Академический Документы
Профессиональный Документы
Культура Документы
Service Manual
FM300
4. TROUBLE SHOOTING���������������������������������������������������������� 24
4.1 Power on Trouble – 3.3V Main power������������������������������������������� 24
4.2 Power on Trouble – BCM Booting Trouble���������������������������������� 27
4.3 Power on Trouble – 3.75V LTE power�������������������������������������������� 31
4.4 SIM card Trouble������������������������������������������������������������������������������������ 35
4.5 Power LED Indication Trouble���������������������������������������������������������� 41
4.6 Ethernet LED Indication Trouble����������������������������������������������������� 43
4.7 RGB LED Indication Trouble�������������������������������������������������������������� 45
4.8 USB Connection Trouble�������������������������������������������������������������������� 47
4.9 Ethernet Connection Trouble����������������������������������������������������������� 52
4.10 LTE RF Component (Primary)��������������������������������������������������������� 55
4.11 LTE VCXO Trouble�������������������������������������������������������������������������������� 56
4.12 LTE Tx Trouble��������������������������������������������������������������������������������������� 58
4.13 Power on Trouble – LTE Booting Trouble���������������������������������� 60
4.14 Memory Trouble shooting�������������������������������������������������������������� 64
5. DOWNLOAD������������������������������������������������������������������������� 67
6. BLOCK DIAGRAM����������������������������������������������������������������� 73
7. CIRCUIT DIAGRAM�������������������������������������������������������������� 74
9. PCB LAYOUT������������������������������������������������������������������������� 86
LGE Internal Use Only -- Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features
of this model.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the this phone or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.
LGE Internal Use Only -- Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
LGE Internal Use Only -- Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
ACS Adjacent
j Channel Selectivityy
BB Baseband
BS Base Station
CP Cyclic Prefix
CW Continuous Wave
DCS Di it l C
Digital Communication
i ti SSystem
t
DL Downlink
LGE Internal Use Only -- Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
IF Intermediate Frequency
LGE Internal Use Only -- Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
RF Radio Frequency
RS Reference Signal
TA Travel Adapter
UE User Equipment
UL Uplink
LGE Internal Use Only -- Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. PERFORMANCE
2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Ch i time
Charging ti N use external
No: t l power adapter
d t
ANT External
LGE Internal Use Only -- Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. PERFORMANCE
It
Item S
Specification
ifi ti
E-UTRA Band 20
Transmit Frequency
832MHz ~ 862MHz
UTRAACLR1 33 dB
d
UTRAACLR2 36 dB
BW Channel 10 MHz
LGE Internal Use Only -- Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. PERFORMANCE
Item Specification
Measurement
Frequency Range Maximum Level
Bandwidth
LGE Internal Use Only - 10 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. PERFORMANCE
It
Item S
Specification
ifi ti
Reference Sensitivity Level Maximum throughput >=95% when Îor = -94 dBm / 10 MHz (Single)
Maximum throughput >=95% when Îor = -97 dBm / 10 MHz (Dual)
Maximum
a u Input
put Level
e e Maximum
a u throughput
t oug put >=95%
95% when
e Îor = -25
5 dB
dBm (at each
eac antenna
a te a port)
po t)
Spurious Emissions < -57 dBm / 100 kHz @ 30MHz ≤ f < 1 GHz
< -47 dBm / 1 MHz @ 1 GHz ≤ f ≤ 12.75 GHz
LGE Internal Use Only - 11 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 MAIN
3.1.1 Network Processor (BCM5358U, U200)
The Broadcom® BCM5358U processor is the highest performance chip in the Intensi-fi® XLR processor family.
Integrating a powerful 533 MHz MIPS32® 74KTM core with a four-way set associative 32 KB instruction cache,
a 2-way set associative 32 KB data cache, and a 64-entry TLB, the BCM5358U offers significant performance
improvements in both transfer rates and CPU utilization.
Flexible support for a variety of system bus interfaces is provided,
provided including one USB 2.0
2 0 EHCI (OHCI 1.0
1 0 support)
host port, one USB HSIC port , 16-bit DDR400 memory control, serial Flash port . There are shared GPIOs with
other functions on the BCM5358U processor. All inputs can be used to generate processor interrupts. The
sections below describe each major functional block in more detail.
The BCM5358U has a 5-port, non-blocking 10/100 Ethernet switch. Any of the five ports can be configured as
the WAN port, with the other four being LAN ports. Each port can be programmed to support four-level priority
queues for quality of service (IEEE 802.1p QoS). IEEE 802.1q VLAN, IGMP snooping, and IP DiffServ/ToS are also
supported. The MAC is IEEE 802.3u
802.3u™ compliant and supports a frame size up to 1536 bytes.
General:
• IEEE 802.11n-compliant.
• Integrated 2.4 GHz radio.
• Internal PAs capable of Pout > 18 dBm (G band).
• Simultaneous dual-band support with additional MAC/PHY/Radio (e.g., BCM43236).
• 2-stream spatial multiplexing up to 200 Mbps.
• Supports 2 Ý 2 and optional diversity with 3 antennas.
• Supports MCS 0 – 15 and MCS 32 modulation and coding rates in 802.11n.
• Supports 20 MHz and 40 MHz channels with optional SGI.
• Support for STBC in both TX and RX.
• Full IEEE 802.11b/g legacy compatibility with enhanced performance.
• Advanced MIPS32® 74KTM Core:
- 32 KB I-cache, 32 KB D-cache
- CPU can run up to 533 MHz/960 DMIPs
• MMU/TLB support for Linux®.
• Five-port integrated 10/100BASE-TX IEEE 802.3u™ compliant Auto-MDIX transceivers and LAN/WAN switch
controller.
• Advanced Ethernet MAC (BCM5358 only):
- MII PHY interface.
- Supports external 10/100 switch, such as the BCM5325E.
• One USB 2.0 host port plus one 480 MHz HSIC port
• 16-bit DDR400 support
pp up p to 2 Gbit capacity.
p y
• Supports serial Flash up to 16 MB.
• UART and JTAG interface, up to 32 GPIOs.
• BCM5358U package: 15 mm Ý 15 mm 366-pin TFBGA
LGE Internal Use Only - 12 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF
The MT46V16M16P-6TIT is a 256Mb Double Data Rate(DDR) SDRAM. The DDR SDRAM uses a double data rate
architecture to achieve high-speed operation. The double data rate architecture is essentially a 2n-prefetch
architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or
write access for the DDR SDRAM effectively consists of a single 2n-bit-wide, one-clockcycle
data transfer at the internal DRAM core and two corresponding n-bit-wide, onehalf-clock-cycle data transfers at
the I/O pins.
• VDD = +2.5V
+2 5V ·0.2V,
·0 2V VDDQ = +2.5V
+2 5V ·0.2V
·0 2V
• VDD = +2.6V ·0.1V, VDDQ = +2.6V ·0.1V (DDR400)
• Bidirectional data strobe (DQS) transmitted/received with data, that is, source-synchronous data capture
(x16 has two – one per byte)
• Internal, pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; centeraligned with data for WRITEs
• DLL tto align
li DQ and d DQS transitions
t iti with
ith CK
• Four internal banks for concurrent operation
• Data mask (DM) for masking write data (x16 has two – one per byte)
• Programmable burst lengths (BL): 2, 4, or 8
• Auto refresh
– 64ms, 8192-cycle(Commercial & Industrial)
– 16ms, 8192-cycle (Automotive)
• Self refresh (not available on AT devices)
• Longer-lead
L l d TSOP for
f improved
i d reliability
li bili (OCPL)
• 2.5V I/O (SSTL_2-compatible)
• Concurrent auto precharge option supported
• 66-pin TSOP (Pb-free) (22.22mm x 11.76mm x 1.2mm)
CKE DQ0-DQ15
CK#
CK LDQS
CS#
256Mb UDQS
WE#
CAS#
DDR1 SDRAM
RAS# Memory LDM
A0-A12 UDM
BA0,BA1
LGE Internal Use Only - 13 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF
The N25Q128 is a 128 Mbit (16Mb x 8) serial Flash memory, with advanced write protection mechanisms.
It is accessed by a high speed SPI-compatible bus and features the possibility to work in XIP (“eXecution in
Place”) mode.
The N25Q128 supports innovative, high-performance quad/dual I/O instructions, these new instructions allow
to double or quadruple the transfer bandwidth for read and program operations.
LGE Internal Use Only - 14 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF
For the generation of the reference frequency for BCM5358U an external Crystal unit is used.
The XTAL ground is separated from main ground for reducing noise. It is used for the various clocks,
including the clock for the 10/100 MAC core (25 MHz) and the MIPS32 74K, UART, and USB 2.0 host in
BCM5358U.
20MHz CRYSTAL
R406 0
XTAL_IN
X400
CXC3X200000GHVRG00
4 3 R407
GND2 HOT2 XTAL_OUT
220
1 2
HOT1 GND1
XTAL_GND
FB401 FB400
600 600
GND
LGE Internal Use Only - 15 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF
This SIM interface is placed in main board, but is connected with LTE module. Also it is controlled and
detected from LTE module. It is the push-push type SIM socket. SIM interface scheme is shown in figure.
SIM Interface
SIM_CLK : SIM card reference clock
SIM_RST : SIM card Async /sync reset
SIM_DATA : SIM card data
SIM_PWR : SIM card power source
LTE_USIM_DET/ : SIM card detection to LTE Module
NP_USIM_DET/ : SIM card detection to BCM5358U ( It is optional. Not used )
ENSY0023001
S300 SCGC1B0100
R348
G5 G3 G1 COMMON SIM_PWR
4.7K
8 TP302
R350 0
7 SIM_DATA
R351 DNI
6
5 TP303 C349
4 DNI
SIM_CLK 3
SIM_RST/ 2
SIM_PWR 1
R307 0
G6 G4 G2 SW NP_USIM_DET/
C339 C340 C341 C342 R308 0
0.1u 100p 33p 33p LTE_USIM_DET/
C350
DNI
R306
1K
VDD_3.3
LGE Internal Use Only - 16 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF
This Ethernet Interface is connected to the outside device through the RJ-45 connecter.
And the Ethernet signals from the connecter go into the transformer with the function which is line impedance
matching of Ethernet port.
This transformed impedance required the differential 100ohm for the Main chipset (BCM5358U).
The Ethernet signals go from the transformer to BCM5358U which is the Main chipset.
Ethernet Interface
PORT1_TDP : Plus signal of Ethernet transmit pair.
PORT1_TDN : Minus signal of Ethernet transmit pair.
PORT1_RDP : Plus signal of Ethernet receive pair.
PORT1_RDN : Minus signal of Ethernet receive pair.
VDD_2.5
R133 0 1 14
PORT1_TDP 2
TD+ TX-
15 C127 1n P1_TDN
FB100 220 R134 75
V_CTR1 CM2
R135 0 3 16
PORT1_TDN 6
TD- TX+
11
P1_TDP
R137 0
PORT1_RDP RD+ RX+ P1_RDP
R136
7 10
0
U104
V_CTR2 CM1
R138 0 8 9
PORT1_RDN RD- RX- P1_RDN
4 13
NC1 NC4
5 12
NC2 NC3
ELCP0009412
TLA-6T118LF
CN101
G1 G3
9
1
P1_RDP 2
P1_RDN 3
P1_TDP C137 1n 4
R146 75
5
6
P1_TDN C138 1n 7
R148 75
8
G2 G4
10
R150
R151
0
ENZY0030801
85507-5001
LGE Internal Use Only - 17 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF
R102 100K
R 10
47K
VDD_3.3
28
27
26
25
24
23
22
29
Power LED(White)
ENL
TON
AGND2
EN/PSV
LXS
ILIM
PGOOD
AGND3
30 L100
VIN5
21
LX3
1 20 2.2u
FB LX2
2 19 67-21-L9C-W4556W1X1B2-2T
V5V PGND6 C101 C102 C104
19.1K
C9 LD100
3 U2 18 R104
R2
DNI
6 15 C110
VLDO LX1
7 C12 DNI
BST
PGND1
PGND2
LXBST
31
R110
47p
LX4
VIN1
VIN2
VIN3
VIN4
C8
2.2u
8
9
10
11
12
13
14
16K
R6
3
R114 2 Q100
PWR_LED UMT2222A
C4 1u 1K
1 EQBN0005301
C15
C116
10u
DNI
NP_EN
C115
DNI
4
VA100
SPPH410100
ESPY0001701
CN102
1
3
DNI
R13 DNI
R103 100K
4 7K
R9
VDD_3.75
28
27
26
25
24
23
22
29
ENL
TON
AGND2
EN/PSV
LXS
ILIM
PGOOD
AGND3
30 L101
VIN5
21
LX3
1 20 2.2u
FB LX2
2 19
V5V U1 PGND6 C119 C120 C105
19.1K
C10
3 18
R1
EUSY0369702
100n 1u 5 16 DNI 0.1u
VIN PGND3
6 15
VLDO LX1
7 C11
BST
PGND1
PGND2
LXBST
31 47p
LX4
VIN1
VIN2
VIN3
VIN4
C7
2.2u
8
9
10
11
12
13
14
30K
R5
C5 1u
C14 C13
10u 10u
LTE_EN
C126
0
R123
10K
DNI
R 124
3
LTE_PWR_EN
2
1
5
Q101
KRX102U
EQBA0000601
LGE Internal Use Only - 18 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF
3.2 LTE(SUB)
3 2 1 LTE Modem (L2000
3.2.1 (L2000, U201)
The L2000 CPU Subsystem consists of an embedded ARM1136JF-S microprocessor and peripherals, which
supports AMBA AHB bus interface(Main-AHB & Sub-AHB).
The peripherals was included the DMA Controller, DDR Controller, L2000 Modem Subsystem, EPI, P-SPI, SMI,
SRAM Controller, Flash Memory Controller, SDIO, USBs, Crypto C ell, Boot ROM, Internal SRAM by AMBA AHB
bus interface and CPU APB Bridge(AHB2APB) which controls SIM, UART0, UART1, GPIO, Timer(TMU, TMOS),
W t hD
Watch Dog Ti
Timer, I2C
I2C, IInterrupt
t tCController,
t ll SYSCSYSC, CPG,
CPG DBG,
DBG b
by AMBA APB b
bus iinterface.
t f
LGE Internal Use Only - 19 - Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. Technical Brief
3. TECHNICAL BRIEF