 MHz
DCS1800 TX : 1710 – 1785 MHz
LGE Internal Use Only - 10 - Copyright © 2014 LG Electronics. Inc. All right reserved.
3
2. PERFORMANCE

DCS1800 RX : 1805 – 1880 MHz
PCS1900
DCS1800TXRX : 1850– –1880
: 1805 1910MHz
MHz
DCS1800 RX : 1805 – 1880 MHz
PCS1900 TX
PCS1900 RX :: 1930
1850 –– 1990
1910 MHz
MHz
PCS1900 TX : 1850 – 1910 MHz
PCS1900 GPS
RX : 1575.42: 1930MHz– 1990 MHz
PCS1900 RX : 1930 – 1990 MHz
GLONASS : 1601.72
GPS : 1575.42 MHzMHz
GPS : 1575.42 MHz
Application Standard GLONASSWAP 2.0 MHz
: 1601.72
GLONASS : 1601.72 MHz
Application Standard WAP 2.0
2.3 Main Parts :Main Chipset Solution
Application Standard WAP 2.0
2.3 Main
2.3Main Item Parts
Main Parts :Main
:Main Chipset
Chipset Solution
Solution
Part Name Comment
2.3 Parts : Main Chipset Solution
DigitalItem
Baseband MSM8926: Qualcomm
Part Name Comment
Item Part Name Comment
Analog Baseband
Digital Baseband MSM8926
MSM8926:: Qualcomm
Qualcomm
Digital Baseband MSM8926: Qualcomm
RF Baseband
Analog Chip WTR1625L
MSM8926 :: Qualcomm
Qualcomm
Analog Baseband MSM8926 : Qualcomm
PMIC
RF Chip PM8926 : Qualcomm
WTR1625L : Qualcomm
RF Chip WTR1625L : Qualcomm
WLAN
PMIC BCM4334 : Broadcom
PM8926 : Qualcomm
PMIC PM8926 : Qualcomm
WLAN BCM4334 : Broadcom
WLAN BCM4334 : Broadcom
2.4HW
2.4 H/W Features
Features
2.4
2.4 H/W
ItemFeatures
H/W Features Feature Comment
Form Factor
Item DOP type
Feature Comment
Item Feature Comment
Form Factor 1)DOP
Capacity
type
Form Factor DOP type
Battery Standard1): Capacity
Li-ion, 2540mAh
1) Capacity
Battery 2) Packing: Li-ion,
Standard Type : Hard Pack
2540mAh
Battery Standard : Li-ion, 2540mAh
2) Packing Standard :
Type : Hard Pack
Size 2) Packing Type : Hard Pack
127.95Standard
X 65.9 X 10.25
: mm
Size Standard :
Weight
Size 127.95 X 65.9 X125.75g
10.25 mm With Battery
127.95 X 65.9 X 10.25 mm
Weight LTE1 : -96.3dBm/10MHz
125.75g With Battery
Weight 125.75g With Battery
LTE3 :: -93.3dBm/10MHz
LTE1 -96.3dBm/10MHz
LTE1 : -96.3dBm/10MHz
LTE3 -94.3dBm/10MHz
LTE7 -93.3dBm/10MHz
RX sensitivity LTE7 : -94.3dBm/10MHz
LTE20
LTE8 : :-93.3dBm/10MHz
-93.3dBm/10MHz
RX sensitivity LTE8 : -93.3dBm/10MHz
RX sensitivity WCDMA1
LTE20 : -106.7dBm
: -93.3dBm/10MHz
WCDMA2 :: -106.7dBm
WCDMA1 -106.7dBm
WCDMA1 : -106.7dBm
WCDMA5 :: -106.7dBm
WCDMA2 -106.7dBm
WCDMA2 : -106.7dBm
WCDMA5 : -106.7dBm
WCDMA5 : -106.7dBm
4
2. PERFORMANCE
WCDMA8 : -106.7dBm
EGSM : -104.6dBm
GSM850 : -104.6dBm
DCS 1800 : -104.6dBm
PCS 1900 : -104.6dBm
GPRS compatibility GPRS Class 33
EDGE compatibility EDGE Class 33
LTE1: 22.5 / 10 MHz
LTE3: 23.5 / 10 MHz, Class3(LTE)
LTE/ LTE7 : 23.5dBm / 10 MHz, Class3(WCDMA)
WCDMA/ LTE8 : 22.5dBm / 10 MHz Class4 (EGSM)
GSM/ LTE20 : 23.5dBm / 10 MHz,, Class4 (GSM850)
TX output GPRS WCDMA : 24dBm/3.84MHz,+1/-3dBm Class1 (PCS)
power GSM850/ EGSM : 33dBm Class1 (DCS)
DCS1800/ PCS 1900 : 30dBm
GSM 850 : 26dBm E2 (GSM850)
GSM 900 : 25dBm E2 (GSM900)
EDGE
DCS 1800 : 24.5dBm E2 (PCS)
PCS 1900 : 24dBm E2 (DCS)
SIM card type Micro SIM(3FF) 3V /1.8V
Main LCD : TFT LCD

Display
(5.0”,HD1280X720pixels, 16.7MColors, TFT)
Built-in Camera 8M AF Camera and 1.3M FF front camera
Status Indicator Yes
Full Touch Screen Side Key : Power On,
Keypad
Side Key :3 Volume up/down
ANT Main : Internal Fixed Type
System connector 5 Pin u-USB
Ear Phone Jack 3.5 pi type
PC synchronization Yes
8GB eMMC
Memory
8Gb LPDDR2
Speech coding FR, EFR, HR,AMR
5
2. PERFORMANCE
Vibrator Built in Vibrator
Blue Tooth Bluetooth 4.0 + BLE
MIDI(for Buzzer
SW Decoded 72Poly
Function)
Music Player MP3/WMA/AAC/MIDI/EAAC+/HEAAC/OGG
Video Player MPEG4, H.264
Camcorder MPEG4 or H.263
Voice Recording Yes

Speaker Phone mode
Yes
Support
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable Yes

T-Flash
Yes ( Up to 32GB )
(External Memory)
6
2. PERFORMANCE
2.5
2.5SWH/W
Features
SPEC.
1)1)
GSM transceiver
GSM specification
transceiver specification
Item Specification
Rms : 5°
Phase Error
Peak : 20 °
GSM : 0.1 ppm
Frequency Error
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission Dist
GSM/DCS : < -28dBm
urbance)
Transmitter Output power and Burst GSM : 5dBm – 33dBm ± 3dB
Timing DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out to 200kHz : -36dBm
less than 1800kHz offset 600kHz : -51dBm/-56dBm
GSM :
1800-3000kHz :< -63dBc(-46dBm)
Spectrum due to modulation out to 3000kHz-6000kHz : <-65dBc(-46dBm)
larger than 1800kHz offset to the 6000kHz < : < -71dBc(-46dBm)
edge of the transmit band DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
400kHz : -19dBm/-22dBm(5/0), -23dBm
Spectrum due to switching transient
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection – Speech ± 800kHz, ± 1600kHz
channels : -98dBm/-96dBm (2.439%)
AM Suppression
- GSM : -31dBm -98dBm/-96dBm (2.439%)
- DCS : -29dBm
Timing Advance ± 0.5T
2. PERFORMANCE
2) WCDMA transmitter
2) WCDMA specification
transmitter specification
Item Specification
Band1 : 1920 – 1980 MHz

Band2 : 1850 – 1910 MHz
Transmit Frequency
Band5 : 824 – 849 MHz
Band8 : 880 – 915 MHz
Maximum Output Power +24dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPM
Normal Conditions : within ±9 dB,

Open Loop Power Control
Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage > 33 dB @ ±5 MHz,
Power Ratio (ACLR) > 43 dB @ ±10 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz
< -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MH
z
Spurious Emissions
< -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MH
|f-fc| > 12.5 MHz
z
< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MH
z
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6
MHz
Transmit Intermodulation < -31 dBc @ 5 MHz &< -41 dBc @ 10 MHz
8
2. PERFORMANCE

when Interference CW Signal Level = -40 dBc
Error Vector Magnitude when < 17.5 %, when

Interference Pout ≥Level
CW Signal -20 dBm
= -40 dBc
Peak
Error Code
VectorDomain Error
Magnitude < <17.5
-15%,dBwhen Pout ≥-20-20dBm
at Pout dBm
Peak Code Domain Error < -15 dB at Pout  -20 dBm
3) 3)
WCDMA receiver
WCDMA specification
receiver specification
3) WCDMAItem
receiver specification Specification
Item Band1 : 2110 – 2170 MHz

Specification
Band2 : 1930 – 1990 MHz
Receive Frequency Band1 : 2110 – 2170 MHz
Band5 : 869 – 894 MHz
Band2 : 1930 – 1990 MHz
Band5 : 869 – 894 MHz
Reference Sensitivity Level BER < 0.001 when
Band8 Îor
: 925= –-106.7 dBm / 3.84 MHz
960 MHz
Maximum
Reference Input Level
Sensitivity Level BER< <0.001
BER 0.001when
when ÎorÎor= =-106.7
-25 dBm
dBm/ /3.84
3.84MHz
MHz
Maximum
Adjacent InputSelectivity
Channel Level BER ACS > 33when
< 0.001 dB where
Îor =BER
-25<dBm
0.001/ 3.84
whenMHz
Îor = -92.7 dBm / 3.84 MHz
(ACS) ACS > 33 dB where BER < 0.001 when
Adjacent Channel Selectivity &Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Îor = -92.7 dBm / 3.84 MHz
(ACS) BER &Ioac
< 0.001 when Îor /=3.84
-103.7 dBm / 3.84
= –52 dBm MHz @ ±5 MHzMHz
&Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 M
&Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
Blocking Characteristic Hz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 M
BER < 0.001 when Îor Hz
= -103.7 dBm / 3.84 MHz
Spurious Response
&Iblocking = -44 dBm
BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
Spurious Response BER < 0.001 &Iblocking
when Îor= =-103.7 dBm / 3.84 MHz
-44 dBm
Intermodulation & Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Intermodulation & Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
Spurious Emissions & Iouw2-57

< dBmdBm
= -46 / 100 kHz MHz
/ 3.84 BW @@ 9Fuw2(offset)
kHz ≤ f < 1= GHz
±20 MHz
< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
< -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz
Spurious Emissions
< -47 dBm Adjust
/ 1 MHz BW @ 1 command)
output(TPC GHz ≤ f ≤ 12.75 GHz
cmd1dB 2dB 3dB
Adjust output(TPC command)
+1 +0.5/1.5 +1/3 +1.5/4
cmd1dB 2dB 3dB
Inner Loop Power Control 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
+1 +0.5/1.5 +1/3 +1.5/4
In Uplink -1 -0.5/-1.5 -1/-3 -1.5/-4
Inner Loop Power Control 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
In Uplink -1 -0.5/-1.5 -1/-3 -1.5/-4
9
2. PERFORMANCE
group(10equal command group)
+1 +8/+12 +16/+24
group(10equal command group)

+1 +8/+12 +16/+24
4) HSDPA transmitter specification

4) HSDPA transmitter specification
Item Specification
Band1 : 1920 – 1980 MHz
Band2 : 1850 – 1910 MHz
Transmit Frequency
Band5 : 824 – 849 MHz
4) HSDPA transmitter specification Band8 : 880 – 915 MHz
Item Specification
Sub-Test
Band1 : 1920 – 1980 MHz
1=2/15, 2=12/15 21~25dBm / 3.84 MHz
Maximum Output Power Band2 : 1850 – 1910 MHz
Transmit Frequency 3=15/820~25dBm / 3.84 MHz
Band5 : 824 – 849 MHz
4=15/4 19~25dBm / 3.84 MHz
Band8 : 880 – 915 MHz
Sub-test
Power ste
Sub-Test
in tabl Power Power step slot Transmitter power st
1=2/15, 2=12/15 p size, P
21~25dBm / 3.84 MHz
Maximum Output Power e C.10.1. step boundary ep tolerance [dB]
3=15/820~25dBm [dB]
/ 3.84 MHz
4
4=15/4 19~25dBm / 3.84 MHz
HS-DPCCH 1 Start of Ack/Na 6 +/- 2.3
Sub-test
ck Power ste
in tabl Power Power step slot Transmitter power st
5 2 Start of CQI p size,
1 P +/- 0.6
e C.10.1. step boundary ep tolerance [dB]
3 Middle of CQI 0
[dB] +/- 0.6
4
4 End of CQI 5 +/- 2.3
HS-DPCCH 1 Start of Ack/Na 6 +/- 2.3
ck
5 2 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6
4 End of CQI 5 +/- 2.3
10
2. PERFORMANCE
LG-D722v
LG-D722v Product
Product SPEC
SPEC
Sub-Test
Sub-Test :: 1=2/15,
1=2/15, 2=12/15,
2=12/15, 3=15/8,
3=15/8, 4=15/4,
4=15/4,
Frequency
Frequency offset
offset fro
fro Measurement
Measurement Band
Band
Minimum
Minimum requirement
requirement
m
m carrier
carrier ᇞf width
width
ᇞf : 1=2/15, 2=12/15, 3=15/8, 4=15/4,
Sub-Test
Spectrum
Spectrum Emission
Emission Mask
Mask 2.5
2.5 ~
~ 3.5
Frequency MHz
3.5offset
MHz fro -35-15×(ᇞf-2.5)dBc
-35-15×(ᇞf-2.5)dBc 30
30 kHz
kHz Band
Measurement
Minimum requirement
3.5
m ~
3.5 ~ 7.5
7.5 MHz
carrier MHz
ᇞf -35-1×(ᇞf-3.5)dBc
-35-1×(ᇞf-3.5)dBc 1 MHz
1width
MHz
Spectrum Emission Mask 7.5
2.5 ~
7.5 ~ 8.5
3.5 MHz
8.5 MHz -35-10×(ᇞf-7.5)dBc
-35-10×(ᇞf-7.5)dBc
-35-15×(ᇞf-2.5)dBc 1
1 MHz
30 MHz
kHz
8.5
3.5 ~
8.5 ~~ 12.5
12.5 MHz
MHz
7.5 MHz -49dBc
-49dBc
-35-1×(ᇞf-3.5)dBc 1
1 MHz
MHz
7.5 ~ 8.5 MHz -35-10×(ᇞf-7.5)dBc 1 MHz
Sub-Test
Sub-Test :: 1=2/15,
1=2/15, 2=12/15,
2=12/15, 3=15/8,
3=15/8, 4=15/4,
4=15/4,
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent
Adjacent Channel
Channel Leakage
Leakage
Power Ratio (ACLR)
Power Ratio (ACLR) >
> 33
33 dB
dB @
@ ±5
±5 MHz
MHz
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4,
> 43 dB @ ±10
> 43 dB @ ±10 MHzMHz
Adjacent Channel Leakage
Error
Error Vector
RatioMagnitude
Vector
Power Magnitude
(ACLR) <
< 17.5
17.5 >%,
%,33when
dB @Pout
when Pout ≥
≥ -20
±5 MHz-20 dBm
dBm
> 43 dB @ ±10 MHz
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
5) 5)
HSDPA receiver specification
5) HSDPA
HSDPA receiver
specification
Item
Item Specification
Specification
Band1 :: 2110
Band1 2110 –– 2170
2170 MHz
MHz
5) HSDPA receiver specification
ReceiveItem
Receive Frequency
Frequency Band2 Specification
Band2 :: 1930
1930 –– 1990
1990 MHz
MHz
Band5 :: 869
Band5 869 – 894
894 MHz
MHz
Band1 : 2110 –– 2170 MHz
Band8 : 925
Band8: :1930 – 960
925 –– 1990MHz
960 MHz
Receive Frequency Band2 MHz
Sub-Test : 1=1/15, 2=12/15,
Sub-Test : 1=1/15, Band5
2=12/15, 3=13/15,
3=13/15,
: 869 4=15/8,
– 894 4=15/8,
MHz 5=15/7,
5=15/7, 6=15/
6=15/
Maximum
Maximum Input
Input Level
Level
0
Band8 : 9250 – 960 MHz
(BLER
(BLER or
or R),
R), 16QAM
16QAM Only
Only
BLER
BLER <
< 10% or
or R
R >=
10% 3=13/15, 700kbps
>=4=15/8,
700kbps5=15/7, 6=15/
Sub-Test : 1=1/15, 2=12/15,
Maximum Input Level
0
(BLER or R), 16QAM Only
6)LTE
6)LTE transceiver
specification BLER < 10% or R >= 700kbps
6)LTE transceiver specification
Item
Item specification Specification
Specification
6)LTE transceiver
Band1
Band1 :: 1920-1980
1920-1980 MHzMHz
Transmit Frequency
Item Band3 :
: 1850 - 1910 MHz
1850 -
Band3Specification 1910 MHz
Transmit Frequency
Band7 : 2500 - 2570
Band7 : 2500 - 2570 MHz MHz
Band1
Band8 : 1920-1980 MHzMHz
Band8 :: 880-915
880-915 MHz
Transmit Frequency Band3 : 1850 - 1910 MHz
Band7 : 2500 - 2570 MHz
Band8 : 880-915 MHz
11
11
LG-D722v Product SPEC 2. PERFORMANCE
Band20 : 832 - 862 MHz

Maximum Output Power(ClassIII) +24 dBm / 10 MHz,
Frequency Error within ±0.1 PPM

Band20 : 832 - 862 MHz
Occupied Bandwidth < 10 MHz at 3.84 Mcps (99% of power)
Maximum Output Power(ClassIII) +24 dB
>-29.2 dBm / 10 MHz,
@E-UTRA ACLR1
Frequency Error within
> -32.2 dB ±0.1
@UTRAPPM
ACLR1
Power Ratio (ACLR)
Occupied Bandwidth < 10 MHz at 3.84
>-35.2 Mcps (99%
dB @UTRA of power)
ACLR2
< -36 dBm />-29.2
1 kHzdB
RW@E-UTRA ACLR1
@ 9 kHz ≤ f < 150 kHz
Spurious Emissions > -32.2
< -36 dBm / 10 dB @UTRA
kHz RW ACLR1
@ 150 KHz ≤ f < 30 MHz
Power Ratio (ACLR)
|f-fc| > 12.5 MHz >-35.2
< -36 dBm / 100 kHzdB
RW@UTRA
@ 30ACLR2
MHz ≤ f < 1 GHz
< <-30
-36dBm
dBm/ /1 1MHz
kHz RW
RW @@ 19 GHz
kHz ≤≤ ff << 12.75 GHz
150 kHz
Spurious Emissions < -36 dBmdBc
< -31 / 10@ kHz RW &<
5 MHz @ 150
-41 KHz ≤ f10< MHz
dBc @ 30 MHz
Transmit Intermodulation
|f-fc| > 12.5 MHz < -36 dBm
when / 100 kHz CW
Interference RW Signal
@ 30Level
MHz =≤ -40
f < dBc
1 GHz
Error Vector Magnitude < -30 dBm< /17.5
1 MHz RW @
%, when 1 GHz
Pout ≤ dBm
≥ -20 f < 12.75 GHz
Peak Code Domain Error < -31 dBc @ 5dBMHz

< -15 &< -41
at Pout dBcdBm
 -20 @ 10 MHz
Transmit Intermodulation
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
※Under by rules of 3GPP TS 36.521-1 Standard
Peak Code Domain Error < -15 dB at Pout  -20 dBm
* Under by rules
※Under byofrules
3GPP of
TS 36.521-1
3GPP TSStandard
36.521-1 Standard
7)LTE receiver specification

7)LTE receiver specification
Item Specification
7)LTE receiver specification Band1 : 2110–2170 MHz
Band3 : 1805 – 1880 MHz
Item Specification
Band8 : 925 – 960 MHz
Band1 :: 2110–2170
Band20 791 – 821 MHz
MHz
Band1 : BER Band3 : 1805 – 1880 MHz
< 0.001 when Îor = -96.3dBm / 10 MHz
Receive Frequency Band3 : BER <Band7
0.001 :when
2620 –Îor2690 MHz
= -93.3dBm / 10 MHz
Band7 : BER Band8 : 925 – 960 MHz
< 0.001 when Îor = -94.3dBm / 10 MHz
Reference Sensitivity Level
Band8 : BER < Band20 : 791 Îor
0.001 when – 821 MHz
= -93.3dBm / 10 MHz
Band1 :: BER
Band20 BER << 0.001
0.001 when
when Îor
Îor == -96.3dBm
-93.3dBm // 10
10 MHz
MHz
Band3 : BER < 0.001 when Îor = -93.3dBm / 10 MHz
Maximum Input Level BER < 0.001 when Îor = -25.7 dBm / 10 MHz
Reference Sensitivity Level Band7 : BER < 0.001 when Îor = -94.3dBm / 10 MHz
Maximum Input Level BER < 0.001 when Îor = -25.7 dBm / 10 MHz
LGE Internal Use Only 12-
- 19 Copyright © 2014 LG Electronics. Inc. All right reserved.
2. PERFORMANCE
ACS > 33 dB where BER < 0.001 when

Adjacent Channel Selectivity
Îor = -92.7 dBm / 3.84 MHz
(ACS)
&Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
BER < 0.001 when Îor = -88.3 dBm / 10 MHz

In-Blocking Characteristic (Δf = ± 7.5MHz, LTE BW 5MHz,
Δf = ± 12.5MHz, LTE BW 5MHz)
BER < 0.001 when Îor = -88.3 dBm / 10 MHz

Intermodulation
(Δf = ± 12.5MHz, CW Δf = ± 25MHz, LTE BW 5MHz)
< -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

Spurious Emissions
< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
※Under by rules of 3GPP TS 36.521-1 standard.
*Under by rules of 3GPP TS 36.521-1 standard.
2. PERFORMANCE
8)8)
WLAN 802.11b
WLAN transceiver
802.11b specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under
Frequency Tolerance within ±25 PPM
Chip clock Frequency

within ±25 PPM
Tolerance
≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz

Spectrum Mask
≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dB
Modulation Accuracy
≤ 35%
(Peak EVM)
< -36 dBm @ 30MHz ~ 1GHz

< -30 dBm above @ 1GHz ~ 12.75GHz
Spurious Emissions
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -85dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Adjacent Channel ≥ 35dB @FER ≤ 8%,

Rejection interference input signal -70dBm@fc±25MHz(11Mbps)
14
2. PERFORMANCE
9)9)
WLAN 802.11g
WLAN transceiver
802.11g specification
Item Specification
Tx Power Level ≤ 20dBm

within ±25 PPM
Tolerance
≤ -22 @ ±11MHz offset (9Mhz ~ 11MHz)

Spectrum Mask ≤ -30 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -42 @ ±30MHz offset (20MHz ~ 30Mhz)
≤-5dB@6Mbps, ≤-8dB@9Mbps, ≤-10dB@12Mbps,

Transmitter constellation error
≤-13dB@15Mbps, ≤-16dB@24Mbps, ≤-19dB@36Mbps,
(rms EVM)
≤-22dB@45Mbps, ≤-25dB@54Mbps
< -36 dBm @ 30MHz ~ 1GHz

Spurious Emissions
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
PER ≤ 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
Rx Min input Sensitivity
-66dBm@45Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
PER ≤ 10%,
ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps,
ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@15Mbps,
Rx Adjacent Channel ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps
Rejection ACR ≥ 0dB@45Mbps, ACR ≥ -1dB@54Mbps
※ACR shall be measured by setting the desired signal's stre
ngth 3 dB above the rate-dependent
sensitivity specified in min input sensitivity
2. PERFORMANCE
10) WLAN
10) 802.11n
WLAN transceiver
802.11n specification
Item Specification
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)

within ±25 PPM
Tolerance
≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)

Spectrum Mask ≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
≤ -5dB@6.5Mbps, ≤ -10dB@13Mbps, ≤ -13dB@19.5Mbps,

Transmitter constellation error
≤ -16dB@26Mbps, ≤ -19dB@39Mbps, ≤ -22dB@52Mbps,
(rms EVM)
≤ -25dB@58.5Mbps, ≤ -28dB@65Mbps
< -36 dBm @ 30MHz ~ 1GHz

Spurious Emissions
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
PER ≤ 10%
-82dBm@6.5Mbps, -79dBm@13Mbps, -77dBm@19.5Mbps
Rx Min input Sensitivity
-65dBm@58.5Mbps, -64dBm@65Mbps
Rx Max input Sensitivity ≥ -20dBm(6.5,13,19.5,26,39,52,58.5,65Mbps) @ PER ≤ 10%
PER ≤ 10%,
ACR ≥ 16dB@6.5Mbps, ACR ≥ 13dB@13Mbps,
ACR ≥ 11dB@19.5Mbps, ACR ≥ 8dB@26Mbps,
Rx Adjacent Channel ACR ≥ 4dB@39Mbps, ACR ≥ 0dB@52Mbps
Rejection ACR ≥ -1dB@58.5Mbps, ACR ≥ -2dB@65Mbps
※ACR shall be measured by setting the desired signal's stren
gth 3 dB above the rate-dependent
sensitivity specified in min input sensitivity
2. PERFORMANCE

11) GNSS
11) receiver
GNSS specification
11) GNSS receiver
Item specification Specification
Item Specification
GPS : 1574.42 MHz ~ 1576.42 MHz
ReceiveFrequency GPS : 1574.42 MHz ~ 1576.42 MHz
ReceiveFrequency GLONASS : 1598 MHz ~ 1606 MHz
GLONASS : 1598 MHz ~ 1606 MHz
Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
12) RSSI Display

12) RSSI Display
12) RSSI Display
LTE
RSSI BAR GSM WCDMA LTE Comment
(단위 :dBm/15khz)
RSSI BAR GSM WCDMA Comment
(단위 :dBm/15khz)
BAR 5->4 - 90dBm±3dB - 87dBm±3dB -81 ~ -91
BAR 5->4 - 90dBm±3dB - 87dBm±3dB -81 ~ -91 1. Call Connec
BAR 4->3 - 96dBm±3dB - 93dBm±3dB -92 ~ -101 1. Call ConnecL
ted & CPIPH
BAR 4->3 - 96dBm±3dB - 93dBm±3dB -92 ~ -101
BAR 3->2 - 98dBm±3dB - 99dBm±3dB -102 ~ -111 tedevel=-3.3
& CPIPH L
BAR 3->2 - 98dBm±3dB - 99dBm±3dB -102 ~ -111 evel=-3.3
BAR 2->1 - 102dBm±3dB - 103dBm±3dB -112 ~ -121
BAR 2->1 - 102dBm±3dB - 103dBm±3dB -112 ~ -121 2. LTE: RSRP
BAR 1->0 - 104dBm±3dB - 109dBm±3dB -122 ~ -133 2. LTE: RSRP
BAR 1->0 - 104dBm±3dB - 109dBm±3dB -122 ~ -133
Measure RSSI after 10 seconds when you change power
Measure
MeasureRSSIRSSI
afterafter
10 seconds when when
10 seconds you change power power
you change
13) Charging Time

13) Charging
13) Charging Time
Under 4 hours forTime
2540mAh charging
Under 4 hours for 2540mAh charging
Under 4 hours for 2540mAh charging
14) Travel Charger

14) Travel Charger
14)
InputTravel
: 100 ~ Charger
240 V, 50/60 Hz
Input : 100 ~ 240 V, 50/60 Hz
Input
Output : 100 ~V,240 V, 50/60 Hz
Output : 5.0: 5.0
V, 0.850.85
A A
Output : 5.0 V, 0.85 A
15)15) Battery
Battery Type
Type
15)
Li-ion Battery
Li-ion Battery
Battery Type
Pack,
Pack, 2540
2540 mAhmAh
Li-ion
Standard Battery
Voltage
Standard Pack,
Voltage V,2540
: 3.8: 3.8 mAh
Battery Full Full
V, Battery Charge Voltage
Charge : 4.35V
Voltage : 4.35V
Standard Voltage : 3.8 V, Battery Full Charge Voltage : 4.35V
2. PERFORMANCE
16)
16)Current
CurrentConsumption
Consumption
Specification
GSM WCDMA LTE
7.3mA @ DRX
Standby 4.5mA @ P.P 5 4.5mA @ DRX 7
2.56sec
600mA @ Max pwr

Talk 340mA @ GSM LVL 5 430mA @ TX 10dBm
260mA @ TX 10dBm
Power Off M
300uA under
ode
17) Battery Bar

17) Battery Bar
Battery Bar Specification Battery Bar Specification
Bar 20(Full) 98%이상 Bar 9 -> Bar 8 43% -> 42%
Bar 20 -> Bar 19 98% -> 97% Bar 8 -> Bar 7 38% -> 37%
Bar 19 -> Bar 18 93% -> 92% Bar 7 -> Bar 6 33% -> 32%
Bar 18 -> Bar 17 88% -> 87% Bar 6 -> Bar 5 28% -> 27%
Bar 17 -> Bar 16 83% -> 82% Bar 5 -> Bar 4 23% -> 22%
Bar 16 -> Bar 15 78% -> 77% Bar 4 -> Bar 3 16% -> 15%
Bar 15 -> Bar 14 73% -> 72% Bar 3 -> Bar 2 13% -> 12%
Bar 14 -> Bar 13 68% -> 67% Bar 2 -> Bar 1 8% -> 7%
Bar 13 -> Bar 12 63% -> 62% Bar 1 -> Bar 0 3% -> 2%
Bar 12 -> Bar 11 58% -> 57% Power off 1%이하
Bar 11 -> Bar 10 53% -> 52% Power off voltage 3.3V(3.4V~3.2V)
Bar 10 -> Bar 9 48% -> 47% Low battery pop-up 15% , 5%, 0%
3. TROUBLE SHOOTING
4. 1. Checking XO Block
The output frequency(19.2MHz)
frequency(19 2MHz) of XO(X4100) is used as the reference one of WTR1625L
3.and
TROUBLE SHOOTING
PM8926 internal VCO
3.1 Checking XO Block

The output frequency(19.2MHz) of XO(X4100) is used as the reference one of WTR1625L and PM8926 internal VCO
X4100
TP1
R4106 100K
G_L12 TOL=0.01
X4100
X1E0002910001
4 3
Thermistor XTAL2
1 2
1n
XTAL1 GND/Therm
19.2MHz
DNI
DNI
C4100
TP1 (C4102)
TP1 (C4102)
C4101
C4102
11
3. TROUBLE SHOOTING
START
Check TP1 Yes

XO Circuit is OK. Check next step
Is it 19.2MHz?
No
Replace X4100 and then

check TP1
Yes
Is it 19.2MHz? XO Circuit is OK. Check next step
No
The Problem may be Logic part

Refer to Logic trouble shoot
4. Trouble Shooting
3. TROUBLE SHOOTING
2. Checking Transceiver DC Power Supply Circuit Block
3.2 Checking Transceiver DC Power Supply Circuit Block

Test Point
TP2(2.05V)
TP1(1.225V)
TP3(1.8V)
U1500
Circuit Diagram
TP1(1.225V)TP1(1.225V)
TP3(1.8V)
TP3(1.8V) NOTE1 NOTE2
+1V225_VREG_L1
22n
8.2n
+1V8_VREG_L10
L1507
L1508
+2V05_VREG_L9
TP2(2.05V)
P2(2.05V) NOTE1
DNI
100p
100p
4.7u
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
DNI
DNI
DNI
10u
1u
C1500
C1501
C1502
C1503
C1509
C1513
C1517
C1504
C1505
C1506
C1507
C1508
C1510
C1511
C1512
C1514
C1515
C1516
C1518
C1519
C1520
C1521
C1522
C1523
C1524
103
129
126
157
147
116
100
52, 59
93, 74
149
115
135
136
80
62
79
78
48
90
25
38
14
57
129
126
157
114
147
116
100
103
137
149
115
135
136
54
98
80
62
79
78
48
90
52
59
93
74
25
31
72
38
14
11
22
57
34
VDD_RF1_P_HMB_LO
VDD_RF1_G_VCO
VDD_RF1_D_LOM
VDD_RF1_P_HMB
VDD_RF2_P_VCO
VDD_RF2_S_VCO
VDD_RF1_S_VCO
VDD_RF1_P_VCO
VDD_RF1_D_MB
VDD_RF2_T_VCO
VDD_RF1_T_VCO
VDD_RF1_P_HB_LO
VDD_RF1_T_UPC
VDD_RF1_G_LNA
VDD_RF2_FBRX
VDD_RF1_G_BB
VDD_RF1_D_HB
VDD_RF2_PRX
VDD_RF2_XO
VDD_RF1_T_SYN
VDD_RF2_D_BB
VDD_RF1_D_LB_LO
VDD_RF2_T_DA
VDD_RF2_P_BB
VDD_RF1_T_DA
VDD_RF1_G_PLL
VDD_RF2_T_BB
VDD_RF1_T_LO
VDD_RF1_D_LB
VDD_RF1_P_LB
VDD_RF1_P_PLL
VDD_RF1_S_PLL
VDD_RF2_T_PLL
VDD_DIO
162
WTR0_TX_LB1_OUT TX_LB1_OUT
153 160
WTR0_TX_LB2_OUT TX_LB2_OUT TX_BB_IM WTR0_TXBB_I_N
163 151
WTR0_TX_LB3_OUT TX_LB3_OUT TX_BB_IP WTR0_TXBB_I_P
154 161
TX_LB4_OUT TX_BB_QM WTR0_TXBB_Q_N
146 152
TX_MB1_OUT TX_BB_QP WTR0_TXBB_Q_P
138
WTR0_TX_MB2_OUT TX_MB2_OUT
139 108
WTR0_TX_MB3_OUT TX_MB3_OUT PRX_BB_IM WTR0_PRXBB_I_N
155 99
WTR0_TX_MB4_OUT TX_MB4_OUT PRX_BB_IP WTR0_PRXBB_I_P
130 97
WTR0_TX_HB1_OUT TX_HB1_OUT PRX_BB_QM WTR0_PRXBB_Q_N
R1500 121 107
WTR0_TX_HB2_OUT TX_HB2_OUT PRX_BB_QP WTR0_PRXBB_Q_P
15
117 86
PDET_RFFB DRX_BB_IM WTR0_DRXBB_I_N
R1501
R1502
76
330
330
DRX_BB_IP WTR0_DRXBB_I_P
102 68
WTR0_PRX_LB1_IN PRX_LB1_IN DRX_BB_QM WTR0_DRXBB_Q_N
92 61
WTR0_PRX_LB2_IN PRX_LB2_IN DRX_BB_QP WTR0_DRXBB_Q_P
73
WTR0_PRX_LB3_IN PRX_LB3_IN
65 60
WTR0_PRX_LB4_IN PRX_LB4_IN GNSS_BB_IP WTR0_GNSSBB_I_P
51 53
WTR0_PRX_MB1_IN PRX_MB1_IN GNSS_BB_IM WTR0_GNSSBB_I_N
43 67
WTR0_PRX_MB2_IN PRX_MB2_IN GNSS_BB_QP WTR0_GNSSBB_Q_P
27 85
WTR0_PRX_MB3_IN PRX_MB3_IN GNSS_BB_QM WTR0_GNSSBB_Q_N
9
WTR0_PRX_HB1_IN PRX_HB1_IN
17 71 R1503 4.75K
PRX_HB2_IN RTUNE
18 37 TOL=0.01
WTR0_PRX_HB3_IN PRX_HB3_IN DNC
19
WTR0_PRX_HMB4_IN PRX_HMB4_IN
U1500 DAC REF
127
WTR0 DAC IREF
5 123
3. TROUBLE SHOOTING
START
No
Check TP1 +1.225V is OK?
Yes
No
Check TP3 +1.8V is OK? The Problem may be Logic part
Yes
No
Check TP2 +2.05 V is OK?
Yes
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 3. Checking DC-DC Block
3.3 Checking DC-DC Block Test Point
TP4
TP3
TP2
U1400
TP1
Circuit Diagram
TP1
TP1
TP2
TP2 D3 A1
SGND PVIN1
B1
PVIN2
0.1u
C1
10u
VIO
B4
PACB
D1 U1400
C1401
RFFE1_CLK
C1400
SCLK
D4
C2
LM3263 SVDD
RFFE1_DATA SDATA
DNI
DNI
A3
PGND
TP4
BGND
GPO1
ACB1
ACB2
SW1
SW2
C1408
C1409
FB
B3
D2
A2
B2
A4
C4
C3
TP4
L1400 1.5u
10u
TP3
1n
C1
TP3
C1403
15
3. TROUBLE SHOOTING
START
No
Check TP1 +VPWR is OK?
Yes
No
Check TP2 1.2V ≤ TP2 ? The Problem may be Logic part
Yes
No
Check TP3 0.2V ≤ TP3 ≤ 1.267V ?
Yes
No
Check TP4 Check U1000 Physical Damage or
0.5V ≤ TP4 ≤ 3.8V ? soldering condition
Yes
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 4. Checking FEMiD Block
(GSM Quad
Quad, W B1/2/5/8
B1/2/5/8, LTE B1/3/8/20)
3.4 Checking FEMiD Block (GSM Quad, W B1/2/5/8, LTE B1/3/8/20)
Test Point
FL1201
TP1(2.75V) TP2(1.8V)
Circuit Diagram
+1V8_VREG_L10 +2V75_VREG_L14
TP1(2.75V)
TP1(2.75V)
TP2(1.8V)
TP2(1.8V)
C1203
C1204
100p
100p
40
39
36
35
34
33
32
31
30
29
28
38
37
GND17
GND16
GND13
SDATA
GND12
GND11
GND10
GND15
GND14
VDD
ANT_H
ANT_L
VIO
17 SCLK TRX6 H
17
3. TROUBLE SHOOTING
START
No
Check TP1 High Level ? The Problem may be Logic part
(2.5V≤TP1 ≤3.0V) Refer to Logic trouble shoot
Yes
No
Check TP2 High Level ? The Problem may be Logic part
(1.65V≤TP1 ≤1.95V) Refer to Logic trouble shoot
Yes
Check next step
3. TROUBLE SHOOTING
3.5 GSM RF Part
START
Check XO Block
Refer 3.1
Check Transceiver DC Power supply

Block Refer 3.2
Check FEMid Block

Refer 3.3
Check T/RX Block
Re-Download & Cal
Change the Board
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 5. GSM RF Part
4 5
4. 5. 1.
1 GSM850/900/1800/1900 Rx
3.5.1 GSM850/900/1800/1900 Rx
GSM850/900/1800/1900 RXGSM850/900/1800/1900
RF PATH RX RF PATH
U1500
FL1201
SW1102
1. GSM850 RX PATH
2. GSM900 RX PATH
3. GSM1800/1900 RX PATH
4. High
g Band T/RX PATH
5. Low Band T/RX PATH
SW1101
20
4. Trouble Shooting
3. TROUBLE SHOOTING
4. 5. GSM RF Part
4 5
4. 5. 1.
1 GSM850/900/1800/1900 Rx
4. 5. 1. 1. Checking RF signal path (SW)
3.5.1.1 Checking RF signal path (SW)

Test Point Circuit Diagram
C10061 SW1101
2
ANT COMMON
33p 1
G3 G4
TP1(L10062) 3 4
L10062
L10061
0.5p
DNI
TP2
TP1(L10062)
TP1 (D
MC
2 ANT2(B1,B2,B3,B
TP2(C1109)
SW1102
2
ANT COMMON
1
G3 G4
3 4
TP2(C1109)
21
C1109
4.7p
C1111 C1112
56 DNI
3. TROUBLE SHOOTING
1) GSM850/900
START
No
Check TP1 Signal exist? Check SW1101 Soldering
Yes
Check next step
2) GSM1800/1900
START
No
Yes
Check next step
4. Trouble Shooting
3. TROUBLE SHOOTING
. GSM RF Part
5
5. 1.
1 GSM850/900/1800/1900 Rx
. 5. 1. 2. Checking RF signal path
3.5.1.2 Checking RF signal path
Test Point
U1500 TP1
TP2
TP3
rcuit Diagram
TP1(L1210)
L1210 18n
C1215 33p
WTR0_PRX_LB2_IN
TP1(L1210)
1p
L1212
33p
TP2(L1214)
C1218
L1214 15n
C1220 33p
WTR0_PRX_LB3_IN
DNI
TP2(L1214)
L1215
C1221 DNI
TP3(L1221)
L1221 4.7n
C1234 33p C1244 100p
WTR0_PRX_MB2_IN
DNI
TP3(L1221)
L1222
C1237 DNI
3. TROUBLE SHOOTING
START
No
Check TP1/2/3 Signal exist? Check Component above RF signal path
Yes
NOT GOOD
Check Transceiver physical damage
or soldering condition
Replace U1500
OK?
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 5. GSM RF Part
3.5.24.
4GSM850/900/1800/1900
5
5. 2.
2 GSM850/900/1800/1900
Tx Tx
GSM850/900/1800/1900
GSM850/900/1800/1900 TX RF PATH TX RF PATH
U1500
FL1201
1. GSM850/900 TX Input
2. GSM850/900 TX Output
3. GSM1800/1900 TX Output SW1102
4. GSM1800/1900 TX Output
5. High Band T/RX PATH
SW1101
25 25
4. Trouble3. Shooting
TROUBLE SHOOTING
4. 5. GSM RF Part
4 5
4. 5. 2.
2 GSM850/900/1800/1900 Tx
4. 5. 3.5.2.1 Checking
2. 1. Checking GSM GSM
PAM DCPAM
PowerDC Power Circuit
Circuit
Test Point
TP3
TP1 TP4
U1300
TP2
TP2(1328)
TP2(1328) Circuit Diagram

3/4G +VPA0
2G
10u
1n
C1330
C1328
GND
TP3(R1302)
TP4(R1303)
TP3(R1302)
36
37
38
39
40
41
42
43
GND15
NC
GND16
GND17
GND18
GND19
GND20
PGND
35 1
TP4(R1303)
RFOUT_B1 RFIN_B1_B2
34 2
RFOUT_B3 RFIN_B4
33 3
RFOUT_B4 RFIN_B26
32 4
RFOUT_B2 RFIN_B5_B8
31 5
RFOUT_B5_B26 GND1
30 6
+1V8_VREG_L10
29
GND14
RFOUT_B8
U1300 VIO
GND2
7
28 8 R1302 0
1 2 RFFE1_CLK
27
VCC1
VCC2
SKY77629-21 SCLK
SDATA
9 R1303 0
RFFE1_DATA
26 10
VCC_GSM GND3
25 11
GND13 VBATT +VPA_BATT0
24 12
RFOUT_GSM_HB GND4
10u
23 13
1n
GND12 RFIN_GSM_HB
22 14
RFOUT_GSM_LB RFIN_GSM_LB
C1319
C1318
GND11
GND10
GND9
GND8
GND7
GND6
GND5
TP1(C1318)
21
20
19
18
17
16
15
GND
TP1(C1318)
26
3. TROUBLE SHOOTING
START
Check TP1/TP2 No The Problem may be Other part

+VPWR OK? Check Logic part
Yes
Check TP3/4
with Control CLK & Data
Check correct CLK No

(19.2MHz)& MIPI data? The Problem may be Logic part
Yes
Check Next step
3. TROUBLE SHOOTING
3.5.2.2 GSM850/900/1800/1900 Tx
Refer to 3.5.1.1
1) GSM850/900
START
Check TP1 YES

If GSM850/900 under 31dBm? Check SW1001 Soldering
NO
Check next step
2) GSM1800/1900
START
Check TP1 YES

If DCS/PCS under 28dBm? Check SW1001 Soldering
NO
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 5. GSM RF Part
4 5
4. 5. 2.
2 GSM850/900/1800/1900 Tx
4. 5. 2. 3. Checking RF signal path
Test Point
TP4
TP3
U1500
U1300
TP1
TP2
Circuit Diagram
G1800/G1900
C1327 1.2n
TP2 (C1327)
FEMID_TX_GSMHB
DNI
DNI
TP2 (C1327)
L1318
L1319
G850/G900
C1326 1.8n
FEMID_TX_GSMLB
L1320
L1321
TP1 (C1326) 22n
TP1 (C1326)
0.5p
C1321 33p C1322 33p

WTR0_TX_MB2_OUT GSM_HB
TP4 (C1322)
DNI
TP4 (C1322)
L1314
C1324 33p C1325 33p

WTR0_TX_LB2_OUT ATT, EU GSM_LB
DNI
TP3 (C1325)
L1317
29 TP3 (C1325)
3. TROUBLE SHOOTING
START
Check TP1/2 Yes

If GSM850/900 Over 31dBm? Check component above RF signal path
If DCS/PCS Over 28dBm?
No
Check TP3/4 Yes

If GSM850/900 Over 7dBm? Check U1300 soldering
If DCS/PCS Over 5dBm?
No
NOT GOOD
Check Transceiver physical damage
Replace U1500
OK?
Check next step
3. TROUBLE SHOOTING
3.6 WCDMA RF Part
START
Check XO Block
Refer 3.1

Block Refer 3.2
Check Checking DC-DC Block

Refer 3.3
Check FEMid Block

Refer 3.4
Check T/RX Block
Re-Download & Cal
Change the Board
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 6. WCDMA RF Part
3.6.1 WCDMA B1/2/5/8 Rx
4 6
4. 6. 1.
1 WCDMA B1/2/5/8 Rx
WCDMA B1/2/5/8 RX RF PATH
WCDMA B1/2/5/8 RX RF PATH
U1500
SW1103
U1300
FL1201
U1100
1. WCDMA B1 RX PATH
2
2. WCDMA B2 RX PATH
SW1102 3. WCDMA B5 RX PATH
4. WCDMA B8 RX PATH
5. High Band T/RX PATH U1500
7
7. WCDMA B1 DRX PATH
8. WCDMA B8 RX PATH
9. COMMON DRX PATH
SW1101
32
4. Trouble Shooting
3. TROUBLE SHOOTING
4. 6. WCDMA RF Part
4 6
4. 6. 1.
1 WCDMA B1/2/5/8 Rx
4. 6. 1. 1. Checking RF signal path (SW)
3.6.1.1 Checking RF signal path (SW)
1) PRX Path : Refer to 4.5.1.1
1) PRX Path : Refer to 3.5.1.1
2) DRX Path
2) DRX Path Test Point
TP1
SW1103
Circuit Diagram
SW1103
C1150 100p C1124
2
FEED ANT COMMON
3p 1
ANT1102 G3 G4
3 4
L1117 L1118
10n DNI
TP1(C1124)
TP1(C1124)
33
3. TROUBLE SHOOTING
START
NO
Check TP21Signal exist? Check SW1103 Soldering
YES
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 6. WCDMA RF Part
4 6
4. 6. 1.
1 WCDMA B1/2/5/8 Rx
3.6.1.2 Checking RF signal path(PRX B1/8)
4. 6. 1. 2. Checking RF signal path(PRX B1/8)
Test Point
TP5
U1500
TP4
U1300
TP3
TP2 FL1201
TP1
FL1100 FL10062
Circuit Diagram
TP1(C1101) TP2(C1103) TP3(C1105)
TP1(C1101) TP3(C1105)
TP2(C1103)
C1101 33p
FL1100
FL10062
4 3
DNI
Termination_Port OUT
DNI
1 6 C1104 8p
5 GND2 GND1 2 GND1 HI-BAND
51
C1103 3.3n
TOL=0.01
2 5
6 Coupling IN 1 COMMOM GND3
3 4
R1100
DNI
GND2 LO-BAND
1 2
L1101
DNI
L1102
L1110
L1104
C1105
TP4(L1206) TP5(L1210) 2.2n
L1210 18n
L1206
C1208 33p C1215 33p
1.2n
WTR0_PRX_HMB4_IN WTR0_PRX_LB2_IN
35
L1207
TP4(L1206) TP5(L1210)
1p
1.8n
L1212
C1218 33p
3. TROUBLE SHOOTING
START
No
Check TP1 Signal exist? Check FL1100 Soldering
Yes
No
Check TP2 Signal exist ? Check FL10062 Soldering
Yes
No
Yes
No
Check TP4/5 Signal exist? Check TP4/5 Signal exist?
Yes
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 6. WCDMA RF Part
4 6
4. 6. 1.
1 WCDMA B1/2/5/8 Rx
3.6.1.3 Checking DRX RF signal path (B1/8)
4. 6. 1. 3. Checking DRX RF signal path (B1/8)
Test Point
FL1105
TP1 U1100
TP2
FL1106
TP3
U1500
TP5
Circuit Diagram
TP4
TP1(C1125)
TP2(C1127)
TP1(C1125)
100p
5 4
PORT2
VCTL
C1122
C1125
6 3
100p
ANT GND
TP2(C1127) C1163
PORT1
DNI
1
VDD
DNI
1n
FL1106 C1164
FL1105 1 6
1 2
C1126
GND1 HI-BAND
2 5 1n
L1121
C1127 1n
COMMOM GND3
TP3(C1164)
3 4
2 GND2 LO-BAND
DNI
C1162
DNI
TP3(C1164)
C1120 33p L1113 33p C1141 33p L1132 10n
TP4(L1113) TP5(L1132)
DNI
L1114 TP4(L1113)
3n
TP5(L1132)
37
L1133
3. TROUBLE SHOOTING
START
Check TP1 No
Check FL1105 Soldering
Signal exist?
Yes
Check TP2 No
Signal exist? Check FL1106 Soldering
Yes
Check TP3 No
Signal exist? Check U1100 Soldering
Yes
Check TP4/5 No
Signal exist? Replace U1500
Yes
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
3.6.2
4.WCDMA B1/2/5/8RF
6. WCDMA Tx Part
4 6
4. 6. 2.
2 WCDMA B1/2/5/8 Tx
WCDMA B1/2/5/8 TX RF PATH
WCDMA B1/2/5/8 TX RF PATH
U1500
U1300
FL1201
SW1102
SW1101
1. WCDMA B1 TX PATH
2. WCDMA B2 TX PATH
3. WCDMA B5 TX PATH
4. WCDMA B8 TX PATH
5. High Band T/RX PATH
39
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 6. WCDMA RF Part
4 6
4. 6. 2.
2 WCDMA B1/2/5/8 Tx
3.6.2.1 Checking WCDMA PAM DC Power&Control Circuit
4. 6. 2. 1. Checking WCDMA PAM DC Power&Control Circuit
Test Point
TP3
TP1 TP4
U1300
TP2
TP2(1328)
TP2(1328)
Circuit Diagram
3/4G +VPA0
2G
10u
1n
C1330
C1328
TP3(R1302)
TP4(R1303)
GND
TP3(R1302)
36
37
38
39
40
41
42
43
GND15
NC
GND16
GND17
GND18
GND19
GND20
PGND
35 1
TP4(R1303)
RFOUT_B1 RFIN_B1_B2
34 2
RFOUT_B3 RFIN_B4
33 3
RFOUT_B4 RFIN_B26
32 4
RFOUT_B2 RFIN_B5_B8
31 5
RFOUT_B5_B26 GND1
30 6
+1V8_VREG_L10
29
GND14
RFOUT_B8
U1300 VIO
GND2
7
28 8 R1302 0
1 2 RFFE1_CLK
27
VCC1
VCC2
SKY77629-21 SCLK
SDATA
9 R1303 0
RFFE1_DATA
26 10
VCC_GSM GND3
25 11
24 12
RFOUT_GSM_HB GND4
10u
23 13
1n
GND12 RFIN_GSM_HB
22 14
RFOUT_GSM_LB RFIN_GSM_LB
C1319
C1318
GND11
GND10
GND9
GND8
GND7
GND6
GND5
TP1(C1318)TP1(C1318)
21
20
19
18
17
16
15
40 GND
3. TROUBLE SHOOTING
START
Check TP1/TP2 No The Problem may be Other part

+VPWR OK? Check Logic part
Yes
Check TP3/4
with Control CLK & Data
Check correct CLK No

(19.2MHz)& MIPI data? The Problem may be Logic part
Yes
Check Next step
3. TROUBLE SHOOTING
3.6.2.2 Checking RF signal path(SW)
Refer to 3.5.1.1
1) WCDMA 850/900
START
YES
NO
Check next step
2) WCDMA 1900/2100
START
YES
NO
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 6. WCDMA RF Part
4 6
4. 6. 2.
2 WCDMA B1/2/5/8 Tx
3.6.2.3 Checking RF signal path(B1/B2)
4. 6. 2. 3. Checking RF signal path(B1/B2)
Test Point
TP7
U1500
U1300
TP5
TP6
TP3 FL1201
TP1
TP4
FL1103
Circuit Diagram FL1100 TP2
FL10062
TP1(C1101)
TP1(C1101)
C1101 33p
FL1100
FL10062
4 Termination_Port OUT 3
DNI
1 6 C1104 8p
5 2
TP2(C1103)
GND2 GND1 GND1 HI-BAND
51
C1103 3.3n
TOL=0.01
2 5
3 4
R1100
DNI
GND2 LO-BAND
1 2
DNI
L1102
TP2(C1103)TP5(C1305)
L1110
TP4(C1105)
L1104
TP3(C1110) C1105
TP3(C1110) TP5(C1305)
2.2n
TP7(C1302)
DNI
C1110
TP4(C1105)
L1151
1.5n C1305 3.3n

DNI
FL1103 LDJ1882
0.5p
TP7(C1302)
DNI
Termination_Port
0.5p
4
GND2
L1109
L1108
5
Coupling
L1301
6 C1304 33p C1302 33p

L1302
DNI
TP6(C1317)
C1317
4.7p
L1300
43
L1310 L1311
TP6(C1317)
7.5n
8.2n
3. TROUBLE SHOOTING
START
Yes
Check TP1/3
Signal is over 21dBm? Check FL1100 or FL1103 Soldering
No
Yes
Check TP2
Signal is over 21dBm?
No
Yes
Check TP4
Signal is over 21dBm
No
Yes
Check TP5/6
Check U1300 Soldering
No
No
Check TP7 Replace U1500
Signal is over 3.5dBm
OK?
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 6. WCDMA RF Part
4 6
4. 6. 2.
2 WCDMA B1/2/5/8 Tx
3.6.2.4 Checking RF signal path(B5/B8)
4. 6. 2. 4. Checking RF signal path(B5/B8)
Test Point TP7
U1500
U1300
TP5
TP6
TP3 FL1201
TP1
TP4
FL1103
Circuit Diagram FL1100 TP2
FL10062
TP1(C1101)
TP1(C1101)
C1101 33p
FL1100
4 Termination_Port OUT TP2(C1103)
3 FL10062
DNI
1 6 C1104 8p
51
C1103 3.3n
TOL=0.01
2 5
TP5(C1320)
3 4
R1100
DNI
GND2 LO-BAND
1 2
DNI
TP4(C1105)
L1102
TP3(C1110)
L1110
TP2(C1103)
L1104
C1105
2.2n
TP3(C1110) TP5(C1320)
DNI
C1110
C1320 3.9n TP7(C1314)
TP4(C1105)
L1151
1.5n
TP6(C1323)
DNI
FL1103 LDJ1882
0.5p
Termination_Port
4
GND2 L1312 L1313
L1109
L1108
5 C1314 33p C1315 33p

45 6
Coupling
1.5p 1.5p
DNI
L1309
C1323 1.2n
TP7(C1314)
DNI
DNI
TP6(C1323)
L1315
L1316
3. TROUBLE SHOOTING
START
No
Check TP1/3
Signal is over 21dBm? Check FL1100 or FL1103 Soldering
Yes
No
Check TP2
Yes
No
Check TP4
Yes
No
Check TP5/6
Yes
No
Check TP7 Replace U1500
Signal is over 3.5dBm
OK?
Check next step
3. TROUBLE SHOOTING
3.7 LTE RF Part
START
Check XO Block
Refer 3.1

Block Refer 3.2
Check Checking DC-DC Block

Refer 3.3
Check FEMid Block

Refer 3.4
Check T/RX Block
Re-Download & Cal
Change the Board
3. TROUBLE SHOOTING
3.7.1 LTE B1/B8 TX/PRX

Refer to 3.6.1(Same as WCDMA B1/B8)
3.7.1.1 Checking LTE PAM DC Power Circuit
Refer to 3.6.2.1
Refer to 3.6.2.2 about TX
Refer to 3.6.2.3 (B1) 3.6.2.4 (B8)
3. TROUBLE SHOOTING
4. Trouble Shooting
4.3.7.2
7. LTE
LTE RF Part
B3 TX/PRX
4 7.
4. 7 2
2. LTE B3 TX/PRX
LTE B3 TX/PRX RF PATH LTE B3 TX/PRX RF PATH
U1500
U1300
FL1201
SW1102
1.
1 LTE B3 PRX PATH
2. LTE B3 TX PATH
3. COMMON T/PRX PATH
52
3. TROUBLE SHOOTING
3.7.2.1 Checking LTE PAM DC Power Circuit
Refer to 3.6.2.1
Refer to 3.5.1.1
START
YES
NO
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 7. LTE RF Part
4 7.
4. 7 2
2. LTE B3 TX/PRX
Test Point
TP5
U1500
U1300
TP4
FL1203
TP2
FL1201
TP3
TP1
FL1103
rcuit Diagram
TP1(C1101)
TP1(C1101) TP2(C1211) C1206 33p
TP3(L1204)
L1204 1n
TP2(C1211)
TP3(L1204)
C1110 L1205
0.5p
1.5n
C1211 3n FL1203
DNI
FL1103 LDJ188 33p

0.5p
C1210
6 1
ANT RX
Termination_Port
4
0.5p
3
DNI
GND2
L1109
TX
L1108
5
Coupling 2 9
6
L1208
L1209
GND1 GND6
4 8
GND2 GND5
5 7
GND3 GND4
C1312 2.7n C1307 2.7n

C1306 33p
TP5(C1306)
TP4(C1312)
DNI
DNI
1p
TP4(C1312) TP5(C1306)
L1323
L1322
L1303
55
3. TROUBLE SHOOTING
START
Check TP1 No
TP1 signal is exist? Check FL1103 Soldering
Yes
Check TP2 No
Yes
Check TP3/TP4 Yes

TP4 is over 21dBm? Check FL1203 Soldering
No
TP3 signal is exist?
No YES
Check TP3 Yes

No
Check Transceiver
physical damage Replace U1500
OK?
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 3.7.3
7. LTE RF Part
LTE B7 TX/PRX
4 7.
4. 7 3
3. LTE B7 TX/PRX
LTE B7 TX/PRX RF PATHLTE B7 TX/PRX RF PATH
U1500
U1751
FL1750
SW1101
1.
1 LTE B7 PRX PATH
2. LTE B7 TX PATH
57
4. Trouble Shooting
3. TROUBLE SHOOTING
4. 7. LTE RF Part
4 7.
4. 7 3
3. LTE B7 TX/PRX
4. Checking
3.7.3.1 Checking
7. 2. 1.LTE LTE
PAM DC Power PAM
Circuit DC Power Circuit
Test Point
TP1
TP2
U1751
Circuit Diagram
g
ReferRFFE1_DATA
to 4.6.2.1
RFFE1_CLK
Refer to 4.6.2.1
ACPM-9307-TR1 U1751
1 4
VCC1 VIO
10 6
VCC2 SCLK
3
VBAT
9 2
RFOUT RFIN
5
SDTA
7
GND
11 8
TP2(C1763)
PGND NC
TP1(C1766)
TP2(C1763)
TP1(C1766)
330p
2.2u
330p
10u
C1764
C1763
C1766
C1765
58
3. TROUBLE SHOOTING
START
Check TP1 No The Problem may be Other part

VPWR OK? Check Logic part
Yes
Check TP2 No
0.5V≤TP2≤4.2V? Check Power Block Component
Yes
Check MIPI CLK & Data in each mode No

Check U2100 Part
is OK? Refer 4.6.2.1
Yes
Check Next step
3. TROUBLE SHOOTING
Refer to 3.5.1.1
START
Check TP1 YES

If Signal is over 21dBm? Check SW1101 Soldering
NO
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 7. LTE RF Part
4 7.
4. 73.7.3.3
3
3. LTE B7 RF
Checking TX/PRX
signal path
Test Point
TP7
U1500
TP5
U1751
TP2
FL1750
TP6
TP1
FL1102 TP4
FL1100
Circuit Diagram TP3
FL10062
TP1(C1101)
TP1(C1101)
C1101 33p
4
FL1100
Termination_Port OUT 3 FL10062 TP3(C1104)

( )
DNI
1 6 C1104 8p
5 2
GND2 GND1
TP2(C1103) GND1 HI-BAND
51
C1103 3.3n
TOL=0.01
2 5
6 1
TP5(L1753)
Coupling IN COMMOM GND3
3 4
R1100
DNI
GND2 LO-BAND
1 2
DNI
TP3(C1104)
L1102
L1110
L1104
TP2(C1103) C1105
TP5(L1753)
TP4(C1756)
2.2n
TP7(C1760)
DNI
C1750 33p L1753 1.2n

WTR0_PRX_HB3_IN
L1151
TP4(C1756)
L1754
2n
ACPM-9307-TR1 U1751
TP7(C1760)
C1753 33p 1 4
VCC1 VIO
FL1750 10 6
C1756 1.5n VCC2 SCLK
4 7 3
ANT RX VBAT
C1757 2n
C1760 33p
DNI
1 9 2
12n
TP6(C1757)
TX RFOUT RFIN
2 6 5
0.5p
L1755
L1756
GND1 GND4 SDTA

DNI
DNI
3 8 7
GND2 GND5 GND
5 9 11 8
L1757
GND3 GND6 PGND NC

L1760
L1758
2655MHz
61
TP6(C1757)
3. TROUBLE SHOOTING
START
Check TP1 No
Yes
Check TP2 No
TP2 signal is exist? No
Yes
Check TP3 No
Yes
Check TP4 No
Yes
Check TP5/TP6 Yes

TP5 signal is exist? No
No YES
Check TP7 No
Signal is over 3dBm? Check U1500 Soldering
Yes
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 3.7.4
7. LTE RF Part
LTE B20 TX/PRX
4 7.
4. 7 4
4. LTE B20 TX/PRX
LTE B20 TX/PRX RF PATH
LTE B20 TX/PRX RF PATH
U1500
FL1700
U1701
FL1201
SW1101
1.
1 LTE B20 PRX PATH
2. LTE B20 TX PATH
63
4. Trouble Shooting
3. TROUBLE SHOOTING
4. 7. LTE RF Part
4 7.
4. 7 4
4. LTE B20 TX/PRX
4. 1. Checking
4. 7. Checking
3.7.4.1 LTE PAM
LTE PAM DC Power Circuit DC Power Circuit
Test Point
TP1
TP2
Circuit Diagram
g
+VPA_BATT0
+VPA0
+1V8_VREG_L10
Refer to 4.6.2.1
Refer to 4.6.2.1
RFFE1_CLK
6
SCLK SDATA
5
RFFE1_DATA
GND VIO
7 U1701 4
NC VBATT
8 RF7920 3
RF_OUT RF_IN
9 2
VCC2 VCC1
10 1
PGND
11
TP2(C1707) TP1(C1710)
330p
2.2u
TP2(C1707) TP1(C1710)
330p
10u
C1707
C1708
C1709
C1710
64
3. TROUBLE SHOOTING
START
Check TP1 No The Problem may be Other part

VPWR OK? Check Logic part
Yes
Check TP2 No Check Power Block

0.5V≤TP2≤4.2V? Component
Yes
Check MIPI CLK & Data in each mode No

Check U2100 Part
is OK? Refer 4.6.2.1
Yes
Check Next step
3. TROUBLE SHOOTING
Refer to 3.5.1.1
START
Check TP1 YES

If Signal is over 21dBm? Check SW1101 Soldering
NO
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 7. LTE RF Part
4 3.7.4.3
4. 7.
7 4 4.Checking
LTE B20 TX/PRX
RF signal path
Test Point
TP7
TP5
U1500
U1300
TP4 TP6
FL1700
TP3
U1701
TP2
FL1201
TP1
FL1100
Circuit Diagram
FL10062
TP1(C1101)
33p
TP1(C1101)
C1101
FL1100
FL10062
4 Termination_Port OUT 3
TP2(C1103)
DNI
1 6 C1104 8p
51
C1103 3.3n
TOL=0.01
2 5
3 4
R1100
DNI
GND2 LO-BAND
1 2
DNI
L1102
L1110
TP2(C1103) TP3(C1105)
L1104
TP4(C1703) C1105
TP5(L1700)
TP5(L1700)
TP5(L1700)
2.2n
TP3(C1105)
+VPA_BATT0
C1700 L1700 18n
WTR0_PRX_LB1_IN
33p
TP4(C1703)
+1V8_VREG_L10
DNI
TP5(L1700)
L1701
FL1700
SCLK SDATA
C1703 6 1 C1701 DNI 6 5
ANT RX GND VIO
7 U1701 4
6.8n C1706 NC VBATT
C1711 33p C1712 33p
TP6(L1707)
3 8 RF7920 3
TX RF_OUT RF_IN
L1702 L1703 3.9p 9 2
VCC2 VCC1
DNI
DNI 15n 2 9 10 1
TP7(C1712)
GND1 GND6 PGND
4 8 L1710 L1707 11
67 67
GND2 GND5
5 7 7.5n 18n
GND3 GND4
L1709
C1714
DNI
TP6(L1707) TP7(C1712)
3. TROUBLE SHOOTING
START
Check TP1 No
Yes
Check TP2 No
Yes
Check TP3 No
Yes
Check TP4 No
Yes
Check TP5/TP6 Yes

No
No YES
No
Check TP7
Yes
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. LTE
3.7.5 7. LTE
B1/B8RF
DRXPart
4 7.
4. 7 6
6. LTE B3 DRX
Refer to 3.6.1.3(Same as WCDMA DRX B1/B8)
3.7.6 LTE B3 DRX

LTE B3 DRX RF PATH
LTE B3 DRX RF PATH
FL1105
U1100
SW1103 FL1106
U1500
70
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 7. LTE RF Part
4 7.
4. 7 6
6. LTE B3 DRX
Test Point
FL1105
TP1 U1100
TP2
FL1106
TP3
U1500
Circuit Diagram
TP4
TP1(C1125)
TP1(C1125)
TP2(C1127)
100p
5 4
PORT2
VCTL
C1122
C1125
6 3
ANT GND
TP2(C1127) C1163
100p
PORT1
DNI
1
VDD
DNI
1n
FL1106 C1164
FL1105 1 6
1 2
C1126
GND1 HI-BAND
2 5 1n
L1121
C1127 1n
COMMOM GND3
3 4
2 GND2 LO-BAND
TP3(C1164)
DNI
C1162
DNI
TP3(C1164)
L1123
TP4(L1115)
C1123 33p L1115 1n
WTR0_DRX_MB3_IN
L1116
3.9n TP4(L1115)
C1128 33p 71
3. TROUBLE SHOOTING
START
No
Yes
No
Yes
No
Check TP3 Signal exist? Check U1100 Soldering
Yes
No
Check TP4 Signal exist? Replace U1500
Yes
Check next step
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 7. LTE RF Part
4 7.
4. 7 8
8. LTE B20 DRX
3.7.7 LTE B7 DRX
LTE B20 DRX RF PATH

LTE B7 DRX RF PATH
FL1105
U1100
SW1103 FL1106
U1500
76 76
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 7. LTE RF Part
4 7.
4. 7 8
8. LTE B20 DRX
Test Point
FL1105
TP1 U1100
TP2
FL1106
U1500
Circuit Diagram TP3
TP1(C1125)
TP1(C1125) TP2(C1127)
100p
5 4
PORT2
VCTL
C1122
C1125
6 3
ANT GND
TP2(C1127) C1163
100p
PORT1
DNI
1
VDD
DNI
1n
FL1106 C1164
FL1105 1 6
1 2
C1126
GND1 HI-BAND
2 5 1n
L1121
C1127 1n
COMMOM GND3
3 4
2 GND2 LO-BAND
DNI
C1162
DNI
TP3(C1164)
L1123
TP3(L1128)
C1158 33p
L1144 2.2n WTR0_DRX_HB3_IN
DNI
77 TP4(L1144)
L1147
C1161 DNI
3. TROUBLE SHOOTING
START
No
Yes
No
Yes
No
Check TP3 Signal exist? Check U1100 Soldering
Yes
No
Yes
Check next step
4. Trouble Shooting
3. TROUBLE SHOOTING
4. 7. LTE RF Part
4 7.
4. 7 8
8. LTE B20 DRX
3.7.8 LTE B20 DRX

LTE B20 DRX RF PATH
LTE B20 DRX RF PATH
FL1105
U1100
SW1103 FL1106
U1500
76 76
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 7. LTE RF Part
4 7.
4. 7 8
8. LTE B20 DRX
Test Point
FL1105
TP1 U1100
TP2
FL1106
U1500
Circuit Diagram TP3
TP1(C1125)
TP1(C1125) TP2(C1127)
100p
5 4
PORT2
VCTL
C1122
C1125
6 3
ANT GND
TP2(C1127) C1163
100p
PORT1
DNI
1
VDD
DNI
1n
FL1106 C1164
FL1105 1 6
1 2
C1126
GND1 HI-BAND
2 5 1n
L1121
C1127 1n
COMMOM GND3
3 4
2 GND2 LO-BAND
DNI
C1162
DNI
L1123
C1137 33p
TP3(L1128) L1128
18n WTR0_DRX_LB4_IN
L1129
3.3p TP3(L1128
77
3. TROUBLE SHOOTING
START
No
Yes
No
Yes
No
Yes
Check next step
3. TROUBLE SHOOTING
3.8 BT&WIFI PART

3.8.1 BT&WIFI Trouble Shooting
BT&WIFI control signals are generate WCN 3620
START ANT 5101 : Ant. Contact

U5100 : BCM4334
Yes U4100 : PM8926
No
Check ANT5101 Remove the foreign substance
in ANT5101
Yes
Check TP1,2,3, No
TP1 C5109 is 1.8v
TP2 C5103 is 1.3v Check U4100
TP3 R5301 is 3.3v
Yes
Check U5100
Test point Net name Description
TP1 +1V8_VREG_L6 Power for BCM4334 digital I/O circuits
Power for BCM4334 analog, digital circuits.

TP2 VDD_LN
Power for WLAN driver amplifier circuits
TP3 VBAT_FEM Power for WLAN 2.4GHz PA circuits
3. TROUBLE SHOOTING
4. Trouble Shooting
4. 8. BT&WIFI PART
4 8.
4. 8 1.
1 BT&WIFI Trouble Shooting
BT&WIFI controlcontrol
BT&WIFI signals are generate
signals areby generate
BCM4334 by BCM4334
BT/WIFI Antenna Clip
BT/WIFI Circuit
BT/WIFI PATH & TEST POINT(BOT)
80
3. TROUBLE SHOOTING
4. Trouble Sho
4. 8. BT&WIFI PART
BT&WIFI control signals are generate by BCM4330 (U9000)
4 8.
4. 8 1.
BT&WIFI control signals are generate by BCM4330 (U5100)
TP3
TP1 TP2
(Slimport)+1V0_SLIMPORT_IOVCC
VDD_CORE
Last m
FB5100
+1V8_VREG_L6
VDD_LN
120 FB5102 600 VOUT_3P3
VDD_LN
VIN_LDO
+VPWR_WL Close to C8 ball
220n
0.1u
VDD_LN
220n
220n
K10
L10
C5109
C5110
0.1u
0.1u
10p
G7
D1
D3
D2
C1
H4
C6
D6
C8
D8
K5
K6
K7
A1
A3
2.2u
F1
F2
F7
J1
2
_PADRV_VBAT_VDD5P0
WRF_SYNTH_VDD1P2
WRF_BUCK_VDD1P5
WRF_TCXO_VDD1P8
FM_LNAVCOVDD
RF_XTAL_CAB_VDD1P2
BT_VCOVDD
BT_LDOPAVDD2P5
HSIC_DVDD1p2_OUT
BT_LNAVDD
BT_VDDBAT
FM_PLLVDD
VDDC_1
VDDC_2
VDDC_3
VDDC_4
BT_PLLVDD
VDDIO_RF
VDDIO_1
VDDIO_2
BT_IFVDD
C5103
C5104
C5105
C5106
C5107
C5108
1
J10
RF_SW_CTRL_0
K9
TP1
RF_SW_CTRL_1
J9
RF_SW_CTRL_2
H9
RF_SW_CTRL_3
Close to H4 ball RF_SW_CTRL_4
H10
H8
RF_SW_CTRL_5
TP2
J8
TP2 TP1
R5300
+VPWR +VPWR_WL
0
R5301
VBAT_FEM
0
TP3
TP3
LGE Internal Use Only - 91 - 81

Copyright © 2014 LG Electronics. Inc. All right reserved.
4. Trouble Shooting
3. TROUBLE SHOOTING
4. 8. BT&WIFI PART
4 8.
4. 8 1.
BT&WIFI
BT&WIFI controlcontrol
signals aresignals
generateare generate
by BCM4330 by BCM4330 (U5100)
(U9000)
ANT5101
ANT5101
ANT5101
Diplexer(2.4G/5G BPF)
FL5100
ANT5100
ANT5101
FEED
FEED
5 4
ESD OPTION C5101 1n C5102 GND2 NC1
3
6 P3 P2 2G_WLAN_RF
1.2n
7 2
GND3 GND1
8 1
NC2 P1 5G_WLAN_RF
C5199 C5232 C5233
DNI DNI 0.5p
82
3. TROUBLE SHOOTING
3.9 GPS Part
START

Block Refer 3.1
Check GPS RF Block

Refer 3.2
Re-Download
Change the Board
4. 9. GPS Part Shooting
3. TROUBLE SHOOTING
GPS RF PATH
GPS RF PATH
SAW
GPS
LNA
4. Trouble
4. 9. GPS Part
4 9.
4. 9 1
1. Checking GPS LNA DC Power Circuit
Shooting 3. TROUBLE SHOOTING
3.9.1 Checking GPS LNA DC Power Circuit

Test Point
TP1 TP2
Circuit Diagram
TOL=0.01
R1103 L1134 2.2n R1104 10
GNSS_ELNA_EN +2V75_VREG_L14
820
TP2TP2
6.8p
0.1u
33p
TP1
TP1
C1143
C1144
C1145
7 1
NEAR TO WTR
VCTRL
VDD
FL1109
L1150
L1149
8.2n
C1148 100p C1149 100p

100p
RFOUT1 5
1 4 FL1108
IN OUT 2 RFIN SFMG2B0D001
DNI
G1 G2 G3
6
DNI
RFOUT2
2 3 5
DNI
DNI
GND1
GND2
GND3
L1138
L1139
L1153
L1141
L1142
DNI C1159 100p C1160 100p

3 4 8
90
3. TROUBLE SHOOTING
START
No
The Problem may be Other part Check Logic
Check TP1 2.75V OK?
part
Yes
No
The Problem may be Other part Check Logic
Check TP2 1.4V≤TP2≤3.0V?
part
Yes
Check Next step
4. Trouble
9. GPS Part
9.
9 22. Checking GPS RF Signal path
Shooting 3. TROUBLE SHOOTING
3.9.2 Checking GPS RF Signal path

Test Point
TP1
TP2
TP3
TOL=0.0
R1103 L1134 2.2n R1104 10
GNSS_ELNA_EN
ANT3
820
6.8p
33p
C1143
Circuit Diagram TP1 TP2
C1144
ANT3 GNSS
7
VCTRL
1
FL1109 VDD
L1150
C1151
L1149
8.2n
100p
100p
RFOUT1 5
1 4 FL1108
FEED IN OUT 2 RFIN SFMG2B0D001
G1 G2 G3
6
DNI
RFOUT2
TP1 TP2
ANT1104 2 3 5
DNI
DNI
82n
1
GND1
GND2
GND3
L1138
L1146 L1153
L1141
L1142
FEED
DNI DNI
ANT1105 3 4 8
L1143
2
L1145
100p
( DGMS Guide )
MC-C00002-14 : ESD Protection Circuit
TOL=0.01
R1103 L1134 2.2n R1104 10
GNSS_ELNA_EN +2V75_VREG_L14
820
6.8p
0.1u
33p
C1143
C1144
C1145
7 1
NEAR TO WTR
VCTRL
VDD
FL1109
L1150
8.2n
C1148 100p C1149 100p

RFOUT1 5 GNSS_IN_N
1 4 FL1108
IN OUT 2 RFIN SFMG2B0D001
DNI
DNI
G1 G2 G3
6
DNI
RFOUT2
TP3
2 3 5
DNI
DNI
GND1
GND2
GND3
L1138
L1139
L1140
L1153
L1141
L1142
DNI C1159 100p C1160 100p

3 4 8 GNSS_IN_P
n Circuit
TP3
LGE Internal Use Only - 97 - Copyright © 2014 LG Electronics. Inc. All right reserved. 92
3. TROUBLE SHOOTING
START
No
Check TP1 Signal exist? Check Antenna feeding clip soldering
Yes
No
Yes
No
Yes
NOT GOOD
Check Transceiver physical damage Replace U1500
OK?
Check next step
3. TROUBLE SHOOTING
3.10 Power
START
No
Battery voltage higher than 3.4V? Change or charging the Battery
Yes
Press PWR Key No

Change CN100
R4105 signal change from high to low?
Yes
Check PM8926’s SMPS voltage level?
No
Is it normal voltage?
Yes
No
Is the X4100 signal normal?
Change X4100
Check it’s 19.2Mhz
Yes
No
Is the signal high at R4104, TP2106 ?
Yes
No
Phone doesn’t boot yet?
Yes
Change the main board END
4. Trouble 3. TROUBLE SHOOTING
4. 10. Power Shooting

PM8926 power on sequence
95
3. TROUBLE SHOOTING
4. 10. Power 85
CBL_PWR_N
102
PM_KYPD_PWR_N KPD_PWR_N
108
OPT_2
119
OPT_1
JTAG_PS_HOLD
R4104 10K 100
MSM_PS_HOLD PS_HOLD
R4105 0 101
RESIN_IN
77
MSM_RESIN_N PON_RESET_N
-KPD_PWR_N 85
CBL_PWR_N
102
Check the signal change from high to low108
OPT_2
when push the PWR key. (R4105) 119
OPT_1
JTAG_PS_HOLD
R4104 10K 100
MSM_PS_HOLD PS_HOLD
-KPD_PWR_N R4105 0 101
77
RESIN_IN
PON_RESET_N
Check the signal change from high to low
CN100 MSM_RESIN_N
when push the PWR

1 key. (R4105) R101 100 KEYPAD_SENSE_0
R102 100
2 PM_KYPD_PWR_N
3
4
5
R103 100
6CN100 KEYPAD_SENSE_2
1 R101 100 KEYPAD_SENSE_0
D105 D103 R102 100
2 PM_KYPD_PWR_N
3 CN100(2,3 pin -> power key)
CN100(2,3 pin -> power key)
2
4 D104
5
R103 100
6 KEYPAD_SENSE_2
D105 D103
D104
- PS_HOLD-check : R4104
PS_HOLD check : R4104
It should be high when power
It should be high whenonpower on
85
CBL_PWR_N
102
108
OPT_2
119
OPT_1
JTAG_PS_HOLD
R4104 10K 100
MSM_PS_HOLD PS_HOLD
R4105 0 101
RESIN_IN
77
- 96 -
4. Trouble
3. TROUBLE SHOOTING
+1V8_VREG_L12
4. 10. Power R4106 100K
TOL=0.01
X4100
Shooting
X1E0002910001
4 3
Thermistor XTAL2
1 2
1n
XTAL1 GND/Therm
19.2MHz
DNI
DNI
C4100
C4101
C4102
R4106 100K
L12
JTAG_TMS XO Output check : X4100(19.2MHz)
TOL=0.01
X4100 TMS
X1E0002910001 AP33 R4106 100K
TRST_N
+1V8_VREG_L12 JTAG_TRST
4 3 TOL=0.01
X4100
Thermistor XTAL2 D33 X1E0002910001
TP2106
RESIN_N MSM_RESIN_N
4 3
1 E32
2 Thermistor XTAL2
1n
XTAL1 RESOUT_N
GND/Therm MSM_RESOUT_N
1 2
C4102 C4100 DNI 1n
XTAL1 GND/Therm
19.2MHz
DNI
C4100
19.2MHz
DNI
DNI
C4101
C4101
TMS JTAG_TMS C4102

R4105AP33 0
RESIN_IN
TMS JTAG_TMS
TRST_N 77 JTAG_TRST
AP33 MSM_RESIN_N PON_RESET_N TP
D33
TRST_N JTAG_TRST RESIN_N MSM_RESIN_N
E32 112 MSM_RESOUT_N
RESOUT_N
R4107 0 TP2106
D33 SPMI_CLK
RESIN_N PMIC_SPMI_CLK
MSM_RESIN_N R4108 0 123
E32 SPMI_DATA
PMIC_SPMI_DATA
RESOUT_N MSM_RESOUT_N
R4105 0
RESIN_IN
77
R4107 0 112
SPMI_CLK
PMIC_SPMI_CLK R4108 0 123
SPMI_DATA
PMIC_SPMI_DATA
R4105 0
RESIN_IN
77
R4107 0 112
SPMI_CLK
PMIC_SPMI_CLK R4108 0 123
SPMI_DATA
PMIC_SPMI_DATA -PON_RESET_N
It should be high
when phone boot with battery
97
3. TROUBLE SHOOTING
4. Trouble
3.11 Charger
4. 11. Charger
D620 uses PMIC (Power Management IC) for charging control. The PMIC (PM8926) circuit includes the charging pass transistor
Shooting
detects the VDD and VBAT voltages, and its control driver.
Charging Procedure
- Supply the VCHG use a TA or u-USB cable
- PM8926 control the charging current
- Charging current flows into the main battery & system current
Troubleshooting Check Point

- Connection of the TA or u-USB cable
- Charging current path
- Main battery
During charging operation, Internal detector circuits measure these voltages to recognize when an external supply. And then, SW-
controlled charging start. Test Point :
1. VCHG ( if TA or u-USB connected, +5.0V)
2. C4142 , C4143
143
+5V0_VREG_BHARGER VCHG_1
155
VCHG_2
L4133 1u 154
+VPWR VSW_CHG_1
166
L4133 Part Change VSW_CHG_2
4.7u
4.7u
152
VPH_PWR_1
C4142
C4143
164
VPH_PWR_2
140
BATFET_CP_DRV
139
CHG_PGND VBAT_1
151
VBAT VBAT_2
C4145 0.1u 163
VBAT_3
156
VBAT_SENSE VBAT_SNS
VBAT_SENSE_P C4146 470n 131
+VPWR BMS_BYP
R4135 DNI 107
+VPWR BMS_CSP
96
Note 2 +VPWR R4138 DNI
BMS_CSN
76
VCOIN VCOIN
VBAT_SENSE_N Note 1 104
VDD_FLASH
U4100
+5V0_VREG_BHARGER 4
+1V35_VSW_S3 VDD_GR1
1
R4139 11
VDD_GR2_1 PM8926
VDD_GR2_2
+2V1_VSW_S4 +2V075_VREG_L25 115
VDD_GR3
0
+2V1_VSW_S4 27
+2V1_VSW_S4 VDD_GR4
59
+VPWR VDD_GR5_1
60
VDD_GR5_2
7
+VPWR VDD_GR6
41
VDD_GR7
48
VDD_L25
121
AVDD_BYP
170
Note 3 If you don't use bypass Boost, Connect +VPWR VPRE_BYP
9
+VPWR VDD_S1_1
10
Note 4 VDD_S1_2
22
GR1 : L1, L2, L4, L5 GND_S1_1
33
GR2 : L3, L24, L26 34
GND_S1_2
GR3 : L6, L7, L8, L9, L27 VDD_S2
57
GND_S2_1
GR4 : L10, L11, L13 67
GND_S2_2
68
GR5 : L14, L12 GND_S2_3
47
GR6 : L15, L16, L17, L18 23
VDD_S3
GR7 : L19, L20, L21, L22, L23, L28 GND_S3
93
VDD_S4
69
GND_S4
R4141 0 126
+VPWR VDD_WLED
113
GND_WLEDI_1
114
Note 9 Current Sensing Point for WLED Driver GND_WLEDI_2
GND_CHG_PSUB
79
GND_CHG_HP_1
GND_CHG_HP_2
VDD_S5
92
GND_S5
GND_WLED
GND_CHG
GND_OVP
22u
22u
DNI
10u
1u
4.7u
0.1u
0.1u
4.7u
2.2u
2.2u
2.2u
2.2u
2.2u
150
110
142
109
153
165
C4164
C4169
C4173
C4174
C4175
C4176
C4177
C4170
C4171
C4172
C4165
C4166
C4167
C4168
Note 5 Place input caps close to respective VIN pins.

Each capacitor GND should be star routed to their respective reference ground
(GND_S1, GND_S2, GND_S3, GND_S4)
Then input caps should via directly to main ground CHG_PGND
98
98
3. TROUBLE SHOOTING
START
Check the Connection of uUSB and battery.

And battery should be standard type
No
Connection OK? Change I/O connector
Yes
No
Is the uUSB Cable voltage 5.0V Change TA (or uUSB Cable)
Yes
Yes
Is it charging properly After turning on?
No
Change the main board
END
3. TROUBLE SHOOTING
3. TROUBLE SHOOTING
3.12 Audio
3.12.1 Speaker troubleshooting
Speaker path as below :
MSM8926-2 -> WCD9302 SPKR_DRVP / SPRK_DRVN -> Speaker
START
Yes
After power on, Headphone icon
Refer to 3.9.5 Ear-MIC troubleshooting
display on Upper right LCD ?
No
Change Speaker Module
Yes
Speaker Sound can hear? Replace component ANT10003,
ANT10004
No
No
ANT10003, ANT10004 is OK? Replace component L6611, L6612
Yes
No
TP1 to TP2/TP3 to TP4
Short test. Is it OK?
Yes
Yes Yes
Check TP5(BUCK_VSW)
TP6(VDD_SPKDRV) Headphone path works well?
No No
Fail on TP5 -> replace U6100 Replace component Replace component

Fail on TP6 -> replace U4940 U2100 or main board U6100
End
3. TROUBLE SHOOTING
4. Trouble Shooting
TP1
TP1
(L6611) TP2
(L6611)
TP2
1000 ANT10003 EAG63613001
FB6610 L6611 82n
SPK_P FEED
FB6609 1000 L6612 82n

SPK_N FEED
ANT10004 EAG63613001
TP3 TP2
33p
33p
TP4
(L6612)
TP3 C6702 C6703
DNI DNI C-CLIP PN CHANGE 1.4 -> 2.05
C6701
C6700
(L6612)
(DGMS Guide)
MC-C04773-8 : For ESD Protection / Tuning points
TP3 TP1 TP2 TP4

(L6612) (L6611)
LGE Internal Use Only 102
3. TROUBLE SHOOTING
4. Trouble Shooting
3
VDD_BUCK +2V1_VSW_S4
U6100 Make star route to BUCK_VOUT1 and 2 from C6104. FB6100
BUCK_VSW
13 1000
TP1
WCD9302 (L6611)
6
4.7u
BUCK_VOUT1
2.2u
12
BUCK_VOUT2 TP5
(FB6100)
C6105
7
C6104
GND_BUCK
C6107 1u
11
-NCP_VNEG
Dedicate a ground island for the buck/NCP ground connections.
2
NCP_C1P C6108
1
-NCP_C1M 1u (DGMS Guide) MC-C06162-1 : 1. Don't connect Positive of Tantal, TVS diode to Negative voltage if use
49
2. We recommend MLCC capacitor in this case.
SPKR_DRVP SPK_P
50
SPKR_DRVM SPK_N
45
VDD_SPKDRV +5V0_SPK_BOOST
55
DNI
4.7u
GND_SPKDRV_1
DNI
40
GND_SPKDRV_2 TP6 TP1
(C6109)
(L6611)
C6109
18
C6121
GND4
C6122
TP6
(C6109)
LGE Internal Use Only 103(FB6100)

TP5
3. TROUBLE SHOOTING
3.12.2 Receiver troubleshooting

Receiver path as below :
MSM8926-2 -> WCD9302 EAROP/ EAROM -> Receiver
START
Yes
Run Voice Recording application.
Main Mic. Works well?
No
Refer to 3.9.5 Main MIC troubleshooting

Yes
After Change Receiver
Works well?
No
Yes
TP1 to TP2/TP3 to TP4
Short test. Is it OK?
No
Rework component Yes

TP1(L6450), TP3(L6451)
Works well?
No
Replace component U6100
End
3. TROUBLE SHOOTING
4. Trouble Shooting
TP1
(L6450) TP2
TP1 RCV + TCOIL

TP2
(L6450)
CN6450
L6450 82n 1
RCV_P
C6810 33p
L6451 82n 2
RCV_N
TP3
(L6451)
TP3 TP4 TP4
33p
33p
D6810 D6811
DNI DNI
(L6451)
C6811
C6812
(DGMS Guide)
When USE) TVS devices's Working Voltage must be greater
Main Top
TP2
TP1
TP4
(L6450)
TP3
(L6451)

3. TROUBLE SHOOTING
3.12.3 Main MIC troubleshooting

Main Mic. path as below :
MSM8926-2 -> WCD9302 MIC1_INP/ MIC1_INM -> Mic
START
Yes
Headphone icon display on Upper Refer to 3.9.5 Ear-MIC troubleshooting
right LCD ?
No
Yes Yes
Check Mic Power in Main Board Check Mic signal in Main Board
TP1(MIC_BIAS_1) TP2(MIC1_IN_P)
No
No
Replace component MIC6920
No
Replace component U6100. Voice
signal OK?
Yes
Change Main Board
End
4. Trouble Shooting
3. TROUBLE SHOOTING
TP1
(C6920)
TP1
(C6920)
MIC6920
MIC_BIAS_1
0.1u
G4
6
G3
5
C6920
VDD
4
G2
3
MIC_IN1_N G1
2
OUT
33p
1
C6921
FB6920 1800
MIC_IN1_P
DNI
TP2
(FB6920)
(DGMS Guide)
MC-C00074-11 : For ESD Protection
R6920
TP2
0
(FB6920) When USE) TVS devices's Working
D6925
D6924
D6926
GND Close to MIC
TP1
(C6920)
TP2
(FB6920)

3. TROUBLE SHOOTING
3.12.4 SUB MIC troubleshooting

Sub Mic. path as below :
MSM8926-2 -> WCD9302 MIC3_INP/ MIC3_INM -> Mic
START
Yes
Headphone icon display on Upper Refer to 3.9.5 Ear-MIC troubleshooting
right LCD ?
No
Yes Yes
Check Mic Power in Main Board Check Mic signal in Main Board
TP1(MIC_BIAS_1) TP2(MIC3_IN_P)
No
No
Replace component MIC6921
No
Replace component U6100. Voice
signal OK?
Yes
Change Main Board
End
4. Trouble Shooting
3. TROUBLE SHOOTING
TP1
(C6922)
TP1
(C6922)
MIC_BIAS_1
0.1u
G4
6
G3
5
VDD
TP2
C6922
4
G2
(FB6921) 3
MIC_IN3_N G1
2
TP2 OUT
33p
1
(FB6921) MIC6921
C6923
FB6921 1800
MIC_IN3_P
DNI
(DGMS Guide)
R6921
MC-C00074-11 : For ESD Protection / Tuning p

0
D6928
When USE) TVS devices's Work
D6929
D6927
GND Close to MIC
TP2
(FB6921)
TP1
(C6922)
3. TROUBLE SHOOTING
3.12.5 Ear-MIC troubleshooting

3.12.5.1 Headset Sound trouble
Ear-Mic. path as below :
MSM8926-2 -> WCD9302 HPH_L / HPH_R -> Headset
START
Yes
Headphone icon display on Upper
right LCD ?
No
Yes
Replace Headset Jack (J6600)
Replace component U2100

No
Check Main Board Yes Check Main Board Yes Yes

Check Main Board
TP1(MIC) TP2(HPH_L), TP3(HPH_R), TP4(HPH_ TP5(-NCP_VNEG), TP6(NPC_C1P)
When headset inserted. REF)
No No No
Replace component U6600 Replace component U6100 Replace component U6100
END
3. TROUBLE SHOOTING
TP3 TP2
4. Trouble
(FB6612) Shooting
(FB6611)
EAR_MIC_JACK
FB6611 1800
HPH_L_OUT FB6613 1800 TP2 S/W_Detect J6600
EAR_SENSE_JACK (FB6611) SPK_L
TP3 FB6612 1800 SPK_R
HPH_R_OUT C6610 1n (FB6612)
R6926 GND
FM_ANT 0 FB6600 1800 MIC
47p
D5100
C6612
L6613
TP1
4.7n
4.7n
100n
(FB6600)
R6611
R6610
1
GND Close to EarJack HPH_REF
R6617 0 TP1
(FB6600)
VA6600
VA6603
VA6601
TP4
R6615
0
2
(L6613)
VA6602
10n
TP4 R6613 R6425

MIC_BIAS_2 +VPWR
(L6613) 2.2K 2.4M
C6611
33p
C6613
2.2K
U6600 FSA5157L6X
R6424 1 6
C6614
S B1
330K 2 5
VCC GND
3 4
MIC_IN2_N A B0
R6616
DNI
C6606
1n
TP2 TP3
(FB6611) (FB6612)
TP1
(FB6600)
TP5
(C6107)
TP4 TP6
(L6613) (C6108)
3. TROUBLE SHOOTING
3.12.5.2 Headset Mic. trouble
Ear-Mic. path as below :

MSM8926-2 -> WCD9302 MIC2_INP/ MIC2_INM -> Headset
START
Yes
Headphone icon display on Upper
right LCD ?
No
Yes
Replace Headset Jack (J6600)
No
Check Main Board Yes Yes

Check Main Board
TP1(MIC) TP2(MIC_IN2_N) is GND level? Replace component U6100
When headset inserted.
No No
Replace component U6600 Replace component R6616
End
3. TROUBLE SHOOTING
4. Trouble Shooting
EAR_MIC_JACK
FB6611 1800
HPH_L_OUT FB6613 1800 S/W_Detect J6600
EAR_SENSE_JACK SPK_L
FB6612 1800 SPK_R
HPH_R_OUT C6610 1n R6926 GND
FM_ANT 0 FB6600 1800 MIC
TP1
47p
(FB6600)
D5100
C6612
L6613
4.7n
TP1
4.7n
100n
(FB6600)
R6611
R6610
1
R6617 0
GND Close to EarJack HPH_REF
VA6600
VA6603
VA6601
R6615
0
2
VA6602
10n
R6613 R6425
MIC_BIAS_2 +VPWR 2.4M
2.2K
C6611
33p
C6613
2.2K
U6600 FSA5157L6X
R6424 1 6
C6614
S B1
330K 2 5
VCC GND
3 4
MIC_IN2_N A B0
TP2
R6616
DNI
(R6616)
TP2
C6606
(R6616) 1n
TP2
(R6616)
TP1
(FB6600)
3. TROUBLE SHOOTING
3.13 LCD
Main LCD control signals are generated by MSM8926. Those signal’s path are :
MSM8926-> LCD Module
Start
Press power key

To turn the power on.
No
Is the circuit powered? Follow the power on
trouble shooting.
Yes
Disconnect and reconnect

Yes
LCD connector.
LCD display OK?
No
Yes Change the LCD module.

LCD display OK?
No
Check
No
+2V8_VREG_L15 (C7101) TP1 Change the PM8926 (U4100) or
+1V8_VREG_L8 (C7103) TP2 main BD.
OK?
Yes
LCD display OK?
Yes
End
3. TROUBLE SHOOTING
4. Trouble
4. 13. LCD Shooting
+1V8_VREG_L8
10
FL7100
+3V0_VREG_L15
2.8V --> 3.0V at 1.0
2 1
8 9
LCD_MIPI_DATA0_N
LCD_MIPI_DATA0_P
4 3
6 7
CN15001
LCD_MIPI_DATA1_N
1 30
LCD_MIPI_DATA1_P
2 29
+5V5_DDVDH
3 28
5
-5V5_DDVDL
4 27
5 26
LCD_VSYNC 6 25
P5 5
LCD_RESET_N 7 24
CABC_WLED 8 23
P1 P4 LCD_MIPI_CLK_N
TP1 FB7200 600 9 22 1 4
10 21 2
P2 P3
3
LCD_MIPI_CLK_P
PMIC_LED_A
P6
11 20
PMIC_LED_C 12 19 FL15002
6
13 18
TP1
14 17
15 16
LCD_MAKER_ID FL7101
10
C15004
C15003
C15002
1u
1u
1u
100p
100p
100p
100p
TP2 LCD_MIPI_DATA2_N
8 9
2 1
LCD_MIPI_DATA2_P
C15000
C15001
C15005
C15006
VA15002
VA15001
VA15000
VA15003
LCD_MIPI_DATA3_N
6 7
4 3
ADD at PMIC_LED_A, LED_C Bead/Cap
TP2 LCD_MIPI_DATA3_P
TP1 +1V8_VREG_L8
TP2 +2V8_VREG_L15
115
3. TROUBLE SHOOTING
3.14 Touch
Touch control signals are generated by touch sensor.
Those signal’s path are touch sensor -> MSM8926
Start
Reconnect Touch Module CN7200.
Yes
Touch Woks OK ?
No
Yes Change the touch module.

Touch Woks OK?
No
Check +2V95_VREG_L28 No
(C7201) TP1 Change PM8926 (U4100)
+1V8_VREG_L6 (C7505) TP2
Yes
No
Check I2C Line
(VA7201, VA7202) TP3 OK? Change Main Board.
Yes
Touch Woks OK ?
Yes
End
4. Trouble
4. Trouble Shooting
4. 14. Touch Shooting
3. TROUBLE SHOOTING
TP2
TP3 TP1
TP3
TP2
CN7200
TP1
R7200
1 10
+1V8_VREG_L6
4.7K 2 9 R7201 0
TOUCH_I2C_SCL 3 8
TOUCH_RESET_N
TOUCH_I2C_SDA +1V8_VREG_L6
4 7
TOUCH_INT +2V8_VREG_L28
5 6
TOUCH_MAKER_ID
DNI
2.2u
1u
2
C7201
C7200
VA7200
VA7201
VA7202
R7204
VA7203
VA7204
TP1 +2V95_VREG_L28
TP3 (C7200)
(I2C Line & Signal Line)
(VA7201 & VA7202)
TP2
+1V8_VREG_L6
(C7201)
117
3. TROUBLE SHOOTING
3.15 Sensor
3.15.1 Compass + Motion Sensor
START
Accelerometer function Check.
Yes
Change PM8926. (U4100) Sensor Woks OK ?
No
No Check
+1V8_VREG_LVS1 (C8100) TP1
+2V85_VREG_L19 (C8101) TP2
Yes
Yes Check I2C Line.

(R2207, R2208) TP3
OK?
No
Change Main Board.
Change the sensor (U8100).
Sensor Woks OK ?
Yes
End
4. 15. Sensor Shooting
4 15
4. 15. 1
1. C
Compass + M
Motion
ti S Sensor
3. TROUBLE SHOOTING
TP1
+1V8_VREG_LVS1
SENSOR0_I2C_SDA
TP1
14
13
12
SDI
PS
CSB
1 11
2
SDO SCK
10
SENSOR0_I2C_SCL
TP2
ACCEL_INT 3
INT1 U8100 VDDIO
9
INT2 BMC150 GND3
4 8
COMPASS_INT DRDY VDD +2V85_VREG_L19
GND1
GND2
INT3
0.1u
0.1u
5
6
7
C8100
C8101
TP2
TP3
TP1
U8100
TP3 TP2
119
3. TROUBLE SHOOTING
3.15.2 Proximity
Proximity Sensor is worked as below:
Send Key click -> Phone number click -> Call connected -> Object moved at the sensor
->Control the screen’s on/off operation automatically
START
Proximity function Check.
Yes
Change PM8926. (U4100) Sensor Woks OK ?
No
Check
No
+2V85_VREG_L19 (C8400) TP1
+1V8_VREG_LVS1 (R8400) TP2
OK?
Yes
Yes
Check I2C Line.
(R2207, R2208) TP3 OK?
No
Change Main Board.

Change the proximity sensor
(U8400).
Sensor Woks OK ?
Yes
End
4. Trouble
4. 15. Sensor Shooting 3. TROUBLE SHOOTING
4 15
4. 15. 2.
2 Proximity
P i it
TP2
TP1
TP2
R8400 4.7K U8400 APDS-9130-200
+1V8_VREG_LVS1
1 8 R8401
+1V8_VREG_LVS1
SENSOR0_I2C_SDA
R8400 4.7K
2
1
SDA
U8400
INT
VDD
APDS-9130-200
7
SCL 8
22
R8401
TP1 +2V85_VREG_L19
PROXIMITY_INT
SENSOR0_I2C_SDA SDA VDD SENSOR0_I2C_SCL +2V85_VREG_L19
22
3 6
2 LDR GND 7
PROXIMITY_INT INT SCL SENSOR0_I2C_SCL
4 5
3 LEDK LEDA 6
LDR GND
9
4 NC 5 C8401 C8400
LEDK LEDA
9 1u 1u
NC C8401 C8400
1u 1u
TP3
TP3
Sensors +1V8_VREG_LVS1 R2207 2.2K

SENSOR0_I2C_SDA
Sensors +1V8_VREG_LVS1
R2208
R2207
R2208
2.2K
2.2K
SENSOR0_I2C_SCL
SENSOR0_I2C_SDA
SENSOR0_I2C_SCL
U8400
TP2 TP1
TP3
121
121
3. TROUBLE SHOOTING
3.16 USB
START
No
Cable is inserted? Insert Cable
Yes
No
Check VCHG is 5V? Check C10001
Yes
No
USB_DP is 3.05V? Check R9202
Yes
Change the Main Board
3. TROUBLE SHOOTING
4. 16. USB
Typical USB Path.
Typical USB Path
Path.
DNI for test
FL10000
1 3
IN OUT VBUS_USB_IN
2 4
GND1 GND2
DNI
47K
22p
1u
C10000
R10000
C10001
D10007
D10000
CN10001
6
7
FL10001
8
6
P6
VBUS1
D- 2 2 4 R9201 0
P2 P4 USB_D_M
D+3 1 3 R9202 0
P1 P3 USB_D_P
ID 4
5 P5
GND5
2
9
10
11
1
1
D9202
D9203
MSM_USB_ID Delted at B
PM_USB_ID
PM_USB_ID : Direct connection to USB connector

DNI
to detect ID when MSM PHY is off

C9202
D10006
VCHG Check : C10001
USB_DP : R9202
- 123 -
3. TROUBLE SHOOTING
3.17 Camera
Start
Check the Camera Connector and

reconnect
Yes
Camera is OK? END
No
No Check the MSM8926/

PM8926 outputs RESET(TP1)
MCLK(TP2) DVDD(TP3)
Yes
No
Check the LDO IC outputs
Change the LDO IC
IOVDD(TP4)AVDD(TP5)
Yes
No
Check the EMI Filter signals Change the EMI Filter
CIK/Data TP6
Yes
Change the Camera
Yes
Camera is OK? END
No
Change the Main board
4. 17. Camera
3. TROUBLE SHOOTING
4 17
4. 17. 1.
1 Main
M i C
Camera TP4
TP2 TP5 TP3
TP1
3.17.1 Main Camera
+2V8_EXT_LDO3 TP5 TP4 TP3

TP2
TP1
CAM0_I2C_SDA
CAM0_I2C_SCL
R7300 0
MAIN_CAM0_MCLK
VA7405
VA7404
CN7300
MAIN_CAM0_RESET_N
1 30
DNI
2 29
3 28
VA7303
C7304
4 27
FL7301 5 26
5
6 25
+1V2_VREG_L5
7 24
+1V8_CAM_IOVDD
MAIN_CAM0_MIPI_DATA1_P 8 23 FL7302
7 6
3 4
5
MAIN_CAM0_MIPI_DATA1_N 9 22
+2V8_EXT_LDO1
10 21
MAIN_CAM0_MIPI_DATA0_P 11 20
MAIN_CAM0_MIPI_DATA3_P
9 8
1 2
7 6
3 4
MAIN_CAM0_MIPI_DATA3_N
13 18
14 17
10
9 8
1 2
15 16
10
2.2u
4.7u
2.2u
2.2u
FL7300
6
G2
C7300
2 4
MAIN_CAM0_MIPI_CLK_P
C7302
C7301
C7303
D2 D4
1 3
MAIN_CAM0_MIPI_CLK_N D1 D3
5 G1
TP6 TP6
TP4
TP3
TP2 TP5
TP1
TP6 125
4. 17. Camera
4 17
4. 17. 2.
2 VT Camera
C 3. TROUBLE SHOOTING
TP6
3.17.2 VT Camera TP1 TP3 TP5

TP6
FL7400
TP1 TP3 TP5
6
G2
2 4
VT_CAM_MIPI_DATA0_P 1
D2 D4
3
VT_CAM_MIPI_DATA0_N D1 D3
5 G1
CHANGE PIN ORDER at A

CHANGE filter 4port -> 2port at B FL7401
6
G2
2 4
D2 D4
VT_CAM_MIPI_CLK_P 1 3
CN7400
D1 D3
VT_CAM_MIPI_CLK_N 1 20
2 19
5 G1
3 18
+2V8_EXT_LDO1
TP2
4 17
5 16
+1V2_VREG_L5
R7401 0
VT_CAM_MCLK 6 15
+1V8_CAM_IOVDD
7 14
CAM0_I2C_SDA
CHANGE_PART 8 13
CAM0_I2C_SCL
TP2 1.SEVY0005402_>_EAH61533301
9 12
TP4
10 11
VT_CAM_RESET_N
2.REF_DGMS_CHECK_LIST
TP4
DNI
2.2u
2.2u
2.2u
C7403
VA7400
C7400
C7401
C7402
VA7400-7403 : Clamping 12.8V / 15pF / 50W
TP5
TP3
TP4
TP1
126
TP6 TP2
4. DOWNLOAD
4. DOWNLOAD
TOOL INFORMATION
TOOL VERSION DLL NAME USB DRIVER

LGD722V_20140617_LGFLASHv160_ LGUnitedMobileDriver_S4981MAN38AP22_ML_WHQL_
LGFLASHv160
Download Ver_3.8.1
Please Check the Version to “B2B”
H/W
Name Part No. Software
D/L Cable Micro 5P (56-open-910K) USB DLC RAD32167835 TOT
4. DOWNLOAD
LGD722V
LGD722V
LGD722V
4. DOWNLOAD
LGD722V
LGD722V_20140617_LGFLASHv160_Download
LGD722V
4. DOWNLOAD
4. DOWNLOAD
LGD722V
LGD722V
4. DOWNLOAD
RAD32167835
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
4. DOWNLOAD
LGD722V
LGD722V
LGD722VAT-00-V10a-SSV-XXX-JUN-03-2013+0.tot
LGD722V
4. DOWNLOAD
LGD722V LGD722V_20140617_LGFLASHv160_Download
LGD722V LGD722VAT-00-V10a-SSV-XXX-JUN-03-2013+0.tot
LGD722V
LGD722V
4. DOWNLOAD
LGD722V
LGD722V
4. DOWNLOAD
LGD722V
LGD722V
LGD722V
4. DOWNLOAD
LGD722V
LGD722V
LGD722V
5. BLOCK DIAGRAM
5. BLOCK DIAGRAM
LG-D722V Main Block Diagram

SDIO_DATA(8)
eMMC v4.5
SDIO_CLK 8GB
513MHz
37.4MHz MIPI_CSI0(4lane)
WLAN (IQ, CTL(5)) / TCXO_IN POP 8M Cam (AF)
BCM4334 BT_SSBI LP-DDR2 1GB MIPI_CSI1(1lane)
(BT/WLAN/FM) FM_SSBI 1.3M VT
(533MHz 32 bit
Dual channel)
Hall IC
I2C
TX_IQ ACCel+Compass
I2C
PRX_IQ Proximity
DRX_IQ
SSBI PWM/EN Q-Coin
Haptic Drv(SM100) Motor
GNSS_IQ
MSM8926
GP_CLK
(1.2GHz Quad I2C
Touch CoF
Touch
GP_SYN Screen
GP_DATA Cortex-A7)
DAC_REF MIPI_DSI(4lane)
DSV_EN 5.0” HD
DW8755 (1280X720)
XO_in from PMIC LCD Backlight
19.2MHz
GNSS EXT GNSS_ELNA_EN
Rx circuits LNA FLASH_STROBE Flash LED
TX_GTR_THRESH
USIM & uSD Combo
PS_HOLD
PM8926
UIM1
NFC SDC2(4) RESET (PMIC)
FET SPMI
(PN547) USIM1 UIM1
BB_CLK
19.2M
TCXO
19.2MHz
27.12MHz +5V_SPK_ 2540mAh(Typ), PWR_N,
+VPWR
Li-ion
I2C
SPK
booster
FPCB
USB_D_P/M
2 Mics
(Main,Sub) Feul
Battery
WCD9302 Gauge
Receiver (Codec)
IR LED VBAT
Speaker LINE_OUT
IRRC w/o driver VBUS_USB_IN
Ear-Jack (Side Contact)
USB Con.
5. BLOCK DIAGRAM
LG D722V Logic
HAPTIC_EN HAPTIC
eMMC CLK/CMD/MSM RESOUT N
eMMC_CLK/CMD/MSM_RESOUT_N Motor VD N/P
Motor_VD_N/P
eMMC LIN_MOTOR_PWM SM100
8GB SDC 1
eMMC_DATA(0:7)
Toshiba
IRRC_PWM_TX
IRRC
SDCARD_CLK/CMD
LINE_OUT_IRRC
_ _ LEVEL
uSD
SD Card
C d SDC 2 WCD9302 SHIFTER
SDCARD_DATA(0:3)
SDCARD_DET
GPIO 37 CHG_EN_SET
UIM1_CLK/RESET_N Wireless
WLC_OK / WLC_CHG_IRQ_N Linear Charger
uSD/USIM USIM1
Combo UIM1_DATA GPIO 57~59
GAUGE_I2C_SCL/SDA
Fuel
SDRAM FUEL_GAUGE_INT Gauge
LPDDR2 PoP
8Gb
BMC150 SENSOR0_I2C_SCL/SDA Hynix
Accelerometer
BMC150_INT MSM8926
compass
COMPASS_INT
HALL IC HALL_INT
BU52061NVX
SENSOR0_I2C_SCL/SDA
PROXIMITY
PROXIMITY_INT
APDS 9130
APDS-9130
PM_KYPD_PWR_N
PM8926
USB_D_M / P
KEYPAD_SENSE(0:1)
USB Con. FPCB
5. BLOCK DIAGRAM
LG D722V Power
+1V15_VSW_S1
VSW_S1 VDD CORE
+2V8_VREG_L15 VDD_USB_COR / VDD_SDC_CDC_01
5.0” HD VREG_L15 +1V15_MSM_AP_CORE
+VPWR DCDC +5V5_DDVH
(1280X720) +1V8_VREG_L8
VSW_S2 VDD_APC
VREG_L8
DSV -5V5_DDVL
+2V05_VREG_L9 +1V15_VSW_S5
VSW_S5
_ VDD_MODEM_01
_ _
VDD_RF2 VREG_L9
VREG_L1 +1V225_VREG_L1
VDD_A1
Q-Coin
Motor
+VPWR WTR1625L +1V8_VREG_L10
VREG_L10
VDD_P1/ VDD_DDR_CORE_1P8
VDD_MEM
VIO VDD_PLL1
FEMID VDD_EBI0_CDC
+1V8_MSM_IO
VREG_L6 MODE
FORCED_USB_BOOT/GPIO_113
+1V8_EAR_DETECT_VDD
VIO +1V9_MSM_A2
VREG_L7 VDD_A2
HCPA_APT_AC +2V75_VREG_L14 +3V075_MSM_USB_3P3
VREG_L14
PM7700 VREG L20
VREG_L20 VDD USB 3P3
VDD_USB_3P3
PM8926 VREG_L21
+2V95_VREG21
VDD_P2 MSM8926
S 8926
+2V95_VREG22
LM3263
VDD_1P8
(PMIC) VREG_L22
+2V95_VREG23
VDD_P5
(1.2GHz Quad
+VPWR VREG_L23
Cortex-A7)
VDD_P6
H/S +VPWR
Analog s/w +1V8_VREG_LSV1
VDD VOUT_LVS1
Hall IC
VCOIN
+1V8_VREG_LSV1
ACCEL_COMPA
+VPWR
CHARGE VBAT +2V1_PM_GR3
Batttery
VSW_S4 VDD_GR3
+2V1_PM_GR4
CHARGE Wireless WLC 5V OUT
WLC_5V_OUT
Wireless
VDD GR4
VDD_GR4
Charger Conn +1V2_CODEC_CORE

VREG_L4 VDD_MIPI_CSI
VBUS_USB_IN USB_IN
VDD_MIPI_DSI_1P2
USB Con. FLASH_LED_OUT_P

+1V8_MSM_P3, P4, P7, P8
VCC1 +2V95_VREG_L17 VREG
G_L6
6 VDD_P3,
_ P4, P7, P8
Flash LED VREG L17
VREG_L17 +1V8_MSM_DDR_CORE_1P8
VREG_L23 VDD_DDR_CORE_1P8
VREG_L5
eMMC v4.5
VDD_WLAN
8GB
+2V1_CODEC_BUCK
+1V8_VREG_L6 VDD_BUCK
+VPW
+1V3_WCN_RF
VDD_DIGWCD9302
+1V8_CODEC_IO
BCM4334 VDD TX RX (Codec)
VDD_TX_RX
+1V8_VREG_L6 +1V8_CODEC_IO
(BT/WLAN/FM) VDD_IO
+1V8_IRRC_TR +2V8_EXT_LDO1 LDO 1
+1V2_VREG_L6 +2V8_EXT_LDO3
`
IRRC circuits 8M Cam LDO 2
Touch
Screen +1V8_VREG_L6 ` +1V2_VREG_L6 VT Cam +1V8_CAM_IOVDD LDO 1
5. BLOCK DIAGRAM
LG D722V Audio
FM_ANT
BCM4334
HPH REF
HPH_REF HPH REF
HPH_REF GND
HPH_L HPH_L_OUT SPK_L
HPH_R HPH_R_OUT SPK_R
3.5pi
Ear jack connector
S/W_DETECT
MIC_BIAS_2 MIC_BIAS_2 MIC
EAR_
MBHC_HSDET EAR_SENSE_JACK
_SENSE_JACK
MIC
MSM8926
MIC_BIAS_1 MIC_BIAS_1
MIC_IN1_P Main
MIC1_INP MIC
MIC_IN1_N
MIC1_INM
WCD9302
S
Bo
AUDIO CODEC
MIC3_INP MIC_IN3_P
Sub
MIC3_INM MIC_IN3_N MIC EAR JACK
Analog S/W
MIC2_INP EAR_MIC_JACK A
EAROP RCV_P
RECEIVER
EAROM RCV_N
SPKR_DRVM SPK_P
SPEAKER
SPKR DRVP
SPKR_DRVP SPK_N
SPK N
+5V0_SPK_BOOST
VDD_SPKDRV SPK CDC_BOOST_
PM
_5V_EN
booster 8926
SLIMBUS_CLK / I2C_SCL SLIMBUS_CLK GPIO_70
SLIMBUS_CLK / I2C_SDA SLIMBUS_DATA GPIO_71
INTR CODEC_INT
CODEC INT GPIO_68
GPIO 68
RESET_N CODEC_RESET_N GPIO_72
VDD_VBAT
+VPWR
5. BLOCK DIAGRAM
LG D722V Camera & Display

LDO1_EN
GPIO_62 5.0” HD
MAIN_CAM0_VCM_PWDN
GPIO_36 (1280X720)
LDO3_EN
GPIO_113
MAIN_CAM0_MIPI_CLK_N
Main MIPI_CSI0_CLK_N
LCD
CAM MAIN_CAM0_MIPI_CLK_P
MIPI_CSI0_CLK_P
5.0"Qhd DCDC
8M MAIN_CAM0_MIPI_DATA0_N MIPI_DSI0_CLK_N LCD_MIPI_CLK_N
30pin
DDVDL_-5.5V +VPWR
MIPI_CSI0_LN0_N
DDVDL_+5.5V DSV
LDO 1 +2V8_EXT_LDO1
2V8 EXT LDO1 30pin MAIN_CAM0_MIPI_DATA0_P MIPI DSI0 CLK P
MIPI_DSI0_CLK_P LCD MIPI CLK P
LCD_MIPI_CLK_P
MIPI_CSI0_LN0_P
MAIN_CAM0_MIPI_DATA1_N MIPI_DSI0_LN0_N LCD_MIPI_DATA0_N
+2V8_EXT_LDO3
LDO 2
MIPI_CSI0_LN1_N
MIPI_DSI0_LN0_P LCD_MIPI_DATA0_P PM8926
1V8_CAM_IOVDD MIPI_CSI0_LN1_P +VREG_L15_2V8
LDO 3
MIPI_DSI0_LN1_N LCD_MIPI_DATA1_N
MAIN_CAM0_MIPI_DATA2_N MIPI_CSI0_LN2_N +VREG_L8_1V8
MAIN_CAM0_MIPI_DATA2_P MIPI_DSI0_LN1_P LCD_MIPI_DATA1_P
WR
MIPI_CSI0_LN2_P
+VPW
MAIN_CAM0_MIPI_DATA3_N MIPI_CSI0_LN3_N MIPI_DSI0_LN2_N LCD_MIPI_DATA2_N

PMIC_LED_A OVP_WLED
MAIN_CAM0_MIPI_DATA3_P MIPI_CSI0_LN3_P MIPI_DSI0_LN2_P LCD_MIPI_DATA2_P
MAIN_CAM0_RESET_N GPIO_114 PMIC_LED_C WLED_1
PM 1V2_VREG_L5
MAIN_CAM0_MCLK GPIO_26
MSM8926
CAM0_I2C_SDA GPIO_39 CABC_WLED GPIO_6
8926 LCD_MAKER_ID
CAM0_I2C_SCL GPIO_40 GPIO_23
GPIO_24 LCD_VSYNC
VT
CAM GPIO_25 LCD_RESET_N
VT_CAM_MIPI_CLK_N MIPI_CSI1_CLK_N
1.3M
20pin VT_CAM_MIPI_CLK_P MIPI_CSI1_CLK_P
VT_CAM_MIPI_DATA0_N MIPI_CSI1_LN0_N
VT_CAM_MIPI_DATA0_P MIPI_CSI1_LN0_P
VT_CAM_MCLK GPIO_27
VT_CAM_RESET_N GPIO_28
Flash FLASH_LED_OUT_ VLED_FLASH

LED
5. BLOCK DIAGRAM
LG-D722v BT & Wi-Fi Block Diagram

MSM8926
BCM4334 - BT_UART_RTS
BT_UART_CTS_N GPIO 15
(802.11a/b/g/n) BT_UART_CTS
BT_UART_RTS_N GPIO 14
BT_UART_TX
VBAT BT_UART_RXD GPIO 12
WLAN/BT ANT. BT_UART_RX
2G_G_TSSI BT_UART_TXD GPIO 13
WRF G TSSI IN
WRF_G_TSSI_IN
BT_PCM_CLK, 2048KHz
BT_PCM_CLK GPIO 49
WLAN_2G_RX BT_PCM_DATA_OUT
WRF_RFIN_2G BT_PCM_IN GPIO 52
BT_PCM_DATA_IN
WL_2.4G_ BT_TX BT_PCM_OUT GPIO 51
SAW BT_RF BT_PCM_SYNC
DPX BT_PCM_SYNC GPIO 50
FEM WLAN_2G_TX
WRF_RFOUT_2G
WLAN CLK 100MHz
WLAN_CLK,
SW_BT_TX SDIO_CLK GPIO 44
RF_SW_CTRL_0 WLAN_CMD
SW_2G_RX SDIO_CMD GPIO 43
RF_SW_CTRL_1 WLAN_DATA_0
SW_2G_PA_EN SDIO_DATA_0 GPIO 42
SW_2G_LNA_EN SDIO_DATA_1 GPIO 41
SDIO_DATA_2 GPIO 40
WLAN_DATA_3
RF_SW_CTRL_4
RF SW CTRL 4 SDIO DATA 3
SDIO_DATA_3 GPIO 39
RF_SW_CTRL_5 WLAN_HOST_WAKEUP
WL_HOST_WAKE GPIO 54
RF_SW_CTRL_6 HOST_BT_WAKEUP
BT_DEV_WAKE GPIO 47
BT_HOST_WAKEUP
BT_HOST_WAKE GPIO 48
WLAN_PWR_ON
WRF_RFIN_5G WL_REG_ON GPIO 46
BT_POWER_ON
BT_REG_ON GPIO 45
WRF_RFOUT_5G
WRF_XTAL_CAB_OP XO
WRF_GPIO_OUT WRF_XTAL_CAB_ON 37.4MHz
SLEEP CLK
SLEEP_CLK 32 768Khz
32.768Khz
LPO_IN SLEEP_CLK
+1.8V_VREG_L6
VDDIO_1,2 VREG_L6
VDD_LN
VDD_CORE Internal BUCK & LDO
VBAT PM8926
VOUT_3P3 ((Main power
p source))
VIN_LDO
5. BLOCK DIAGRAM
LG D722V NFC
NFC_PN547
+2V95_VREG_L22
PMUVCC
TX1
TX2
RXP
COMMON_I2C_SDA
RXN IF2 GPIO_10
COMMON_I2C_SCL MSM8926
IF3 GPIO 11
GPIO_11
NFC_IRQ
IRQ GPIO_21
FET NFC_MODE
DWL_REQ GPIO_22
S
SIM_SOCKET D
I/O NFC_VEN
UIM_D
UIM D G EXT SW CTRL
EXT_SW_CTRL VEN GPIO 20
GPIO_20
ATA
VPP SWIO_UICC
NFC_SWP +VPWR
VCC SIMVCC
+3V0_USIM_NFC VBAT
VBAT2
VEN _MON
IFSEL1 PMIC (PM8926)

GPIO0
GPIO1
TEST1 VREG_L6
XTAL XTAL2 VREG L22
VREG_L22
TEST2 +1.8V_VREG_L6
G
27.12MHz XTAL1 TEST3
TEST4
TEST10
PVDD
5. BLOCK DIAGRAM
LG D722V RF Circuit
Coupler
GSM_LB
ANT1 GSM_HB B5/8 LPF TX_LB1(B5)
( )
WTR1625L
GSM850/GSM900 B5
GSM_LB
WCDMA B5/8 B8 TX_LB2(GSM_LB)
HCPA
LTE B7/8/20 B1 GSM_HB
TX_MB2(GSM_HB)
B2
ACPM-7700 B1/2
TX_MB3(B1/2)
B3/B4
DPX
B4 TX_MB4(B3/B4)
LB B3
DPX
DIP FEMID GSM_HB_RX

PRX_MB2(GSM_HB)
B5
PRX_LB3(B5/GSM850)
B8
PRX_LB2(B8/GSM900)
HB B1
SPDT PRX_HMB4(B1)
ANT3 B2
PRX_MB1(B2)
GNSS
PRX_MB3(B3)
B20/28 LPF
B20/28
DPX LPF PAM SAW TX_LB3(B20/28)
PRX LB1(B20/28)
PRX_LB1(B20/28)
ANT2
DCS1800/PCS1900 SAW LNA
GNSS_IN_N
WCDMA B1/2 GNSS_IN_P
LTE B1/3 B7 TRx
DPX PAM TX_HB1(B7)
PRX_HB3(B7)
SP5T B40 Tx
SAW PAM TX_HB2(B40)
Coupler
p
B40 Rx
R
SAW PRX_HB2(B40)
B1 DRx
DRX_HMB4(B1/B4)
B2 DRx
DRX_MB1(B2)
B3 DRx
DRX_MB3(B3)
B7 DRx
HB Diversity DRX_HB3(B7)
FEM
B8 DRx
DRX_LB2(B8)
DIPLEXER
ANT6 MIMO DRX_HB1(B40)
B5 DRx DRX_LB3(B5)
WCDMA B1/8
LB B28 DRx
LTE B1/3/7/8/20 SAW DRX_LB1(B28)
B20 DRx
DRX_LB4(B20)
B40 DRx SAW
SPDT DRX_MB3(B1/B4)
DRX_MB1(B2) WFR1620
PRX_MB1(B2)
SPDT PRX_MB3(B1)
6. CIRCUIT DIAGRAM
6. CIRCUIT DIAGRAM
ANT10062
< 1_3_1_26_ANT_CA_NA_EU > Rev_0.1

ANT10061
ANT1
ANT10060
FEED
FEED
FEED
MBV62562001 C10050
C10061 C10064 100p
C10052
ANT_1 R1105 100p
ANT1 ANT1 (B5,B7,B8,B13,B17,B20,B28,G850/900)

33p DNI
DNI
C10051
L10062 100p
L10061
11
SW1101 0.5p
DNI C10065 3.3n
RFC
2 C1101 33p
ANT_1 ANT COMMON 1
RF1 RF3
10 C10066 8.2n
1 FL1100 C10068 15n
C10067 100p 2 FL10060 9
FL10062 RF2 RF4
G3 G4 4 3
DNI
Termination_Port OUT 3 RF1149A 8
DNI
1 6 C1104 8p GND1 GND2
3 4 5 GND2 GND1 2 GND1 HI-BAND R10069 4 7
+2V75_VREG_L14
51
L1103 C1103 3.3n
TOL=0.01
240KTOL=0.01
2 5 VDD EN
6 1
CTL1
CTL2
Coupling IN COMMOM GND3 0
82n 3 4
R1100
DNI
GND2 LO-BAND C10069
1 2 360KTOL=0.01
L1101
DNI
R10062
L1102
5
6
10n
R10061
L1110
L1104
R10063 4.7K TOL=0.01
R10064 4.7K TOL=0.01

C1105 C10070
33p
C10071
33p
Lower current option
ANT_TRX_FEMID_LB
( DGMS Guide ) 2.2n
DNI
L1151
TP1101
GRFC_8
GRFC_9
TP1100
ANT2 ANT2(B1,B2,B3,B4,B40,G1800/1900)
+2V75_VREG_L14
B40 DRX
WTR0_PDET_IN
1n
SW1102 C1110
2 885049 FL1104
ANT COMMON C1106 DNI C1107 DNI
1.5n
C1108
1 1 4 L1105 DNI
IN OUT WTR0_DRX_HB1_IN
7
6
5
4
G3 G4
DNI
FL1103 LDJ18829M24AD011 G1 G2 G3
0.5p
B40
RF4
RF5
GND1
VDD
3 4
DNI
Termination_Port OUT 2 3 5
L1152 4 3
DNI
DNI
GND2 GND1
L1109
82n GND2 CTL1 GRFC_13

L1108
5 2 8 3
Coupling IN ANT_TRX_FEMID_HB
L1107
6 1 9
ANT FL1102 CTL2
2
GRFC_14
RF1635
GND3 CTL3 GRFC_15
L1106
10 1 C1113 DNI
100p
100p
100p
GND4
GND5
RF1
RF2
RF3
C1115
C1116
C1117
( DGMS Guide )
11
12
13
14
15
C1109
FEED
PATH CTRL1 CTRL2 CTRL3
4.7p
TE_1_1H_C-CLIPANT1100
ANT-RF1 H L L
C1111 C1112
FEED
5.6n DNI ANT-RF2 L H L ANT_TRX_B7 C1118 DNI L1111 DNI
TE_1_1H_C-CLIPANT1101 ANT-RF3 H H L WFR0_DRX_MB3_IN

ANT_TX_B40
ANT-RF4 L L H
ANT_PRX_B40
100p
ANT-RF5 H L H
B1/4 DRX_WFR
L1112
DNI
R1106
C1119 DNI
C1120 33p L1113 33p
ANT6
WTR0_DRX_HMB4_IN
VDD CTRL
PORT 1 H H L1114
ANT6 MRD (B1,B2,B3,B4,B5,B7,B8,B13,B17,B20,B28,B40) GRFC_20

PORT 2 H L
3n
B1/4 DRX_WTR
C1121 33p
100p
5 4
C1123 33p L1115 1n
PORT2
WTR0_DRX_MB3_IN
VCTL
SW1103
C1122
C1150 100p C1124 C1125
2 6 3
FEED ANT COMMON ANT GND
C1163
3p 1
100p
PORT1
DNI L1116
G3 G4 1 1
VDD
DNI
DNI
1n
ANT1102 FL1106 C1164 3.9n
3 4 L1119
B3 DRX
FL1105 1 6
L1117 L1118 1 2
C1126
82n GND1 HI-BAND
2 5 1n
L1120
L1121
10n DNI C1127 1n
COMMOM GND3 C1128 33p
3 4
2 2 GND2 LO-BAND
DNI
C1162 C1129 DNI
L1124 DNI WFR0_DRX_MB1_IN
+2V75_VREG_L14
DNI
L1123
DNI
FEED
B2 DRX_WFR
DNI
ANT1103
L1125
+1V8_VREG_L10+2V75_VREG_L14
C10073 C1130 DNI
100p
L1154
C1131 33p L1126 4.7n

WTR0_DRX_MB1_IN
11
26
25
24
23
22
21
C1132
C1133
GND12
L10070 1.5n
RFC
GND11
ANT_LB
GND10
ANT_HB
GND9
1p
L10069 100p 1 10
B2 DRX_WTR
RF1 RF3
L10071 100p 2 FL10061 9
L1127
RF2 RF4
100p
100p
3 RF1149A 8 C10074 6.8n 1 20
R10070 4
GND1 GND2
7
( DGMS Guide ) 2
GND1 GND8
19
+2V75_VREG_L14 VDD EN MC-C00002-14 : ESD Protection Circuit GND2 B1/4_RX C1136 33p
CTL1
CTL2
0 3 18
RFFE2_CLK 4
SCLK
U1100
B3_RX
17
360K TOL=0.01 RFFE2_DATA SDATA
D5202
B2_RX L1128
5
6
5 16 C1137 33p
WTR0_DRX_LB4_IN
PA THERM_1
R10065 VIO B20_RX 18n
PA THERM_0
R10066 6 15
VDD B5_RX
C10075 240K TOL=0.01 7 14
GND3 B8_RX
B17 DRX
8 13 L1129
10n
Lower current option GND4 GND7
3.3p
B7_RX
R1101 0
GND5
GND6
R10067 4.7K TOL=0.01
R10068 4.7K TOL=0.01
PA_THERM_0
AUX
C10076 C10077
DELETED AT B 33p 33p

TOL=0.01
9
10
11
12
DNI
PT1100
100K
L1130
C1139 33p
C1135
WTR0_DRX_LB3_IN
10n
B5 DRX
10n
L1131
C1140 33p
GRFC_10
GRFC_11
C1141 33p L1132 10n

WTR0_DRX_LB2_IN
DNI
B8 DRX
L1133
C1142 33p
FL1107
TOL=0.01 C1146 DNI C1147 DNI
1 4
R1103 L1134 2.2n R1104 10 UB UB-Lch DNI L1135 WTR0_DRX_LB1_IN
GNSS_ELNA_EN +2V75_VREG_L14 G1 G2 G3
ANT3
820
DNI
2 3 5
DNI
6.8p
0.1u
33p
L1148 L1136
DNI DNI
B28/B29 DRX
C1143
L1137
C1144
C1145
ANT3 GNSS
7 1
NEAR TO WTR
C1155 DNI
DNI AT 1.0
VCTRL
VDD
FL1109
L1150
C1151
L1149
8.2n
C1148 100p C1149 100p

100p
100p
RFOUT1 5 GNSS_IN_N C1158 33p

FEED
1
IN OUT
4
2 RFIN
FL1108 L1144 2.2n WTR0_DRX_HB3_IN
SFMG2B0D001
DNI
DNI
G1 G2 G3
6
DNI
DNI
RFOUT2
ANT1104 2 3 5
B7 DRX
DNI
DNI
82n
1
GND1
GND2
GND3
L1138
L1139
L1140
L1147
L1146 L1153
L1141
L1142
FEED
DNI DNI C1159 100p C1160 100p

ANT1105 3 4 8 GNSS_IN_P C1161 DNI
L1143
2
L1145
100p
( DGMS Guide )
6. CIRCUIT DIAGRAM
< 1_3_2_18_FEMID_nCA_NA_EU > Rev_0.1

+2V75_VREG_L14
C1200 DNI
B4_PRX_WTR
B4 TRX_WTR for non CA
+1V8_VREG_L10
+2V75_VREG_L14
C1173 DNI
B4 TRX_WFR for CA
C1251 DNI C1201 DNI
C1202 DNI
GND2 AO
4 3 B4_PRX_WFR
ANT_TRX_FEMID_HB
DNI
AI DNI VCC
DNI
5 2
C1203
C1204
ANT_TRX_FEMID_LB FL1200 DNI GRFC_2 6

PON GND1
1
C1205 6 1 L1220 DNI
DNI
ANT RX BGA7M1N6 U1101 C1175
L1201
L1200
DNI
100p
100p
DNI
C1174
DNI
3
TX DPX_TX_B4 DNI
2 9 L1219
L1203
L1202
RFFE2_DATA 4
GND1 GND6
8
DNI
RFFE2_CLK 5
GND2 GND5
7
GND3 GND4
40
39
36
35
34
33
32
31
30
29
28
38
37
C1172
GND17
GND16
GND13
SDATA
GND12
GND11
GND10
GND15
GND14
VDD
ANT_H
ANT_L
DNI
VIO
+2V75_VREG_L14
SCLK TRX6_H B1_PRX_WTR

1 27
GND1 TRX5_H
2 26 C1206 33p L1204 1n
RXB1 FL1201 GND9 WTR0_PRX_MB3_IN
1n
3 25
GND2 LMSW54GM-G20TX850/900 FEMID_TX_GSMLB FL1202
2
1
4 24
C1207
GND3 TX1800/1900 FEMID_TX_GSMHB
PORT1
VDD
B1 & B4 PRX_WTR
5 23 L1205 L1206
RXB2 TXB8 DPX_TX_B8 3 6 C1208 33p
6 22 0.5p WTR0_PRX_HMB4_IN
B3 TRX
GND ANT
GND4 TXB5 DPX_TX_B5 1.2n
PORT2
7 21
DPX_TX_B2
VCTL
GND5 TXB2
100p
FL1203
TRX2_L_LTE
TRX3_L_LTE
8 20 C1211 3n C1210 33p

RX1800/1900 TXB1 DPX_TX_B1 6 1 XMSS1R6G0PA-001TMP L1207
4
5
9 19 ANT RX
C1209
1.8n
TRX1_L
TRX4_L
GND6
GND7
GND8
0.5p
RXB5
RXB8
DNI
TX DPX_TX_B3 GRFC_5
2 9
B4_PRX_WTR
L1208
L1209
10
11
12
13
14
15
16
17
18
GND1 GND6
4 8
GND2 GND5 VDD CTRL
5 7
GND3 GND4 PORT 1 H H
PORT 2 H L
B13__B17_B20_B28A TRX
C1213 33p
ANT_TRX_B13__B17_B20_B28A +2V75_VREG_L14
B1_PRX_WFR
DNI
L1210 18n FL1204
2
1
G900_B8 PRX
C1214
PORT1
C1215 33p
VDD
B1 & B4 PRX_WFR
WTR0_PRX_LB2_IN 3 6 C1216 DNI L1211 DNI
GND
DNI ANT WFR0_PRX_MB3_IN
PORT2
VCTL
DNI
1p
L1213 DNI
4
5
C1217
L1212
C1218 33p
GRFC_5 C1219 DNI
B4_PRX_WFR
FL1205
VDD CTRL
C1223 DNI C1224 DNI PORT 1 H H
B29_PRX
1 4
UB UB-Lch L1223 DNI
WTR0_PRX_LB4_IN
G1 G2 G3 PORT 2 H L
DNI
DNI
2 3 5
DNI
B29_DNI_AT 1.0
L1228
L1225
C1245 DNI
G850_B5 PRX
L1214 15n
C1220 33p
WTR0_PRX_LB3_IN
DNI
L1215
C1221 DNI
B1 PRX_WTR for non CA

C1247 33p
B1_PRX_WTR
B1 PRX_WFR for CA
C1222 C1248 DNI
33p
B1_PRX_WFR
L1229
1.5p
B2 PRX_WTR
C1225 100p L1226 3n
WTR0_PRX_MB1_IN
3.9n
L1227
C1246 100p
C1229 DNI
WFR0_PRX_MB1_IN
B2 PRX_WFR For CA
L1217 DNI
DNI
L1218
C1235 DNI
L1221 4.7n
C1234 33p C1244 100p
WTR0_PRX_MB2_IN
GSM_HB PRX
DNI
L1222
C1237 DNI
6. CIRCUIT DIAGRAM
< 1-3-3-1_HCPA_APT_ACPM7700 > Rev_0.3
B1 DPX_TX_B1
C1305 3.3n C1304 33p C1302 33p
WTR0_TX_MB3_OUT B1,B2
DNI
DNI
0.5p
L1300
L1301
L1302
B3 C1312 2.7n
GND
C1306 33p C1307 2.7n
WTR0_TX_MB4_OUT
KR, ATT, EU
DPX_TX_B3 B3,B4
DNI
VZW
DNI
1p
36
37
38
39
40
41
42
43
L1303
GND15
NC
GND16
GND17
GND18
GND19
GND20
PGND
L1323
L1322
B4 35
34
RFOUT_B1 RFIN_B1_B2
1
2
NON-LTE PATH
C1313
C1310 DNI RFOUT_B3 RFIN_B4
DPX_TX_B4
1.5n
33 3
RFOUT_B4 RFIN_B26
32 4 C1314 33p C1315 33p
DNI
DNI
31
RFOUT_B2 RFIN_B5_B8
5
WTR0_TX_LB1_OUT ATT, EU, DCM, VZW
RFOUT_B5_B26 GND1
3
2
1
DNI
30 6 FL1301
+1V8_VREG_L10
GND14
U1300 VIO B5, B8
L1306
L1307
29 7 KR
OUT
G1
IN
B2
DNI
RFOUT_B8 GND2
28 8 R1302 0
1 2
L1309
RFFE1_CLK
VCC1
SKY77629-21 SCLK
NC
G2
G3
27 9 R1303 0
C1317
VCC2 SDATA RFFE1_DATA

4.7p
L1308
4
5
6
26 10
DPX_TX_B2 25
VCC_GSM GND3
11
24 12
L1310 L1311 RFOUT_GSM_HB GND4
10u
23 13
1n
7.5n
22
GND12 RFIN_GSM_HB
14 LTE PATH(LPF USE)
B5
8.2n RFOUT_GSM_LB RFIN_GSM_LB
C1319
C1318
GND11
GND10
GND9
GND8
GND7
GND6
GND5
C1320 3.9n
DPX_TX_B5
21
20
19
18
17
16
L1312 L1313 15
C1321 33p C1322 33p
1.5p 1.5p WTR0_TX_MB2_OUT GSM_HB
B8 GND
DNI
C1323 1.2n
DPX_TX_B8
L1314
DNI
DNI
L1315
L1316
C1324 4.7n C1325 33p

WTR0_TX_LB2_OUT KR, DCM, VZW
GSM_LB
3/4G
DNI
ATT, EU
+VPA0
L1317
2G
10u
1n
C1330
C1328
G1800/G1900
C1327 1.2n
FEMID_TX_GSMHB
DNI
DNI
L1318
L1319
G850/G900
C1326 1.8n
FEMID_TX_GSMLB
L1320
L1321
22n 0.5p
6. CIRCUIT DIAGRAM
< 1-3-4-2_PT_APT_LM3263 > Rev_0.4

Boost Option
D3 A1 R1401
SGND PVIN1 +VPWR +VPWR|+VPA_BATT0
B1 0
PVIN2
0.1u
C1
+1V8_VREG_L10
10u
VIO
B4
PACB
D1 U1400
C1401
RFFE1_CLK
C1400
SCLK
D4
C2
LM3263 SVDD
RFFE1_DATA SDATA
DNI
DNI
A3
PGND
BGND
GPO1
ACB1
ACB2
SW1
SW2
C1408
C1409
FB
B3
D2
A2
B2
A4
C4
C3
L1400 1.5u
+VPA0
10u
1n
C1
C1403
6. CIRCUIT DIAGRAM
< 1-3-5-1_RFIC_CA_nCA_WTR1625 > Rev_0.4

CAUTION: YOU MUST CHECK & MODIFY RF PORT AND GPIO ON YOUR SCHEMATICS.
NOTE1 NOTE2
CHANGE R1507 22nH, C1510 DNI CHANGE R1508 8.2nH
22nH inductor helps spurs for B3+B5 CA 8.2nH inductor helps spurs for B4+B2 CA
DOCUMENT NO: 80-NA805-44 DOCUMENT NO: 80-NA805-42
+1V225_VREG_L1
NOTE1 NOTE2
22n
8.2n
+1V8_VREG_L10
L1507
L1508
+2V05_VREG_L9
NOTE1
USE ONLY FOR CA
DNI
100p
100p
4.7u
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
100n
DNI
DNI
DNI
10u
1u
C1500
C1501
C1502
C1503
C1509
C1513
C1517
C1504
C1505
C1506
C1507
C1508
C1510
C1511
C1512
C1514
C1515
C1516
C1518
C1519
C1520
C1521
C1522
C1523
C1524
103
129
126
157
147
116
100
52, 59
93, 74
149
115
135
136
80
62
79
78
48
90
25
38
14
57
R1505
129
126
157
114
147
116
100
103
137
149
115
135
136
DNI
+1V225_VREG_L1
54
98
80
62
79
78
48
90
52
59
93
74
25
31
72
38
14
11
22
57
34
R1506
+2V05_VREG_L9
VDD_RF1_P_HMB_LO
VDD_RF1_G_VCO
VDD_RF1_D_LOM
VDD_RF1_P_HMB
VDD_RF2_P_VCO
VDD_RF2_S_VCO
VDD_RF1_S_VCO
VDD_RF1_P_VCO
VDD_RF1_D_MB
VDD_RF2_T_VCO
VDD_RF1_T_VCO
VDD_RF1_P_HB_LO
VDD_RF1_T_UPC
VDD_RF1_G_LNA
VDD_RF2_FBRX
VDD_RF1_G_BB
VDD_RF1_D_HB
VDD_RF2_PRX
VDD_RF2_XO
VDD_RF1_T_SYN
VDD_RF2_D_BB
VDD_RF1_D_LB_LO
VDD_RF2_T_DA
VDD_RF2_P_BB
VDD_RF1_T_DA
VDD_RF1_G_PLL
VDD_RF2_T_BB
VDD_RF1_T_LO
VDD_RF1_D_LB
VDD_RF1_P_LB
VDD_RF1_P_PLL
VDD_RF1_S_PLL
VDD_RF2_T_PLL
VDD_DIO
162 DNI
WTR0_TX_LB1_OUT TX_LB1_OUT C1527 C1526
153 160
WTR0_TX_LB2_OUT TX_LB2_OUT TX_BB_IM WTR0_TXBB_I_N DNI DNI
163 151
WTR0_TX_LB3_OUT TX_LB3_OUT TX_BB_IP WTR0_TXBB_I_P
154 161
C1528
C1529
C1530
C1525
TX_LB4_OUT TX_BB_QM WTR0_TXBB_Q_N
146 152
TX_MB1_OUT TX_BB_QP WTR0_TXBB_Q_P
138
WTR0_TX_MB2_OUT TX_MB2_OUT
139 108
DNI
DNI
DNI
DNI
C1531
C1532
C1533
C1534
C1535
WTR0_TX_MB3_OUT TX_MB3_OUT PRX_BB_IM WTR0_PRXBB_I_N
155 99
DNI
DNI
WTR0_TX_MB4_OUT TX_MB4_OUT PRX_BB_IP WTR0_PRXBB_I_P
130 97
WTR0_TX_HB1_OUT TX_HB1_OUT PRX_BB_QM WTR0_PRXBB_Q_N
121 107 23 56 17 37
C1536
C1537
DNI
DNI
DNI
DNI
DNI
R1500
C1539 33p WTR0_TX_HB2_OUT TX_HB2_OUT PRX_BB_QP WTR0_PRXBB_Q_P
WTR0_PDET_IN +1V8_VREG_L10
15
117 86
PDET_RFFB DRX_BB_IM WTR0_DRXBB_I_N
DNI
31 44 33 47 24 59 10
24
47
59
39
10
15
33
44
31
37
17
56
23
R1501
R1502
76
2
330
330
DRX_BB_IP WTR0_DRXBB_I_P
VDD_RF1_D_MHB_FE
VDD_RF1_P_MHB_FE
VDD_RF1_P_VCO
VDD_RF2_P_VCO
VDD_RF2_XO
VDD_RF1_D_LO
VDD_RF2_D_BB
VDD_RF1_P_LO
VDD_RF2_P_BB
VDD_RF1_D_LB_FE
VDD_RF1_P_LB_FE
102 68
VDD_RF1_P_PLL
VDD_RF1_DIG
VDD_RF3_DIO
C1538
WTR0_PRX_LB1_IN PRX_LB1_IN DRX_BB_QM WTR0_DRXBB_Q_N
92 61
WTR0_PRX_LB2_IN PRX_LB2_IN DRX_BB_QP WTR0_DRXBB_Q_P
73
WTR0_PRX_LB3_IN PRX_LB3_IN
65 60
WTR0_PRX_LB4_IN PRX_LB4_IN GNSS_BB_IP WTR0_GNSSBB_I_P
51 53 2
WTR0_PRX_MB1_IN PRX_MB1_IN GNSS_BB_IM WTR0_GNSSBB_I_N 22
43 67 WFR0_PRX_MB1_IN PRX_MB1_IN
WTR0_PRX_MB2_IN PRX_MB2_IN GNSS_BB_QP WTR0_GNSSBB_Q_P 16 43
27 85 PRX_MB2_IN DRX_HB_CA_IN
WTR0_PRX_MB3_IN PRX_MB3_IN GNSS_BB_QM WTR0_GNSSBB_Q_N 6 65
9 WFR0_PRX_MB3_IN PRX_MB3_IN DRX_MB_CA_OUT
WTR0_PRX_HB1_IN PRX_HB1_IN 36
17 71 R1503 4.75K DRX_LB_CA_IN
PRX_HB2_IN RTUNE 49
18 37 TOL=0.01 WFR0_DRX_MB1_IN DRX_MB1_IN
WTR0_PRX_HB3_IN PRX_HB3_IN DNC 54 27
19 DRX_MB2_IN PRX_HB_CA_IN
WTR0_PRX_HMB4_IN PRX_HMB4_IN
U1500 DAC_REF
127
WTR0_DAC_IREF
WFR0_DRX_MB3_IN
66
DRX_MB3_IN PRX_MB_CA_OUT
5
3
WTR0_DRX_LB1_IN
5
DRX_LB1_IN WTR1625L GP_DATA0
123
WTR0_GPDATA_0 52
PRX_LB_CA_IN
U1501
15 104 GND1
WTR0_DRX_LB2_IN DRX_LB2_IN GP_DATA1 WTR0_GPDATA_1 1 28
16 141 GND2 PRX_BB_IM WFR0_PRXBB_I_N
DRX_LB3_IN GND64
WTR0_DRX_LB3_IN
WFR1620
61 29
7 GND3 PRX_BB_IP WFR0_PRXBB_I_P
WTR0_DRX_LB4_IN DRX_LB4_IN 34 30
28 105 GND4 PRX_BB_QM WFR0_PRXBB_Q_N
WTR0_DRX_MB1_IN DRX_MB1_IN SSBI_TX_GNSS WTR0_SSBI_TX_GNSS 14
DNI 25
20 95 GND5 PRX_BB_QP WFR0_PRXBB_Q_P
DRX_MB2_IN SSBI_PRX_DRX WTR0_SSBI_PRX_DRX 46
1 GND6
WTR0_DRX_MB3_IN DRX_MB3_IN 35 63
4 109 GND7 DRX_BB_IM WFR0_DRXBB_I_N
WTR0_DRX_HB1_IN DRX_HB1_IN ADC_IN 42 62
12 GND8 DRX_BB_IP WFR0_DRXBB_I_P
DRX_HB2_IN 53 64
13 131 C1541 1n GND9 DRX_BB_QM WFR0_DRXBB_Q_N
WTR0_DRX_HB3_IN DRX_HB3_IN XO_IN WTR0_XO_IN 20 57
2 C1543 DNI GND10 DRX_BB_QP WFR0_DRXBB_Q_P
WTR0_DRX_HMB4_IN DRX_HMB4_IN 51
91 GND11
PRX_LB_CA_OUT 41 19 R1504 DNI
36 50 GND12 R_TUNE
GNSS_IN_P GNSS_RF_INP PRX_MB_CA_IN 45 13
44 33 GND13 SSBI_PRX_DRX WFR0_SSBI_PRX_DRX
GNSS_IN_N GNSS_RF_INM PRX_HB_CA_OUT 50
GND14
18 7 C1540 DNI
113 32 GND15 XO_IN WTR0_XO_IN
GND50 DRX_LB_CA_OUT
94 29
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND51 DRX_MB_CA_IN
DNI
140 30
GND52 DRX_HB_CA_OUT
55
C1542
GND53
118 112
GND54 GND58
8
11
21
32
38
55
40
60
48
58
26
12
156 132
GND55 GND59
122 45
GND56 GND60
164 66
GND57 GND61
84
GND62
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
GND38
GND39
GND40
GND41
GND42
GND43
GND44
GND45
GND46
GND47
GND48
GND49
75
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND63
8
3
89
56
83
82
58
35
26
64
42
41
81
21
24
39
10
23
46
49
69
88
70
63
40
47
87
77
96
111
101
110
145
144
143
128
120
119
106
150
134
159
142
125
124
148
158
133
6. CIRCUIT DIAGRAM
< 1-3-6-4_TRX_B13_B17_B20_B28 > L1700 18n

Rev_0.4
B17 / B20 / B28 PRX
C1700
WTR0_PRX_LB1_IN
33p
DNI
L1701
C1701 DNI
MIPI APT
+VPA_BATT0
B13__B17_B20_B28A TRX +VPA0
+1V8_VREG_L10
B17 SFSY0041401
BYPASS FOR NON-CA B17 EAM62870401 B12 EAM62250901
C1702 33p B12 EAM62930301 B17(WB) EAM62890401
RFFE1_CLK B12(WB)
FL1700
C1704 DNI C1703 6 1 6
SCLK SDATA
5
RFFE1_DATA
ANT_TRX_B13__B17_B20_B28A ANT RX GND VIO
7 U1701 4 FL1701
B17 / B20 / B28 TX

3
2
1
FL1702 6.8n C1706 NC VBATT

3 8 3 C1705 33p 4 1 C1711 33p C1712 33p
OUT
G1
IN
RF7920
L1703
TX
9
RF_OUT RF_IN
2
OUT IN
G3 G2 G1
WTR0_TX_LB3_OUT
L1702 3.9p
VCC2 VCC1
NC
G2
G3
DNI
DNI
DNI 15n 2 9 10 1 5 3 2
DNI 4
GND1 GND6
8 L1710 11
PGND
4
5
6
L1707
GND2 GND5
5 7 7.5n 18n
L1708
GND3 GND4
L1709
C1714
C1713
DNI
DNI
USE LPF FOR CA
3
2
1
FL1653
OUT
G1
IN
330p
2.2u
B28 TX
330p
10u
NC
G2
G3
C1707
C1708
DNI
4
5
6
C1709
C1710
6. CIRCUIT DIAGRAM
< 1-3-6-7_TRX_B7 > MIPI APT
Rev_0.4
+VPA0
+VPA_BATT0
+1V8_VREG_L10
C1750 33p L1753 1.2n
WTR0_PRX_HB3_IN
L1754
2n RFFE1_DATA
RFFE1_CLK
C1753 33p
TRX B7 ACPM-9307-TR1 U1751
B7 TX
1 4
VCC1 VIO
FL1750 10 6
C1756 1.5n VCC2 SCLK
4 7 3
ANT_TRX_B7 ANT RX VBAT
C1757 2n C1758 4.7n
DNI
1 9 2 C1759 33p C1760 33p

12n
TX RFOUT RFIN WTR0_TX_HB1_OUT

2 6 5
0.5p
L1755
L1756
GND1 GND4 SDTA

3 8 DNI 7
DNI
DNI
GND2 GND5 GND
5 9 11 8
L1757
GND3 GND6 PGND NC

L1758
2655MHz
L1759
L1760
330p
2.2u
330p
10u
C1764
C1763
C1766
C1765
6. CIRCUIT DIAGRAM
< 1-3-6-8_TRX_B40> Rev_0.3

+VPA_BATT0
+VPA0 +1V8_VREG_L10
U1800
RFFE1_CLK
B40TX
6
SCLK SDATA
5
RFFE1_DATA
GND VIO
FL1800 7 RF7940 4
885049
TX B40
L1800 NC VBATT L1801
C1801 DNI C1802 DNI 4
OUTDNI IN
1 C1803 DNI 8 DNI 3 C1804 DNI
ANT_TX_B40 G3 G2 G1 DNI 9
RF_OUT RF_IN
2 DNI
WTR0_TX_HB2_OUT
VCC2 VCC1
DNI
5 3 2 10 1
B40
DNI
DNI
DNI
PGND
C1806 11
DNI
DNI
DNI
DNI
DNI
C1807
L1802
L1803
L1804
C1808
C1809
C1810
C1811
885049 FL1802
PRX B40
C1812 DNI C1813 DNI 1 DNIOUT 4 C1814 DNI
ANT_PRX_B40 IN
G1 G2 G3
WTR0_PRX_HB1_IN
DNI
DNI
2 3 5
DNI
L1806
L1807
L1808
6. CIRCUIT DIAGRAM
< 5-1-1-3_BT_Wi-Fi_BCM4334_CoB > Rev_0.4

(Slimport)+1V0_SLIMPORT_IOVCC
VDD_CORE
Last modified date: 2013.09.25
FB5100
+1V8_VREG_L6
VDD_LN
120 FB5102 600 VOUT_3P3
VDD_LN
VIN_LDO
+VPWR_WL Close to C8 ball
220n
0.1u
ANT5
VDD_LN
Diplexer(2.4G/5G BPF)
220n
220n
K10
L10
C5109
C5110
0.1u
0.1u
10p
G7
D1
D3
D2
C1
H4
C6
D6
C8
D8
K5
K6
K7
A1
A3
2.2u
F1
F2
F7
J1
2
WRF_PADRV_VBAT_VDD5P0
WRF_SYNTH_VDD1P2
WRF_BUCK_VDD1P5
WRF_TCXO_VDD1P8
FM_LNAVCOVDD
WRF_XTAL_CAB_VDD1P2
BT_VCOVDD
BT_LDOPAVDD2P5
HSIC_DVDD1p2_OUT
BT_LNAVDD
BT_VDDBAT
FM_PLLVDD
VDDC_1
VDDC_2
VDDC_3
VDDC_4
BT_PLLVDD
VDDIO_RF
VDDIO_1
VDDIO_2
BT_IFVDD
C5103
C5104
C5105
C5106
C5107
C5108
1
J10
FL5100 RF_SW_CTRL_0 SW_BT_TX
ANT5100
ANT5101
K9
FEED
FEED
4 RF_SW_CTRL_1 SW_2G_RX
ESD OPTION C5102 5 GND2 NC1 J9
C5101 1n
3 RF_SW_CTRL_2 SW_2G_PA_EN
6 P3 P2 2G_WLAN_RF H9
1.2n 2 RF_SW_CTRL_3 SW_2G_LNA_EN
7 GND3 GND1 Close to H4 ball H10
1 RF_SW_CTRL_4 SW_5G_RX
8 NC2 P1 5G_WLAN_RF H8
RF_SW_CTRL_5 SW_5G_LNA_EN
C5199 C5232 C5233 J8
RF_SW_CTRL_6 SW_5G_PA_EN
DNI DNI 0.5p J3
PA_LIN_CTRL
C5111 C5112 R5102 R5103 C5115 R5104 R5105
J4
GPIO_0/WL_HOST_WAKE
10p
10p
4.7p
4.7p
4.7p
J5 10p 10p 220K 220K 220K 220K
GPIO_1/WL_DEV_WAKE
H5
NC
L8
C5113
C5114
C5155
C5156
JTAG_SEL
H1 H6
WLAN_TX_2G WRF_RFOUT_2G GPIO_2/TCK
K1 G6
WLAN_TX_5G WRF_RFOUT_5G GPIO_3/TMS
G1 H7
WLAN_RX_2G WRF_RFIN_2G GPIO_4/TDI/UART_RX WLAN_HOST_WAKEUP
L1 L9 TP5113
WLAN_RX_5G WRF_RFIN_5G GPIO_5/TDO/UART_TX
J6
GPIO_6/SPI_MODE_SEL
K2 J7
2G_G_TSSI WRF_G_TSSI_IN GPIO_12/JTAG_TRST_L
H2
5G_A_TSSI WRF_GPIO_OUT FB5101 75
B1
FM_RFIN FM_RF_IN FM_RF_IN FM_ANT
A7
VDD_LN VOUT_LNLDO
B8 D4
VDD_CORE VOUT_CLDO BT_UART_CTS_N BT_UART_RTS
B7 E4
VOUT_3P3 VOUT_3P3 BT_UART_RTS_N BT_UART_CTS
+VPWR_WL
B9
SR_VDDBATA5V
U5100 BT_UART_RXD
BT_UART_TXD
B5
E5 BT_UART_TX
BT_UART_RX
A9
+VPWR
R5300
+VPWR_WL VIN_LDO L5106 2.2u
A8
B10
SR_VDDBATP5V
LDO_VDD1P5 BCM4334LKUBG BT_I2S_CLK
F5
F6
TP5112 FM_I2S_CLK
SR_VLX BT_I2S_DO FM_I2S_DATA_OUT
0
MSM °¡±îÀÌ ½ÇÀå22 BT_I2S_WS
G5
FM_I2S_FSYNC
1u
1u
1u
4.7u
F10 E6
10u
R5107
WLAN_CLK SDIO_CLK BT_I2S_DI TP5114 TP5115
R5301 G10
WLAN_CMD SDIO_CMD
C5128
C5129
C5130
C5131
VBAT_FEM G9 E1 C5133 10p
WLAN_SDIO_0 SDIO_DATA_0 BT_RF BT_TX
C5126
0 F9
WLAN_SDIO_1 SDIO_DATA_1
G8 A5
WLAN_SDIO_2 SDIO_DATA_2 BT_REG_ON BT_POWER_ON
E8 TP5104
WLAN_SDIO_3 SDIO_DATA_3
C7
BT_PCM_CLK BT_PCM_CLK
D10 D7
HSIC_STROBE BT_PCM_IN BT_PCM_DATA_OUT
R5109
R5110
R5111
R5112
R5113
E10 E7
47K
47K
47K
47K
47K
HSIC_DATA BT_PCM_OUT BT_PCM_DATA_IN
E9 C4
RREFHSIC BT_PCM_SYNC BT_PCM_SYNC
+1V8_VREG_L6 B4
BT_DEV_WAKE/GPIO_0 HOST_BT_WAKEUP
F4
BT_HOST_WAKE/GPIO_1 BT_HOST_WAKEUP
WRF_PADRV_VBAT_GND5P0
WRF_XTAL_CAB_GND1P2
A4
WL_REG_ON WLAN_PWR_ON
WRF_LNA_2G_GND1P2
WRF_LNA_5G_GND1P2
WRF_SYNTH_GND1P2
WRF_VCO_GND1P2
A6
WRF_AFE_GND1P2
CLK_REQ
WRF_RX_GND1P2
WRF_TX_GND1P2
B6
LPO_IN SLEEP_CLK
L5
WRF_XTAL_CAB_OP
FM_VCOVSS
BT_VCOVSS
FM_LNAVSS
BT_LDOVSS
AGND12PLL
FM_PLLVSS
BT_PLLVSS
L6
PMU_AVSS
R5114 X5100 Q22FA1280013000
BT_PAVSS
WRF_XTAL_CAB_ON
BT_IFVSS
SR_PVSS
L7 3 4
VSSC_1
VSSC_2
VSSC_3
VSSC_4
VSSC_5
220
WRF_TCXO_CKIN2V
2 1
C5137
37.4MHz C5136
15p 15p
G4
G2
G3
H3
C5
C9
D5
D9
C3
C2
C10
K4
K8
E2
E3
A2
B2
B3
A10
F3
F8
L3
L2
L4
J2
C5117 DNI
5G_WLAN_RF
C5116 DNI
SW_5G_LNA_EN
SW_5G_RX
C5118
DNI
C5121 DNI DNI
5GHz FEM
WLAN_RX_5G
<5-2-1-4_NFC_PN547> Rev_0.5
17
16
15
14
13
R5303
L5202
GND
LNA_EN
C_RX
GND5
ANT
DNI
1 12
GND1 GND4
2 11
RX U5102 VCC3
3 RFFM8502 10
GND2 VCC2 VBAT_FEM
4 DNI 9
VBAT_FEM VCC1 VMODE
DNI
DNI
PA_EN
GND3
PDET
NFC_SWP
+2V95_VREG_L22
TX
C5123
C5124
C5125
5
6
7
8
+3V0_USIM_NFC
DNI
X5200
XRCGB27M120F3M10R0
1 2 L5107
NFC_CKL_O IN/OUT1 FLOAT1 C5127 DNI
Q5200 DNI
WLAN_TX_5G
4 3
FLOAT2 IN/OUT2
G 5G_A_TSSI
DNI
27.12MHZ D UIM1_DATA SW_5G_PA_EN
470n
USING External clock !!!!

D4
E5
F3
F5
F4
F6
F7
C5132
C5205 C5206 S
100n
PMUVCC
EXT_SW_CTRL
C5134
SVDD
SWIO_SE
SIMVCC
SWIO_UICC
10p 10p
CLK1
C5200
R5200
1M
DNI
B7
C5201
TVDD_IN
F1
E2
D1
I2C_ADR0
I2C_ADR1
TVDD
B3
C6
2.4GHz FEM
COMMON_I2C_SCL I2C_SCL ANT1
C2 B4 NFC_RX_P If your design support LTE7,40,41
COMMON_I2C_SDA I2C_SDA RXP
C1 A7
NFC_IRQ IRQ TX1 NFC_TX_1 FL5101 should be changed to EAM62690501 (AVAGO, ACPF-7124)
C3 A6
NFC_VEN VEN
U5200 TX2
RXN
A4
NFC_TX_2
NFC_RX_N FL5101
C5138 1.8n
F2 C7 4 1
C5139 1n C5140 10p
NFC_MODE DWL_REQPN5472A2UK/C20803 ANT2
2G_WLAN_RF ANT TX/RX
E3 G3 G2 G1
NFC Antenna
CLK_REQ
E4 A5 5 3 2
PWR_REQ VMID EAM62690501
D6
VDHF
D2 A2 C5141 L5108 SW_2G_RX
+1V8_VREG_L6 PVDD SAP_DCDC DNI DNI
+VPWR_NFC D7 A1 SW_BT_TX
VBAT SAM_DCDC
Power_ball_3
Power_ball_2
Power_ball_1
E7 A3 GND
DCDC_VSS
VDD VUP
E6 B2
R5305
R5306
17
16
15
14
13
+VPWR_NFC
10K
10K
DVDD VBAT_DCDC
PVSS
TVSS
EPAD
ANT
GND4
VRX
VBT
VSS
CLK
C5219
C5220
C5222
1 12
0.47u
100n
2G_G_TSSI
100n
VDET GND3
1u
2 11
D3
C5
C4
D5
E1
B5
B1
B6
GND1 U5103 BT L5110 1n BT_TX

1u
1u
1u
L5109 6.8n 3 10
AWL9280 VCC3 VBAT_FEM
C5217
VCC1
C5215
C5207
C5223
4 9
C5204 VBAT_FEM VCC2 LNA_EN SW_2G_LNA_EN
C5143
PA_EN
NFC_RX_P
GND2
1n 100n
330p
RX
TX
C5298
NFC_CKL_O
R5203
2.7K
DNI
5
6
7
8
C5144 C5145
C5208
33p
390n 4.7u 100n C5146 10p
C5142
L5200
NFC_TX_1 WLAN_RX_2G
C5209 C5210 C5211
270p 51p 120p C5147 10p L5111 1.5n
SW_2G_PA_EN
WLAN_TX_2G
R5302 Closed to PN547 FEED
+VPWR_NFC +VPWR ANT5102

2108614-5
0 C5212 C5213 C5214 C5120 C5148
270p 51p 120p DNI 1.5p
L5201 390n C5216
NFC_TX_2 FEED
33p 2108614-5
ANT5103
C5299
R5206
2.7K
DNI
C5218
NFC_RX_N
1n
C-CLIP Height Change (3.0 -> 2.7)
6. CIRCUIT DIAGRAM
<2-1-3-3-1_MSM8926_DATA> Rev_0.7
< 9-3-1_JTAG >
CCDS CARD Information
Release Date 2013.11.12
Rev_0.4
Based on Reference Schematic Rev.BA +1V8_VREG_L6
80-NE925-41_MSM8926_BASEBAND_PRELIMINARY_REFERENCE_SCHEMATIC_BA
U2100 MSM8926-2
F21 AT31 CN9300
USB_D_M USB_HS2_DM SRST_N JTAG_SRST 1 14
MSM_USB_ID USB_D_P
E22
USB_HS2_DP TCK
AN34
JTAG_TCK JTAG_TCK MSM_UART_TX
Deleted at B D23
USB_HS2_ID TDI
AY35
JTAG_TDI 2 13
AR32
TDO JTAG_TDO TP9300 MSM_UART_RX
G24 AW34
USB_HS2_VBUS TMS JTAG_TMS 3 12
AP33
TP2103 TRST_N JTAG_TRST JTAG_TDO
B25
GND1 TP2106 4 11
D33
RESIN_N MSM_RESIN_N JTAG_TDI
R2100 200 A22 E32
TOL=0.01
USB_HS2_REXT RESOUT_N MSM_RESOUT_N 5 10
JTAG_TMS
Note 8 Note 8 R2101 240 AM9
EBI0_CAL_REXT MODE_0
AU32 R2102 DNI +1V8_VREG_L6 6 9
TOL=0.01
If you use 3die, 4die LPDDR, R2103 240 AD1
EBI0_ZQ0 MODE_1
AV31 R2104 R2002
DNI and R2004 are needed only for BSCAN mode. JTAG_TRST
TOL=0.01 AY19 TP2101 JTAG_PS_HOLD
R2105 0
change to 240 ohm 1% resistor. EBI0_ZQ1
C34
7 8
PS_HOLD MSM_PS_HOLD JTAG_SRST
Y39
VREF_LPDDR2 VREF_DQ Note 4
AC2 F1 R2106 0
VREF_CA SDC1_CLK eMMC_CLK
G6
SDC1_CMD eMMC_CMD C2107
AF33 F3
C2100 0.1u
EBI0_VREF_D0 SDC1_DATA_0 eMMC_DATA_0 100n
P33 E2
AM29
EBI0_VREF_D1 SDC1_DATA_1
G4 eMMC_DATA_1 Note 4
EBI0_VREF_D2 SDC1_DATA_2 eMMC_DATA_2 Do not delete R2106, It can be changed value for tunning.
J30 J2
EBI0_VREF_D3 SDC1_DATA_3 eMMC_DATA_3
AN10
EBI0_VREF_CA SDC1_DATA_4
E4 It is recommend R2106 is located at MSM side
D1 eMMC_DATA_4
SDC1_DATA_5 eMMC_DATA_5
U6 G2
VREF_LDO_MPP_3 VREF_APC_MPM SDC1_DATA_6 eMMC_DATA_6
K1
SDC1_DATA_7 eMMC_DATA_7
P37
GND2
Note 5
G20 M3
Note 9 USB_HS2_SYSCLK QDSS_SDC2_TRCLK/SDC2_CLK R2108 0
SDCARD_CLK
TP2102 deleted at B
0.1u
L6 L4
DDR RF Desense Issue _ 533MHz BB_CLK CXO QDSS_SDC2_TRSYNC/SDC2_CMD SDCARD_CMD
0
B27 M5
CASE 1. WTR1625L + WFR1620 (APAC-CA, NA-EU-CA) BB_CLK_EN
B35
CXO_EN QDSS_SDC2_TRDATA_0/SDC2_DATA_0
L2
SDCARD_DATA_0
TP2105
C2101
L 2100 - L 2107 are needed SLEEP_CLK SLEEP_CLK QDSS_SDC2_TRDATA_1/SDC2_DATA_1 SDCARD_DATA_1

R2109
M1
QDSS_SDC2_TRDATA_2/SDC2_DATA_2 SDCARD_DATA_2 Note 5
AG2 P1
Note 6 : WTR0 uses CH0 & CH2 Note 6 WTR0_PRXBB_I_N BBRX_CH0_IM QDSS_SDC2_TRDATA_0/SDC2_DATA_3 SDCARD_DATA_3 Do not delete R2108, It can be changed value for tunning.
AH1
WTR1(or WFR) uses CH1 & CH3 WTR0_PRXBB_I_P BBRX_CH0_IP
AG4 G28 It is recommend R2108 is located at MSN side
WTR0_PRXBB_Q_N BBRX_CH0_QM PMIC_SPMI_CLK PMIC_SPMI_CLK
AG6 D27
Note 9 WTR0_PRXBB_Q_P BBRX_CH0_QP PMIC_SPMI_DATA PMIC_SPMI_DATA
L2100 120n AF5
WFR0_PRXBB_I_N BBRX_CH1_IM
L2101 120n AF3 AU26
WFR0_PRXBB_I_P BBRX_CH1_IP MIPI_CSI0_LN0_N MAIN_CAM0_MIPI_DATA0_N
L2102 120n AF1 AR26
WFR0_PRXBB_Q_N BBRX_CH1_QM MIPI_CSI0_LN0_P MAIN_CAM0_MIPI_DATA0_P
L2103 120n AE2 AY25
WFR0_PRXBB_Q_P BBRX_CH1_QP MIPI_CSI0_LN1_N/MIPI_CSI0_CLK_N MAIN_CAM0_MIPI_CLK_N
AJ4 AW26
WTR0_DRXBB_I_N BBRX_CH2_IM MIPI_CSI0_LN1_P/MIPI_CSI0_CLK_P MAIN_CAM0_MIPI_CLK_P
AJ6 AP23
Note 1 : If you don't use BBRX_CH1, 3 pin, WTR0_DRXBB_I_P BBRX_CH2_IP MIPI_CSI0_LN2_N MAIN_CAM0_MIPI_DATA1_N
Note 1 WTR0_DRXBB_Q_N
AH5
BBRX_CH2_QM MIPI_CSI0_LN2_P
AN24
these pin must be floated. AH3 AY23
WTR0_DRXBB_Q_P BBRX_CH2_QP MIPI_CSI0_LN3_N MAIN_CAM0_MIPI_DATA2_N
L2104 120n AK3 AW22
WFR0_DRXBB_I_N BBRX_CH3_IM MIPI_CSI0_LN3_P MAIN_CAM0_MIPI_DATA2_P
L2105 120n AL4 AU22
WFR0_DRXBB_I_P BBRX_CH3_IP MIPI_CSI0_LN4_N MAIN_CAM0_MIPI_DATA3_N
L2106 120n AK1 AR22
WFR0_DRXBB_Q_N BBRX_CH3_QM MIPI_CSI0_LN4_P MAIN_CAM0_MIPI_DATA3_P
L2107 120n AL2
WFR0_DRXBB_Q_P BBRX_CH3_QP
AV27
R2117 MIPI_CSI1_LN0_N VT_CAM_MIPI_DATA0_N
U32 AT27
Note 2 WLAN_REXT MIPI_CSI1_LN0_P VT_CAM_MIPI_DATA0_P
U34 AY27
Note 2 0 WLAN_BB_IM MIPI_CSI1_LN1_N/MIPI_CSI1_CLK_N VT_CAM_MIPI_CLK_N
V35 AW28
PIN WCN using BCM using P35
WLAN_BB_IP MIPI_CSI1_LN1_P/MIPI_CSI1__CLK_P VT_CAM_MIPI_CLK_P
R2110 3.9k DNI R34
WLAN_BB_QM
AV17
GND WLAN_BB_QP MIPI_DSI0_CLK_N LCD_MIPI_CLK_N
IQ line connect to WCN GND MIPI_DSI0_CLK_P
AT17
LCD_MIPI_CLK_P
AC4 AT21
ET_DAC_M MIPI_DSI0_LN0_N LCD_MIPI_DATA0_N
AA4 AV21
Note 10 ET_DAC_P MIPI_DSI0_LN0_P
AP19
LCD_MIPI_DATA0_P
DDR RF Desense Issue _ 533MHz MIPI_DSI0_LN1_N LCD_MIPI_DATA1_N
AB5 AR20
CASE 2. WTR16x5L + WTR2100 (SGLTE/DSDA) WTR0_TXBB_I_N TX_DAC0_IM MIPI_DSI0_LN1_P LCD_MIPI_DATA1_P
AB3 AY15
L2110, L2111 are needed. TX_DAC_IM and IP are connected to GND. WTR0_TXBB_I_P TX_DAC0_IP MIPI_DSI0_LN2_N LCD_MIPI_DATA2_N
Y1 AW14
WTR0_TXBB_Q_N LCD_MIPI_DATA2_P
< 3-1-2-3-1_LPDDR2_PoP_8Gbit_SK_Hynix >
CASE 3. WTR1605L + WTR2100/WTR2605 (Single Sku CT-SVLTE and SGLTE) TX_DAC0_QM MIPI_DSI0_LN2_P
W2 AR16
L21108, L2109, L2110, L2111 are needed WTR0_TXBB_Q_P TX_DAC0_QP MIPI_DSI0_LN3_N LCD_MIPI_DATA3_N
AA6 AU16
C2102 DNI WTR0_DAC_IREF TX_DAC0_IREF MIPI_DSI0_LN3_P LCD_MIPI_DATA3_P
+1V9_VREG_L7 V5
Note 10 GND
VREF_LDO_MPP_3 AD3
AD5
TX_DAC0_VREF
TX_DAC1_IM POP_8Gb 168ball 533MHz (38nm, 4Gb x 2), Hynix
TX_DAC1_IP
AD7
AC6
TX_DAC1_QM
TX_DAC1_QP
Rev_1.0
AE8
TX_DAC1_IREF
DNI R2112 AC8
TX_DAC1_VREF
AN4
WTR0_GNSSBB_I_P GNSS_BB_IP
0
AM3
Note 7 WTR0_GNSSBB_I_N GNSS_BB_IM
AR4 U3100
WTR0_GNSSBB_Q_P GNSS_BB_QP
DNI
H9TKNNN8JDAPLR-NGH
R2111
AP3 1
WTR0_GNSSBB_Q_N GNSS_BB_QM Fiducial1
C2103
Note 7
ET/APT R2111 R2112
CSFB, CA ET Unused DNI 0 ohms
CSFB, CA ET Used 0 ohm DNI
SVLTE ET Unused 0 ohm DNI
SVLTE ET Used 0 ohm DNI
6. CIRCUIT DIAGRAM

Based on Reference Schematic Rev.BA
<2-1-3-3-2_MSM8926_GPIO> Rev_0.6
Port / Part Change at B
R2221 100K
R2222 DNI
+1V8_VREG_L6
U2100 MSM8926-2
R2223 DNI
R2224 100K
+1V8_VREG_L6
F7 B7
GPIO_0/BLSP1_3 UIM1_RESET/GPIO_59 UIM1_RESET_N
E6 C4
GPIO_1/BLSP1_2 UIM1_DET/GPIO_60 DSV_EN
D3 B3
FUEL_I2C_SDA GPIO_2/BLSP1_1 UIM_BATT_ALARM/GPIO_61 BATT_UIM_ALARM
D5 J38
FUEL_I2C_SCL GPIO_3/BLSP1_0 GPIO_62 LDO1_EN
F29 H35
HALL_INT GPIO_4/BLSP2_3/UIM3_DATA GP_PDM_2B/GPIO_63 FM_I2S_CLK Note 3
F31 C38
WLC_CHG_IRQ_N GPIO_5/BLSP2_2/UIM3_CLK GPIO_64 FM_I2S_FSYNC
SENSOR0_I2C_SDA
D35
GPIO_6/BLSP2_1 SPI_CS2_N_BLSP2/GPIO_65
D39
FM_I2S_DATA_OUT Option for GYRO_INT
C36 C40
SENSOR0_I2C_SCL GPIO_7/BLSP2_0 GPIO_66 COMPASS_INT Note 3
AE34 B29
MSM_UART_TX GPIO_8/BLSP3_3/SPI_CS1_N_BLSP1 GPIO_67 FUEL_GAUGE_INT
AD33 M35
MSM_UART_RX GPIO_9/BLSP3_2/SPI_CS2A_N_BLSP1 GPIO_68 CODEC_INT
AB37 G34
COMMON_I2C_SDA GPIO_10/BLSP3_1 GPIO_69 ACCEL_INT
AC34 A28
COMMON_I2C_SCL GPIO_11/BLSP3_0 SLIMBUS_CLK/GPIO_70 SLIMBUS_CLK
AV37 C28
BT_UART_TX GPIO_12/BLSP4_3 SLIMBUS_DATA/GPIO_71 SLIMBUS_DATA
AU38 K35
BT_UART_RX GPIO_13/BLSP4_2/GP_PDM_2A GPIO_72 CODEC_RESET_N
AR36 AW10
BT_UART_CTS GPIO_14/BLSP4_1 GPIO_73 RFFE2_CLK
AN36 AY11
BT_UART_RTS GPIO_15/BLSP4_0 GPIO_74 RFFE2_DATA
AV39 AV11
TOUCH_RESET_N GPIO_16/BLSP5_3 GRFC_0/PA0_ON0/GPIO_75
AP35 AP15
Pull-Down
DNI
DNI
TOUCH_INT
AY37
GPIO_17/BLSP5_2 GRFC_1/PA0_ON1/GPIO_76
AU12
Note 4
TOUCH_I2C_SDA GPIO_18/BLSP5_1 GRFC_2/PA0_ON2/GPIO_77 GRFC_2 Install to disable watchdog.
AW36 AN14
TOUCH_I2C_SCL GPIO_19/BLSP5_0 GRFC_3/PA0_ON3/GPIO_78
Note 4
R2201
AT37 AY9
R2200
NFC_VEN GPIO_20/BLSP6_3/GP_PDM_0A GRFC_4/PA0_ON4/GPIO_79
AU40 AT11 R2202 DNI
NFC_IRQ GPIO_21/BLSP6_2/GP_PDM_1B GRFC_5/PA0_ON5/GPIO_80 GRFC_5 +1V8_VREG_L6
AP37 AR12
NFC_MODE GPIO_22/BLSP6_1/GP_MN/SPI_CS3_N_BLSP1 GRFC_6/PA0_RANGE0/BOOT_CONFIG_0/GPIO_81 PA0_R_0
AR38 AP13
LCD_MAKER_ID GPIO_23/BLSP6_0/SPI_CS2B_N_BLSP1 GRFC_7/PA0_RANGE1/BOOT_CONFIG_1/GPIO_82
AE40 AW6
LCD_VSYNC GPIO_24/MDP_VSYNC_P GRFC_8/ANT0_SW_SEL0/BOOT_CONFIG_2/GPIO_83 GRFC_8
Y33 AV7
Note 6 LCD_RESET_N GPIO_25/MDP_VSYNC_S/GP_PDM_0B GRFC_9/ANT0_SW_SEL1/BOOT_CONFIG_3/GPIO_84 GRFC_9
AC36 AR10
You can use GPIO_97 for VT_CAM_EN also. MAIN_CAM0_MCLK GPIO_26/CAM_MCLK0 GRFC_10/ANT0_SW_SEL2/BOOT_CONFIG_4/GPIO_85 GRFC_10
AB35 AY5
VT_CAM_MCLK GPIO_27/CAM_MCLK1 GRFC_11/ANT0_SW_SEL3/SDC1_EMMC_1P2_EN/GPIO_86 GRFC_11 Note 5
VT_CAM_RESET_N
AD37
GPIO_28 GRFC_12/TX_GRT_THRESH/GPIO_87
AV5 Noteuse
If you 5 MAX14628, Mode pin of MAX14628 must be connected PMIC MPP4.
AH39 AT5 TX_GTR_THRESH
CAM0_I2C_SDA GPIO_29/CCI_I2C0_SDA GRFC_13/ANT1_SW_SEL0/GPIO_88 GRFC_13
And if you use MAX14628 or don't use earjack detector, GPIO 88 can use LDO4_EN.
AG40 AR2
CAM0_I2C_SCL GPIO_30/CCI_I2C0_SCL GRFC_14/ANT1_SW_SEL1/GPIO_89 GRFC_14
AD35 AP1
EXT_OVP_CTRL GPIO_31/CCI_TIMER0 GRFC_15/ANT1_SW_SEL2/GPIO_90 GRFC_15
AH35 AN6
FLASH_STROBE_TRIG GPIO_32/CCI_TIMER1 GRFC_16/PA1_ON0/GPIO_91
AJ36 T1
Note 1 : If you use BCM connectivity, IRRC_PWM_TX GPIO_33/CCI_TIMER3/CCI_ASYNC1/GP_CLK0 GRFC_17/PA1_ON1/GPIO_92
AJ40 AU6
net name must be changed to BCM net name. GPIO_34/CCI_TIMER4/CCI_ASYNC2/GP_CLK1 GRFC_18/PA1_RANGE0/GSM0_TX_PHASE_D2/GPIO_93
AK35 AR8
CHG_EN_SET GPIO_35/CCI_ASYNC0 GRFC_19/PA1_RANGE1/GSM1_TX_PHASE_D2/GPIO_94
AM35 AV3
MAIN_CAM0_VCM_PWDN GPIO_36 GSM0_TX_PHASE_D0/GPIO_95 WTR0_GPDATA_0
AR40 AV1
SDCARD_DET GPIO_37 GSM0_TX_PHASE_D1/GPIO_96 WTR0_GPDATA_1
FOR BCM FOR WCN AL34 AU4
BAT_ID GPIO_38/CCI_TIMER2 GSM1_TX_PHASE_D0/GPIO_97
Y37 AT3
WLAN_SDIO3 WLAN_SDIO_3 GPIO_39/SDC3_DATA_3/BT_SSBI GSM0_TX_PHASE_D0/GPIO_98
R40 AR6
WLAN_SDIO2 WLAN_SDIO_2 GPIO_40/SDC3_DATA_2/WLAN_DATA_2 RFFE1_CLK/GPIO_99 RFFE1_CLK
N38 AT7
WLAN_SDIO1 WLAN_SDIO_1 GPIO_41/SDC3_DATA_1/WLAN_DATA_1 RFFE1_DATA/GPIO_100 RFFE1_DATA
T39 U4
WLAN_SDIO0 WLAN_SDIO_0 GPIO_42/SDC3_DATA_0/WLAN_DATA_0 SSBI1_RFIC0/GPIO_101 WTR0_SSBI_PRX_DRX
DNI
DNI
V37 U2
WLAN_CMD WLAN_CMD GPIO_43/SDC3_CMD/WLAN_SET SSBI2_RFIC0/GPIO_102 WTR0_SSBI_TX_GNSS
Note 1 WLAN_CLK WLAN_CLK
P39
GPIO_44/SDC3_CLK/WLAN_CLK SSBI1_RFIC1/GPIO_103
T3
AC38 R2 WFR0_SSBI_PRX_DRX
BT_RESET_N BT_POWER_ON GPIO_45/FM_SSBI GRFC_21/SSBI2_RFIC1/GPIO_104 Note 7
R2218
R2204
W40 T5
WLAN_PWR_EN WLAN_PWR_ON GPIO_46/FM_SDI GRFC_20/EXT_GNSS_LNA_EN/GPIO_105 GNSS_ELNA_EN
AD39 J40 If you don't use these pin,
BT_WAKEUP HOST_BT_WAKEUP GPIO_47/BT_CTL GPIO_106 KEYPAD_SENSE_0
you can use GPIO_108,109 for GYRO_INT, LDO4_EN.
LDAF_INT Note 7
AC40 K39
BT_HOST_WAKEUP BT_HOST_WAKEUP GPIO_48/BT_DATA_STROBE GPIO_107
L34 L40
BT_PCM_CLK GPIO_49 GPIO_108 KEYPAD_SENSE_2
D37 G40
BT_PCM_SYNC GPIO_50 GPIO_109 LDAF_EN
Note 9 BT_PCM_DATA_IN
A30
GPIO_51/UIM3_RESET SPI_CS1_N_BLSP3/GPIO_110
C24
Option for HAPTIC_EN BT_PCM_DATA_OUT
B31
GPIO_52/UIM3_DET/GP_PDM_1A SPI_CS2_N_BLSP3/GPIO_111
D25
A8 F25
If you don't use USIM2, make sure VDD_P6 voltage. GPIO_53/UIM2_DATA SPI_CS3_N_BLSP3/GPIO_112
B9 C2
GPIO_54/UIM2_CLK FORCED_USB_BOOT/GPIO_113 LDO3_EN
C10 C26
Note 10 Note 10 A10
GPIO_55/UIM2_RESET SPI_CS3_N_BLSP2/GPIO_114
T7
MAIN_CAM0_RESET_N
Option for WLC_EN WLAN_HOST_WAKEUP GPIO_56/UIM2_DET GPIO_115 GRFC_20 R2226
UIM1_DATA
C6
GPIO_57/UIM1_DATA GPIO_116
V1
R2219 D722 D725
If you don't use USIM2, make sure VDD_P6 voltage. Note 2 A4 W4 DNI
UIM1_CLK GPIO_58/UIM1_CLK GPIO_117 100K
GPIO_118
W6 R2220 D723
C22 +1V8_VREG_L6
GPIO_119 PROXIMITY_INT DNI
A24
GPIO_120 TOUCH_MAKER_ID
Note 2
GPIO_56(WLAN_HOST_WAKEUP) is for BCM connectivity,
Model indexing for Production
I2C Pull-Up
Sensors +1V8_VREG_LVS1 R2207
R2208
2.2K
2.2K
SENSOR0_I2C_SDA
SENSOR0_I2C_SCL
LCD Boost, Flash, NFC, Audio +1V8_VREG_L6 R2209 2.2K

COMMON_I2C_SDA
R2210 2.2K
COMMON_I2C_SCL
Touch +1V8_VREG_L6 R2211 2.2K
TOUCH_I2C_SDA
R2212 2.2K
TOUCH_I2C_SCL
Main CAM, VT CAM +1V8_CAM_IOVDD R2213

R2214
2.2K
2.2K
CAM0_I2C_SDA
CAM0_I2C_SCL
Fuel Guage (ADD at B)

R2215 DNI
+1V8_VREG_L6 FUEL_I2C_SDA
FUEL_I2C_SCL
R2216 DNI
TDMB SPI CS Pull-Up

Note 8
Note 8
If you don't use TDMB, delet this box
6. CIRCUIT DIAGRAM
<2-1-3-3-4_MSM8926_GND_NC> Rev_0.6
Note 2 :
Release Date 2013.08.26 Added for Current spike on Vdd_P3 after freezeIO assertion
Note 1 : These resistors are 1005 size for cost.
Based on Reference Schematic Rev.BA Ground K37 if WCN3620 is used or if no WCN is used. If you want 0603 size, use ERHY0009507 resistor.
Note 2
R2304
R2305
GND
1M
1M
M11
M13
M15
M17
M21
M29
M31
M33
M37
G22
G30
G32
G36
G38
H11
H13
H15
H17
H19
H23
H29
H33
H37
H39
N24
N34
N36
N40
R24
R26
R28
R36
U36
U40
K11
K13
K15
K17
K19
K21
K23
K25
K27
K29
K31
K33
K37
P11
P13
P15
P17
P21
P29
T11
T13
T15
T17
T19
T21
T31
T35
L22
L24
L28
J14
J22
J28
J32
J36
M7
M9
H1
H3
H9
N2
N6
R4
U2100 MSM8926-2
K5
K9
P3
P7
P9
T9
J6
WCN_XO
F27 AM15
GND_1
GND_2
GND_3
GND_4
GND_5
GND_6
GND_7
GND_9
GND_10
GND_11
GND_12
GND_13
GND_14
GND_15
GND_16
GND_17
GND_18
GND_19
GND_20
GND_21
GND_22
GND_23
GND_24
GND_25
GND_26
GND_27
GND_28
GND_29
GND_30
GND_31
GND_32
GND_33
GND_34
GND_35
GND_36
GND_37
GND_38
GND_39
GND_41
GND_42
GND_43
GND_44
GND_45
GND_46
GND_47
GND_48
GND_49
GND_50
GND_51
GND_52
GND_53
GND_54
GND_55
GND_56
GND_57
GND_58
GND_59
GND_60
GND_61
GND_62
GND_63
GND_64
GND_65
GND_66
GND_67
GND_68
GND_69
GND_70
GND_71
GND_72
GND_73
GND_74
GND_76
GND_77
GND_78
GND_79
GND_80
GND_81
GND_82
GND_83
GND_84
GND_85
GND_86
NC_01 NC_11
E28 AR14
NC_02 NC_12
AP29 AT33
NC_03 NC_13
AN30 AU34
AF17 NC_04 NC_14
GND_259 AA2 AV33
AF25 NC_05 NC_15
GND_260 K3 AV35
AF27 NC_06 NC_16
GND_261 J4 L36
AF29 V9 NC_07 NC_17
GND_262 GND_89 P5 L38
V11 NC_08 NC_18
GND_90 E8 T37
AG10 V13 NC_09 NC_19
GND_264 GND_91 AA38 U38
AG12 V15 NC_10 NC_20
GND_265 GND_92 AE10
AG14 V17 NC_21
GND_266 GND_93
AG16 V19
GND_267 GND_94
AG20 V21
GND_268 GND_95
AG22 V25
GND_269 GND_96
AG24 V29
GND_270 GND_97
AG30 V31
GND_271 GND_98
AG32 V33
GND_272 GND_99
AG36
GND_273
AG38
GND_274
W24
GND_102
W26
GND_103
AH25 W28
GND_277 GND_104
AH27 W32
GND_278 GND_105
AH29 W34
GND_279 GND_106
AH33 W36
GND_280 GND_107
AH37 Y9
GND_281 GND_108
Y11
GND_109
Y13
GND_110
AJ12 Y15
GND_284 GND_111
AJ16 Y17
GND_285 GND_112
AJ18 Y19
GND_286 GND_113
AJ22 Y21
GND_287 GND_114
AJ32 Y25
GND_288 GND_115
AJ34 Y31
GND_289 GND_116
AJ38 AM11
GND_290 GND_117
AM17
GND_118
AM25
GND_119
AK5 AM27
GND_293 GND_120
AK9 AM31
GND_294 GND_121
AK17 AM33
GND_295 GND_122
U2100
AK23 AM37
GND_296 GND_123
AK25 AN8
GND_297 GND_124
AK27 AN12
GND_298 GND_125
AK29 AN18
GND_299 GND_126
AK31 AN20
GND_300 GND_127
MSM8926-2
AK37 AN22
GND_301 GND_128
AK39 AN26
GND_302 GND_129
AN28
GND_130
AN32
GND_131
AL12 AN38
GND_305 GND_132
AL18 AN40
GND_306 GND_133
AL22 AP5
GND_307 GND_134
AL24 AP7
GND_308 GND_135
AL28 AP9
GND_309 GND_136
AL32 AP17
GND_310 GND_137
AL36 AP21
GND_311 GND_138
AL38 AP27
GND_312 GND_139
AL40 AP31
GND_313 GND_140
AM1 AP39
GND_314 GND_141
AM5 AR28
GND_315 GND_142
AM7 AR30
GND_316 GND_143
P19 AT1
GND_317 GND_144
M19 AT9
GND_318 GND_145
T25 AT15
GND_319 GND_146
U24 AT23
GND_320 GND_147
AB17 AT25
GND_321 GND_148
AD17 AT29
GND_322 GND_149
AC26 AU10
GND_323 GND_150
AF11 AU14
GND_324 GND_151
AD27 AU18
GND_325 GND_152
AE12 AU20
GND_326 GND_153
AD11 AU28
GND_327 GND_154
AB9 AU30
GND_328 GND_155
U28 AV9
GND_329 GND_156
U30 AV13
GND_330 GND_157
AE6 AV15
GND_331 GND_158
AE4 AV19
GND_332 GND_159
AH9 AV25
GND_333 GND_160
AA8 AV29
GND_334 GND_161
AU24 AW2
GND_335 GND_162
AV23 AW4
GND_336 GND_163
AW24 AW8
GND_337 GND_164
AW18 AW12
GND_338 GND_165
AR18 AW20
GND_339 GND_166
B21 AW30
GND_340 GND_167
AL6 AW38
GND_341 GND_168
V3 AW40
GND_342 GND_169
Y5 AY1
GND_343 GND_170
R32 AY3
GND_344 GND_171
J26 AY29
RSVD GND_172
GND_173
GND_174
GND_175
GND_176
GND_177
GND_178
GND_179
GND_180
GND_181
GND_182
GND_183
GND_184
GND_185
GND_186
GND_187
GND_188
GND_189
GND_190
GND_191
GND_192
GND_193
GND_194
GND_195
GND_196
GND_197
GND_198
GND_199
GND_200
GND_201
GND_202
GND_203
GND_204
GND_205
GND_206
GND_207
GND_208
GND_209
GND_210
GND_211
GND_212
GND_213
GND_214
GND_215
GND_216
GND_217
GND_218
GND_219
GND_220
GND_221
GND_222
GND_223
GND_224
GND_225
GND_226
GND_227
GND_229
GND_230
GND_231
GND_232
GND_233
GND_234
GND_235
GND_236
GND_237
GND_238
GND_239
GND_240
GND_243
GND_244
GND_245
GND_246
GND_249
GND_250
GND_251
GND_252
GND_253
GND_254
GND_255
GND_257
GND_258
G8
AC12
AC20
AC22
AC32
AD25
AD29
G10
G18
AB7
C8
D7
D9
AY31
AY39
AA20
AA26
AA32
AA40
AB11
AB13
AB15
AB19
AB25
AB31
AB33
AE20
AE22
AE36
AE38
C12
C14
C16
C20
C30
C32
D11
D13
D15
D17
D21
D29
D31
AF7
B1
A2
A6
AF13
AF15
B11
B13
B15
B17
B39
E12
E14
E16
E20
E30
E34
E36
E38
E40
A12
A14
A16
A20
A26
A32
A36
A38
A40
F9
F11
F13
F15
F17
F33
F35
F37
6. CIRCUIT DIAGRAM
< 4-1-3-1_PMIC_PM8926_DATA > Rev_0.6

Based on Reference Schematic Rev.BA
80-NE925-41 MSM8926 BASEBAND PRELIMINARY REFERENCE SCHEMATIC_BA
PMIC_SPMI_CLK
PMIC_SPMI_DATA
C4196
TP4100
C4195
85 124
DNI
15p
WLC_OK CBL_PWR_N GPIO_1 PMIC_AUDIO_REF_CLK
102 136
PM_KYPD_PWR_N KPD_PWR_N GPIO_2 CDC_BOOST_5V_EN
108 149
OPT_2 GPIO_3
119 135
OPT_1 GPIO_4 BATT_UIM_ALARM
148
0
JTAG_PS_HOLD GPIO_5 FLASH_STROBE_TRIG
R4104 10K 100 160
MSM_PS_HOLD PS_HOLD GPIO_6 CABC_WLED
R4102
R4103
R4105 0 101 134
RESIN_IN GPIO_7 TX_GTR_THRESH
77 122
MSM_RESIN_N PON_RESET_N GPIO_8
112 159
R4107 0
SPMI_CLK MPP_1 VREF_MSM_PX_MPP_1 Note 5
PMIC_SPMI_CLK R4108 0 123 146
SPMI_DATA MPP_2 HR_LED_SINK 40mA sink
PMIC_SPMI_DATA 158
MPP_3 VREF_LDO_MPP_3
R4106 100K 120 157
+1V8_VREG_L12 XO_THERM MPP_4 5/10/15mA sink
TOL=0.01 63 132
X4100 GND_XOADC MPP_5 PA_THERM_0
U4100 144
X1E0002910001 MPP_6 5/10/15mA sink
5 130
XTAL_19M_IN PM8926
4 3
Thermistor XTAL2 MPP_7 PCB_REVISION
6 141
XTAL_19M_OUT MPP_8
1 2
1n
XTAL1 GND/Therm
62 66
19.2MHz GND_XO_BUFF VIB_DRV_N PMIC_VIB_N
17 65
DNI
DNI
C4100
GND_XO GND_DRV
44 168
BB_CLK1_EN LED_CHG
C4101
C4102
BB_CLK_EN
13 72
WTR0_XO_IN RF_CLK1 AMUX_1 VBAT_THERM
39 73
RF_CLK2 AMUX_2
R4110 22 31 97
BB_CLK has special layout and component requirements. Note 1 BB_CLK BB_CLK1 USB_ID_IN PM_USB_ID Note 4 AMUX Input
42
Please refer to 80-NC833-14 for more information. BB_CLK2 R4113 200K
+1V8_VREG_L6
TOL=0.01
R4114 0 88
SLEEP_CLK SLEEP_CLK1
169
VREF_BAT_THERM VREF_BAT_THM
61
VREF_LPDDR2 VREF_LPDDR
129
REF_BYP
117
DNI
DNI
GND_REF
DNI
Note 2
0.1u
GND_REF must connect directly to cap on a thin trace
C4103
C4105
C4107
C4106
The cap should via directly to main ground with
no connections to intermediate ground fills
Note 6
<9-1-2_Battery_CNT_4P>
Rev. 0.4 : PA Thermistor Pull up
REV.0.6 +1V8_VREG_L12
R4115 100K
TOL=0.01
PA_THERM_0
DNI
R4118
Routing Width 2mm
VBAT
R9100
VBAT_SENSE_P DELETED AT B
TOL=0.01
0
100u
100n
100p
If you use external sensing resister, you have to change 0ohm to Sensing Resister
R9103
R9101
1u
10m
VBAT_SENSE_N External sensing resistor : ERHY0035601(10mm ohm, 1%)

0
VBAT_SENSE
C9100
C9101
C9102
C9103
D1
R9104 TOL=0.01 1
VREF_BAT_THERM 2
150K R9102 36K
VBAT_THERM 3
R9105 4.7K TOL=0.01 TOL=0.01
VREF_BAT_THERM R9106 4
BAT_ID
120
D2
VA9100
CN9100
VA9101
D9100
(DGMS Guide)
Use :F(1%) grade component
MC-C04766-5
1. PCB rev
2. Device ADC
3. Thermistor, temperature pheri.
(DGMS Guide)
(DGMS Guide) MC-C06162-1 : 1. Do not connect negative of tantal Cap. to positive voltage if use
2. We recommend Ceramic Cap.
MC-C00073-15 : Apply to large capacity around the bat connector
1. Over 47uF around the bat connector
2. Over 100uF totally on Vbat line
Use the TVS diode of VR=5V, when TVS diode have to use for ESD
6. CIRCUIT DIAGRAM
<2-1-3-3-3_MSM8926_POWER> Rev_0.6
CCDS CARD Information ADD FOR PDN at A
Based on Reference Schematic Rev.BA U2100 MSM8926-2
80-NE925-41_MSM8926_BASEBAND_PRELIMINARY_REFERENCE_SCHEMATIC_BA AF39 AA16
+1V2_VREG_L2 VDD_P1_01 VDD_CORE_01 +1V15_VSW_S1
AJ2 AA18
VDD_P1_02 VDD_CORE_02
0.47u
0.1u
0.1u
0.1u
0.1u
AM39 AA22
10n
6.8n
4.7n
0.1u
4.7u
33n
47n
22n
C2310 0.1u
C2311 0.1u
C2312 0.1u
C2313 0.1u
C2314 0.1u
C2315 0.1u
C2316 0.1u
1u
AN2 AA24
C2300
AT39 AA30
C2305
C2306
C2309
C2301
C2302
C2303
C2304
C2307
C2308
C2402
C2403
C2404
C2405
AW32 AB21
AY13 AB23
AY21 AB27
B23 AB29
B33 AC14
VDD_P1_10 VDD_MODEM_01 +1V15_VSW_S5
F39 AC16
0.47u
M39 AC24
10n
10n
10n
10n
10n
10n
5.6n
2.2u
0.1u
0.1u
0.1u
0.1u
47n
22n
V39 AC30
AD13
C2318
C2319
C2321
C2322
C2324
C2325
C2326
C2401
C2317
C2320
C2323
VDD_MODEM_02
C2406
C2407
C2408
C2409
R6 AD15
+2V95_VREG_L21 VDD_P2 VDD_MODEM_03
AD21
VDD_CORE_16
AA34 AE14
C2327 Changed 8226 Ref. E VDD_P3_01 VDD_MODEM_04
1u
AG34
VDD_P3_02 VDD_MODEM_05
AE16 C2401(10%tol.) added 8926 Ref. BA
AK33 AE18
C2327
AL8 AE24
AM13 AE30
AN16 AE32
+1V8_VREG_L6 VDD_P3_06 VDD_CORE_22
C18 AF21
H31 AG18
J24 AG26
C2328 0.1u
C2329 0.1u
C2330 0.1u
C2331 0.1u
C2332 0.1u
C2333 0.1u
C2334 0.1u
1u
J34 AH21
C2335
V7 AJ14
Y35 AJ20
AJ26
VDD_CORE_29
H25 AJ30
+1V8_VREG_L6 VDD_P4 VDD_CORE_30
AK11
VDD_CORE_31
E10 AK13
AK15
VDD_CORE_33
E18 AK19
AK21
VDD_CORE_35
J8 AL14
AL20
VDD_CORE_37
H27 AL26
AL30
VDD_CORE_39
A18 AM21
+1V8_VREG_L6 VDD_DDR_CORE_1P8_01 VDD_CORE_40
A34 J20
VDD_DDR_CORE_1P8_02 VDD_CORE_41
Note 2
0.1u
0.1u
0.1u
0.1u
0.1u
AB1 L20
0.1u
C2336 0.1u
C2338 0.1u
C2339 0.1u
C2340 0.1u
AB39 L26
VDD_DDR_CORE_1P8 pad cap is shared with VDD_P3 PAD Note 2 VDD_DDR_CORE_1P8_04 VDD_CORE_43
C2337
AY7 M27
These DNI CAP is for PDN. If you don't need these cap, delete. VDD_DDR_CORE_1P8_05 VDD_CORE_44
C2341
C2342
C2343
C2344
C2345
AY33 N28
B5 N30
P23
Note 3 AU2
VDD_MODEM_06
P25
VDD_DDR_CORE_1P2 pad cap is shared with VDD_P1 PAD +1V2_VREG_L2 VDD_DDR_CORE_1P2_01 VDD_CORE_48
AU36 P31
These DNI CAP is for PDN. If you don't need these cap, delete.
0.1u
0.1u
0.1u
0.1u
0.1u
AW16 U20
B19 U22
Note 3 VDD_DDR_CORE_1P2_04 VDD_MODEM_07
B37 U26
Note 4 VDD_DDR_CORE_1P2_05 VDD_CORE_52
C2346
C2347
C2348
C2349
C2350
W38 V23
VDD_EBI0_CDC pad cap is shared with VDD_MEM PAD H5
V27
W14
These DNI CAP is for PDN. If you don't need these cap, delete. VDD_CORE_55
AD31 W16
+1V15_VREG_L3 VDD_EBI0_CDC_01 VDD_CORE_56
R30 W22
Note 5
0.1u
0.1u
0.1u
0.1u
VDD_EBI0_CDC_02 VDD_CORE_57
1u
AJ28 W30
Ground pin AD9 and DNI R2300 Note 4 VDD_EBI0_CDC_03 VDD_CORE_58
L30 Y23
And change R2300 from DNI to 0 ohm C2351 AJ10 Y27
C2352
C2353
C2354
C2355
Y29
if there is no DSDA, no SVLTE VDD_CORE_61
H21
+3V075_VREG_L20 VDD_USB_3P3
F19 AA12
+1V8_VREG_L10 VDD_USB_1P8 VDD_MEM_01 +1V15_VREG_L3
F23 AA14
+1V15_VSW_S1 VDD_USB_CORE VDD_MEM_02
0.47u
AA28
22n
10n
0.1u
0.1u
47n
33n
VDD_MEM_03
0.1u
4.7u
+1V9_VREG_L7
Note 5 Y7
VDD_A2_01 VDD_MEM_04
AC28
AD9 AD19
C2360
C2362
R2300 0
C2356
C2357
C2358
C2361
C2359
C2412
C2413
AD23
VDD_MEM_06
AA10 AE28
+1V15_VREG_L3 VDD_MEM_34 VDD_MEM_07
AF19
VDD_MEM_08
G26 AF23
+1V8_VREG_LVS1 VDD_QFPROM_PRG VDD_MEM_09
AF31
VDD_MEM_10
H7 AG28
+1V15_VSW_S1 VDD_SDC_CDC_01 VDD_MEM_11
K7 AH11
VDD_SDC_CDC_02 VDD_MEM_12
N4 AH13
VREF_MSM_PX_MPP_1 VREF_SDC VDD_MEM_13
D19 AH15
VREF_UIM VDD_MEM_14
AH17
VDD_MEM_15
T23 AH19
+1V15_VREG_L3 VDD_PLL1_01 VDD_MEM_16
AC18 AH23
VDD_PLL1_02 VDD_MEM_17
DNI
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
AH31
1u
1u
1u
VDD_MEM_18
Note 5 AE26
AJ24
C2365
C2366
C2373
T29 L14
C2363
C2364
C2367
C2368
C2369
C2370
C2371
C2372
C2374
C2375
C2376
C2377
AC10 L32
N20 M23
+1V8_VREG_L8 VDD_PLL2_03 VDD_MEM_22
M25
VDD_MEM_23
T33 N22
+1V3_VREG_L24 VDD_WLAN VDD_MEM_24
N26
VDD_MEM_25
AJ8 N32
+1V9_VREG_L7 VDD_A2_03 VDD_MEM_26
AF9 P27
0.1u
AH7 R20
AK7 R22
AG8 T27
C2379
W12
VDD_MEM_31
AP25 W18
+1V2_VREG_L4 VDD_MIPI_CSI VDD_MEM_32
AY17 W20
VDD_MIPI_DSI_1P2 VDD_MEM_33
AM19
VDD_MIPI_DSI_1P8
AL16 G12
VDD_MIPI_DSI_0P4 VDD_APC_01 +1V15_VSW_S2
G14
L2300 2.2u VDD_APC_02
0.47u
3.3n
3.3n
2.2u
3.3n
AM23 G16
10n
2.2n
4.7n
6.8n
0.1u
22n
MIPI_DSI_LDO VDD_APC_03
1u
1u
1u
1u
1u
1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
J10
DNI
2.2u
Note 1 VDD_APC_04
J12
C2382
C2384
C2387
C2410
C2414
C2415
1u
1u
C2380
C2381
C2383
C2385
C2386
C2388
C2389
C2411
C2416
C2417
C2418
VDD_APC_05
J16
VDD_APC_06
C2398
C2399
C2390
C2391
C2392
C2393
C2394
C2395
C2396
C2397
C2400
J18
VDD_APC_07
L8
VDD_APC_08
L10
VDD_APC_09
L12
C2398, C2399 Changed 8226 Ref. E VDD_APC_10
L16
Note 1 VDD_APC_11
L18
Place the CAP very close VDD_APC_12
N8
to VDD_MIPI_DSI_0P4 pin VDD_APC_13
N10
VDD_APC_14
N12
VDD_APC_15
N14
VDD_APC_16
N16
VDD_APC_17
N18
VDD_APC_18
R8
VDD_APC_19
R10
VDD_APC_20
R12
VDD_APC_21
R14
VDD_APC_22
R16
VDD_APC_23
R18
VDD_APC_24
U8
VDD_APC_25
U10
VDD_APC_26
U12
VDD_APC_27
U14
VDD_APC_28
U16
VDD_APC_29
U18
VDD_APC_30
W8
VDD_APC_31
W10
VDD_APC_32
6. CIRCUIT DIAGRAM
< 3-2-2-1-1_eMMC_v4_5_8GB_Toshiba >

PN CHANGE to EAN63126301 (A19n, 64Gbx1) at A
+1V8_VREG_L6
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
R3208
10K
R3200
R3201
R3202
R3203
R3204
R3205
R3206
R3207
A3 A7
eMMC_DATA_0 DAT0 RFU1
A4 E5
A5 E8
B2
eMMC_DATA_3 DAT3
B3 G3
B4 P7
B5 P10
B6 G10
K6
RFU8
M6 K7
eMMC_CLK CLK RFU9
K10
RFU10
M5
eMMC_CMD CMD
C2 D4
VDDI NC_INDEX
C6 A1
VCCQ1 NC1
M4 C5
+1V8_VREG_L6 VCCQ2 NC3
N4 G12
2.2u
0.1u
DNI
DNI
VCCQ3 NC59
0.1u
P3 G13
VCCQ4 NC60
P5 G14
VCCQ5 NC61
C3200
C3201
C3202
C3204
E6 H1
C3203
VCC1 NC62
F5 H2
VCC2 NC63
J10 H3
VCC3 NC64
K9 H12
+2V95_VREG_L17 VCC4 NC66
H13
NC67
J5 H14
VSS1 NC68
2.2u
0.1u
A6 J1
VSS2 NC69
E7 J2
VSS4 NC70
G5 J3
C3205
C3206
VSS5 NC71
H10 K12
VSS6 NC83
K8 K13
VSS7 NC84
N2 K14
VSSQ1 NC85
N5 L1
P4
VSSQ2
VSSQ3
U3200 NC86
NC87
L2
P6 L3
TP3200
C4
VSSQ4
VSSQ5
THGBMBG6D1KBAIL NC88
NC89
L12
L13
NC90
K5 L14
MSM_RESOUT_N RSTN NC91
M1
NC92
H5 M2
DS NC93
M3
NC94
A2 M7
NC2 NC95
A8 M8
NC5 NC96
A9 M9
NC6 NC97
A10 M10
NC7 NC98
A11 M11
NC8 NC99
A12 M12
NC9 NC100
A13 M13
NC10 NC101
A14 M14
NC11 NC102
B1 N1
NC12 NC103
B7 N3
NC13 NC104
B8 N6
NC14 NC105
B9 N7
NC15 NC106
B10 N8
NC16 NC107
B11 N9
NC17 NC108
B12 N10
NC18 NC109
B13 N11
NC19 NC110
B14 N12
NC20 NC111
C1 N13
NC21 NC112
C3 N14
NC22 NC113
J12 P1
NC73 NC114
C7 P2
NC24 NC115
C8 P8
NC25 NC117
C9 P9
NC26 NC118
C10 P11
NC27 NC120
C11 P12
NC28 NC121
C12 P13
NC29 NC122
C13 P14
NC30 NC123
NC31
NC32
NC33
NC34
NC35
NC36
NC37
NC38
NC39
NC40
NC74
NC75
NC76
NC45
NC46
NC47
NC48
NC49
NC50
NC52
NC53
NC54
NC55
NC56
NC77
NC78
VSF1
VSF2
VSF3
C14
D1
D2
D3
D12
D13
D14
E1
E2
E3
J13
J14
K1
E12
E13
E14
F1
F2
F3
F12
F13
F14
G1
G2
K2
K3
F10
E10
E9
6. CIRCUIT DIAGRAM
< 6-1-1-1_Codec_WCD9302 > Rev_0.5

< 6-6-1_Earjack > Rev_0.4
+VPWR
+1V2_VREG_L4
+1V8_VREG_L6 EAR_MIC_JACK
FB6611 1800
HPH_L_OUT FB6613 1800 S/W_Detect J6600
5 35 C6101 C6102 EAR_SENSE_JACK
GND1 VDD_VBAT SPK_L
0.1u 0.1u
FB6612 1800 SPK_R
33 19 HPH_R_OUT
MODE VDD_DIG C6610 1n R6926 GND
TP6106 8 FM_ANT
CODEC_RESET_N RESET_N 0 FB6600 1800 MIC
27
VDD_TX_RX
R6100 0 29
PMIC_AUDIO_REF_CLK MCLK Remove C6100 to reduce BOM.
QMC Recommanded : 28
47p
GND3 WCD9302 MICBias has high PSRR and VDD_VBAT pin is only used to MICBias.
Do not connect HPH_REF on near WCD9302 44
MIC1_INP
HPH_REF MIC_IN1_P
Connect this line to the earjack to reduce headset crosstalk. 39 26
D5100
C6612
MIC_IN3_N MIC_IN1_N MIC1_INM EAROP RCV_P L6613
47 31
DNI
4.7n
4.7n
EAR_MIC_JACK MIC2_INP EAROM RCV_N 100n
MIC_IN2_N 53
MIC_IN2_N MIC2_INM
MIC_IN1_N 38 16
R6611
R6610
MIC_IN3_P MIC3_INP HPH_L HPH_L_OUT
DNI
DNI
DNI
DNI
43 17
C6112
MIC_IN3_N MIC3_INM HPH_REF HPH_REF

42 21
MIC4_INP HPH_R HPH_R_OUT
41
MIC4_INM
1
52 36
R6101
R6102
R6103
R6104
NC3 LINE_OUT1 LINE_OUT_IRRC R6617 0

46 32 GND Close to EarJack HPH_REF
1n
1n
NC1 LINE_OUT2
VA6600
VA6603
VA6601
C6622
C6623
R6105 20K 37 3
EAR_SENSE_JACK MBHC_HSDET VDD_BUCK +2V1_VSW_S4
R6615
Make star route to BUCK_VOUT1 and 2 from C6104.
0
Connect this GND to inner GND layer directly. C6103 1u 22 U6100 13 FB6100 1000
2
CCOMP BUCK_VSW
VA6602
CCOMP is used for CODEC reference voltage generating, WCD9302
C6106 0.1u 34 6
and LDO_HI_CAP is used for MICBias.
4.7u
LDO_HI_CAP BUCK_VOUT1
2.2u
12
So do not connect this gnd to other ground on out layer. 54
BUCK_VOUT2
10n
MIC_BIAS_1 MIC_BIAS1 R6425
C6105
48 7
C6104
R6613
MIC_BIAS_2 MIC_BIAS2 GND_BUCK MIC_BIAS_2 +VPWR
51 2.2K 2.4M
C6611
NC2 C6107 1u
23 11
GND_CFILT -NCP_VNEG
33p
Dedicate a ground island for the buck/NCP ground connections.
C6613
2.2K
U6600 FSA5157L6X
10 2
+1V8_VREG_L6 VDD_IO NCP_C1P C6108 R6424 1 6
C6614
1 S B1
25
-NCP_C1M 1u (DGMS Guide)MC-C06162-1 : 1. Don't connect Positive of Tantal, TVS diode to Negative voltage if use 330K 2 5
DNI
VCC GND
2. We recommend MLCC capacitor in this case.
0.1u
GND2 3 4
49 MIC_IN2_N A B0
SPKR_DRVP SPK_P
20 50
SLIMBUS_CLK SLIMBUS_CLK/I2C_SCL SPKR_DRVM SPK_N
30
C6111
C6110
SLIMBUS_DATA SLIMBUS_DATA/I2C_SDA
R6616
45
DNI
VDD_SPKDRV +5V0_SPK_BOOST
14
I2S_WS
15 55
DNI
4.7u
I2S_SCK GND_SPKDRV_1
DNI
24 40
DMIC0_DATA/TX_I2S_SD0 GND_SPKDRV_2 C6606
9
DMIC0_CLK/RX_I2S_SD0 1n
C6109
4 18
C6121
CODEC_INT INTR GND4
C6122
1. Pin 18, 23 and pin 40 should be connected to main GND directly.
2. Pin 55 should be connected to the GND side of C680 and directly
connected to the main GND with dedicated vias.
Note: The WCD9302 ingetrates IEC ESD protection inernally. (8 kV contact and 15 kV air discharge)
You may subtract the external ESD components (The pins of HPH L/R, EAR P/M and SPK L/R)
DC GND < 6-9-2_2MIC > Rev_0.4
Deleted at B MAIN_MIC
<4-9-1-2-1_5V_BOOST_ MIC_BIAS_1 MIC6920
TPS61256A_AUDIO_EXTERNAL>
0.1u
G4
6
G3
5
C6920
VDD
4
G2
3
MIC_IN1_N G1
2
Rev_0.3
OUT
33p
1
C6921
FB6920 1800
MIC_IN1_P
DNI
(DGMS Guide)
R6920
< 6-8-2_Receiver_TCOIL >
0
When USE) TVS devices's Working Voltage must be greater than the Path voltage
D6925
D6924
D6926
L4940
1.0mm
+VPWR 1u
B1
B2
C4940
Rev_0.4
1.0mm GND Close to MIC
SW1
SW2
4.7u A3 A1
VIN VOUT1 +5V0_SPK_BOOST
A2
U4940 VOUT2
B3
CDC_BOOST_5V_EN EN
GND1
GND2
GND3
C4941
Change 22u CAP to TANTAL RCV + TCOIL
SUB_MIC
22u
For Removing Shieldcan Insulator

C1
C2
C3
CN6450
L6450 82n 1
RCV_P
C6810 33p
L6451 82n 2
MIC_BIAS_1
RCV_N
0.1u
G4
6
G3
5
VDD
C6922
4
G2
33p
33p
D6810 D6811 3
MIC_IN3_N G1
DNI DNI 2
OUT
< 6-7-1_Speaker > Rev_0.4
33p
C6811
C6812
1
MIC6921
(DGMS Guide)
C6923
MC-C04773-8 : For ESD Protection / Tuning points 1800
FB6921
When USE) TVS devices's Working Voltage must be greater than the Path voltage MIC_IN3_P
DNI
(DGMS Guide)
R6921
EAG63613001 MC-C00074-11 : For ESD Protection / Tuning points
0
1000 ANT10003
FB6610 L6611 82n
SPK_P FEED
D6928
D6929
D6927
FB6609 1000 L6612 82n
SPK_N FEED
ANT10004 EAG63613001
33p
33p
C6702 C6703
GND Close to MIC
DNI DNI C-CLIP PN CHANGE 1.4 -> 2.05
C6701
C6700
(DGMS Guide)
should apply capacitor under 50pF value for ESD protection with d-class amp
6. CIRCUIT DIAGRAM
< 7-1-7-3-1_LCD_5_0inch HD > Rev_0.4

<7-2-1-2_Touch CNT_LS_MTRON_GB042-10S>
+1V8_VREG_L8
10
FL7100
+3V0_VREG_L15
2.8V --> 3.0V at 1.0
2 1
8 9
LCD_MIPI_DATA0_N
REV.0.4
LCD_MIPI_DATA0_P
4 3
6 7
CN15001
LCD_MIPI_DATA1_N
1 30
LCD_MIPI_DATA1_P
2 29
+5V5_DDVDH
3 28
5
-5V5_DDVDL
4 27
5 26 CN7200
LCD_VSYNC 6 25
R7200
1 10
+1V8_VREG_L6
P5 5
LCD_RESET_N 7 24 4.7K 2 9 R7201 0
CABC_WLED 8 23
TOUCH_I2C_SCL 3 8
TOUCH_RESET_N
P1 P4 LCD_MIPI_CLK_N TOUCH_I2C_SDA +1V8_VREG_L6
FB7200 600 9 22 1 4 4 7
P2 P3 LCD_MIPI_CLK_P TOUCH_INT +2V8_VREG_L28
10 21 2 3 5 6
PMIC_LED_A TOUCH_MAKER_ID
P6
11 20
PMIC_LED_C
DNI
12 19 FL15002
2.2u
1u
13 18
2
14 17
C7201
C7200
VA7200
VA7201
VA7202
15 16
1
R7204
VA7203
VA7204
LCD_MAKER_ID FL7101
10
C15004
C15003
C15002
1u
1u
1u
100p
100p
100p
100p
LCD_MIPI_DATA2_N
8 9
2 1
LCD_MIPI_DATA2_P
C15000
C15001
C15005
C15006
VA15002
VA15001
VA15000
VA15003
LCD_MIPI_DATA3_N
6 7
4 3
LCD_MIPI_DATA3_P
ADD at PMIC_LED_A, LED_C Bead/Cap
VT_MAIN_CAM_LDO1
5
+VPWR
LDAF_VL6180 GPIO 0/1 : DEFALUT PULL UP // ACTIVE LOW
+1V8_CAM_IOVDD
TLV70728PDQNR U4190 C7600 PLACE CLOSELY AT PIN NO.8(AVDD)
[ DGMS Guide ] 4 1
MC-C00057-14 LAYER_ALIGN VDD VOUT +2V8_EXT_LDO1 150mA
PGND
Daisy_Chain 3 2
DLA_1 LDO1_EN CE GND
1 - Data and Power line should have ESD protection nearby DLA_1
DLA_2 DLA_7
1u
DAISY_CHAIN
1u
2- LCD Control pin should have DNI Pad for ESD protection nearby DLA_2 DLA_7
DLA_3 DLA_6
5
DLA_3 DLA_6
DLA_4 DLA_5
R7602
47K
C4190
C4191
DLA_4 DLA_5
R7601
47K
CN7500
< Main_Camera_30pin_8M >

LDAF_EN 1
2 LDAF_INT
CAM0_I2C_SCL 3
4
CAM0_I2C_SDA 5 R7600 +2V8_EXT_LDO1
VT_MAIN_CAM_LDO3
6
0
+2V8_EXT_LDO3 +VPWR
TLV70728PDQNR U4193
CAM0_I2C_SDA
4 1
CAM0_I2C_SCL VDD VOUT +2V8_EXT_LDO3 150mA
PGND
3 2
R7300 0
MAIN_CAM0_VCM_PWDN CE GND D7600
MAIN_CAM0_MCLK
4
1u
1u
VA7405
VA7404
CN7300
MAIN_CAM0_RESET_N
5
1 30
DNI
C4198
C4197
2 29
3 28
VA7303
C7304
4 27
3
FL7301 5 26
5
6 25
+1V2_VREG_L5
7 24
+1V8_CAM_IOVDD
MAIN_CAM0_MIPI_DATA1_P 8 23 FL7302
7 6
3 4
+2V8_EXT_LDO1
10 21
MAIN_CAM0_MIPI_DATA0_P 11 20
9 8
1 2
7 6
3 4
VT_MAIN_CAM_LDO4
13 18
14 17
10
9 8
1 2
15 16
+VPWR
10
2.2u
4.7u
2.2u
2.2u
FL7300
6
TLV70718 U4192
G2
C7300
2 4
MAIN_CAM0_MIPI_CLK_P
C7302
C7301
C7303
D2 D4 4 1
1 3 VDD VOUT +1V8_CAM_IOVDD 150mA
MAIN_CAM0_MIPI_CLK_N
PGND
D1 D3 3 2
LDO3_EN CE GND
5 G1
1u
1u
5
C4194
C4199
< 7-4-1_VT_Camera_20pin_VGA_1.26M_1.3M_2.4M>
<7-5-4_DSV_DW8755>
FL7400
Rev_0.4 <9-8-3_Flash_LED>
6
G2
2 4
VT_CAM_MIPI_DATA0_P 1
D2 D4
3
VT_CAM_MIPI_DATA0_N D1 D3
L7500
5 G1
4.7u
CHANGE PIN ORDER at A

CHANGE filter 4port -> 2port at B FL7401 FLASH_LED_OUT_P
6
A2 B3
G2
+VPWR PVIN1 VOUT_P +5V5_DDVDH

2 4 D2
D2 D4 AGND2
VT_CAM_MIPI_CLK_P 1 3
CN7400 C7500 A1 A3
D1 D3 AVIN SW_P
VT_CAM_MIPI_CLK_N 1 20 10u
2 19 U7500
5 G1
C2
3 18
+2V8_EXT_LDO1 FD DW8755A B1
4 17 SW_N
D1
5 16
+1V2_VREG_L5 DSV_EN EN LD9830
R7401 0 D3 C1
VT_CAM_MCLK +1V8_CAM_IOVDD
AGND1
REF -VOUT_N -5V5_DDVDL VA7406

PGND
6 15
7 14
CAM0_I2C_SDA
CHANGE_PART
L7501
8 13
C3
B2
4.7u
C7501 C7502
9 12
CAM0_I2C_SCL
10u 10u
1.SEVY0005402_>_EAH61533301 10 11
VT_CAM_RESET_N rev 0.4
2.REF_DGMS_CHECK_LIST
ZD9830 : Clamping 12.3V / 65pF / 150mW
DNI
2.2u
2.2u
2.2u
DGMS Guide
C7403
VA7400
C7400
C7401
C7402
VA7400-7403 : Clamping 12.8V / 15pF / 50W MC-C06162-1 : Don't connect positive of tantal to negative charger pump.
C7503
1u
6. CIRCUIT DIAGRAM
<8-1-2-1_Accel_Compass_BMC150> REV_1.0
<8-7-1-1_Hall IC_BU52061NVX>
Rev_0.3
+1V8_VREG_LVS1
SENSOR0_I2C_SDA
14
13
12
SDI
PS
CSB
1 11
2
SDO SCK
10
SENSOR0_I2C_SCL
ACCEL_INT 3
INT1 U8100 VDDIO
9 U8700 BU52061NVX
INT2 BMC150 GND3
4 8
COMPASS_INT DRDY VDD +2V85_VREG_L19
GND1
GND2
1 4
INT3
HALL_INT OUT VDD +1V8_VREG_L6
2 3
0.1u
0.1u
GND NC
PGND
Power Source Change at B
5
6
7
C8701
LVS1 -> L6
0.1u
C8100
C8101
5
0.1u
C8700
(DGMS Guide)
MC-C00058-12
MC-C00058-12 Adjust the bypass capacitor value as necessary,
according to voltage noise conditions
<8-4-1-1_Proximity_APDS-9130> REV.1.0
< 8-9-1-2_IRRC_w/o_driver_IC > Rev_1.0
R8400 4.7K U8400 APDS-9130-200
+1V8_VREG_LVS1
1 8 R8401 IRRC_PWM_TX
SENSOR0_I2C_SDA SDA VDD +2V85_VREG_L19
22
2 7 +1V8_VREG_LVS1
PROXIMITY_INT INT SCL SENSOR0_I2C_SCL
TOL=0.01
R8951 100K
3 6
LDR GND
4.7u
4 5 C8951 +2V85_VREG_L19
LEDK LEDA
LD8950
R8950
9 U8950 SN74AUP1T97DSFR
NC C8401 C8400
1 6 2.2
B C
3 2 5 3
1u 1u R8952 100 2 Q8950 GND VCC
3 4 R8953 300 2
LINE_OUT_IRRC A Y
Q8951 C8950
TOL=0.01 TOL=0.01 4.7u
1 1
1K
VA8950
TOL=0.01
1K
TOL=0.01
C8952
R8954
R8955
0.1u
RED LED
+VPWR
R8956
LD8951
D8900
HR_LED_SINK
6. CIRCUIT DIAGRAM
<Wireless Charger Contact >

2108614-5 ANT8000
R4751
FEED VBUS_USB_IN
DNI
DNI
DNI
R4750
DNI
D4000
2108614-5 ANT8001
FEED
DNI
2108614-5 ANT8002
FEED WLC_5V_OUT
DNI
4P -> 3P Change
<4-8-1_Fuel_Gauge_MAX17048>
C-CLIP Partnumber change (3.0T -> 2.7T)
Rev_1.0
Only use line VBAT1 from Battery Connector.
CLOSE TO Battery CONNECTOR
DNI R4801
VBAT_SENSE +1V8_VREG_L6
R4800 DNI
U4800
MAX17048
A3 A1
VBAT_SENSE VDD CTG
B3
QSTRT
B4
ALRT FUEL_GAUGE_INT
A2 B1
CELL SDA FUEL_I2C_SDA
A4 B2
GND SCL FUEL_I2C_SCL
C4800 C4801
DNI
DNI DNI
Don't use Board GND

Use line GND From Battery GND Pin#3
<4-7-1-1_Linear Charger_RT9536 >

WLC_5V_OUT
VBAT
+1V8_VREG_L6
R4802
U4801 RT9536 DNI
11
PGND
1 10
VIN BATT
2 9
3
ISET PGB
8
WLC_OK
GND1 CHGSB
4 7 WLC_CHG_IRQ_N
LDO GND2
5 6
IEOC EN_SET CHG_EN_SET
DNI
R4747
C4749
DNI
C4748
R4746
R4745
DNI
DNI
DNI DNI
GND
R4747, PMA current Set (I)

560 ohm : 901mA
620 ohm : 850mA R4746 : EOC % Setting Value
780 ohm : 680mA 2K ohm : 10% of ISET
4.3K ohm : 20% of ISET
820 ohm : 646mA ex) 6% = 1.2K / 200
1000 ohm : 530mA
6. CIRCUIT DIAGRAM
<4-1-3-2_PMIC_PM8926_POWER> Rev_0.6
PCB REVISION R4130 R4131 (1005 SIZE)
G1
G2
Rev
Q4101
Note 1 0 100K 20K 0.300
External OVP FET for over 1A charging A 100K 30K 0.415
Based on Reference Schematic Rev.BA PCB_REVISION
R4130
+1V8_VREG_L12 B 100K 43K 0.541
100K
80-NE925-41 MSM8926 BASEBAND PRELIMINARY REFERENCE SCHEMATIC_BA C
Q4100 100K 68K 0.729
33n
D1
D3
D4
D2
S1
S2
D 100K 100K 0.900
R4131
DNI
6 D1_1 S1 1 E 100K 180K 1.157
C4130
8 D1_2
1.0 100K DNI 1.800
1.1 DNI 100K 0.000
R4145
4.7K
5 G2 G1 2
EXT_OVP_CTRL
R4146
4.7K
D2_2 7
133
145
147
83
84
26
28
40
54
82
89
90
91
4 S2 D2_1 3
DNC_1
DNC_2
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
NC_9
NC_10
NC_11
BACKUP BATT
L4130 240n
161 8
VBUS_USB_IN USB_IN_1 VSW_S1_1 +1V15_VSW_S1
172 21
USB_IN_2 VSW_S1_2 Remote Sense +1V15_VSW_S2
20 R4132
171
VREG_S1 0
+1V35_VSW_S3 10uAH / 0.03F / SMZY0023501
C4131 10n
+5V0_VREG_BHARGER OVP_CP_DRV L4131 240n
162 45
OVP_OUT VSW_S2_1 +2V1_VSW_S4
167 46
C4132 100n
VDRV_P VSW_S2_2 +1V15_VSW_S5
58 C4182
VSW_S2_3 Remote Sense
56 R4133 0
VREG_S2 Note 8 VCOIN
143 47u
+5V0_VREG_BHARGER 155
VCHG_1
35 L4132 1u Output capacitor should be placed close to MSM load
DNI
DNI
22u
22u
22u
47u
47u
VCHG_2 VSW_S3 ground cap directly to main ground using separate via. BAT4130
DNI
DNI
36
VREG_S3 Main ground should be continuous (not fragmented) plane
C4133
C4134
C4135
C4136
C4137
C4138
C4139
L4133 1u 154
+VPWR VSW_CHG_1 between output capacitor and the PMIC
C4140
C4141
166 81 L4134 2.2u
L4133 Part Change VSW_CHG_2 VSW_S4 DNI
4.7u
4.7u
95
152
VREG_S4 DNI (Backup BAT )
VPH_PWR_1
C4142
C4143
L4135 1u
164 80
VPH_PWR_2 VSW_S5
78
VREG_S5
140
Note 2 BATFET_CP_DRV
139
VBAT_1
L4132/4135 value change to 1u (QCT Review)
If BMS_CSP and BMS_CSN pins are not used, CHG_PGND 151 L4134 Part Change
VBAT VBAT_2
please connect them to VPH_PWR. C4145 0.1u 163
VBAT_3 VREG_L1
15
+1V225_VREG_L1
156 3
1'st : Use internal sensing Resistor VBAT_SENSE VBAT_SNS VREG_L2 +1V2_VREG_L2
2
VBAT_SENSE_P VREG_L3 +1V15_VREG_L3
C4146 470n 131 37
+VPWR BMS_BYP VREG_L4 +1V2_VREG_L4
107 25
ATT : External Fuel Guage Note 2 +VPWR
+VPWR R4135
R4138
DNI
DNI 96
BMS_CSP VREG_L5
105
+1V2_VREG_L5
Other : QCT BMS VCOIN
76
BMS_CSN
VCOIN
VREG_L6_1
VREG_L6_2
106
+1V8_VREG_L6
Connect BMS even Fuel Guage VBAT_SENSE_N Note 1 104 U4100 VREG_L7
116
118
+1V9_VREG_L7
+5V0_VREG_BHARGER VDD_FLASH VREG_L8 +1V8_VREG_L8
4 128
+1V35_VSW_S3 VDD_GR1 VREG_L9 +2V05_VREG_L9
1 38
R4139 11
VDD_GR2_1 PM8926 VREG_L10
16
+1V8_VREG_L10
+2V1_VSW_S4 +2V075_VREG_L25 115
VDD_GR2_2 VREG_L11
71
PMIC Internal Use for VREG_L6Note 6
+2V1_VSW_S4 VDD_GR3 VREG_L12 +1V8_VREG_L12
0 27 14
+2V1_VSW_S4 59
VDD_GR4 VREG_L13
49
PMIC Internal Use for VREG_RF_CLK
+VPWR VDD_GR5_1 VREG_L14 +2V75_VREG_L14
60 43
VDD_GR5_2 VREG_L15 +3V0_VREG_L15
7 19
+VPWR
41
VDD_GR6 VREG_L16
18
Change 2.8V --> 3.0V at 1.0
VDD_GR7 VREG_L17_1 +2V95_VREG_L17
48 30
VDD_L25 VREG_L17_2
32
121 29
AVDD_BYP VREG_L19 +2V85_VREG_L19
170 55
Note 3 If you don't use bypass Boost, Connect +VPWR VPRE_BYP VREG_L20 +3V075_VREG_L20
9 53
+VPWR VDD_S1_1 VREG_L21 +2V95_VREG_L21
10 52
Note 4 VDD_S1_2 VREG_L22 +2V95_VREG_L22
22 51
GR1 : L1, L2, L4, L5 GND_S1_1 VREG_L23 Reserve +2V95_VREG_L23 at B
33 12
GR2 : L3, L24, L26 GND_S1_2 VREG_L24 +1V3_VREG_L24
34
VDD_S2 VREG_L25
70 Note 7 +2V075_VREG_L25
GR3 : L6, L7, L8, L9, L27 57 24
GND_S2_1 VREG_L26 Reserved for future 1200mA, Source S3
GR4 : L10, L11, L13 67
GND_S2_2 VREG_L27
127
68 50 Reserved for future 600mA, Source S4
GR5 : L14, L12 GND_S2_3 VREG_L28 +2V8_VREG_L28
47 Reserved for USIM3150mA
GR6 : L15, L16, L17, L18 23
VDD_S3
94
GR7 : L19, L20, L21, L22, L23, L28 GND_S3 VOUT_LVS1 +1V8_VREG_LVS1
93
VDD_S4
69 138 L4136 10u
GND_S4 VSW_WLED +VPWR
R4141 0 126 137
+VPWR 113
VDD_WLED OVP_WLED
ZD4130
PMIC_LED_A Up to 10EA of LED
GND_WLEDI_1
114 125
Note 9 Current Sensing Point for WLED Driver GND_WLEDI_2 WLED_1 PMIC_LED_C
GND_CHG_PSUB
79 103
GND_CHG_HP_1
GND_CHG_HP_2
VDD_S5 VLED_FLASH FLASH_LED_OUT_P

92
GND_S5
GND_WLED
GND_CHG
GND_OVP
C4183 C4163
GND_1
GND_2
GND_3
GND_4
GND_5
GND_6
GND_7
GND_8
2.2u 2.2u
22u
22u
DNI
10u
1u
4.7u
0.1u
0.1u
4.7u
2.2u
2.2u
2.2u
2.2u
2.2u
64
74
75
86
87
98
99
150
110
142
109
153
165
111
C4164
C4169
10K
C4173
C4174
C4175
C4176
C4177
C4170
C4171
C4172
C4165
C4166
C4167
C4168
4.7u
4.7u
4.7u
DNI
4.7u
4.7u
4.7u
4.7u
4.7u
1u
1u
1u
1u
4.7u
4.7u
4.7u
4.7u
1u
1u
1u
1u
R4142
Place input caps close to respective VIN pins.
1u
1u
1u
1u
Note 5
1u
1u
1u
1u
Each capacitor GND should be star routed to their respective reference ground
C4147
C4129
C4180
C4181
C4128
C4148
C4127
C4126
C4125
C4124
C4123
C4149
C4150
C4151
C4122
C4152
C4121
C4153
C4154
C4155
C4156
C4120
C4119
C4157
C4158
C4159
C4160
C4161
C4162
(GND_S1, GND_S2, GND_S3, GND_S4)
Then input caps should via directly to main ground CHG_PGND
C4171,4172 CHANGE CAP AT 1.0 (AUDIABLE NOISE)
6. CIRCUIT DIAGRAM
< 9-2-1_IO_USB2.0 > Rev_0.5 < 9-5-3_Micro_SD_Combo >

DNI for test
FL10000
1 3
< PCB Contact > +2V95_VREG_L22
+3V0_USIM_NFC +2V95_VREG_L22 +2V95_VREG_L18 +1V8_VREG_L6 +2V95_VREG_L21
IN OUT VBUS_USB_IN
2 4
GND1 GND2
DNI
ANT1 MBV62562001
47K
22p
1u
1M
FEED
DNI
DNI
DNI
DNI
DNI
15K
C10000
R10000
C10001
R9511
D10007
D10000
R9512
DNI
0
R9501
R9508
R9509
R9505
R9506
R9507
R9500
CN10001
6
7
FL10001 ANT2 C-Clip Change : 1.4 -> 0.95
8
(Height and Postion Near Motor)
6
P6
VBUS1
2 4 R9201 0 S1 T1
D- 2
USB_D_M VCC SDCARD_DATA_2
D+3 1
P2 P4
3 R9202 0
USB_D_P
1 POINT DELETED NEAR GPS AT B UIM1_RESET_N S2
DAT2
T2
P1 P3
R9504 10 S3
RST CD/DAT3
T3
SDCARD_DATA_3
ID 4
UIM1_CLK CLK1 CMD SDCARD_CMD
5 P5
S4 T4
GND5 RESERVED1 VDD
S5 T5
2
9
S6
GND CLK2
T6
SDCARD_CLK
10 S9500
NFC_SWP S7
VPP VSS
T7
11
UIM1_DATA S8
I/O DAT0
T8
SDCARD_DATA_0
RESERVED2 DAT1
SW
SDCARD_DATA_1
S/W SDCARD_DET
1
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
D9202
D9203
G1
G2
G3
G4
G5
G6
G7
G8
MSM_USB_ID Delted at B
10p
10p
1u
1u
33p
C9505
PM_USB_ID
VA9501
VA9502
VA9503
VA9504
C9501
C9504
VA95010
VA9505
VA9506
VA9507
VA9500
VA9508
VA9509
C9502
C9503
PM_USB_ID : Direct connection to USB connector 7/2 C9501/9505 CI item
DNI
to detect ID when MSM PHY is off

C9202
D10006
SD DATA LINE VARISTOR

VALUE CHANGE 15pF -> 5pF
Back Volume Key < 9-9-1-1_Motor >

CN100
1
R101 100 KEYPAD_SENSE_0 +VPWR
Rev_0.3
< 8-8-1-1_Haptic_SM100 >
R102 100
2 PM_KYPD_PWR_N
3 CN4
4 L9910 100n 1
5
R103 100
6 KEYPAD_SENSE_2 2
DNI
1u
D105 D103
Deleted at A
C9912
C10002
D9910
D104
L9911 100n
PMIC_VIB_N
33p
33p
ZD8803
PMIC Control
C9910
C9911
Change 4p to 6p at A
TOP SHIELD CAN CLIP
SC10001 SC10002 SC10003 SC10004 SC10005 SC10006 SC10007 SC10008 SC10009
1 1 1 1 1 1 1 1 1
PID
BOTTOM SHIELD CAN CLIP
SCREW_HOLE GND
PID1 SC20002
SC20001 SC20003 SC20004 SC20005 SC20006
OJ13000OJ13001OJ13002
1 1 1 1 1 1
ADD AT 1.0 AGAIN
7. BGA PIN MAP
7. BGA PIN MAP

U1500-WTR1625L
7. BGA PIN MAP
U2100-MSM8926
7. BGA PIN MAP
U3200-eMMC
7. BGA PIN MAP
U4100-PM8926
7. BGA PIN MAP
U6100-CODEC IC(WCD9302)
8. PCB LAYOUT
8. PCB LAYOUT
LD8950 : IRRC LED

U8400 : Proximity Sensor - Q-remote not Operate
- No Proximity Funtion
U1500 : RF Transceiver, WTR1625L
FL1105 RF trouble shooting
Switch ,SPDTRF trouble shooting
U1100 :
FEMID, D5202 B1, B3, B7, B8,B20
U6100 : Audio Codec RF trouble shooting
Audio trouble shooting
CN4
FL1106 : Filter, High/Low BandRF Contact, Motor
trouble shooting No Motor operation
FL1700 : Duplexer, B8633

RF trouble shooting FL1701 : SAW Filter, B9485
RF trouble shooting
FL1202 : Filter, SPDT U2100, U3100

RF trouble shooting MSM8926 & LPDDR2 (8G, POP Type)
Baseband processor
U1300 : MMPA, SKY77629
RF trouble shooting
U4100
PMIC, PM8926
U1701 : RF Tx PAM, B20
Power trouble shooting
RF trouble shooting
FL1203, Duplexer ACMD-6103 U1751 : RF Tx PAM, B7

RF trouble shooting RF trouble shooting
FL1201, FEMid, LMSW54GM-G27

FL1750, Duplexer
RF trouble shooting
ACMD-6103
RF trouble shooting
FL1102, SP5T
RF1635, RF trouble shooting
CN9100
Battery connector
FL1100, FL1103 : Coupler Can’t power on
LDJ18829M24AD011RF trouble
shooting
FL110062, Diplexer
DPX202700DT-4162A1
RF trouble shooting
LG-D722V_MAIN_EAX65886601_1.0_TOP-1
8. PCB LAYOUT
U8700 : Hall Sensor IC

- Quick Cover not operate
CN10001
Micro USB
No USB, Charging operation
LG-D722V_MAIN_EAX65886601_1.0_TOP-2
8. PCB LAYOUT
8. PCB LAYOUT
MIC6921 SW1103
SUB MIC Mobile switch, Main
No MIC operation Can’t search signal
U8100
Compass/Accel Sensor IC
- No Compass / Accel Funtion
ANT5100, 5101
Antenna Clip, BT / Wi-fi
ANT1104, ANT1105 Can’t search signal
Antenna Clip, GPS
Can’t search signal
CN7400
Connector, VGA Camera
CN7500 No VT camera operation
Laser AF Connector
Camera AF not Operate
U5100
CN7300 WCN3620 , BT/Wi-Fi /FM IC
Connector, 8M Camera No BT/Wifi/FM Radio operation
No main camera operation
S9500 : SIM / Micro SD Socket

- No SIM / Micro SD Funtion
U3200
eMMC 8GB
Memory trouble shooting CN10000
Back key Connector
Back key not Operate
SW1102
Mobile switch,
DRX B1, B2, B3, B20
U5200
PN547, NFC
NFC not operate
LG-D722V_MAIN_EAX65886601_1.0_BOT-1
8. PCB LAYOUT
SW1101
Mobile switch,
DRX B1, B2, B3, B20
ANT5102,5103
Antenna Clip, NFCCan’t search signal
CN7200
Connector, Touch
No touch operation
(touch one point guide)
CN7100
Connector, LCD
No LCD operation
MIC6920 ANT10003, 10004 FL10060 ANT10060, 10061, 10062 ANT1000, 1001

Main MIC Speaker Clip RF load Switch Antenna Clip, Main Antenna Clip, Main
No MIC operation No Speaker operation RF1149A Can’t search signal Can’t search signal
RF Trouble Shooting
LG-D722V_MAIN_EAX65886601_1.0_BOT-2
9. CALIBRATION
9. CALIBRATION
CAL INFORMATION
S/W VERSION
[TachyonV48] LGD722V 20140723 ALL File Calibration
Please Check the Version to “B2B”
H/W
Name Part No.
PIF PIF200(All Type) BJAY0024021
USB Cable USB Cable RAD32247898
Power Cable DC Power Cable RAD32247878
I/O Cable 5P E-SATA_DC_Plug RAD32167861
RF Cable_Main MS-156C MXFJK1WT4000C2
Power Supply_PIF Power Supply 5.3V
Power Supply_Phone Power Supply 5.0V
RF Test Equipment E5515C(8960)
NOTICE Use the Battery
Reference to Attached ppt

>How to connect between phone RF switch and RF 800A: It has to be
connected as below
CMW500 RF Cable connection
>How to connect between CMW500 and RF800A ; It has to connected as below
-CMW500 [RF1COM] to RF-800A [left COM], - CMW500 [RF2COM] to RF-800A
[Right COM]
9. CALIBRATION
9. CALIBRATION
LGD722V
MS695
[TachyonV48] LGD722V 20140723 ALL File Calibration

[Tachyon36]LGMS695_20120213_Calibration
LGD72V
9. CALIBRATION
9. CALIBRATION
LGD722V
9. CALIBRATION
LGD722V
LGD722V
LGD722V
LGD722V
LGD722V
LGD722V
LGD722V
LGD722V
9. CALIBRATION
LGD722V
9. CALIBRATION
COM1
A COM3
2A 2B
5.5V
The phone
must be fitted
with the bettery
RAD32167861
RF cable : MS-156C
(P/No :MXFJK1WT4000C2)
This is for example.

You can check “C:\LGE\Tachyon\Model\D722V\Setting Guide”
9. CALIBRATION
2A COM1
A
COM3
2B
Shield Box USB Cable
RF Connection Cable
2
4
2 3 4
USB cable (A-B type)
(P/No : BJAY0020060) MS-156C
MXFJK1WT4000C2
GPIB cable (IEEE-488)
(P/No : BJAY0020058)
RAD32167861
2A B
2B
A
This is for example.

You can check “C:\LGE\Tachyon\Model\D722V\Setting Guide”
9. CALIBRATION
9. CALIBRATION
9. CALIBRATION
9. CALIBRATION
Tachyon 36
Tachyon_36
9. CALIBRATION
5.3V
5.0V
9. CALIBRATION
9. CALIBRATION
9. CALIBRATION
LGD722V
MS695
LGD722V
LGD722V
LGD722V
LGD722V
LGD722V
LGD722V
LGD722V
9. CALIBRATION
D722V
MS695
9. CALIBRATION
D722V
MS695
D722V
MS695
RF900
10. HIDDEN MENU
10. HIDDEN MENU
Hidden Menu Start

Start shortcut keys: 3845#*722#
Hidden Menu
Start the desired menu: Menu, click
Version Info
Classified Information representation
Hidden Menu
Settings
Version Info
10. HIDDEN MENU
Factory Reset
Factory Reset : Reset as default
Factory Settings
Factory Reset(Power Off) :
Reset as default
Factory Settings and Power Off
Hidden menu
WCDMA-Only
Factory Reset
AAT Device Test

All auto Test - Full :
You can test all functions
automatically
All auto Test - Full (+Power)

You can check Test Results
When you touch the screen with pushing
power key
10. HIDDEN MENU
Auto Detecting Item

Check below Items
USIM Card1 : connecting is PASS
SD Card : connecting is PASS
Ear Phone : No connecting is PASS
TA wrong : No connecting is PASS
SmartCover : No connecting is PASS
battery ID : Right Battery ID is pass
Key Press Test

Check below Items
Up/Down key : Hard Key
Power key : Hard Key
Proximity Sensor : Blind the Proximity sensor
Camera Test – Snapshot

Click OK button to calibrate
A+ function
Touch screen to capture
10. HIDDEN MENU
Camcorder Test
Camera is recoding for 4 seconds
VT Camera Test
Show the VT Camera image
Display Check Test

Check Black & White Color
10. HIDDEN MENU
Sound Test
Check the sound
Vibrator Test
Check the vibration
IrRC Test
Touch the ‘Start’ Button and check IrRC function
through JIG
10. HIDDEN MENU
Touch Drawing Test

Check Channel status & Raw data
Draw a guide line
Back button enable
Double tap back button
Motion Sensor Test

Check 3 positions & Magnetic sensor
Position horizontally
Position Vertically
Position side
GPS BT Wifi Test

GPS(RF) test : CNO is some value : OK
Bluetooth Scanning is PASS : OK
WiFi Scanning is PASS : OK
10. HIDDEN MENU
NFC Test
Put phone on the NFC Tag.
Touch start button
FM Radio Test
Connect wired headset
Check the volume of FM radio
Loopback Test
Check the Audio loopback
Check the Speaker loopback
10. HIDDEN MENU
Individual item
You can test only individual item
11. DISASSEMBLE GUIDE
11.1 DISASSEMBLE. BATTERY & BATTERY COVER
A front view of D722v.

1
Lift up battery cover with your

2
finger nail.
3 Disassemble battery cover.
4 Disassemble battery.
11.2 DISASSEMBLE REAR, ASSEMBLY.
Loosen screws.
1 Disassemble Screw
(10 Points.)
Unhook all hooks .

Push Be carefully Rear and antenna
2 with spatula
Finger
c-clip damage.
using a spatula.
3 Disassemble a Rear assembly.
11.3 DISASSEMBLE PCB ASSEMBLY, MAIN.
Disassemble connectors using

1
spatula.
2 Disassemble three connectors.
Lift up a assembled PCB From a

3
bar assembly.
A view of BAR assembly and PCB

4
assembly.
11.4 DISASSEMBLE PCB ASSEMBLY, MAIN, SMT
To disassemble a shield can top,

1 lift up a shield can according to
hole, using a pincette.
To disassemble a shield can

bottom , lift up a shield can
2
according to hole, using a
pincette.
A view of PCB assembly.

3 A main Top(left) and a shield can
top(right).
A view of PCB assembly.

4 A main bottom(left) and a shield
can bottom(right).
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW(SBOM)

EAU00
EBP00
EAB01 ABM01 ABM00
MBL01
EBP01
MBL00
EAC00 ACQ00
EBD00 EAJ00 MJN00 ACQ01 EBR00 ACQ02
FAB00
MDS00 FAB01
MBL02 MDS01
EAG00 EAB00
Location Description Location Description

EBD00 Tocuh Window Assembly EAG00 Jack, Phone
MDS00 Gasket EBR00 PCB Assembly, Main
EAJ00 LCD Module ABM00 Can Assembly, Shield
MJN00 Tape, Window ABM01 Can Assembly, Shield
ACQ01 Cover Asembly, Front EBP01 Camera Module
MBL00 Cap ACQ02 Cover Asembly, Rear
MBL01 Cap EAB00 Speaker Module
MBL02 Cap EAC00 Rechargeable Battery, Lithium Ion
EAB01 Receiver FAB00 Scerw, Machine
EAU00 Motor, DC ACQ00 Cover Assembly, Battery
EBP00 Camera Module FAB01 Screw, Tapping
MDS01 Gasket
12.2 Replacement Parts Note: This Chapterisused for reference, Part order is ordered
<Mechanic component> by SBOM standard on GCSC
Level Location no Description P/N Specification Remark
1 AGQ000000 Phone Assembly AGQ87946401 LGD722V.AVD2TN TN:TITAN TITAN -
2 MEZ002100 Label,Approval MLAA0062303 COMPLEX KB770 DEUBK ZZ:Without Color -
Cover
2 ACQ100400 ACQ87512501 LGD722V.AVD2TN TN:TITAN TITAN -
Assembly,EMS
Cover
Assembly,Rear
Cover Assembly,
Rear(SVC)
5 MJN000000 Tape MJN69208401 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 MJN061100 Tape,Protect MJN68931401 COMPLEX LGD725.AATTZY ZZ:Without Color -
CUTTING ACRYL LGD725.AATTTN BK:BLACK

5 MKC009400 Window,Camera MKC64919101
BLACK -
CUTTING ACRYL LGD725.AATTTN ZZ:Without

5 MKC009401 Window,Camera MKC65019401
Color -
COMPLEX C2000 CGRSV WA:White C2000 USASV

5 MEZ000900 Label,After Service MLAB0001102
DIA 4.0 PRINTING,
5 ABH000000 Button Assembly ABH74999701 LGD725.AATTTN TN:TITAN TITAN -
Cover Assembly,
5 ACQ063400 ACQ87131501 LGD725.AATTTN BK:BLACK BLACK -
Rear(Sub)
6 MCK063300 Cover,Rear MCK68145001 MOLD PC LGD725.AATTTN BK:BLACK BLACK -
6 MBF000000 Bush MBF63223801 COMPLEX LGF350L.ALGTWH ZZ:Without Color -
5 ACW000000 Decor Assembly ACW74417101 LGD725.AATTTN TN:TITAN TITAN -
6 MBF000000 Bush MBF63223801 COMPLEX LGF350L.ALGTWH ZZ:Without Color -
6 MCR000000 Decor MCR65486701 MOLD PC LGD725.AATTZY BK:BLACK BLACK -
5 MCQ009400 Damper,Camera MCQ67665001 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MCQ049800 Damper,Motor MCQ67747201 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MCQ000000 Damper MCQ67747301 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MFB029600 Lens,Flash MFB63413201 MOLD PC LGD725.AATTTN ZZ:Without Color -
5 MHK000000 Sheet MHK64646301 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MJN009400 Tape,Camera MJN68827201 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MCQ009401 Damper,Camera MCQ67969301 COMPLEX LGD725.AATTTN ZZ:Without Color -
Cover
3 ACQ003400 ACQ87110901 LGD725.AATTTN TN:TITAN TITAN -
Assembly,Bar
COMPLEX LG-VX6000 ZZ:Without Color PID Label

4 MEZ00 Label MLAZ0038301
4 Array PRINTING,
4 MJN061100 Tape,Protect MJN68931301 COMPLEX LGD725.AATTZY ZZ:Without Color -
Cover
Assembly,Front
5 MDS000000 Gasket MDS64673601 COMPLEX LGD725.AATTTN ZZ:Without Color -
MOLD SILCON RUBBER LGD725.AATTTN

5 MBL00 Cap MBL65937001
ZZ:Without Color -

5 MBL01 Cap MBL65936901
ZZ:Without Color -

5 MBL02 Cap MBL65917101
ZZ:Without Color -
Cover Assembly,
Front(Sub)
6 MCK032700 Cover,Front MCK68125901 MOLD PC LGD725.AATTTN TN:TITAN TITAN -
6 MET099500 Insert,Nut MICE0016904 COMPLEX MECH_COMMON ZZ:Without Color -
6 MDQ000000 Frame MDQ63916501 CASTING MG LGD725.AATTZY ZZ:Without Color -
5 MJN061100 Tape,Protect MJN69309201 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 MDS000005 Gasket MDS64911601 COMPLEX LGF470L.ALGTWH ZZ:Without Color -
5 MKC041800 Window,IRDA MKC64919001 MOLD PC LGD725.AATTTN ZZ:Without Color -
5 MJN000000 Tape MJN68931601 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MJN000001 Tape MJN68930701 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MHK000000 Sheet MHK64705401 COMPLEX LGD725.AATTZY ZZ:Without Color -
5 MHK000001 Sheet MHK64688101 COMPLEX LGD725.AATTTN ZZ:Without Color -
PRESS STS 0.15T LGD725.AATTTN BK:BLACK

4 MCR000000 Decor MCR65486601
BLACK -
4 MDS00 Gasket MDS64673701 COMPLEX LGD725.AATTZY ZZ:Without Color -
4 MJN00 Tape,Window MJN68887201 COMPLEX LGD725.AATTZY ZZ:Without Color -
4 MJN107400 Tape,USP Film MJN68931201 COMPLEX LGD722V.AVD2TN ZZ:Without Color -
GMEY0014301 BH + 1.4mM 3.5mM MSWR NI PLT

3 FAB00 Screw,Machine GMEY0014301
N - KUMGANG SCREW CO., LTD
3 FAB01 Screw,Tapping FAB32218901 BH + 1 2.7M 3.5M NI PLT NI
5 MDJ000000 Filter MDJ64045101 COMPLEX LGD725.AATTZY ZZ:Without Color -
Can
5 ABM00 ABM74516401 LGD725.AATTTN ZZ:Without Color -
Assembly,Shield
PRESS STS 0.15T LGD725.AATTZY ZZ:Without

6 MBK070300 Can,Shield MBK63853001
Color -
6 MEV000000 Insulator MEV65132301 COMPLEX LGD725.AATTTN ZZ:Without Color -
Can
5 ABM01 ABM74476601 LGD722V.AVD2TN ZZ:Without Color -
Assembly,Shield
PRESS STS 0.15T LGD725.AATTZY ZZ:Without

6 MBK070300 Can,Shield MBK63812701
Color -
6 MEV000001 Damper MCQ68127201 COMPLEX LGD725.AATTTN ZZ:Without Color -
5 MCQ000000 Damper MCQ68146501 COMPLEX LGD725.AATTTN ZZ:Without Color -
SC20001
SC20002
SC20003 PRESS STS 301 0.15 LGLU6200.ALGTBK BK:Black
6 Clip MBV62321701
SC20004 -
SC20005
SC20006
LGD722V.AVD2TN ZZ:Without Color LGD722V

1 AGF000000 Package Assembly AGF77598701
VD2(S6-1/ENG STD/Seal/Body_AL_P_800ea)
COMPLEX LGE615.ACISBK ZZ:Without Color

2 MAF086500 Bag,Vinyl MAF63267402
HDPE Phone Bag_add CIS Mark_85X200
2 MAY084000 Box,Unit MAY66808201 COMPLEX LGD722V.AVD2TN ZZ:Without Color -
COMPLEX LGE730.ANLDKT ZZ:Without Color

2 MAY047101 Box,Master MBEE0061004
S6T_STD Master Box(10EA)
PRINTING CG300 CGR DG ZZ:Without Color

2 MEZ047200 Label,Master Box MLAJ0004402 LABEL MASTER BOX(for CGR TDR 2VER.
mbox_label) GSM standard_master box label
COMPLEX KU990.AGBRBK ZZ:Without Color

2 MEZ000000 Label MLAZ0050901
Battery Warning Label (Lithium ion Battery Label)
COMPLEX LGD820.AUSGBK WH:WHITE WHITE

2 MEZ067500 Label,Sealing MEZ65347401
Nexus5(D820) Seal label (50*25)
PRINTING - ZZ:Without Color CDMA standard (Asia,

2 MEZ084100 Label,Unit Box MLAQ0017701
Africa)_unit box label
LGE730.ANLDKT ZZ:Without Color S6T

2 AGJ000000 Pallet Assembly AGJ73458301
Type_Body+Cap+AL(1200x800)_800EA
COMPLEX LGE730.ANLDKT ZZ:Without Color S6T-

3 MAY010800 Box,Carton MBEC0004404
STD Body(800EA/1200*800)
3 MGA000000 Pallet MPCY0012403 COMPLEX KG800 FRABK DB:DARK BLUE -

3 MBL007000 Cap,Box MCCL0002604
STD Cap(800EA/1200*800)

3 MCQ000000 Damper MCQ66486907
STD Dead Space Sleeve(800EA/1200*800)
1 AAD000000 Addition Assembly AAD87005701 LGD722V.AVD2TN TN:TITAN TITAN -
Cover
Assembly,Battery
PIFA 1NFCLG044 SINGLE -5DB 5:1 FPCB Type - NFC

3 EAA030100 EAA63444601
Antenna,Multiple Tape IMTECH
3 MCK004100 Cover,Battery MCK68125821 MOLD PC LGD722V.AVD2TN TN:TITAN TITAN -
12.2 Replacement Parts Note: This Chapterisused for reference, Part order is ordered
<Main component> by SBOM standard on GCSC
PCB
5 EBR070500 EBR79024201 LGD725.AATTTN 1.0 Flexible
Assembly,Flexible
PCB Assembly,
6 EBR070100 EBR79669001 LGD722V.AVD2TN 1.0 Flexible
Flexible,Insert
7 MJN000000 Tape MJN69310201 COMPLEX LGD725.AATTTN ZZ:Without Color -
PCB Assembly,
Flexible,SMT
PCB Assembly,
Flexible,SMT Top
8 EAX010700 PCB,Flexible EAX65829701 LGD725.AATTTN 1.1 POLYI Multi 2 2 Flexible
PCB Assembly,
7 EBR070200 Flexible,SMT EBR79024701 LGD725.AATTTN 1.0 Flexible
Bottom
VL6180 TOF sensor, Proximity,Ambient light,

measurable range : 0~10cm,0.3~100kLux
8 U5000 IC,Proximity EAN63405901
4.8x2.8x1.0mm LGA R/TP 12P - ST
MICROELECTRONICS ASIA PACIFIC PTE LTD.
Capacitor,Ceramic, C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -

8 C5001 ECCH0009101
Chip 55TO+85C 0603 R/TP - TDK CORPORATION
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -

Capacitor,Ceramic,
8 C5000 ECCH0017601 55TO+85C 1005 R/TP 0.5MM - SAMSUNG
Chip
ELECTRO-MECHANICS CO., LTD.
KI-B241108 DUAL -5DB 3.0 FPCB Type - WLAN+BT

5 EAA030101 PIFA Antenna,WiFi EAA63466801
Tape KOMATECH CO.,LTD
PIFA KI-B081107 MULTI -5DB 3.0 FPCB Type - MRD

5 EAA030102 EAA63466701
Antenna,Multiple Tape KOMATECH CO.,LTD
KI-B151109 SINGLE -5DB 3.0 FPCB Type - GPS

5 EAA030100 PIFA Antenna,GPS EAA63406101
Tape KOMATECH CO.,LTD
LGD725.AATTTN 1.0 POLYI Stack via 2 0.15

5 EAX010700 PCB,Flexible EAX65823601
Flexible
EME1511DJAC Nd-Fe-B 1W 8OHM 85DB 830HZ

4 EAB00 Speaker Module EAB63309002
77.9 X 54.7 X 4.45 FPCB EM-TECH
04-9809-005-001-868+ 5P 4P ANGLE TR 3.5M

4 EAG00 Jack,Phone EAG63849801 BLACK 5P Side Contact KYOCERA CONNECTOR
KOREA SALES CO.,LTD.
EMR1206SHP1 50mW 32OHM 107DB

4 EAB01 Receiver EAB63268701
100HZTO7KHZ PIN - EM-TECH
LH500WX9-SD01 HD 5.0INCH 720X1280 450CD

4 EAJ00 LCD Module EAJ62669901 COLOR 70% 16/9 1000:1 60Hz Inverter N LED 2D -
LG Display Co. Ltd.
WHVM-1030QSS 2V 40mA 0A 12KRPM 12KRPM

4 EAU00 Motor,DC EAU62004401 60mSEC 0GF.CM 29OHM WOOSUNG G&T
CO.,LTD
CW1346-APQH5 CW1346-APQH5 1.3M Sony 1/7.8

4 EBP00 Camera Module EBP61641902 HD, 0deg, FPCB 5mm, Con. Top COWELL
ELECTRONICS CO.,LTD
TSMC-G519A CAPACITIVE TOUCH Glass

Window(0.55t)/Touch Sensor(0.325t) Synaptics
Touch Window S7020 5.0 inch Board To Board_1.0T, GB042-10P-
4 EBD00 EBD61885501
Assembly H10-E3000(ENBY0050901), LSMTRON 2
TONE(Black - Titan silver, Spin pattern) LG
INNOTEK.,LTD.
PCB
3 EBR00 EBR79432701 LGD722V.AVD2TN 1.0 Main
Assembly,Main
PCB Assembly,
Main,Insert
: EFC-3A03-20-MH(Sn99%/Ag0.3%/Cu0.7%)) . .
5 RAA050101 Resin,PC BRAH0001304
NONE
C8AA-Y495A C8AA-Y495A 8M AF, Sony(1/4")

5 EBP01 Camera Module EBP62101701 IMX219, 8.5x8.5x4.95t, MIPI4, FPCB, 90 degree,
30pin LG INNOTEK CO., LTD
5 RAA050100 Resin,PC BRAH0001305 HIFILL 3075B . . NONE
PCB Assembly,
Main,SMT
PCB Assembly,
Main,SMT Bottom
1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM

Inductor,Multilayer,
6 C1111 ELCH0001054 3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Chip
PILKOR ELECTRONICS LTD.
0402AF-101XJEW 100NH 5% - 900mA - - 0.16OHM

6 L6613 ELCH0001444 1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
Chip
R/TP COILCRAFT SINGAPORE PTE LTD.
GRM1555C1H3R0C_H 3pF 0.25PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
6 C1124 Frequency),Cerami EAE62945501
W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
MANUFACTURING CO.,LTD.
LQP03TG1N2C02D 1.2NH 0.2NH - 600mA - -

6 C5102 EAP62226001 0.15OHM 6GHZ 13 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
MURATA MANUFACTURING CO.,LTD.
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

Capacitor,Ceramic,
6 C6611 ECCH0000155 1005 R/TP - ROHM Semiconductor KOREA
Chip
CORPORATION
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C

Capacitor,Ceramic,
6 D5100 ECCH0000122 1005 R/TP - ROHM Semiconductor KOREA
Chip
CORPORATION
R5300
R5301
R5302
R6615
R6920
6 Wire Pad,Short SAFP0000401 AX3100 ATL SV_SHIPBACK,MAIN,A
R6921
R7600
R9100
R9101
R9511
C15002
C15003
C15004
C2366
C2398
C2410 CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
Capacitor,Ceramic,
6 C2417 ECCH0017301 45TO+85C 0603 R/TP - SAMSUNG ELECTRO-
Chip
C2418 MECHANICS CO., LTD.
C4191
C4199
C7201
C9501
C9503
FL7300 ACFE4A2G750E COMMON MODE NOISE FILTER -

6 FL7400 Filter,EMI/Power EAM63150101 1.7pF 0H SMD R/TP 0.87x0.67x0.47 75ohm
FL7401 AMOTECH CO., LTD.
C2318
C2322
Capacitor,Ceramic, C0603X7R1C103KT 10nF 10% 10V X7R -
6 C2325 ECCH0009106
C2326
C2360

6 C5001 ECCH0009101
C3201
C3204
Capacitor,Ceramic, C1005JB0J104KT000F 0.1uF 10% 6.3V X5R -
6 C3206 ECCH0002001
Chip 30TO+85C 1005 R/TP - - TDK CORPORATION
C8100
C8101
R1401
R6617
R6926
MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -
6 R7201 Resistor,Chip ERHZ0000401
ROHM.
R8956
R9201
R9202
C1 CL05A106MP5NUNC 10uF 20% 10V X5R -

Capacitor,Ceramic,
6 C1400 EAE62502901 55TO+85C 1005 R/TP 0.55T max. SAMSUNG
Chip
C5126 ELECTRO-MECHANICS CO., LTD.
RMTMK063CG100JT-F_H 10pF 5% 25V C0G -

Capacitor(High
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03,
W:0.3+-0.03, T:0.3+-0.03 KOREA TAIYO
c,Chip
YUDEN.CO., LTD.
LQG15HS82NJ02D 82NH 5% - 150mA 1.2OHM

6 L1143 ELCH0003841 700MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Chip
FL7100
AHFE16Q750CL COMMON MODE NOISE FILTER -
FL7101
6 Filter,EMI/Power EAM63170001 1.7pF 0H SMD R/TP 1.6x0.8x0.5 75ohm AMOTECH
FL7301
CO., LTD.
FL7302
TE 1.1H C-CLIP 1P ANT TERMINAL STRAIGHT

ANT1100
6 C-Clip EAG63730501 SMD T/REEL AU 2.5 X 1.0X 1.1(L X W X H)
ANT1101
SERVEONE CO., LTD.
C10061
C10070
C10071
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
C10076 Capacitor,Ceramic,
6 ECZH0000830 55TO+125C 1005 R/TP - TDK KOREA
C10077 Chip
COOPERATION
C5208
C5216
C6614
C10067
C10073
C10074
C1150
C1151
C15000 C1005C0G1H101JT 100pF 5% 50V C0G -
Capacitor,Ceramic,
6 C15001 ECZH0000813 55TO+125C 1005 R/TP - TDK KOREA
Chip
C15005 COOPERATION
C15006
L10071
L1145
L1149
R1106
R3208
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -
6 R5305 Resistor,Chip ERHY0009505
ROHM.
R5306
GRM0335C1E6R8BD01D 6.8
Capacitor,Ceramic, pF,25V,B,C0G,TC,0603,R/TP,0.0000000000068,0.1
6 C1143 ECCH0042007
Chip PF,25V,C0G,-55TO+125C,0603,R/TP,0.3 mm
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD

6 FL10000 Filter,EMI/Power SFEY0015301
R/TP - MURATA MANUFACTURING CO.,LTD.
C4195
Capacitor,Ceramic, MCH032A150JK 15pF 5% 25V X7R -55TO+125C
6 C5136 ECCH0009520
Chip 0603 R/TP - ROHM.
C5137
XRCGB27M120F3M10R0 27.12MHZ 30ppm 10pF

6 X5200 Resonator,Ceramic EAW61644701 SMD R/TP 4P MURATA MANUFACTURING
CO.,LTD.
C2386
C2400
C7300
CL03A225MQ3CRNC 2.2uF -20TO20% 6.3V X5R -
6 EAE62726601 55TO+85C 0603 R/TP 0.3T - SAMSUNG
C7303 Chip
C7400
C7401
C7402
C2308
C2362 CL05A475MP5NRNC 4.7uF 20% 10V X5R -
Capacitor,Ceramic,
6 C4940 EAE62506501 55TO+85C 1005 R/TP - - SAMSUNG ELECTRO-
Chip
C5144
R101
MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -
ROHM.
R103
C6613
R2213 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -
6 Resistor,Chip ERHY0009516
R2214 ROHM.
R6613
D103
D105
VA7404
VA7405 EVLC5S01015 5.5V 0% 15pF 0.6*0.3*0.33 NONE
6 Varistor SEVY0008102
VA9501 SMD R/TP AMOTECH CO., LTD.
VA9502
VA9503
VA9504
SW1101 MM8030-2610RK0 NONE STRAIGHT SOCKET

6 SW1102 Connector,RF EAG63772101 SMD T/REEL AU 50OHM 400mDB MURATA
SW1103 MANUFACTURING CO.,LTD.
C4120
C4121
C4125
C4126 CL03A105MP3NSNC 1uF 20% 10V X5R -
Capacitor,Ceramic,
6 C4127 EAE62762301 55TO+85C 0603 R/TP 0.33 MM - SAMSUNG
Chip
C4190
C4194
C9103
C10050
C10051
C10064
Capacitor,Ceramic, C0603C0G1H101JT00NN 100pF 5% 50V C0G -
6 C1148 ECCH0009103
C1159
C9102
L10069
CL05A105KA5NQNC 1uF 10% 25V X5R -

55TO+85C 1005 R/TP 0.6T max. Samsung(1.0+-0.1
6 EAE62685301 0.5+-0.1 0.5+-0.1) Murata (1.0+-0.05 0.5+-0.05 0.5+-
C5130 Chip
0.05) SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
D8900
VA7303 ICVL0505101V150FR 5.6V 0% 100pF 1.0*0.5*0.55
VA7400 NONE SMD R/TP INNOCHIPS TECHNOLOGY
VA7406
THGBMBG6D1KBAIL 8Gbyte
2.7VTO3.6V,1.7VTO1.95V 11.5x13.0x0.8 TR 153P
6 U3200 IC,MCP,eMMC EAN63126301 MLC NAND FBGA 8GB eMMC v5.0 (A19nm 64Gb
MLC x 1/11.5x13.0/91.0%) TOSHIBA
ELECTRONICS KOREA CORPORATION
PN5472A2UK/C20803 WLCSP 2.81x2.79x0.56 NFC

6 U5200 IC,NFC EAN62632401
IC WLCSP R/TP 42P NXP Semiconductors
C4136 JDK212BBJ476MD 47uF -20TO20% 6.3V X5R -

Capacitor,Ceramic,
6 C4138 EAE62767801 55TO+85C 2012 R/TP 0.85T - TAIYO YUDEN
Chip
C4182 CO.,LTD
HK1005 15NJ-T 15NH 5% - 300mA 0.46OHM

Chip
TAIYO YUDEN CO.,LTD
SFMG2B0D001 1.5~3.1V 0 0 0W 0W 0 0 MCM

6 FL1108 IC,RF Amplifier EAN62581401 R/TP 8P Gain : 17.2dB NF : 0.85dB
WISOL.CO.,LTD
C5204 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

Capacitor,Ceramic,
Chip
C6610 CORPORATION
C5201 CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -

Capacitor,Ceramic,
6 C5215 ECZH0004402 30TO+85C 1005 R/TP - - SAMSUNG ELECTRO-
Chip
C5207
C1005X5R1A105KT000F 1uF 10% 10V X5R -
C5220 Chip
COOPERATION
C5222
R10069
R10070
R4107
MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP -
ROHM.
R4133
R7300
R7401
C5105
C5111
C5112
C5113
C5114 Capacitor,Ceramic, MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
6 ECCH0009514
C5133 Chip 55TO+125C 0603 R/TP - ROHM.
C5140
C5146
C5147
C9505
MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -

ROHM.
CN15001 GB042-30S-H10-E3000 30P 0.4MM STRAIGHT

6 Connector,BtoB ENBY0040701
CN7300 FEMALE SMD R/TP 1M - LS Mtron Ltd.
C3200
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
6 ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTRO-
C5104 Chip
MECHANICS CO., LTD.
C7200
VA7200
VA7201
ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD
6 VA7202 Varistor SEVY0005402
R/TP INNOCHIPS TECHNOLOGY
VA7203
VA7204
RC0201JR-0715KL 15KOHM 5% 1/20W 0603 R/TP

- YAGEO CORPORATION
1201-01A 1P ANT TERMINAL STRAIGHT SMD

ANT5100
6 C-Clip EAG63910001 REEL AU 2.6X1.0X0.9(LXWXH) SERVEONE CO.,
ANT5101
LTD.
FB6600
FB6611
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2
FB6612
6 Filter,Bead SFBH0008102 ohm 0.2A SMD R/TP 2P 0 MURATA
FB6613
FB6920
FB6921
PESD5V0V1BL 5V 5.8V min. 12.5V 4.8A 45W SOD-

6 VA6602 Diode,TVS EDTY0012102
882 R/TP 2P 1 STC CORP.
1239AS-H-1R0N=P2 1UH 30% - 2.3A 3.0 2.3

Inductor,Wire
6 L4940 ELCP0014301 0.059OHM - - SHIELD 2.5X2.0X1.2MM NONE R/TP
Wound,Chip
TOKO, INC.
R10061 MCR01MZP5F3603 360KOHM 1% 1/16W 1005

6 Resistor,Chip ERHZ0000275
R10065 R/TP - ROHM.
FL10060 Filter,Separator, RF1149A 0.25dB@700MHz 27dB@700MHz 32 -

6 EAM63030601
FL10061 Switch RF MICRO DEVICES INC
GRM033R71E102KA01D 0.000000001F 10% 25V

Capacitor,Ceramic,
6 C1403 EAE62282201 X7R -55TO+125C 0603 R/TP 0.3+/-0.03 MM -
Chip
R5109
R5110
R5111
ROHM.
R5113
R7601
R7602
R4135
6 R4138 Wire Pad,Open SAFO0000401 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI
R9512
VA9500
VA9505
AVLC10S01005 10V 0% 5pF 0.6X0.3X0.3mm
VA9506
6 Varistor EAF62210001 IEC61000-4-2 (ESD) level #4 SMD R/TP AMOTECH
VA9507
CO., LTD.
VA9508
VA9509
C5115 GRM0335C1E4R7C 4.7pF 0.25PF 25V C0G -

Capacitor,Ceramic,
6 C5155 ECCH0009212 55TO+125C 0603 R/TP - - MURATA
Chip
C5156 MANUFACTURING CO.,LTD.
C2320 Capacitor,Ceramic, C0603X7R0J223KT 22nF 10% 6.3V X7R -

6 ECCH0009110
C2356 Chip 55TO+125C 0603 R/TP - - TDK CORPORATION
ANT10060
ANT10061
ANT10062 2108610-5 1P ANT TERMINAL STRAIGHT SMD
6 ANT1102 C-Clip EAG63652301 T/REEL AU 2.9X1.0X1.4(L X W X H) SERVEONE
ANT1103 CO., LTD.
ANT1104
ANT1105
GRM188R61C475KAAJ 4.7uF -10TO+10% 16V X5R

C4142 Capacitor,Ceramic, -55TO+85C 1608 R/TP Max 0.95T L:1.6+-0.15
6 EAE63067401
C4143 Chip W:0.8+-0.15 T:0.8+-0.15 MURATA
HK1005 3N3S-T 3.3NH 0.3NH - 300mA 0.16OHM

6 C10065 ELCH0001034 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Chip
TAIYO YUDEN CO.,LTD
TLV70718 V2 to V5.5 V1.8 0W QFN R/TP 4P

IC,LDO Voltage EUSY0355501 RP103K181D ,Richo Pin to Pin
6 U4192 EAN62496301
Regulator TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
AWL9280 30DBM 26DB 30% 85A 160A -20DB

Module, FEM(Front
6 U5103 EAT62373301 20DBM 700mDBM 16P 2.5x2.5x0.4MM 2.4GHz
End Module)
FEM(SP3T+LNA+PA) ANADIGICS,INC.
MIC6920 Microphone, MOE-C110R38-K1 -38DB 300OHM OMNI 1.5 TO

6 EAB62670801
MIC6921 Condenser 3.6V 3.76x2.95x1.1 SMD BSE CO., LTD.
BMC150 Accelerometer with Geomagnetic Sensor

IC,Acceleration
6 U8100 EAN62637201 2.2X2.2X1.0 LGA R/TP 14P Accelerometer with
Sensor
Geomagnetic Sensor BOSCH SENSORTEC GMBH
GRM033R60J333KE01D+A01 33nF 10% 6.3V X5R -

Capacitor,Ceramic,
Chip
1041681610 Micro-SD, UIMDupliSocket 16P

6 S9500 Card Socket EAG63310801
STRAIGHT DIP T/REEL - MOLEX
GRM155R61A225KE95 2.2uF -10TO+10% 10V X5R

Capacitor,Ceramic,
6 C2401 EAE62962301 -55TO+85C 1005 R/TP 0.5 L:1.0+-0.05 W:0.5+-0.05
Chip
T:0.5+-0.05 MURATA MANUFACTURING CO.,LTD.
GRM1555C1H271J 270pF +-5% 50V C0G -

C5209 Capacitor,Ceramic, 55TO+125C 1005 R/TP Max 0.55T L:1.0+-0.05
6 EAE63144601
C5212 Chip W:0.5+-0.05 T:0.5+-0.05 MURATA
Capacitor,Ceramic, C0603X7R1H331KT00NN 330pF 10% 50V X7R -

6 C5142 ECCH0009109
VA15000
IECS0505C040FR 10V 0% 4E-12F 1.0x0.5x0.3
VA15001
6 Varistor SEVY0010501 IEC61000-4-1 (ESD) level #4 SMD R/TP
VA15002
INNOCHIPS TECHNOLOGY
VA15003
GRM033R61A472K 4700pF 10% 10V X5R -

Capacitor,Ceramic,
Chip
GRM033R60J473KE19D 47nF 10% 6.3V X5R -

6 ECCH0009201 55TO+85C 0603 R/TP - - MURATA
C2357 Chip
GRM155R71H103KA88D 10nF 10% 50V X7R -

6 EAE62685701 55TO+125C 1005 R/TP 0.55T max. - MURATA
C10075 Chip
C2380 MCH155CN332KK 3.3nF 10% 50V X7R -

Capacitor,Ceramic,
6 C2383 ECCH0000149 55TO+125C 1005 R/TP - ROHM Semiconductor
Chip
C2388 KOREA CORPORATION
C2107
CL03A104KP3NNNC 0.0000001F 10% 10V X5R -
6 EAE62286801 55TO+85C 0603 R/TP 0.3 - SAMSUNG ELECTRO-
C5145 Chip
MECHANICS CO., LTD.
C9101
EVLC 5S 01 100 5.5V 0% 100pF 0.6X0.3X0.3MM

6 VA95010 Varistor EAF61450601 IEC61000-4-2 (ESD) level #4 SMD R/TP AMOTECH
CO., LTD.
RC0603J821C 820OHM 5% 1/20W 0603 R/TP -

6 R1103 Resistor,Chip EBC62236101
SAMSUNG ELECTRO-MECHANICS CO., LTD.
LQP03TG1N5C02D 1.5NH 0.2NH - 600mA - -

6 L5111 EAP62107901 0.15OHM 6GHZ 13 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
PESD12VS1UA 12V 13.3V min. 19V 22.5A 360mW

6 D10000 Diode,TVS EAH61872601
SOD323 R/TP 2P 1 NXP Semiconductors
L1103 LG HK0603 82NJ-T 82NH 5% - 70mA - - 3.37OHM

6 L1119 EAP61866701 1GHZ 4 SHIELD 0 0.6X0.3X0.3MM R/TP TAIYO
Chip
L1152 YUDEN CO.,LTD
LQP03TG1N8C02D 1.8NH 0.2NH - 500mA - -

Chip
2108614-5 1P ANT TERMINAL STRAIGHT SMD

ANT5102
6 C-Clip EAG63652001 T/REEL AU 2.9X1.0X2.7(L X W X H) SERVEONE
ANT5103
CO., LTD.
C1144
6 C6921 ECCH0009104
C6923
BLM03AX121SN1 120 ohm 0.6X0.3X0.3 25% 0.23

6 FB5100 Filter,Bead EAM62230101 ohm 0.45A SMD R/TP 2P 0 MURATA
24-5804-014-000-829+ 14P 0.40MM STRAIGHT

6 CN9300 Connector,BtoB ENBY0053201 FEMALE SMD R/TP 900mM - KYOCERA
CONNECTOR KOREA SALES CO.,LTD.
D6924 EVLC5S01033 EVLC5S01033 EVLC5S01033,5.5 V,
D6926 ,SMD ,Vdc 5.5, Vb 10~15.6, Cp 17.9 at 1MHz,
6 D6927 Varistor SEVY0008101 0.6*0.3*0.33 , ,5.5 , ,23.1~42.9 ,0.6*0.3*0.33 ,[empty]
VA6601 ,SMD ,R/TP AMOTECH CO., LTD. AMOTECH CO.,
VA6603 LTD.
2108612-5 1P ANT TERMINAL STRAIGHT SMD
ANT10003
6 C-Clip EAG63613001 T/REEL AU 2.9X1.0X2.05(L X W X H) SERVEONE
ANT10004
CO., LTD.
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C

Capacitor,Ceramic,
6 C6606 ECZH0025920 0603 R/TP - - MURATA MANUFACTURING
Chip
CO.,LTD.
GRM033R60J224M 0.00000022F 20% 6.3V X5R -

6 ECCH0032801 55TO+85C 0603 R/TP 0.3MM - MURATA
C5109 Chip
C1005X7R1E472KT000F 4.7nF 10% 25V X7R -

R6610 Capacitor,Ceramic,
6 ECZH0001106 55TO+125C 1005 R/TP - - TDK Electronics KOREA
R6611 Chip
CORPORATION
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -

ROHM.
LQP03TG6N8J02D 6.8NH 5% - 200mA - - 1.15OHM

6 L5109 EAP62226401 5.4GHZ 12 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C

Capacitor,Ceramic,
Chip
CORPORATION
C1005X5R1E104K 0.1uF 10% 25V X5R -55TO+85C

Capacitor,Ceramic,
6 C4145 EAE62685201 1005 R/TP 0.55T max. TDK KOREA
Chip
COOPERATION
R10062 MCR01MZP5F2403 240KOHM 1% 1/16W 1005

R10066 R/TP - ROHM.
C1005Y5V1A474ZT000F 470nF -20TO+80% 10V

6 ECZH0001210 Y5V -30TO+85C 1005 R/TP - TDK KOREA
C5200 Chip
COOPERATION
R5203 MCR01MZP5J272 2.7KOHM 5% 1/16W 1005 R/TP -

R5206 ROHM.
GRM0335C1ER50C 0.5pF 0.25PF 25V X7R -

Capacitor,Ceramic,
6 C5233 ECCH0009208 55TO+125C 0603 R/TP - MURATA
Chip
LG HK 0603 2N2S-T 2.2NH 0.3NH - 360mA - -

6 L1134 EAP62227301 0.19OHM 8.8GHZ 4 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
TAIYO YUDEN CO.,LTD
R5102
R5103 MCR006YZPJ224 220KOHM 5% 1/20W 0603 R/TP
R5104 - ROHM.
R5105
LQP03TG1N0C02D 1NH 0.2NH - 600mA - -

Chip
R10063
R10064 MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP
R10067 - ROHM.
R10068
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

6 ECCH0004904 1005 R/TP - MURATA MANUFACTURING
C5129 Chip
CO.,LTD.
GRM1555C1H4R7C_H 4.7pF 0.25PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
C2303
CL03A474MQ3NNNH 0.47uF -20TO20% 6.3V X5R -
6 ECCH0034801 55TO+85C 0603 R/TP 0.3+-0.03 - SAMSUNG
C2358 Chip
C2389
D104 UCLAMP3311Z 3.3V 3.65V min. 7.5V 4A 30W

6 D6929 Diode,TVS EAH62033201 SLP0603P2X3A R/TP 2P 1 SEMTECH
VA6600 INTERNATIONAL AG
TCPCF0J226MJAR0300 22uF -20TO20% 6.3V

C4172 Capacitor,TA,Poly 27.7UA -55TO+105C 0.3OHM 1.6X0.8X0.9MM
6 EAE63284001
C4941 mer NONE SMD R/TP Max 1T SAMSUNG ELECTRO-
MECHANICS CO., LTD.
MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP -

ROHM.
MCR006YZPJ105 1MOHM 5% 1/20W 0603 R/TP -

ROHM.
KQ13L2-6R KQ13L2-6R,6,1.0
CN100
6 Terminal Block ENZY0025801 mm,ETC6.6x4x1.35(t),Stroke:-0.65,Touch window
CN7500
Contact CNT HIROSE KOREA CO.,LTD
251M1002107MR12A168 100uF 20% 10V 50UA -

Capacitor,TA,Confo
6 C9100 EAE62287901 55TO+125C 0.6OHM 3.2X1.6X1.1MM NONE SMD
rmal
R/TP 1.2T max. MATSUO ELECTRIC CO.,LTD
1285AS-H-1R5M 1.5UH 20% - 1.8A 1.8 1.9

Inductor,Wire
6 L1400 EAP62286801 0.144OHM - - SHIELD 2.0X1.6X1.0MM - R/TP
Wound,Chip
TOKO, INC.
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -

Capacitor,Ceramic,
Chip
RC0201FR-0710RL 10OHM 1% 1/20W 0603 R/TP -

YAGEO CORPORATION
MPZ1608S601AT000 600 1.6X0.8X0.8 25% 0.15 1

6 FB7200 Filter,Bead EAM62633801
SMD R/TP 2P - TDK KOREA COOPERATION
RC0201JR-072M4L 2.4MOHM 5% 1/20W 0603

R/TP - YAGEO CORPORATION
GRM1555C1H100J_H 10pF 5% 50V C0G -

Capacitor(High
C5205 55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
6 Frequency),Cerami EAE62963601
C5206 W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
HK1005 1N5S-T 1.5NH 0.3NH - 300mA 0.1OHM

6 L10070 ELCH0001033 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Chip
TAIYO YUDEN CO.,LTD
CL03A224KP3NNNC 220nF 10% 10V X5R -

Capacitor,Ceramic,
Chip
FSA5157L6X 1.65 to 5.5V 60NSEC 20NSEC

6 U6600 IC,Analog Switch EAN62578201 180mW MICROPAK R/TP 6P - FAIRCHILD
SEMICONDUCTOR HONG KONG LTD.
LG HK 0603 1N0S-T 1NH 0.3NH - 470mA - -

C5101 Inductor,Multilayer,
6 EAP62226901 0.11OHM 10GHZ 4 SHIELD - 0.6X0.3X0.3MM R/TP
C5139 Chip
TAIYO YUDEN CO.,LTD
BLM15BB750SN1D 75 ohm 1.0X0.5X0.5 25% 0.4

6 FB5101 Filter,Bead SFBH0007103 ohm 0.3A SMD R/TP 2P 0 MURATA
GB042-20S-H10-E3000 20P 0.4MM STRAIGHT

6 CN7400 Connector,BtoB ENBY0039601
SOCKET SMD R/TP 1M - LS Mtron Ltd.
GB042-10S-H10-E3000 10P 0.4MM STRAIGHT

6 CN7200 Connector,BtoB ENBY0051001
FEMALE SMD R/TP 1M - LS Mtron Ltd.
MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP -

ROHM.
GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C

Capacitor,Ceramic,
Chip
CO.,LTD.
MCR006YZPJ221 220OHM 5% 1/20W 0603 R/TP -

ROHM.
BCM4334LKUBG WiFi(11a/b/g/n, Dual,

HT40)+BT4.0+FM Rx, 4.08x4.48x0.55, 40nm, B3
6 U5100 IC,WiFi EAN63049901
WLBGA R/TP 109P Broadcom International
Distribution Company
MIPSTZ1608D2R2B 2.2UH 30% - 400mA 0.4 0.5

6 L5106 EAP62110401 0.39OHM 0HZ - SHIELD - 1.6X0.8MM R/TP FDK
Chip
CORPORATION.
LFD182G45DCHD277 0.54 30 - 5GHz BPF, 2.4GHz

6 FL5100 Filter,Separator EAM62251301
LPF MURATA MANUFACTURING CO.,LTD.
LQP03TN10NH02D 10NH 3% - 250mA - - 0.7OHM

Chip
LM3263 2.7V to 5.5V 0.4V to 3.6V 0W MICRO SMD
R/TP 16P MIPI RFFE, 2G/3G/4G, 2.5A Max.(PWM),
IC,DC,DC
6 U1400 EAN62788501 2.7 MHz (typ.), 16-bump micro SMD TEXAS
Converter
INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
ESD5205P6T6G 5V 5.5V min. 10V 2UA 0W SOT-

6 D7600 Diode,TVS EAH61794301
963 R/TP 6P 5 ON SEMICONDUCTOR
SFHG89DQ102
6 FL1109 Filter,Saw EAM62633001 1575.42@GPS/1601.72@GLONASS 1.4x1.1x0.5t
SMD R/TP 5P WISOL.CO.,LTD
GRM36X7R104K10PT 100nF 10% 10V X7R -

Capacitor,Ceramic,
6 C1401 ECZH0003103 55TO+125C 1005 R/TP - MURATA
Chip
ICMEF112P500MFR COMMON MODE NOISE

6 FL10001 Filter,EMI/Power EAM62272401 FILTER 0HZ 0.0000000000001F 0H SMD R/TP -
INNOCHIPS TECHNOLOGY
TLV70728PDQNR V2 to V5.5 V2.8 0W QFN R/TP

IC,LDO Voltage
6 U4190 EAN62669801 4P - TEXAS INSTRUMENTS KOREA LTD,
Regulator
HONGKONG BRANCH.
PMR10EZPFU10L0 0.01OHM 1% 1/2W 2012 R/TP -

ROHM.
MCR01MZP5J334 330KOHM 5% 1/16W 1005 R/TP

- ROHM.
TPS61256A V2.5 to V5.5 V5 800mA 0W WLP

IC,DC,DC T/REEL 9P Small Package(1.2x1.3,0.4mm) TEXAS
6 U4940 EAN62461401
Converter INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
LXCL-EY17-4000 WHITE 3.9V 1.5 250lm - - 2016

6 LD9830 LED,Flash EAV62056201
R/TP 2P lumileds LUMILEDS LIGHTING U.S.,LLC
GRM1555C1HR50B_H 0.5pF 0.1PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
6 L10062 Frequency),Cerami EAE62945301
W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
ACPF-7124 BPF 2.44GHZ 1.4x1.1x0.8t SMD R/TP

6 FL5101 Filter,Ceramic EAM62690501 5P AVAGO TECHNOLOGIES INTERNATIONAL
SALES PTE. LIMITED
ACFE1A2G900E COMMON MODE NOISE FILTER

6 FL15002 Filter,EMI/Power EAM62291101
0HZ 0F 0H SMD R/TP - AMOTECH CO., LTD.
BLM03AX601SN1D 600 ohm 0.6X0.3X0.3 25% 0.85

6 FB5102 Filter,Bead EAM62070901 ohm 0.25A SMD R/TP 2P 0 MURATA
SSM3K15AMFV N-CHANNEL MOSFET 30V +-20

6 Q5200 FET EBK61691601 100mA 6OHM 150mW VESM R/TP 3P TOSHIBA
LLL153C70G474ME17E 0.47uF 20% 4V X7S -

6 C5217 Capacitor,Low ESL EAE62781601 55TO+125C 1005 R/TP 0.35T MAX. MURATA
MLG1608SR39JT 390NH 5% - 1mA - - 3OHM

L5200 Inductor,Multilayer,
6 EAP62167601 300MHZ 10 SHIELD 0 1.6X0.8X0.8MM R/TP TDK
L5201 Chip
KOREA COOPERATION
MLP1005V2R2T_ 2.2UH 20% - 50mA 0.05 0.350

6 L2300 EAP62447401 1.3OHM 0HZ - SHIELD - 1.0X0.5X0.55MM R/TP
Chip
TDK KOREA COOPERATION
1005GC2T8N2JLF 8.2NH 5% - 250mA 0.37OHM

Chip
PILKOR ELECTRONICS LTD.
LG HK 0603 8N2J-T 8.2NH 5% - 230mA - -

Chip
TAIYO YUDEN CO.,LTD
Q22FA1280013000 37.4MHZ 10PPM 12F , SMD

6 X5100 Crystal EAW61645401
R/TP EPSON TOYOCOM CORP
MCR006YZPF2002 20KOHM 1% 1/20W 0603 R/TP

- ROHM.
LXES15AAA1-117 15V 25% 0.1pF 1.0X0.5X0.33

6 C6612 Varistor EAF61650701 mm IEC61000-4-2 (ESD) level #4 SMD R/TP
GRM0335C1E1R5CD01D+A02 1.5pF 0.25PF 25V

Capacitor,Ceramic,
6 C5148 ECCH0009502 NP0 -55TO+125C 0603 R/TP - MURATA
Chip
PCB Assembly,
Main,SMT Top
B9485 847MHz 1.4x1.1x0.4t SMD TP 5P EPCOS

6 FL1701 Filter,Saw EAM62690401
PTE LTD.
LQP03TN1N8B02D 1.8NH 0.1NH - 600mA - -

6 EAP62546201 0.15OHM 15GHZ 14 SHIELD - 0.6X0.3X0.3MM
L1207 Chip
R/TP MURATA MANUFACTURING CO.,LTD.
L1128 LG HK 0603 18NJ-T 18NH 5% - 180mA - - 0.71OHM

6 L1700 EAP62227901 2.3GHZ 5 SHIELD - 0.6X0.3X0.3MM R/TP TAIYO
Chip
L1707 YUDEN CO.,LTD
LQP03TG15NJ02D 15NH 5% - 170mA - - 1.9OHM

Chip
FL10062 DPX202700DT-4162A1 0.5dB@LB / 0.5dB@HB

6 Filter,Separator EAM62910201
FL1106 30dB@LB / 25dB@HB - - TDK CORPORATION
GRM0335C1E3R9B_H 3.9pF 0.1PF 25V C0G -

Capacitor(High
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03
W:0.3+-0.03 T:0.3+-0.03 MURATA
c,Chip
GRM0335C1E3R3C_H 3.3pF 0.25PF 25V C0G -

Capacitor(High
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03
W:0.3+-0.03 T:0.3+-0.03 MURATA
c,Chip
6 EAX010000 PCB,Main EAX65886601 LGD725.AATTTN 1.0 FR-4 LX-BUMP 10 0.8 Main
C10050
C10051
C10064
6 C1148 ECCH0009103
C1159
C9102
L10069
Capacitor,Ceramic, C0603X7R1H331KT00NN 330pF 10% 50V X7R -

6 C5142 ECCH0009109
R10069
R10070
R4107
MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP -
ROHM.
R4133
R7300
R7401
LQP03TG1N5C02D 1.5NH 0.2NH - 600mA - -

Chip

6 C5001 ECCH0009101
GRM033R71A682K 6.8nF 10% 10V X7R -

C2385 Chip
C2107
CL03A104KP3NNNC 0.0000001F 10% 10V X5R -
6 EAE62286801 55TO+85C 0603 R/TP 0.3 - SAMSUNG ELECTRO-
C5145 Chip
MECHANICS CO., LTD.
C9101
GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C

Capacitor,Ceramic,
Chip
CO.,LTD.
PM8926 2.5 to 4.5V adj 0W CSP R/TP 172P -

6 U4100 IC,PMIC EAN62739601
QUALCOMM INCORPORATED.
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -

Capacitor,Ceramic,
Chip
C4120
C4121
C4125
C4126 CL03A105MP3NSNC 1uF 20% 10V X5R -
Capacitor,Ceramic,
Chip
C4190
C4194
C9103
GRM033R71E102KA01D 0.000000001F 10% 25V

Capacitor,Ceramic,
6 C1403 EAE62282201 X7R -55TO+125C 0603 R/TP 0.3+/-0.03 MM -
Chip
1239AS-H-100N=P2 10UH 30% 30V 700mA 1 0.7

Inductor,Wire
6 L4136 EAP62106301 0.46OHM - - SHIELD 2.5X2.0X1.2MM NONE R/TP
Wound,Chip
TOKO, INC.
R4135
6 R4138 Wire Pad,Open SAFO0000401 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI
R9512
C1320 LQP03TG3N9C02D 3.9NH 0.2NH - 350mA - -

Chip
L1227 MURATA MANUFACTURING CO.,LTD.
GRM155R61A225KE95 2.2uF -10TO+10% 10V X5R

Capacitor,Ceramic,
6 C2401 EAE62962301 -55TO+85C 1005 R/TP 0.5 L:1.0+-0.05 W:0.5+-0.05
Chip
T:0.5+-0.05 MURATA MANUFACTURING CO.,LTD.
LFL18829MTCRD627 LPF 829MHZ 698 to 960 MHz

6 FL1301 Filter,Ceramic EAM62691501 SMD R/TP 6P MURATA MANUFACTURING
CO.,LTD.
C15002
C15003
C15004
C2366
C2398
C2410 CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -
Capacitor,Ceramic,
6 C2417 ECCH0017301 45TO+85C 0603 R/TP - SAMSUNG ELECTRO-
Chip
C4191
C4199
C7201
C9501
C9503
LG HK0603 7N5J-T 7.5NH 5% - 240mA - - 0.41OHM

6 EAP61866801 3.6GHZ 5 SHIELD 0 0.6X0.3X0.3MM R/TP TAIYO
L1710 Chip
YUDEN CO.,LTD
C1324
6 EAP62226201 6GHZ 12 SHIELD - 0.6X0.3X0.3MM R/TP MURATA
L1126 Chip
L1221
L2100
L2101
L2102
LQP03TNR12J02D 120NH 5% - 80mA - - 12OHM
6 EAP62686901 800MHZ 8 SHIELD - 0.6X0.3X0.3MM R/TP
L2104 Chip
L2105
L2106
L2107
GRM0335C1ER50C 0.5pF 0.25PF 25V X7R -

Capacitor,Ceramic,
Chip
MCH155A121JK 120pF 5% 50V NP0 -55TO+125C

6 ECCH0000129 1005 R/TP - - ROHM Semiconductor KOREA
C5214 Chip
CORPORATION
SC20001
SC20002
SC20003 PRESS STS 301 0.15 LGLU6200.ALGTBK BK:Black
6 Clip MBV62321701
SC20004 -
SC20005
SC20006
APDS-9130-200 High T Proximity Sensor

3.36X4.94X3.45 COB R/TP 8P - AVAGO
6 U8400 IC,Proximity EAN62646301
TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED
LQP03TG2N2C02D 2.2NH 0.2NH - 450mA - -

L1144 Chip
EVLC 5S 01 100 5.5V 0% 100pF 0.6X0.3X0.3MM

6 VA95010 Varistor EAF61450601 IEC61000-4-2 (ESD) level #4 SMD R/TP AMOTECH
CO., LTD.
FL1105 Filter,Separator,Swi XMSS1R6G0PA-001TMP 0.2~0.5dB 17~35dB

6 EAM62730001
FL1202 tch 20dBm - MURATA MANUFACTURING CO.,LTD.
LQP03TN2N7B02D 2.7NH 0.1NH - 500mA - -

C1312 Chip
MCR01MZP5J220 22OHM 5% 1/16W 1005 R/TP -

ROHM.
RC0402FR-074K75L 4.75KOHM 1% 1/16W 1005

R/TP 0.4T max. YAGEO CORPORATION
LG HK 0603 1N0S-T 1NH 0.3NH - 470mA - -

C5139 Chip
TAIYO YUDEN CO.,LTD
IR26-71C/L447/S63/TR8 CLEAR 1.15~1.6V 65mA

6 LD8950 LED,Chip EAV62092201 8.5 920~960nm 100mW 3012 R/TP 2P -
EVERLIGHT ELECTRONICS CO., LTD.
C1 CL05A106MP5NUNC 10uF 20% 10V X5R -

Capacitor,Ceramic,
6 C1400 EAE62502901 55TO+85C 1005 R/TP 0.55T max. SAMSUNG
Chip
C1144
6 C6921 ECCH0009104
C6923
C4133 CL10A226MQ8NRNE 22uF 20% 6.3V X5R -

Capacitor,Ceramic,
Chip
CL05A105KA5NQNC 1uF 10% 25V X5R -

55TO+85C 1005 R/TP 0.6T max. Samsung(1.0+-0.1
6 EAE62685301 0.5+-0.1 0.5+-0.1) Murata (1.0+-0.05 0.5+-0.05 0.5+-
C5130 Chip
0.05) SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
MAKK2016T4R7M 4.7UH 20% - 1A 1 1.05 0.38OHM

L7500 Inductor,Wire
6 EAP62588001 - - SHIELD 2.0X1.25X1.0 MM - R/TP TAIYO
L7501 Wound,Chip
YUDEN CO.,LTD
R3208
ROHM.
R5306
CL21A475KACLRNC 4.7uF -10TO+10% 25V X5R -

Capacitor,Ceramic,
6 C4168 ECCH0042302 55TO+85C 2012 R/TP 0.85+-0.1 - SAMSUNG
Chip
Connector,Termina HSBC-4P25-39F1 4P 2.50MM STRAIGHT DIP

6 CN9100 EAG63749801
l Block T/REEL - HAN SHIN TERMINAL CO., LTD.
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM

6 ELCH0001430 1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
L9911 Chip
TOKO, INC.
R4110 RC0201JR-0722RL 22OHM 5% 1/20W 0603 R/TP -

6 Resistor,Chip EBC61856101
R5107 YAGEO CORPORATION
WCD9302 999 999W WLCSP R/TP 55P MSM8226

6 U6100 IC,Audio Codec EAN62691301 Reference QCT CODEC QUALCOMM
INCORPORATED.
C6613
R2214 ROHM.
R6613
WTR1625L WTR1625L 2G/3G/4G
GSM/GPRS/EDGE,1X, 1xEV-DO ,WCDMA , TD-
IC,RF
6 U1500 EAN62697301 SCDMA , HSPA+/DC-HSPA+ , LTE (FDD) ,TD-LTE,
Transceiver,4G
164pin CSP R/TP 164P QUALCOMM
INCORPORATED.
R5300
R5301
R5302
R6615
R6920
6 Wire Pad,Short SAFP0000401 AX3100 ATL SV_SHIPBACK,MAIN,A
R6921
R7600
R9100
R9101
R9511
LQP03TN3N3B02D 3.3NH 0.1NH - 450mA - -

C1305 Chip
D10006 ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528

6 Diode,TVS EDTY0009101
ZD8803 R/TP 2P 1 ON SEMICONDUCTOR
D5202 0DBM 0DB 0% 0A 0A 0DB 0DBM 0DBM 26P

Module, FEM(Front
6 U1100 EAT62293101 4.0x3.0x1.0MM Div FEM for WTR1625
End Module)
CA(B1/2/3/5/7/8/20) EPCOS PTE LTD.
BLM15AX102SN1D_ 1000 1.0x0.5x0.5 25% 0.49

FB6609
6 Filter,Bead EAM62630901 0.35 SMD R/TP 0P - MURATA MANUFACTURING
FB6610
CO.,LTD.
ACMD-6307 2655MHz 2620 to 2690MHz 2535MHz

2500 tp 2570MHz 3.0dB 3.5dB 1.6x2.0x0.925 DUAL
6 FL1750 Filter,Duplexer EAM63230001
SMD P/TR 9P AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED
MCR006YZPF2003 200KOHM 1% 1/20W 0603

R/TP - ROHM.
SKY77629-21 3.0 to 4.5V 0 0 0W 0W 0 0 SMD R/TP

6 U1300 IC,Power Amplifier EAN62792001 42P 7*5size, MMPA for MSM8974, MIPI, APT
SKYWORKS SOLUTIONS INC.
L4132 TFM201610GHM-1R0MTAA 1UH 20% - 3A 3.6 3

Inductor,Wire
6 L4133 EAP62526501 0.06OHM - - SHIELD 2.0X1.6X1.0 MM - R/TP TDK
Wound,Chip
L4135 KOREA COOPERATION
MPZ1608S102A 1000 1.6x0.8x0.8 25% 0.3 0.8 SMD

6 FB6100 Filter,Bead EAM62870101
R/TP 2P - TDK CORPORATION
LG HK 0603 6N8J-T 6.8NH 5% - 250mA - -

6 C1703 EAP62227601 0.39OHM 3.9GHZ 5 SHIELD - 0.6X0.3X0.3MM R/TP
Chip
TAIYO YUDEN CO.,LTD
R8954 MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP -

R8955 ROHM.
GRM033R61A562KA01D 5.6nF 10% 10V X5R -

Capacitor,Ceramic,
Chip
LQP03TG1N2C02D 1.2NH 0.2NH - 600mA - -

Chip
R2101 RC0201FR-07240RL 240OHM 1% 1/20W 0603

6 Resistor,Chip EBC61856201
R2103 R/TP - YAGEO CORPORATION
COMPLEX LGLS720.ASPRTS ZZ:Without Color PID

6 PID1 Label MEZ65049701
label
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C

Capacitor,Ceramic,
Chip
CO.,LTD.
MSM8926-2 784 pNSP, Quad CA7 1.2GHz,28nm

IC,Digital LP,12x12 PoP,1x600MHz LPDDR3, CAT4(no CA),
6 U2100 Baseband EAN62928201 HSPA+(42/11Mbps),TD-
Processor,4G SCDMA,1080p@30fps,Adreno 305 NSP R/TP 784P
QUALCOMM INCORPORATED.
GU077-5P-NT-E1500 5P 0.65MM ANGLE

6 CN10001 Connector,I/O EAG63231601 RECEPTACLE DIP R/TP Reverse Offset LS Mtron
Ltd.
LG HK 0603 15NJ-T 15NH 5% - 180mA - - 0.71OHM

6 L1214 EAP62246301 5HZ 2.3G SHIELD - 0.6X0.3X0.3MM R/TP TAIYO
Chip
YUDEN CO.,LTD
LQP03TN2N0C02D 2NH 0.2NH - 600mA - -

6 EAP61866901 0.15OHM 6GHZ 14 SHIELD 0 0.6X0.3X0.3MM R/TP
L1754 Chip
MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP

- ROHM.
16-219ASURC/S1230/TR8(LM) RED 2.35V 25mA

6 LD8951 LED,Chip EAV61915501 45mcd 633.5nm 60mW 1005 R/TP 2P -
EVERLIGHT ELECTRONICS CO., LTD.
LG HK 0603 8N2J-T 8.2NH 5% - 230mA - -

Chip
TAIYO YUDEN CO.,LTD
ACMD-6103-TR1 1842.5MHz 1805to1880MHz

1747.5MHz 1710to1785MHz 1.6typ/4.0max
6 FL1203 Filter,Duplexer EAM62632601 1.5typ/3.5max 2.0x1.6x0.9t DUAL SMD R/TP 9P
AVAGO TECHNOLOGIES INTERNATIONAL SALES
PTE. LIMITED
LQP03TN10NH02D 10NH 3% - 250mA - - 0.7OHM

Chip

Chip
CL05A225MP5NSNC 2.2uF 20% 10V X5R -

6 ECCH0007804 55TO+85C 1005 R/TP 0.5MM - SAMSUNG
C1763 Chip
C1005X5R1E104K 0.1uF 10% 25V X5R -55TO+85C

Capacitor,Ceramic,
6 C4145 EAE62685201 1005 R/TP 0.55T max. TDK KOREA
Chip
COOPERATION
GRM0335C1E1R0C_H 1pF 0.25PF 25V C0G -

L1127 Capacitor(High
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03
W:0.3+-0.03 T:0.3+-0.03 MURATA
L1323 c,Chip
KDS160ERTK/H 1.2V 85V 300mA 2A 4NSEC

6 ZD4130 Diode,Switching EDSY0019201
150mW ESC R/TP 2P 1 KEC CORPORAITION
GRM0335C1E8R0D_H 8pF 0.5PF 25V C0G -

Capacitor(High
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03
W:0.3+-0.03 T:0.3+-0.03 MURATA
c,Chip
DW8755A 2.7V to 5.3V Pos. Vout: 4.6V to 6.0 V

IC,DC,DC (0.1V Step) / Neg. Vout: -4.6V to -6.0V (0.1V Step)
6 U7500 EAN63409101
Converter 0W WLCSP R/TP 12P 1.30x1.53x0.45 mm
DONGWOON ANATECH CO.,LTD.
C5201 CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -

Capacitor,Ceramic,
6 C5215 ECZH0004402 30TO+85C 1005 R/TP - - SAMSUNG ELECTRO-
Chip
Q8950 KTC4075E NPN 5V 60V 50V 150mA 100NA 700

6 TR,Bipolar EQBN0020501
Q8951 100mW ESM R/TP 3P KEC CORPORAITION
C1323 LG HK 0603 1N2S-T 1.2NH 0.3NH - 450mA - -

Chip
L1753 TAIYO YUDEN CO.,LTD
TCPCF0J226MJAR0300 22uF -20TO20% 6.3V

C4172 Capacitor,TA,Poly 27.7UA -55TO+105C 0.3OHM 1.6X0.8X0.9MM
6 EAE63284001
C4941 mer NONE SMD R/TP Max 1T SAMSUNG ELECTRO-
MECHANICS CO., LTD.

6 EAP62108601 2.5GHZ 9 SHIELD - 0.6X0.3X0.3MM R/TP
L1507 Chip
C2308
C2362 CL05A475MP5NRNC 4.7uF 20% 10V X5R -
Capacitor,Ceramic,
6 C4940 EAE62506501 55TO+85C 1005 R/TP - - SAMSUNG ELECTRO-
Chip
C5144
ACPM-9307-TR1 3.2V to 4.5V 0 0 0W 0W 0 1 SMD
R/TP 10P Band7, 2520size, MIPI, APT AVAGO
6 U1751 IC,Power Amplifier EAN62867801
TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED

Chip
TLV70728PDQNR V2 to V5.5 V2.8 0W QFN R/TP

IC,LDO Voltage
6 U4190 EAN62669801 4P - TEXAS INSTRUMENTS KOREA LTD,
Regulator
HONGKONG BRANCH.
C2320 Capacitor,Ceramic, C0603X7R0J223KT 22nF 10% 6.3V X7R -

6 ECCH0009110
C2356 Chip 55TO+125C 0603 R/TP - - TDK CORPORATION
LDJ18829M24AD011 1.6x0.8x0.7t SMD COUPLER

FL1100 Coupler,RF 1694MHz 1992MHz (698~2690MHz) SMD R/TP
6 ECA30240001
FL1103 Directional 22.4 to 25.7 0.16 26 - MURATA MANUFACTURING
CO.,LTD.
MCR006YZPJ121 120OHM 5% 1/20W 0603 R/TP -

ROHM.
MIPSZ2016DR24FHS 240NH 20% - 4A 4 4

6 EAP62545901 0.022OHM 0HZ - SHIELD - 2.0X1.6X1.0 MM R/TP
L4131 Chip
FDK CORPORATION.
GRM033R71C222K 2.2nF 10% 16V X7R -

Capacitor,Ceramic,
6 C2381 ECCH0009107 55TO+125C 0603 R/TP - - KOREA MURATA
Chip
ELECTRONICS CO. LTD.
LQP03TG1N0C02D 1NH 0.2NH - 600mA - -

Chip
RC0603F363CS 36KOHM 1% 1/20W 0603 R/TP -

SAMSUNG ELECTRO-MECHANICS CO., LTD.
MCR01MZP5F2000 200OHM 1% 1/16W 1005 R/TP

- ROHM.
GRM1555C1HR50B_H 0.5pF 0.1PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
W:0.5+-0.05 T:0.5+-0.05 MURATA
c,Chip
MCR01MZP5F3000 300OHM 1% 1/16W 1005 R/TP

- ROHM.
MCR006YZPF51R0 51OHM 1% 1/20W 0603 R/TP -

ROHM.
GRM033R60J473KE19D 47nF 10% 6.3V X5R -

C2357 Chip
R1501 MCR006YZPJ331 330OHM 5% 1/20W 0603 R/TP -

R1502 ROHM.
ANT10060
ANT10061
ANT10062 2108610-5 1P ANT TERMINAL STRAIGHT SMD
6 ANT1102 C-Clip EAG63652301 T/REEL AU 2.9X1.0X1.4(L X W X H) SERVEONE
ANT1103 CO., LTD.
ANT1104
ANT1105
IC,Hall Effect BU52061NVX Hall IC 1.2X1.6 SSON R/TP 4P -

6 U8700 EAN62682901
Switch ROHM Semiconductor KOREA CORPORATION
C4169
CL10A106MO8NQNC 10uF -20TO20% 16V X5R -
6 EAE62843001 55TO+85C 1608 R/TP 0.8+-0.15 - SAMSUNG
C7501 Chip
C7502
TFM201610GHM-2R2MTAA 2.2UH 20% - 1.9A 2.4

Inductor,Wire
6 L4134 EAP62526601 1.9 0.152OHM - - SHIELD 2.0X1.6X1.0MM - R/TP
Wound,Chip
TDK KOREA COOPERATION
SN74AUP1T97DSFR 0~3.6V 0.000004 LEVEL

SHIFTER SON-6 R/TP 6P Configurable Gate Logic
6 U8950 IC,Gate EAN62415501
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
MCR01MZP5F1503 150KOHM 1% 1/16W 1005

R/TP - ROHM.
X1E0002910001 19.2MHZ 10PPM 7F - SMD R/TP

6 X4100 Crystal EAW61883401
EPSON TOYOCOM CORP
GRM0335C1E1R5CD01D+A02 1.5pF 0.25PF 25V

Capacitor,Ceramic,
6 C5148 ECCH0009502 NP0 -55TO+125C 0603 R/TP - MURATA
Chip
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

6 ECCH0004904 1005 R/TP - MURATA MANUFACTURING
C5129 Chip
CO.,LTD.
C2318
C2322
Capacitor,Ceramic, C0603X7R1C103KT 10nF 10% 10V X7R -
6 C2325 ECCH0009106
C2326
C2360
L6450
LQW18AN82NG00D 82NH 2% - 250mA 0.6OHM
L6451 Inductor,Wire
6 ELCH0003806 2KHZ 34 NON SHIELD 1.6X0.8X0.8MM - R/TP
L6611 Wound,Chip
L6612
B8633 806.0MHz 791.0to821.0MHz 847.0MHz

832.0to862.0MHz 1.90/3.20dB 1.80/2.50dB
6 FL1700 Filter,Duplexer EAM63130401
2.0x1.6x0.47t DUAL SMD R/TP 9P EPCOS PTE
LTD.
C5207
C1005X5R1A105KT000F 1uF 10% 10V X5R -
C5220 Chip
COOPERATION
C5222
EDZVT2R5.1B 4.98V 4.98TO5.2V 80OHM 150mW

6 D9100 Diode,Zener EDNY0013602 EMD2 R/TP 2P 1 ROHM Semiconductor KOREA
CORPORATION
MCH155A510JK 51pF 5% 50V NP0 -55TO+125C

6 ECCH0000123 1005 R/TP - - ROHM Semiconductor KOREA
C5213 Chip
CORPORATION
SSM6N57NU N-CHANNEL MOSFET 30V +-12 4A

6 Q4100 FET EBK62031701 0.063OHM 1W DFN R/TP 6P TOSHIBA
R10063
R10064 MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP
R10067 - ROHM.
R10068
Filter,Separator,Swi RF1635 0 0 32dBm TDD-LTE Tx/Rx RF MICRO

6 FL1102 EAM62634001
tch DEVICES INC
HK0603 18NH-T 18NH 3% - 140mA - - 1.05OHM

6 L1210 EAP61987001 2.3GHZ 21 SHIELD 0 0.6X0.3X0.3MM R/TP TAIYO
Chip
YUDEN CO.,LTD
GRM188R61H225K 2.2uF -10TO+10% 50V X5R -

C4163 Capacitor,Ceramic, 55TO+85C 1608 R/TP Max 1.0T L:1.6+-0.2 W:0.8+-
6 EAE63541901
C4183 Chip 0.2 T:0.8+-0.2 MURATA MANUFACTURING
CO.,LTD.
MCR01MZP5F1003 100KOHM 1% 1/16W 1005

R/TP - ROHM.
C1211 LQP03TN3N0B02D 3NH 0.1NH - 450mA - -

6 L1114 EAP61767701 0.25OHM 6GHZ 14 SHIELD NONE 0.6X0.3X0.3MM
Chip
L1226 R/TP MURATA MANUFACTURING CO.,LTD.
MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -

ROHM.
R4106 MCR006YZPF1003 100KOHM 1% 1/20W 0603

R4115 R/TP - ROHM.
NTCG104EF104FT 100KOHM 1% 35V 35A 4.25MK

6 PT1100 Thermistor,NTC EBG61306601
SMD R/TP - TDK CORPORATION

R4146 ROHM.
RF7920 3.0V to 4.35V 0 0 0W 0W 0 1 SMD R/TP

6 U1701 IC,Power Amplifier EAN62868001 10P 2520size, Band20, MIPI, APT, w/o CPL RF
MICRO DEVICES INC
H9TKNNN8JDAPLR-NGH 8GBIT LPDDR2

6 U3100 IC,Mobile SDRAM EAN62949701 1.14VTO1.3V 533MHz 5500ns FBGA TR 168P -
HYNIX SEMICONDOCTOR
GRM033R60J333KE01D+A01 33nF 10% 6.3V X5R -

Capacitor,Ceramic,
Chip
MCR006YZPJ150 15OHM 5% 1/20W 0603 R/TP -

ROHM.
MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP -

ROHM.
VA7200
VA7201
ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD
6 VA7202 Varistor SEVY0005402
R/TP INNOCHIPS TECHNOLOGY
VA7203
VA7204
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -

ROHM.
GRM033R61A472K 4700pF 10% 10V X5R -

Capacitor,Ceramic,
Chip
R2219
R2221 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP
R2223 - ROHM.
R4130
GRM0335C1E4R7C_H 4.7pF 0.25PF 25V C0G -

Capacitor(High
55TO+125C 0603 R/TP 0.3+-0.03 L:0.6+-0.03
W:0.3+-0.03 T:0.3+-0.03 MURATA
c,Chip
D8900
VA7303 ICVL0505101V150FR 5.6V 0% 100pF 1.0*0.5*0.55
VA7400 NONE SMD R/TP INNOCHIPS TECHNOLOGY
VA7406
LMSW54GM-G20 0DBM 0DB 0% 0A 0A 0DB 0DBM

6 FL1201 Module,Rx Module EAT61975801 0DBM 40P 5.0x4.0x1.0MM CA FEMiD for WTR1625
SIA929DJ P-CHANNEL MOSFET -30V +-12 -4.5A

6 Q4101 FET EBK62032201 0.12OHM 1.2W DFN R/TP 6P VISHAY
INTERTECHNOLOGY ASIA PTE LTD
BA891_ 1V 35V - - 0SEC 715mW SOD523 R/TP 2P

6 D9910 Diode,Switching EAH61532901
1 NXP Semiconductors
5 SAD010000 Software,Mobile SAD34684701 Android KK Base D72210a - EUROPE QCT -
Software Assembly,
1 SAF010100 SAF30480001 LGD722V.AVD2TN KK -
Common
Software,
2 SAD010100 SAD34764701 Windows KK - PCSuiteV - - EUROPE - -
Application
Software,USB
2 SAD010500 SAD34785101 Windows -
Driver
2 SAD010600 Software,OSP SAD34764801 Windows Windows KK - -
12.3 Accessory Note: This Chapterisused for reference,Part order is ordered

by SBOM standard onGCSC
BL-54SH-WW-LGC 3.8V 2.46AH 490mAH 49*65*5.5

Rechargeable
2 EAC00 EAC62018201 49*68*5.8 BLACK Topcap BL-54SH, 554965,
Battery,Lithium Ion
2460mAh, LGC, WW, Bartype LG Chem,LTD.
PRINTING LGD722V.AVD2TN ZZ:Without Color

2 MFL053800 Manual,Operation MFL68581401
Germany GERMAN -
Card,Quick
2 MBM062600 MBM64636501 PRINTING LGD722V.AVD2TN ZZ:Without Color -
Reference
MCS-02ER_EAC 90Vac~264Vac 4.75Vdc~5.25Vdv

2 EAY060000 Adapters EAY62709907 850mA 50/60Hz CE WALL 2P USB - SUNLIN
ELECTRONICS CO.,LTD
LG0108 USB USB 1.0M 4 BLACK UL N ningbo

2 EAD010000 Cable,Assembly EAD62377902
broad telecommunication co.,ltd
HC-MYD-LG127 20mW 16OHM 115DB

2 EAB010200 Earphone,Stereo EAB62209201 20HZTO20KHZ 1.1M BLACK 3.5 L TYPE STEREO
4POLE PLUG OPEN TYPE I-SOUND CO,LTD

Diagrama Celular LG-D722V

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Internal Use Only

Date: August, 2014 / Issue 1.0

E. Notice of Radiated Emission

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

ENHANCED USER EXPERIENCE

• 8MP AF with flash, 1.3MP VT CMOS Image sensor and Camcorder*

TOOLS & DATA

• Technology: GSM/ WCDMA /LTE/GPS/BT/WiFi

Support Band TX Freq (MHz) RX Freq (MHz)

GSM850 824-849 869-894

GSM900 880-915 925-960

DCS1800 1710-1785 1805-1880

W2100(B1) 1920-1980 2110-2170

W850(B5) 824-849 869-894

LTE B1 1920-1980 2110-2170

LTE B3 1710-1785 1805-1880

LTE B7 2500-2570 2620-2690

LTE B20 832-862 791-821

BT/WiFi 2400 MHz ~ 2483.5 MHz

GPS 1574.42 MHz ~ 1576.42 MHz

• Data Transmission: EDGE, GPRS (Class 33) , HSPA+(Cat. 24), LTE(Cat 4)

LG-D722v Product SPEC

LG-D722v Product SPEC

SIM card type Micro SIM(3FF) 3V /1.8V

Main LCD : TFT LCD

System connector 5 Pin u-USB

Ear Phone Jack 3.5 pi type

Speech coding FR, EFR, HR,AMR

LG-D722v Product SPEC

Vibrator Built in Vibrator

Blue Tooth Bluetooth 4.0 + BLE

Music Player MP3/WMA/AAC/MIDI/EAAC+/HEAAC/OGG

Video Player MPEG4, H.264

Camcorder MPEG4 or H.263

Voice Recording Yes

Stereo Headset Yes

Data Cable Yes

LG-D722v Product SPEC

LG-D722v Product SPEC

Band1 : 1920 – 1980 MHz

Maximum Output Power +24dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Normal Conditions : within ±9 dB,

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage > 33 dB @ ±5 MHz,

Power Ratio (ACLR) > 43 dB @ ±10 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

LG-D722v Product SPEC

LG-D722v Product SPEC

Error Vector Magnitude when < 17.5 %, when

Peak Code Domain Error < -15 dB at Pout  -20 dBm

Item Band1 : 2110 – 2170 MHz

Spurious Emissions & Iouw2-57

LG-D722v Product SPEC

group(10equal command group)

4) HSDPA transmitter specification

LG-D722v Product SPEC

Band20 : 832 - 862 MHz

Frequency Error within ±0.1 PPM

Peak Code Domain Error < -31 dBc @ 5dBMHz

7)LTE receiver specification