Service Manual: Internal Use Only

Internal Use Only
Service Manual
LG-A395
Date: April, 2013 / Issue 1.0

Table Of Contents
1. INTRODUCTION�� 3 4.11 Receiver Trouble�� 81
1.1 Purpose��3 4.12 Microphone Trouble�� 83
1.2 Regulatory Information��3 4.13 SIM Card Interface Trouble�� 85
1.3 Abbreviations��5 4.14 KEY backlight Trouble�� 97
4.15 Micro SD Trouble�� 99
2. PERFORMANCE�� 7
4.16 Bluetooth Trouble��102
2.1 H/W Features��7
4.17 FM Radio Trouble��106
2.2 Technical Specification��9
5. DOWNLOAD�� 109
3. TECHNICAL BRIEF�� 14
3.1 Digital Main Processor�� 14 6. BLOCK DIAGRAM�� 129
3.2 Power Management�� 23
7. CIRCUIT DIAGRAM�� 135
3.3 FEM with integrated Power Amplifier Module (RF7182)�� 27
3.4 Clocks�� 29 8. BGA PIN MAP�� 139
3.5 RFSYS of MT6253 (U101)�� 31
9. PCB LAYOUT�� 141
3.6 MEMORY(H9DA1GH25HBMMMR, U100 )�� 33
3.7 SIM Card Interface�� 37 10. ENGINEERING MODE�� 143
3.8 Micro-SD Card Interface�� 41
11. CALIBRATION�� 145
3.9 LCD Interface�� 42
3.10 Battery Charger Interface�� 44 12. HIDDEN MENU�� 165
3.11 Keypad Interface�� 45
13. EXPLODED VIEW & REPLACEMENT PART LIST �� 170
3.12 Audio Front-End�� 47
13.1 EXPLODED VIEW��170
3.13 Camera Interface�� 49
13.2 Replacement Parts��171
3.14 KEY BACLKLIGHT LED Interfac�� 51
13.3 Accessory��185
3.15 Vibrator Interface�� 52
4. TROUBLE SHOOTING�� 53
4.1 RF Component�� 53
4.2 RX Trouble�� 54
4.3 TX Trouble�� 58
4.4 Power On Trouble�� 62
4.5 Charging Trouble�� 64
4.6 Vibrator Trouble�� 67
4.7 LCD Trouble�� 69
4.8 Camera Trouble�� 73
4.9 Speaker Trouble�� 76
4.10 Earphone Trouble�� 78
LGE Internal Use Only -2- Copyright © 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
4 / 131
1. INTRODUCTION
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
5 / 131
1. INTRODUCTION
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
6 / 131
1. INTRODUCTION
1. INTRODUCTION
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
7 / 131
2. PERFORMANCE
2. PERFORMANCE
2. SYSTEM SPECIFICATION
2.1 H/W
H/W Features
Features
Item Feature Comment
Standard Battery Lithium Ion, 3.7V 1500mAh
Stand by TIME >993 hr., Min.@PP9
Stand by time >1145 hr., Min.@PP5
>8.0hr., Min.@GSM900, PL=5

>22.0 hr., Min.@GSM900, PL=13
Talk time
>11 hr., Min.@PCS, PL=0
>27 hr., Min.@PCS, PL=9
Charging time Approx. 3 hours 30 min.
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
GSM, EGSM: 32.3dBm(Level 5),

TX output power
DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display MAIN : TFT 320 × 240(QVGA) pixel 262K Color
KEY TOTAL 22EA

Hard icons. Key Pad
Status Indicator Numeric(12EA : 0 ~ 9, #, *) Navigation Key OK Key(5EA)
Menu Key, Clear Key, Send Key, End Key,
SIM Switch Key(5EA)
ANT Internal
EAR Phone Jack Yes(3.5Ø)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
8 / 131
2. PERFORMANCE
Item Feature Comment
Speaker/Receiver 18 x 10 (Speaker & Receiver Dual Mode Assembly)
Travel Adapter Yes
MIDI SW MIDI (Mono SPK)

Camera 1.3M FF
Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported
9 / 131
2. PERFORMANCE
2.2
2.2 Technical
TechnicalSpecification
Specification
Item Description Specification
GSM850 EGSM
TX: 824 ~ 849 MHz TX: 880 ~ 915MHz
RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz
DCS
1 Frequency Band TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
RMS < 5 degrees
2 Phase Error
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM850/EGSM
Level Power Toler. Level Power Toler.
5 33dBm ±2dB 13 17dBm ±3dB

6 31dBm ±3dB 14 15dBm ± 3dB
7 29dBm ±3dB 15 13dBm ± 3dB
8 27dBm ±3dB 16 11dBm ± 5dB
9 25dBm ±3dB 17 9dBm ± 5dB
10 23dBm ±3dB 18 7dBm ± 5dB
11 21dBm ±3dB 19 5dBm ± 5dB
12 19dBm ±3dB
4 Power Level
DCS/PCS
Level Power Toler. Level Power Toler.

0 30dBm ±2dB 8 14dBm ± 3dB
1 28dBm ±3dB 9 12dBm ± 4dB
2 26dBm ±3dB 10 10dBm ± 4dB
3 24dBm ±3dB 11 8dBm ± 4dB
4 22dBm ±3dB 12 6dBm ± 4dB
5 20dBm ±3dB 13 4dBm ± 4dB
6 18dBm ±3dB 14 2dBm ± 5dB
7 16dBm ±3dB 15 0dBm ± 5dB
10 / 131
2. PERFORMANCE
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBc

100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
Output RF Spectrum 6,000 -71

5
(due to modulation)
DCS/PCS
Offset from Carrier (kHz). Max. dBc

100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65

6,000 -73
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm

Output RF Spectrum
6 (due to switching 400 -19
transient) 600 -21
1,200 -21
1,800 -24
11 / 131
LGE Internal Use Only - 10 - Copyright © 2013 LG Electronics. Inc. All right reserved.
2. PERFORMANCE
DCS/PCS
Offset from Carrier (kHz). Max. dBm

Output RF Spectrum
400 -22
6 (due to switching
transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
8 Bit Error Ratio
DCS,PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy ±3 dB
10 SLR 15±3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2±3 dB
12 / 131
2. PERFORMANCE
Frequency (Hz) Max.(dB) Min.(dB)

100 - -
200 0 -
300 0 -11
500 0 -10
13 Receiving Response 1,000 0 -9
3,000 0 -13
3,400 0 -
4,000 0
* Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.
14 STMR > 8 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)

-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
System frequency
18 ≤ 2.5 ppm
(13 MHz) tolerance
19 32.768KHz tolerance ≤ 30 ppm
At least 67 dBspl under below conditions:

20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 100 cm
13 / 131
2. PERFORMANCE
Fast Charge : Typ. 700 mA

21 Charge Current Slow Charge : Typ. 400mA
Total Charging Time : < Approx. 3 hours 30min.
Bar Number Power
4 over -91dBm±2dBm
4 -> 3 -91dBm±2dBm
3 -> 2 -99dBm±2dBm
22 Antenna Display
2 -> 1 -103dBm±2dBm
1 -> 0 -105dBm±2dBm
Battery Bar Number Voltage

3 ≥ 3.75± 0.05 V
23 Battery Indicator 3 -> 2 3.75 ± 0.05 V
2 -> 1 3.65 ± 0.05 V
1 -> 0 3.5 ± 0.05 V
≤ 3.5 ± 0.05V (Call), every 1 minute.

Low Voltage Warning
24
( Blinking Bar)
≤ 3.5 ± 0.05V (Standby), every 3 minute.
Forced shut down

25 3.35 ± 0.05V
Voltage
Sustain RTC
26 Over 1 min
without battery
Li-Ion Battery
Standard Voltage = 3.7 V
27 Battery Type
Battery full charge voltage = 4.2 V
Capacity: 1500mAh
Switching-mode charger
28 Travel Charger Input: 1000 ~ 240 V, 50/60 Hz
Output: 5.1 V, 700 mA
14 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Digital Main Processor
Figure. 3.1.1 MT6255 Hardware Block Diagram
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.1 General
• Integrated power management unit, analog baseband and radio circuitry.
• Package:
– 12.1x11.6mm
– 0.5 mm pitch
– TFBGA 354balls, 0.5mm pitch package
3.1.2 MCU Subsystem

• ARM926EJ-STM 32-bit RISC processor
• Java hardware acceleration for fast Java-based games and applets
• High performance multi-layer AHB bus
• Operating frequency : Max. 416MHz with dynamic clock gating
• Dedicated DMA bus with 18 DMA channels
• On-chip boot ROM for Factory Flash Programming
• Watchdog timer for system crash recovery
• 4 sets of General Purpose Timer
• Circuit Switch Data coprocessor
• Division coprocessor
3.1.3 External Memory Interface

• Supports up to 2 external devices
• Supports 16-bit memory components with maximum size of up to 256M Bytes for each bank
• Supports mobile DDR SDRAM and cellular RAM
• Support Flash and SRAM/PSRAM with burst mode
• Support multi-media companion chips with 8/16 bits data width
• Configurable driving strength for memory interface
3.1.4 User Interface

• 8-row x 8-column keypad control with hardware scanner
• Support multiple key press for gaming
• Dual SIM/USIM Controller with hardware T=0/T=1 protocol control
• Real Time Clock(RTC) operating with a low quiescent current power supply
• General Purpose I/Os (GPIOs) available for auxiliary application
• 2 sets of Pulse Width Modulation(PWM) Output
• 15 external interrupt lines
• 2 external channel auxiliary 12 bit A/D converter
3.1.5 Security
• Support security key and 128bit chip random ID
16 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.6 Connectivity
• 3 UARTs with hardware flow control and supports of baud rate up to 921600 bps
• USB 2.0 high speed capability
• Multi Media Card, Secure Digital Memory Card host controller with
flexible I/O voltage power
• Supports SDIO interface for SDIO peripherals as well as WIFI connectivity
• I2S interface for Audio application
• I2C master interface for peripheral management including image sensor.
• SPI master interface for peripheral management including digital TV chip.
3.1.7 Power Management

• Li-ion battery charger
• High efficiency bulk converter for core power and memory power supply with programmable voltage scaling
• 14 LDOs for the power supply of memory card, camera, Bluetooth, RF, SIM card, and other diversified
usage
• Six Open-Drain Output Switches to Supply / control the LED
• LDO type Vibrator
• One NMOS switch to control Keypad LED
• Thermal Overload Protection
• Under voltage Lock out Protection
• Over voltage Protection
• Different levels of power down modes with sophisticated software control enables excellent power saving
performance
3.1.8 Radio Interface and Baseband Front End

• Digital PM data path with baseband front-end
• 96dB dynamic range delta-sigma ADC converts the downlink IF baseband I and Q signals to
digital baseband.
• 10-bit D/A Converter for Automatic Power Control.
• Programmable Radio RX filter with adaptive bandwidth control
• Dedicated Rx filter for FB acquisition
• 6-Pin Baseband Parallel Interface(BRI) with programmable driving strength
• support Multi-band
17 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.9 Voice and Modem CODEC
• Digital tone generation
• Voice Memo
• Noise Reduction
• Echo Suppression
• Advanced Sidetone Oscillation Reduction
• Digital sidetone generator with programmable gain
• Two programmable acoustic compensation filters
• GSM quad vocoders for adaptive multirate(AMR), enhanced full rate(EFR), full
rate(FR), and half rate(HR)
• GSM channel coding, equalization and A5/1, A5/2 and A5/3 ciphering
• GPRS GEA1, GEA2 and GEA3 ciphering
• support GSM/GPRS/EDGE-Rx modem
• Packet Switched Data With CS1/CS2/CS3/CS4 coding schemes
• GSM circuit switch Data
• GPRS/EDGE-Rx Class 12
3.1.10 Voice Interface and Voice Front End

• Two microphone inputs shares one low noise amplifier with programmable gain and automatic gain
control(AGC) mechanism
• Voice power amplifier with programmable gain
• 2nd order Sigma-delta A/D Converter for voice uplink path
• shares D/A Converter for audio playback path
• Supports half-duplex hands-free operation
• Compliant with GSM 03.05
3.1.11 LCD/NAND Flash Interface

• Dedicated Parallel Interface supports 3 external devices with 8_/16-bit NAND flash interface,
8_/9_/16_/18-bit parallel interface, and serial interface for LCM
• supports simultaneous connection to 2 NAND devices
• Built-in NAND Flash Controller with 8-bit ECC for mass storage
3.1.12 LCD Controller

• Supports simultaneous connection to 3 parallel LCD modules, 2 parallel LCD and 1 serial LCD
modules or 1 parallel LCD and 2 serial LCD modules
• Supports LCM format: RGB332, RGB444, RGB565, RGB666, RGB888
• Supports LCD module with maximum resolution up to 800x480 at 18bpp @ 200MHz, 16bit LPDDR1.
480x320 at 18bpp @ 133MHz, 16bit LPDDR1.
• Per pixel alpha channel
• True color engine
• Capable of combining display memories with up to 4 blending layers
18 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.13 Audio CODEC
• Wavetable including GM full set of 128 instruments and 47 sets of percussions
• Advanced wavetable synthesizer capable of generating simulated stereo
• PCM Playback and Record
• Digital Audio Playback
• Supports HE-AAC codec decode
• Supports ASC codec decode
3.1.14 Audio Interface and Audio Front End

• Supports I2S interface
• High resolution D/A Converters for Stereo Audio playback
• Voice band A/D converter with digital MIC input support
• Stereo to Mono Conversion
3.1.15 Camera interface

• YUV422 format image input
• Capable of processing image of size up to 1.3M pixels(Mediatek serial Interface), 3M pixels(w/o
compression) and 5M pixels (with JPEG compression)
• Support panorama
• Support zero shutter delay
3.1.16 JPEG Decoder

• Hardware-accelerated baseline JPEG decoding
• SW based progressive JPEG decoding
• Supports various YUV format, DC/AC Huffman tables, and quatization Tables
3.1.17 JPEG Encoder

• ISO/IEC 10918-1 JPEG baseline mode
• ISO/IEC 10918-2 compliance
• Supports YUV420 formats
• Supports EXIF/JFIF
• Standard DC and AC Huffman tables
• Provides 5 levels of encode quality
19 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.18 Image Data Processing
• Supports Digital Zoom

• Supports RGB and YCbCr image processing
• High throughput hardware scaler. Capable of tailoring an image to an arbitrary size
• Horizontal scaling with bicubic interpolation
• vertical scaling with bicubic interpolation
• Simultaneous scaling for video buffer and display buffer
• YUV and RGB color space conversion
• Boundary padding
• Pixel processing: hue/saturation/intensity/color adjustment, Gamma correction and grayscale/
invert/sepia-tone effects
• Hardware accelerated image editing
• RGB/YCbCr format thumbnail output
3.1.19 MPEG-4/H.263 CODEC

• ISO/IEC 14496-2 simple profile
decode @ level 0/1/2/3
encode @ level 0
• ISO/IEC 14496- 2 advanced simple profile : Decode @ level 0/1/2/3
• ITU-T H.263 profile 0 @ level 40
• Encoder resync maker and HEC
• Supported visual tools for decoder: I-VOP, P-VOP, AC/DC Prediction, 4-MV, Unrestricted MV,
Error Resilience, Short Header
• Error Resilience for decoder : Slice Resynchronization, Data Partitioning, Reversible VLC
• Supported visual tools for encoder : I-VOP, P-VOP, Half-Pel, DC Prediction, Unrestricted MV,
Reversible VLC, Short Header
• Supports encoding motion vector of range up to -64/+63.5 pixels
• HE-AAC decode support
• AAC/AMR/WB-AMR audio decode support
• AMR/WB-AMR audio encode support
• Software Video CODEC
3.1.20 H.264 Decode

• Software Decoder
• ISO/IEC 14496-10 baseline profile :
decode @ level 2. 1
encode @ level 1
• ISO/IEC 14496-10 main/high profile :
decode @ level 2. 1
20 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.21 2D Accelerator
• Supports 32-bpp ARGB8888, 24-bpp RGB888, 16-bpp RGB565, and 8-bpp index color modes
• Rectangle fill with constant or gradient color
• BitBlt : capable with 7 rotation types, ROP4, Mask
• Alpha blending with 7 rotation types, per-pixel alpha and pre-multiplied alpha
• Font caching : normal and italic font
• Linear transform : Support perspective transform, truncate/nearest/bi-linear sample filter
• Command queue with max depth of 1024
21 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.22 Bluetooth Radio Features
• Fully compliant with Bluetooth specification 3.0

• Low out-of-band spurious emissions supports simultaneous operation with GPS and GSM/GPRS/
EDGE-Rx worldwide radio systems
• Low-IF architecture with high degree of linearity and high order channel filter
• Integrated T/R switch and Balun
• Fully integrated PA provides 10dBm output power
• -94dBm sensitivity with excellent interference rejection performance
• Hardware AGC dynamically adjusts receiver performance in changing environments
3.1.23 Bluetooth Baseband Feature

• Up to 4 simultaneous active ACL links
• Up to 1 simultaneous SCO or eSCO link with CVSD coding
• Supports eSCO
• Scatternet support : Up to 4 piconets simultaneously with background inquiry/page scan
• Supports sniff mode
• AFH and PTA collaborative support for WLAN/BT coexistence
• Idle mode and sleep mode enables ultra-low power consumption
• Supports PCM interface and built-in transcoders for A-law, u-law and linear voice with re-transmission
• Built-in hardware modem engine for access code correlation, header error correction, forward error
correction, CRC, whitening and encryption
• Channel quality driven data rate adaptation
• Channel assessment for AFH
3.1.24 Bluetooth Platform features

• Embedded processor for Bluetooth protocol stack with built-in memory system
• Fully verified ROM based system with code patch for feature enhancement
22 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.25 FM Features
• 76-108 MHz worldwide FM bands with 50kHz tuning step

• Supports RDS/RBDS radio data system
• Supports long/short antenna
• 30ms seek time per channel, and 6sec search time for all channels
• Superior stereo noise reduction
• Soft mute volume control
• Supports short antenna, auto calibration for different FM channels
• 60dB SINAD with 22.5 kHz FM deviation
• 3dBuVemf FM RX sensitivity with superior interference rejection
• 20dBuVemf(for SANT) or 19dBuVemf(for LANT) RDS sensitivity (dev: 2kHz)
• More than 55dBc rejection capability against -200 kHz ACL
23 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.2Power
3.2 PowerManagement
Management
The power management unit(PMU) manages the power supply of the entire chip, such as baseband,
processor, memory, SIM cards, camera, vibrator, etc. The digital part of PMU is integrated into the analog
part. PMU includes the following functions for signal processing:
3.2.1 Low Dropout Regulators(LDOs), Buck converter and Reference

The PMU Integrates 14 LDOs and 1 buck converter(BUCK) that are optimized for their given functions by
balancing quiescent current, dropout voltage, line/load regulation, ripple rejection, and output noise
▪ RF LDO (VRF)
The RF LDO is a linear regulator that could source 200mA (max) with 2.8V output voltage. It
supplies the RF circuitry of the handset. The LDO is optimized for high performance and adequate
quiescent current.
▪ Digital Core Buck Converter (VCORE)

The digital core regulator is a DC-DC step-down converter (Buck converter) that could source
350mA (max) with 1.3V to 0.9V programmable output voltage based on software register setting.
It supplies the power for baseband circuitry of the SoC. The buck converter is optimized for high
efficiency and low quiescent current.
Digital IO LDO (VIO18)
The digital IO LDO is a linear regulator that could source 100mA (max) with 1.8V output voltage. It
supplies the power for baseband circuitry of the SoC. The LDO is optimized for very low quiescent
current and turns on automatically together with Vm/Va LDOs.
 Analog LDO (VA)
The analog LDO is a linear regulator that could source 40mA (max) with 2.8V output voltage. It
supplies the analog sections of the SoC. The LDO is optimized for low frequency ripple rejection in
order to reject the ripple coming from the burst at 217Hz of RF power amplifier.
TCXO LDO (VTCXO)
The TCXO LDO is a linear regulator that could source 40mA (max) with 2.8V output voltage. It
supplies the temperature compensated crystal oscillator, which needs ultra low noise supply with
very good ripple rejection.
24 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
 Single-Step RTC LDO (VRTC)
The single-step RTC LDO is a linear regulator that can charge up a capacitor-type backup coin cell to 2.8
V, which also supplies the RTC module even at the absence of the main battery. The single-step LDO
features the reverse current protection and is optimized for ultra low quiescent current while sustaining
the RTC function as long as possible.
SIM LDO (VSIM)

The SIM LDO is a linear regulator that could source 60mA (max) with 1.8V or 3.0V output voltage
selection based on the supply specs of subscriber identity modules (SIM) card. It supplies the SIM card
and SIM level shifter circuitry in the handset. The Vsim LDO is controlled independently by the register
named VSIM_EN.
 SIM2 LDO (VSIM2)
The SIM2 LDO is a linear regulator that could source 60mA (max) with 1.3V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V or
3.3V output voltage selection based on the supply specs of the 2nd subscriber identity modules (SIM)
card. It supplies the 2nd SIM card and SIM level shifter circuitry in the handset. The Vsim2 LDO is
controlled independently by the register named VSIM2_EN.
 USB LDO (VUSB)
The USB LDO is a linear regulator that could source 60mA (max) with 3.3V output dedicated for USB
circuitry. It is controlled independently by the register named RG_VUSB_EN.
 Bluetooth LDO (VBT)
The VBT LDO is a linear regulator that could source 100mA (max) with 1.3V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V,
3.1V or 3.3V output for Bluetooth module. It is controlled independently by the register named
RG_VBT_EN.
 Camera Analog LDO (VCAMA)
The Vcama LDO is a linear regulator that could source 250mA (max) with 1.5V, 1.8V, 2.5V or 2.8V output
which is selected by the register named VCAMA_SEL[1:0]. It supplies the analog power of the camera
module. Vcama is controlled independently by the register named RG_VCAMA_EN.
 Camera Digital LDO (VCAMD)
The Vcamd LDO is a linear regulator that could source 100mA (max) with 1.3V, 1.5V, 1.8V, 2.5V, 2.8V,
3.0V or 3.3V output which is selected by the register named VCAMD_SEL[2:0]. It supplies the digital
power of the camera module. Vcamd is controlled independently by the register named
RG_VCAMD_EN.
25 / 131
3. TECHNICAL BRIEF
Output Output
Device Input pin Power Device Output Voltage(V) Power Net
pin Current (mA)
MT6255 AVDD43_ DC-DC
VCORE 1.2 350 VCORE_1V2
VCORE
AVDD43_VA Essential LDOs VA 2.8 40 AVDD_2V8
AVDD43_VD1 VIO18 1.8 400 VIO_1V8
AVDD43_VD2
VIO28 2.8 60 VIO_2V8
VMC 1.3/1.5/1.8/2.5/2.8/3.0/3.3 200 VMC_3V3
VSIM 1.8/3.0 60 VSIM1
VSIM2 1.3/1.5/1.8/2.5/2.8/3.0/3.3 60 VSIM2
VRTC 2.8 2 VRTC_2V8
Basic Feature VUSB 3.3 60 VUSB_3V3
LDOs VBT 1.5/1.8/2.5/2.8/3.0/3.1/3.3 100 VBT_3V1
VCAMA 1.5/1.8/2.5/2.8 150 VCMA_1V8
VCAMD 1.3/1.5/1.8/2.5/2.8/3.0/3.3 200 VCMAIO_1V8
Extra LDOs VIBR 1.3/1.5/1.8/2.5/2.8/3.0/3.3 200 VIBR_3V0
2G Transceiver
VTCXO 2.8 40 VTCXO_2V8
LDOs
AVDD43_VRF VRF 2.84 200 VRF_2V8
LED_KP KPLED 150mA (8 steps) KEY_BL0
Current Sink 6 x(24 mA,0.25V),Sharing(Individual Current BLED_EN
ISINK0~5 / Enable control) GLED_EN
4/8/12/16/20/24 mA RLED_EN
Table3.2.1. Power Supply Domains
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.2.2
3.2.2Power
PowerOn
OnSequence
Sequence
The PMU handles the powering ON and OFF of the handset. There are three ways to power-on the
handset system :
1. Push PWRKEY (Pull the PWRKEY pin to the low level)
Pulling PWRKEY low is the typical way to turn on the handset. The VCORE buck converter will be turned-
on first, and then VA/VIO LDOs turn-on at the same time. After VA/VIO turn-on, VUSB LDOs, and finally
VRF/VTCXO LDOs will be turn on. The supplies for the baseband are ready and then the system reset
ends at the moment when the VCORE/VA/VIO/VUSB/VRF/VTCXO are fully turned-on to ensure the
correct timing and function. After that, baseband would send the PWRBB signal back to PMU for
acknowledgement. To successfully power-on the handset, PWRKEY should be kept low until PMU
receives the PWRBB from baseband.
2. RTC module generate PWRBB to wakeup the system
If the RTC module is scheduled to wakeup the handset at some time, the PWRBB signal will directly send
to the PMU. In this case, PWRBB becomes high at the specific moment and let PMU power-on just like
the sequence described above. This is the case named RTC alarm.
3. Valid charger plug-in (CHRIN voltage is within the valid range)
Charger plugging-in will also turn on the handset if the charger is valid (no OVP take place). However, if
the battery voltage is too low to power-on the handset (UVLO state), the system won‘t be turned-on by
any of these three ways. In this case, charger will charge the battery first and the handset will be
powered-on automatically as long as the battery voltage is high enough.
Under-voltage Lockout (UVLO)
The UVLO state in the PMU prevents startup if the initial voltage of the main battery is below the 3.2V
threshold. It ensures that the handset is powered-on with the battery in good condition. The UVLO
function is performed by a hysteretic comparator which can ensure the smooth power-on sequence. In
addition, when the battery voltage is getting lower and lower, it will enter UVLO state and the PMU will
be turned-off by itself, except for Vrtc LDO, to prevent further discharging. Once the PMU enters UVLO
state, it draws low quiescent current. The RTC LDO is still working until the DDLO disables it.
Deep Discharge Lockout (DDLO)
PMU will enter to the deep discharge lockout (DDLO) state when the battery voltage drops below 2.5V.
In this state, the Vrtc LDO will be shutdown. Otherwise, it draws very low quiescent current to prevent
further discharging or even damage to the cells.
Reset
The PMU contains a reset control circuit which takes effect at both power-up and power-down. The
RESETB pin is held at low in the beginning of power-up and returns to high after the pre-determined
delay time. The delay time is controlled by a large counter, which use clock from internal ring-oscillator.
At power-off, RESETB pin will return to low immediately without any delay.
27 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.3 FEM with integrated Power Amplifier Module (RF7182)
3.3 FEM with integrated Power Amplifier Module (RF7182)
3.3.1 Internal Block Diagram
3.3.1 Internal Block Diagram
GND
GND
GND
NC
RX0
RX1
GND 1 22 21 20 19 18 17
RFIN HB 2
ESD 16 NC
Protection
GND 3 Amplifier Switch 15 ANTENNA
14 GND
RFIN LB 4
13 GND
GND 5 CMOS Controller
GND 6 7 8 9 10 11 12
GPCTRL1
VRAMP
TX ENABLE
GPCTRL0
VBATT
NC
Figure. 3.3.1 RF7182 FUNCTIONAL BLOCK DIAGRAM
Figure. 3.3.1 RF7182 FUNCTIONAL BLOCK DIAGRAM
3.3.2 General Description
The RF7182 is a quad-band GSM/GPRS Class 12 compliant transmit module (GSM850 / EGSM900 /
DCS1800 / PCS1900) with two symmetrical receive ports. This transmit module builds upon RFMD’s leading
power amplifier with PowerStar® integrated power control technology, pHEMT switch technology, and
integrated transmit filtering for best-in-class harmonic performance. The results are high performance, a
reduced solution size, and ease of implementation. The device is designed for use as the final
portion of the transmitter section in aGSM850 / EGSM900 / DCS1800 / PCS1900 handset and eliminates
the need for PA-to-antenna switch module matching network.
The RF7182 features RFMD’s latest integrated power-flattening circuit, which significantly reduces current and
power variation into load mismatch. The RF7182 also integrates an ESD filter to provide excellent ESD
protection at the antenna port. TheRF7182 is designed to provide maximum efficiency at rated POUT.
/ 131
3. TECHNICAL BRIEF
TX Module Mode Tx ENABLE GpCtrl1 GpCtrl0

Off 0 0 0
RX 0 0 1 0
RX 1 0 1 1
GSM850/900 TX Mode 1 1 0
DCS1800/PCS1900 TX Mode 1 1 1
VBAT
Changed (9/10)
C410 22u
Changed (7/27)
C408 0.1u
RF_ANT_SW2
(10V, X5R)
RF_ANT_SW1
C409 22p
RF_PA_EN
(50V) R407 10K
RF_TX_RAMP
C463 C464 C465

C407
(7/16) U400 : RF7180 -> RF7182 DNI DNI DNI

220p
R409
24K
11
10
9
8
7
VBATT
GPCTRL1
GPCTRL0
TX_ENABLE
VRAMP
Changed (11/6)
close to TXM
Shielding by GND
NC1 GND4
12 6
GND5 GND3
13 5 (50ohm)
C461 100p
14
GND6 RFIN_LB
4
LowBand_Tx
ANTENNA GND2
15 U400 3 (50ohm)
C462 100p
16
NC2 RFIN_HB
2
HighBand_Tx
GND1
1 (7/3) DC Blocking
GND_SLUG
GND7
GND8
GND9
NC3
RX1
RX0
C451 C452
17
18
19
20
21
22
23
DNI DNI
Figure 3.3.2 RF-module CIRCUIT DIAGRAM
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.4Clocks
3.4 Clocks
There are two major time bases in the MT6255. For the faster one is the 26 MHz clock originated from the
digital control oscillator(DCXO) of RF block. This is then converted to the square-wave signal through
CLKSQ.
The other time base is the 32768 Hz clock generated by an on-chip oscillator connected to an external
crystal.
26MHz EN
DCXO MPLL_SEL 104MHz EMI clock
(Cx8300_0204[1:0]) CG 104MHz AHB clock
CLKSQ_DIV2_MCU_SEL0
(Cx8300_0100[0]) 0 52MHz AHB clock
2
3 FMCU_CK 52MHz APB clock
CLKSQ CLKSQ_26M_CK 1/2 0 MCV_DCM
1
CLKSQ_DIV2_MCU_SEL0
1/2 (Cx8300_0100[1]) DPLL_SEL
EN
CLKSQ_CON (Cx8300_0100) (Cx8300_0204[3:2])
0 CG 10MHz GDSP1_CK
10MHz GDSP2_CK
1 0
2 FDSP_CK
MPLL MPLL_113M_CK 3
DSP_DCM
PLL_CON0(Cx8300_0200)
PLL_CON1(Cx8300_0204) CLKSQ_DIV2_GSM_SEL0 GPLL_SEL
(Cx8300_0100[2]) (Cx8300_0204[4])
MPLL_CON0(Cx8300_0210) EN
MPLL_CON1(Cx8300_0214)
0 CG
52MHz GGSM_CK
1 0 52MHz BFE_clock
UPLL UPLL_CON0(Cx8300_0208) 1 FGSM_CK
UPLL_CON1(Cx8300_020C)
GSM_DCM
UPLL_104M_CK
CLKSQ_DIV2_USB_SEL0 UPLL_SEL
(Cx8300_0100[3]) (Cx8300_0204[5])
EN
0 CG
GUSB_CK
1 0 FUSB_CK
1
USB_DCM
UPLL_48M_USB_CK USB PHY USB_PHY_CLK MSDC_DCM

EN
MSDC_clock
UPLL_48M_IRDA_CK F48M_CK
CG IrDA_clock
32KHz EN
XOSC_ANA XOSOOUT F32k_CK

CG SLOW_CK
XOSQ_CON (Cx8300_0000)
Figure. 3.4.1 Clock distributions inside the MT6255.

SLOW_DCM
MT6255
MT6255
B15
XOUT
A15
XIN
C15 X102
TESTMODE
VCO_MONITOR_BT
DVDD28_IO 1 2
SALNA_IN_N_FM
SALNA_IN_P_FM
(VIO_2V8) 32.768KHz
LNA_IN_N_FM
LNA_IN_P_FM
FC-135
TRXIQ_N_BT
TRXIQ_P_BT
RF2G_N_BT
RF2G_P_BT
2 C144 2 C145
RBIAS_BT
BPI_BUS0
BPI_BUS1
BPI_BUS2
BPI_BUS3
BPI_BUS4
BPI_BUS5
22p 22p
1 1
AC10
AC11
G10
AA13
AB12
AB14
AB10
AB11
C11
U14
A12
B12
B11
Y13
V14
F11
Figure. 3.4.2 Crystal Oscillator External Connection
LGE Internal Use Only

30 / 131 ExternalCopyright
Figure. 3.4.2 Crystal Oscillator © 2007 LG Electronics. Inc. All right reserved.
Connection
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.4.1 32.768KHz Time Base
The 32768 Hz clock is always running. It’s mainly used as the time base of the Real Time Clock(RTC) module,
which maintains time and date with counters. Therefore, both the 32768Hz oscillator and the RTC module is
powered by separate voltage supplies that shall not be powered down when the other supplies do.
In low power mode, the 13Mhz time base is turned off, so the 32768Hz clock shall be employed to update the
critical TDMA timer and Watchdog Timer. This time base is also used to clocks the keypad scanner logic
3.4.2 26MHz Time Base

Since PLL are based on 13MHz reference clock. There is an ½-dividers for PLL existing to allow using 26MHz
DCXO.
There are 2 phase-locked loops(PLL) in MT6255. The UPLL generates 624Mhz clock output, then a frequency
divider further divide 6, and 13 to generate fixed 103Mhz, and 48Mhz for GSM_CLOCK and USB_CLOCK and
DSP_CLOCK. These four primary clocks then feed into GSM, USB, MCU and DSP Clock Domain, respectively.
These 2 PLLs require no off-chip components for operations and can be turn off in order to save power. After
power-on, the PLLs are off by default and the source clock signal is selected through multiplexers. The software
shall take cares of the PLL lock time while changing the clock selections. The PLL and usages are listed below.
- PLL supply four clock source : MCU_CLOCK(104~113Mhz), DSP_CLOCK(104~113Mhz),
GSM_CLOCK(104Mhz) and USB_CLOCK(48Mhz)
- For DSP/MCU system clock, MCU_CLOCK and DSP_CLOCK. The outputted 104~113Mhz clock is controlled by
MCU for 500Khz per step and settled time is under 100uS. The clock is also connected to DSP/MCU DCM
(dynamic clock manager) for dynamically adjusting clock rate by digital clock divider.
MCU_CLOCK paces the operations of the MCU cores, MCU memory system, and MCU peripherals as well
- Modem system clock, GSM_CLOCK, which paces the operations of the GSM/GPRS hardware, coprocessors as
well. The outputted 104Mhz clock is connecter to GSM_DCM for dynamically adjusting clock rate by digital
clock divider. Typically the GSM_DCM output clock no more than 52Mhz.
Note that PLL need some time to become stable after being powered up. The software shall take cares of the
PLL lock time before switching them to the proper frequency. Usually, a software loop longer than the PLL lock
time is employed to deal with the problem.
For power management, the MCU software program may stop MCU Clock by setting the Sleep Control Register.
Any interrupt requests to MCU can pause the sleep mode, and thus MCU return to the running mode.
AHB also can be stop by setting the Sleep Control Register. However the behavior of AHB in sleep mode is a
little different from that of MCU. After entering Sleep Mode, it can be temporarily waken up by any “hreq”(bus
request), and then goes back to sloop automatically after all “hreqs” de-assert. Any transactions can take place
as usual in sleep mode, and it can save power while there is no transaction on it. However the penalty is losing a
little system efficiency for switching on and off bus clock, but the impact is small
31 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.5 RFSYS of MT6253 (U101)
3.5 RFSYS of MT6253 (U101)
Figure.3.5.1
Figure. 3.5.1 Block
Block DIAGRAM
DIAGRAM of
ofRFSYS
RFSYS
3.5.1 GENERAL DESCRIPTION

RFSYS built in MT6255 SOC is a highly integrated RF transceiver for multi-band GMS and GPRS and EDGE-Rx
cellular systems. The features are listed as following.
 Receiver
- Quad band differential input LNAs
- Quadrature RF mixers
- Fully integrated channel filter with f3dB=700kHz
- 96 dB dynamic range ADC
- 24 dB PGA gain with 6 dB gain Step
32 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
 Transmitter
- DFM for GSM/GPRS application
 Frequency Synthesizer
- Programmable fractional-N synthesizer
- Integrated wide range RFVCO
- Integrated loop filter
- Fast settling time suitable for multi-slot GPRS/EDGE applications
 Digitally-Controlled Crystal Oscillator (DCXO)

- Two-pin 26 MHz crystal oscillator
-On-chip programmable capacitor array for coarse - tuning
- On-chip programmable capacitor array for fine – tuning
- Low power mode support for 32K crystal removal
 3-wire serial interface

 CMOS process technology
 41 balls(incl.24 GND balls) of RFSYS in TFBGA package
33 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.6MEMORY(H9DA1GH25HBMMMR,
3.6 MEMORY(H9DA1GH25HBMMMR, U100
U100 ) )
3.6.1
3.6.1Functional
FunctionalDescription
Description
SK hynix NAND Flash is offered in 1.8 Vcc and VccQ Power Supply, and with x16 I/O interface. Its NAND cell
provides the most cost-effective solution for the solid state mass storage market. The memory is divided
into blocks that can be erased independently so it is possible to preserve valid data while old data is
erased. The Depending on whether the devices have a x8 or x16 bus width, the page size is (1024+32
spare) words.
Each block can be programmed and erased up to 50,000 cycles with ECC (error correction code) on. To
extend the lifetime of Nand Flash devices, the implementation of an ECC is mandatory.
The chip supports CE# don't care function. This function allows the direct download of the code from the
NAND Flash memory device by a microcontroller, since the CE# transitions do not stop the read operation.
In addition, device supports ONFI 1.0 specification. The copy back function allows the optimization of
defective blocks management: when a page program operation fails the data can be directly
programmed in another page inside the same array section without the time consuming serial data
insertion phase. We don’t have EDC function in this device.
A write protect pin is available to provide hardware protection against program and erase operations. The
devices feature an open-drain ready/busy output that identifies if the program/erase/read controller is
currently active. The use of an open-drain output allows the ready/busy pins from several memories to
connect to a single pullup resistor.
The devices have a cache read feature that improves the read throughput for large files. During cache
reading, the devices loads the data in a cache register while the previous data is transferred to the I/O
buffers to be read. This feature is implemented according to ONFI 1.0 specification.
34 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
VCC
CE# IQ0~IQ15
WE#
RE# R/B#
ALE
CLE
WP#
VSS
Figure.
Figure. 3.6.1
3.6.1 LOGICDIAGRAM
LOGIC DIAGRAM
Table 3_6_1 Signal Names
Table 3_6_1 Signal Names

35 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
A27~A0
ADDRESS
REGISTER/
COUNTER
PROGRAM
ERASE X
CONTROLLER
HV GENERATION D
NAND Flash E
C
ALE MEMORY ARRAY O
D
CLE
E
WE R
CE COMMAND
WP INTERFACE
LOGIC
RE PAGE BUFFER
Y DECODER
COMMAND
REGISTER
I/O BUFFER
DATA
REGISTER
IO0~IO15
Figure. 3.6.2 BLOCK DIAGRAM

Figure. 3.6.2 BLOCK DIAGRAM
36 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.6.2 Features
[ MCP ] [ DDR SDRAM ]
• Operation Temperature
- -30oC ~ 85oC •Standard SDRAM Protocol
• Package •Clock Synchronization Operation
- 130-ball FBGA - 8.0x9.0mm2, 1.0t, 0.65mm pitch
- Lead & Halogen Free •Multibank Operation : Internal 4 Bank Operation
•VDD / VDDQ = 1.7V to 1.95V
[ NAND Flash ]
• OPEN NAND FLASH INTERFACE(ONFI) 1.0 •Memory Cell Array
COMPLIANT - 4Mb x 4Bank x 16 I/O

• POWER SUPPLY VOLTAGE •LVCMOS Compatible I/O Interface
-VCC/VCCQ = 1.7V ~ 1.95V •Programmable Burst Length
-MEMORY CELL ARRAY (with SPARE) - 1, 2, 4, 8 or full page
- Page size : (1K+32spare) words
•Programmable Burst Type
- Block size : (64K+2K) words
- sequential or interleaved
- Plane size : 1024blocks
•Programmable CAS Latency
- Device size : 1024blocks
• PAGE READ / PROGRAM TIME •Programmable Drive Strength
- Random Read Time(tR) : 25us(Max)

- Sequential access time : 45ns(Min)
- Page program : 300us(Typ)
• BLOCK ERASE
- Block Erase Time : 3ms(Typ.)
• COMMAND SET
- ONFI1.0 Compliant command set
- Read Unique Ids
• ELECTRONIC SIGNATURE
- 1st cycle: Manufacturer Code
- 2nd cycle: Device Code
- 3rd cycle: Internal chip number, Cell Type,
Number of Simultaneously
Programmed Pages
- 4th cycle: Page size, Block size, Organization,
Spare size
• RELIABILITY
- 50,000 Program / Erase cycles
(with 4bit/512+16 Byte ECC)
• DATA RETENTION
- 10 years
37 / 131
3. TECHNICAL BRIEF
3.7 SIM Card Interface

VSIM_1
SIM2 (SW must be careful)
J201
R267
1 4 DNI
C1 C5
2 5
SIM_1_RST C2 C6
3 6
SIM_1_CLK C3 C7 SIM_1_DATA
7 10
GND1 GND4
8 9
VA228 GND2 GND3
VA229 C280 VA233
C279 C276 2 C277
DNI DNI 1u DNI
1
VSIM_2
J202
R268
1 4 DNI
C1 C5
2 5
SIM_2_RST C2 C6
3 6
SIM_2_CLK
7
C3 C7
10
SIM_2_DATA
GND1 GND4
8 9
VA234 GND2 GND3
VA235 C283 VA236
C281 C282 C284
DNI DNI 1u DNI
VSIM_3
J203 R269
1 4 DNI
C1 C5
2 5 1 2
SIM_3_RST C2 C6
3 6
SIM_3_CLK
7
C3 C7
10
SIM_3_DATA
GND1 GND4
8 9
VA237 GND2 GND3
2 C285
VA238
2 C286 2 C287 2 C288 VA239
DNI DNI 1u DNI

1 1 1 1
VSIM_4
J204 R240
1 4 DNI
C1 C5
2 5 1 2
SIM_4_RST C2 C6
3 6
SIM_4_CLK
7
C3 C7
10
SIM_4_DATA
GND1 GND4
8 9
VA208 GND2 GND3
2 C241
VA209
2 C242 2 C243 2 C244 VA210
DNI DNI 1u DNI

1 1 1 1
3. TECHNICAL BRIEF
Added for Dual SIM (10/12) Changed for Dual SIM (11/9)
VIO_1V8 VBAT VSIM_1VSIM1 VSIM_2 VSIM_3 VSIM_4 VSIM2
R284
R285
0
0
C239 C2372 2 C238
2.2u 2.2u 1u
1 1
1u
1u
2 2
C259
C260
RST_N
1u
1u
C257
C258
1 1
SIM2 (SW)
23
19
Close to IC (10/12)
4
SYSRSTB
VIO
VBAT
R278 0
SIM_1_CLK
R279 0
SIM_1_RST VSIM1
R280 0 5
SIM_1_DATA SCLK1/GPIO1 SIM_1_CLK
SIM2 (SW)
6
SIM_CLK SIMCLK1/GPI13 SRST1/GPIO2 SIM_1_RST
15 7
SIO1/GPIO3
8
SIM_1_DATA
SIM_RST SIMRST1/GPI14
14
VSIM2
3
SIM_DATA SIMIO1/GPI15 SCLK2/GPIO4 SIM_2_CLK
SIM3 (SW)
13 2
SRST2/GPIO5
1
SIM_2_RST
SIO2/GPIO6
28
SIM_2_DATA
SIM2_CLK SIMCLK2/GPI16
16
U202 VSIM3
27
SIM2_RST SIMRST2/GPI17 SCLK3/GPIO7 SIM_3_CLK
SIM1 (SW) SIM4 (SW)
17 24
Close to IC (10/12) SRST3/GPIO8
25
SIM_3_RST
SIM2_DATA SIMIO2/GPI18 SIO3/GPIO9 SIM_3_DATA
R281 0 18 26
SIM_4_CLK
R282 0 Added for Quad SIM (10/12)
SIM_4_RST 20
CE0 VSIM4
9
R283 0
SIM1 (SW)
10
I2C_SCL2 21
SCL SRST4/GPIO11
11
SIM_4_RST
SIO4/GPIO12
12
SIM_4_DATA
I2C_SDA2 SDA
GND
22
29
In case of dual SIM

R278, R279, R280, R281, R282, R283, R284, R285 : Install
U202, C237, C238, C239, C257, C258, C259, C260 : DNI
In case of quad SIM

Figure 3.7.2 SIM controller Circuit Diagram
R278, R279, R280, R281, R282, R283, R284, R285 : DNI
U202, C237, C238, C239, C257, C258, C259, C260 : Install
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
The Main Base Band Processor(MT6255) contains two dedicated smart card interfaces to allow the
MCU to access the two SIM cards. Each interface can operator via 5 terminals. As shown is the Figure
3.8.2, SIMVCC, SIMSEL, SIMRST, SIMCLK and SIMDATA are for one SIM interface, while SIM2VEE, SIM2SEL,
SIM2RST, SIM2CLK and SIM2DATA are for the other one.
The functions of the two SIM interfaces are identical; therefore, only first SIM interface will be described
in this document.
The VSIM is used to control the external voltage supply to the SIM card and SIM SEL determines the
regulated smart card supply voltage. SIMRST is used as the SIM card reset signal. Besides, SIMDATA and
SIMCLK are used for data exchange purpose.
A395 is using U202 as SIM controller to be able to use Quad SIM.
Figure 3.7.3 SIM Interface block diagram
40 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
• General Description
The MT6306 is a SIM card / GPIO control chip optimized for GSM handsets, especially those based on
the MediaTek MT62xx system solution. It supports up to four SIM interfaces or 12 GPIOs plus six GPIs.
Each SIM interface can be individually programmed as GPIOs. The SIM interface supports both 1.8V and
3V SIM cards. An I2C interface is used to control SIM channel individually.
The MT6306 is available in 28-pin 4mm x 4mm QFN package. The operating temperature range is from
-25°C to +85°C.
• Features
Control and communication through an I2C interface with baseband processor.
Independent 1.8V/3V VCC control for each SIM card
Power management and control for quad SIM cards
Independent clock stop mode (at high or low level) for each SIM card
Programmable SIM interface pins (can be SIM interface pins or GPIO pins)
Compatible with MediaTek baseband processor chips, MT6252, MT6253, MT6235, MT6236, etc.
28-Pin 4mm x 4mm QFN Package
Figure 3.7.4 MT6306 Block diagram
LGE Internal Use Only Figure 3.7.4 MT6306 Block diagram

Copyright © 2007 LG Electronics. Inc. All right reserved.
41 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.8 Micro-SD Card Interface
3.8 Micro-SD Card Interface
VIO_2V8
J301
1 8
MSD_D[2] DAT2 DAT1 MSD_D[1]
2 7
MSD_D[3] CD/DAT3 DAT0 MSD_D[0] R221
3 6
MSD_CMD CMD VSS (7/3) R221 : 1Mohm
4 5 1M
9
VDD CLK
11
MSD_CLK
Changed (10/30) GND1 POL
10 12
VMMC_3V3 GND2 DET MSD_DET_N
C265
1u
VA324 VA325 VA326 VA321 VA322 VA323

Changed (12/29)
1u
1u
C270
C235
Figure 3.8.1 Micro-SD Card Interface

Figure 3.8.1 Micro-SD Card Interface
The controller fully supports the Memory Stick bus protocol as defined in Format Specification version 2.0 of
Memory Stick Standard (Memory Stick PRO) and the SD Memory Card bus protocol as defined in SD Memory
Card Specification Part 1 Physical Layer Specification version 2.0 as well as the Multi Media Card(MMC) bus
protocol as defined in MMC system specification version 4.1. Since SD memory Card bus protocol is backward
compatible to MMC bus protocol, the controller is capable of working well as the host on MMC bus under
control of proper firmware. Furthermore, the controller also support SDIO card specification version 1.0 partially.
However, the controller can only be configured as either the host controller.
42 / 131
3. TECHNICAL BRIEF
3.9 LCD Interface 3. TECHNICAL BRIEF

VIO_1V8
3.9 LCD Interface VBAT
R307 2
DNI 1
C305
35
2.2u
LCD_LED_CA1
FL300 LCD_LED_CA2 34 Added (10/31)
33
LCD_LED_CA3
LCD_WR_N 1 INOUT_A1 INOUT_B1 9 32
LCD_RS 2 INOUT_A2 INOUT_B2 8 IF_MODE[1:0] = 01 --> 00 R308 100K 31 VIO_1V8

D[15:0] 16 bit --> D[7:0] 8 bit mode
LCD_CS_N 3 INOUT_A3 INOUT_B3 7 Changed (9/10)
30 1 2
4 INOUT_A4 INOUT_B4 6 IM0 29 R312
IM1
LCD_VSYNC 28 100K
G1
G2
R367
27
LCD_RD_N
10K
5 10 26
7.5pF
25
24
LCD_RST_N
23
22
VA327 VA328 Added (9/10)
FL301 21
C322
20
1u
LNAND_D_[07] 1 INOUT_A1 INOUT_B1 9 19
Changed from D[15:8] to D[7:0] 15
G1
G2
Changed (9/10) 14
5 10
7.5pF 13
12
11
FL302 10
VIO_1V8 VIO_2V8
9
LNAND_D_[06] 1 INOUT_A1 INOUT_B1 9
8
7
6
5
G1
G2
R311 100K 4
LCD_ID 3
5 10
7.5pF VA329
2
VA332 VA331
Added (9/10) 1 C308 C309
CN301
1u 1u
TIANMA LCD ID : HIGH
Added (10/30)
Figure3.9.1
Figure 3.9.1LCD
LCDInterface
Interface
MT6255 contains a versatile LCD controller which is optimized for multimedia applications. This controller
supports many types of LCD modules and contains a rich feature set to enhance the functionality. These
features are:
• Up to 800x480 at 18 bpp @ 200 MHz, 480x320 at 18 bpp @ 133 MHz
• Supports LCD format : RGB332, RGB444, RGB565, RGB666, RGB888 LCD modules.
• 4 Layers Overlay with individual color depth, window size, vertical and horizontal offset, source key,
alpha value and display rotation control(90°,180°, 270°, mirror and mirror then 90°, 180° and 270°)cc
• One Color Look-Up Table
• Three Gamma Correction Tables
For parallel LCD modules, the LCD controller can reuse external memory interface or use dedicated 16/18-bit
parallel interface to access them and 8080 type interface is supported. It can transfer the display data from the
internal SRAM or external SRAM/Flash Memory to the off-chip LCD modules.
For serial LCD modules, this interface performs parallel to serial conversion and both 8- and 9- bit serial interface
is supported. The 8-bit serial interface uses four pins – LSCE#, LSDA, LSCK and LSA0 – to enter commands and
data.
Meanwhile, the 9-bit serial interface uses three pins – LSCE#, LSDA and LSCK – for the same purpose. Data read
is not available with the serial interface and data entered must be 8 bit.
LGE Internal
UseUse
OnlyOnly
LGE Internal - 42
43 -
/ 131 Copyright
Copyright©©2007
2013 LG Electronics.
LG Electronics. Inc.Inc. All reserved.
All right right reserved.
Only for training and
Onlyservice purposes
for training and service purposes
3. TECHNICAL BRIEF
LCD Charge Pump

3. TECHNICAL BRIEF
Changed (8/8)
VMMC_3V3
VFM_2V8
VIO_1V8
Changed (10/30)
Added for NC pin (8/21)
VBAT
VBAT
2.2u
C360
2
2.2u
R351
C351
1 1K
21
11
14
12
3
SLUG_G
AGND
PGND
LDO2
LDO1
NC2
15
NC1 ENA
10 9
AVIN
U302 13
VOUT
20
LCD_LED_CA1 LED1 PVIN
19 6
LCD_LED_CA2 LED2
18
LCD_LED_CA3 LED3 SDA I2C_SDA2
17 8
16
LED4 SCL
7
I2C_SCL2
C2N
C1N
C2P
C1P
NP0 --> X7R (8/27)

2
2.2u
2.2u
C352 C353 2
2
33p
C354 C355
C356
C357
1u
1
1 (10V)
1u 1u
Figure 3.9.2 Charge Pump CIRCUIT DIAGRAM

Figure 3.9.2 Charge Pump CIRCUIT DIAGRAM
The RT9367C is an integrated solution for backlighting and phone camera input supply. The part contains a
charge pump white LED driver and dual low dropout linear regulators. This IC can be shut down by pulling EN
low.
In the section of charge pump, The RT9367C can power up 4 white LEDs with regulated constant current for
uniform intensity. Each channel (LED1-LED4) can support up to 25mA. The part maintains highest efficiency by
utilizing a x1/x1.5/x2 fractional charge pump and low dropout current regulators. An internal 5-bit DAC is used
for brightness control. Users can easily configure up to 32-step of LED current by I2C interface.
In the section of linear regulator, The RT9367C comprises a dual channel, low noise, and low dropout regulator
sourcing up to 300mA at each channel. The range of output voltage can be configured from 1.1V to 3.3V by I2C
interface. The outputs of LDO offer 3% accuracy and low dropout voltage of 250mV @ 300mA. The LDO also
provides current limiting and output short circuit thermal folded back protection.
44 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.10 Battery Charger Interface
3.10 Battery Charger Interface
VUSB_LDO_4V9 VBUS_USB VBAT VIO_1V8
R271
100K
11
PGND
1 10
VIN BATT
2 9
ISET U204 PGB
3 8
4
GND1 CHGSB
7
EOC
LDO GND2
5 6
IEOC EN_SET CHG_EN
C289
R276
R277
R274
C275
DNI
820
3K
0.1u 0.1u
50V internal voltage (10/31)
Figure 3.10.1 BATTERY CHARGER BLOCK

Figure 3.10.1 BATTERY CHARGER BLOCK
The RT9536 is a fully integrated single cell Li-ion battery charger IC ideal for portable applications.
The RT9536 optimizes the charging task by using a control algorithm including pre-charge mode, fast
charge mode and constant voltage mode. the input voltage range of the VIN pin can be as high as 28V.
When the input voltage exceeds the OVP threshold, it will turn off the charging MOSFET to avoid
overheating of the chip.
In RT9536, the maximum charging current can be programmed with an external resistor. For USB application,
the user can set the current to 100mA/500mA through the EN/SET pin. For the factory mode, the RT9536 can
allow 4.2V or 4.35V/2.3A power pass through to support system operation. It also provides a 50mA LDO to
support the power of peripheral circuit. The internal thermal feedback circuit regulates the die temperature
to optimize the charge rate for all ambient temperatures. The RT9536 provides protection functions such as
under voltage protection, over voltage protection for VIN supply and thermal protection for battery
temperature.
The RT9536 is available in a WDFN-10L 3x2 package to achieve optimized solution for PCB space and
thermal considerations.
45 / 131
3. TECHNICAL BRIEF
3.11 Keypad Interface

SW1 SW2
KB300
KB301
1 2
R301
1 2
KEY_ROW0
680
VA301
NUM 1 NUM 2 NUM 3 UP DOWN

KB302 KB303 KB304 KB305 KB306
R302
KEY_ROW2
680
VA302
NUM 4 NUM 5 NUM 6 LEFT RIGHT

KB308 KB309 KB310 KB311 KB312
R303
KEY_ROW3
680
VA304
Changed (12/29)
NUM 7 NUM 8 NUM 9 OK
KB313 KB314 KB315 KB316
R316 1 2
KEY_ROW4
680
VA305
STAR NUM 0 SHARP SEND

KB317 KB318 KB319 KB320
R304
KEY_ROW1
680
VA306
Changed (12/29)
VA307 VA309 VA310 VA308

VA311
R309
680
R305
R306
R317
680
680
680
R318
680
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
SIM Selection KEY

END
SW300
R365
S1
KEY_ROW4 3
680
4
VA314
5
(10/12) Changed
KB307
6
S2 END_KEY
R366 VA303
KEY_COL4
680
Added for ESD (8/21) 1 VA315
Figure 3.11.1 MAIN KEY STRUCTURE
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
The keypad can be divided into two parts: one is the keypad interface including 7 columns and 6
rows(A395 is using 5columns and 5rows) with one dedicated power-key, as shown in Figure 3.11.2; the
other is the key detection block which provides key pressed, key released and de-bounce mechanisms.
Each time the key is pressed or released, i.e. something different in the 6 x 7 matrix or power-key, the key
detection block senses the change and recognizes if a key has been pressed or released. Whenever the key
status changes and is stable, a KEYPAD IRQ is issued. The MCU can then read the key(s) pressed directly in
KP_MEM1, KP_MEM2, KP_MEM3, and KP_MEM4 registers. To ensure that the key pressed information is
not missed, the status register in keypad is not read-cleared by APB read command. The status register can
only be changed by the key-pressed detection FSM.
Figure 3.11.2 8x8 matrix with one power-key

Figure 3.11.2 8x8 matrix with one power-key
47 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.12 Audio
3.12 Audio Front-End
Front-End
3.12.1General
3.12.1 GeneralDescription
Description
Audio mixed-signal blocks (AMB) integrate complete voice uplink/downlink and audio playback function. As
shown in the figure below, it includes three parts. The first consists of stereo audio DACs and audio amplifiers
for audio playback. The second part is the voice downlink path, including voice-band DACs (left channel
audio DAC) and voice amplifier, which produces voice signal to earphone or other auxiliary output device.
Amplifiers in the two blocks are equipped with multiplexers to accept signals from internal audio/voice. The
last part is the voice path, which is the interface between the microphone (or other auxiliary input device)
input and MT6255 DSP. A set of bias voltage is provided for the external electric microphone.
HS_AMP AU_HSP
AU_HSM
HPR_AMP
Voice or Audio Audio AU_HPR
Digital Signal RCH-DAC
HPL_AMP
Voice or Audio Audio AU_HPL
Digital Signal LCH-DAC
LSB
Class_AB SPK_P
SPK_N
Digital MIC
I/O Signal
AU_V1N0_P
MUX
Voice PGA
Voice Signal
ADC AU_V1N0_N
MUX
MICBIAS0(1.9V)
1.2V
MICBIAS1(1.9V)
AU_V1N1_N
AU_V1N1_P
Figure
Figure 3.12.1.
3.12.1. Block
Block diagram
diagram of of audio
audio mixed-signalblocks.
mixed-signal blocks.
3.13.2
3.13.2Functional
FunctionalSpecifications
Specifications
See
Seethe
thetable
tablebelow
belowfor
forthe
thefunctional specifications
functional of voice-band
specifications uplink/downlink
of voice-band blocks
uplink/downlink blocks.
48 / 131
3. TECHNICAL BRIEF
Figure 3.12.2 Functional specifications of analog voice blocks
See the table below for the functional specifications of audio blocks.
Figure 3.13.2 Functional specifications of analog voice blocks
3. TECHNICAL BRIEF
3.13 Camera Interface
VCAMD_IO_1V8
VCAM_2V8
3. TECHNICAL BRIEF
3.13 Camera Interface Beads are deleted (12/3)
VCAM_IOVDD
VCAM_DVDD
VCAM_AVDD
CN302 VCAMD & VIO are merged to VCAMD_IO_1V8 (10/31)
1 24
CAM_DATA07 2 23 I2C_SCL1
CAM_DATA06 3 22 I2C_SDA1
CAM_DATA05 4 21
CAM_DATA04 5 20 CAM_VSYNC
CAM_DATA03 6 19 CAM_HSYNC
CAM_DATA02 7 18 CAM_F_MCLK
CAM_DATA01 8 17
CAM_DATA00 9 16
R358
10 15 CAM_MCLK 1 2 CAM_F_MCLK
CAM_F_PCLK 10
CAM_RESET 11 14 2 C361 2 C362

DNI 7.5p
0.1u
0.1u
0.1u
CAM_PD 12 13
1u
1u
1u
2 2 2 2
(DIF_D8) 1 VA312 VA313
1 1
C315
C325
C316
C324
C317
C326
1 1 1 1
2
R359
CAM_PCLK 1 2 CAM_F_PCLK
10
C364 C363
7.5p DNI
Figure 3.13.1 Camera Interface

Figure 3.13.1 Camera Interface
The YACC6A1SBDBS is a high quality 1.3mega-pixel single chip cmos image sensor for mobile phone camera
applications and digital still camera products. The YACC6A1SBDBS incorporates a 1324 X 1084 pixel array, on-
chip 10-bit ADC, and an image signal processor. Unique sensor technology enhances image quality by reducing
FPN(Fixed Pattern Noise), horizontal/vertical line noise, and random noise. The Image Signal Processor (ISP)
performs sophisticated image processing functions including color correction, lens shading correction, edge
enhancement, gamma correction, image scaling, noise reduction, auto exposure (AE), auto white balance
(AWB), anti-flicker (50Hz/60Hz, manual/Auto). The AE and AWB functions are performed by an embedded 8-bit
processor which uses to run built-in these sophisticated algorithms. The programmable functions are
controlled by host processor via 2-wire I2C bus interface. The YACC6A1SBDBS, which needs a single master
clock(48Mhz(Max)), is suitable for low power camera module with 2.8V/1.8V power supply.
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.13.1 FEATURES
3.13.1 FEATURES
• Optical size : 1/6 inch

• Unit pixel size : 1.75 um x 1.75 um
• Resolution : 1,280H X 1,024V
• Active image Size : 2.296mm(H) X 1.848mm(V)
• Output format : Yuv4:2:2, RGB5:6:5, ITU656-like
• Frame rate : 15fps@SXGA, 30fps@VGA, 20 fps@720P
• ADC resolution : 10-Bit
• Lens shading correction
• Color correction
• Noise reduction
• Edge enhancement
• Windowing : Programmable
• Sub-Sample : 1/2. 1/4 (VGA, QVGA)
• Gamma correction
• Image effect: Mono, Sepia, Solarization, Negative, Sketch, Embossing
• Image scaling: 1x ~ 1/64x
• Anti-flicker (50Hz/ 60Hz) : Auto/Manual
• Image Flip : X/Y Flip
• Auto exposure (AE)
• Auto white balance (AWB)
• Black Level Calibration
• Strobe Control : Support Xenon / LED Type
• On-Chip Dead Pixel Correction
• Host interface: two-wire serial bus interface
• Internal PLL
• Operating temperature: -20°C to +60°C
• Supply voltage: 2.8V / 1.8V
51 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.14 KEY
3.14 KEYBACLKLIGHT
BACLKLIGHTLED
LEDInterface
Interface
Key Backlight LED is controlled by KEYPAD_LED signal of MT6255.

The built-in open drain output switch drives the Keypad LED in the handset. This switch is controlled by
baseband with the enable register. The keypad LED can sink 150mA and will become high impedance as
disabled.
KEY BACKLIGHT
VBAT
WHITE Top View LED (8/13)
2 C300
2 C301 1u
1u
1
1 LD300 LD301 LD302 LD303 LD304 LD305
R357
R360
R361
R362
R363
R364
47
47
47
47
47
47
Changed (8/8)
KEY_BL0
C319
1u
Figure 3.14.1 Key Backlight Block
Figure 3.14.1 Key Backlight Block
52 / 131
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.15Vibrator
3.15 VibratorInterface
Interface
Vibrator is driven by MT6255.

VIBR_3V0 is connected with + terminal of vibrator and – terminal is connected with
GND. It is controlled by VIBRATOR signal of MT6255 .
VIBRATOR
VIBR_3V0
Location is changed for RSE (11/9)
VB300
L301 22n
1
(10/12) Changed
2
VA330 D301 L302

C307
1u 270n
Figure 3.15.1 Vibrator Driver Block
Changed (9/10) Added (9/10)
Figure 3.15.1 Vibrator Driver Block
53 / 131
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
U101
U101 X102
X101
U401
SW400
Figure 4.1
U101 Main Chip (MT6255)
U400 TX Module (RF7182)
Memory(2G/1G DDR)
U100
H9DA2GH1GHMMMR-46M
X101 Crystal, 26MHz Clock
X102 Crystal, 32.768MHz Clock
4. TROUBLE SHOOTING
4.2 RX Trouble
START
HP8960 : Test mode

62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
(1) Check Crystal Circuit
(2) Check Mobile SW &TX module
(3) Check PLL Control
Re-download SW or
Do calibration again
4. TROUBLE SHOOTING
(1) Checking Crystal Circuit
TP1
Figure 4.2.1
W23
TXO_LB LowBand_Tx
W24
TXO_HB HighBand_Tx TP1
AA16
CLK_SEL X101
1 2
AC16 EARMIC_BIAS
XTAL1 4 3
AB16
XTAL2 VMIC_BIAS_P
TSX-3225 26MHZ_7_4PF
W15 26MHz
FREF
U23
MICBIAS1
P23
MICBIAS0
C132
1u
26 MHz No
Replace TP1
O.K?
Yes
Crystal is OK.
See next page to check PLL Circuit
4. TROUBLE SHOOTING
(2) Checking Mobile SW &Tx module
TP6
TP1
TP7
TP5
SW400
TP4 TP2
TP3
Figure 4.2.1
VBAT
TP2
Changed (9/10) TP5
C410 22u
TP4 Changed (7/27)
C408 0.1u
TP3
RF_ANT_SW2
(10V, X5R)
RF_ANT_SW1
C409 22p
RF_PA_EN
(50V) R407 10K
RF_TX_RAMP
C463 C464 C465

C407
(7/16) U400 : RF7180 -> RF7182 DNI DNI DNI

220p
R409
24K
TP1
11
10
9
8
7
VBATT
GPCTRL1
GPCTRL0
TX_ENABLE
VRAMP
Changed (11/6)
close to TXM
Shielding by GND
(7/17) 12
NC1 GND4
6
GND5 GND3
13 5 (50ohm)
C461 100p
SW400 C466 1.5n C467 2.7n
2 14
GND6 RFIN_LB
4
LowBand_Tx
ANT COMMON ANTENNA GND2
1 15 U400 3 (50ohm)
C462 100p
G3 G4 16
NC2 RFIN_HB
2
HighBand_Tx
L411 GND1
3 4
C415 L456
1 (7/3) DC Blocking
GND_SLUG
DNI 1.2p 47n

GND7
GND8
GND9
NC3
RX1
RX0
C451 C452
17
18
19
20
21
22
23
DNI DNI
component changed (12/5)
TP7
GSM1800,1900
(50ohm) GSM850,900
L451 12n
1 2 LB_RxN
10
(50ohm)
(12/28) Changed
GND4
L401
L402 2.2n Changed (9/10)
Changed (8/9) 1
GSM850/900_UnB GSM850/900_Bal2
9 33n
L452 12n
C457 2 8
GND1 GSM850/900_Bal1 1 2 LB_RxP
1p
FL400 L454 3.9n
3 7
GND2 GSM1800/1900_Bal2 HB_RxP
L405
4 6
GSM1800/1900_UnB GSM1800/1900_Bal1
2.7n L403
GND3
2 C460 6.8n Changed (9/25)

1p L455 3.9n
TP6
5
1 HB_RxN
Changed (9/26)
(7/27) (7/18) coil -> non_coil

(7/27) 0603 -> 1005
(12/28) Changed
4. TROUBLE SHOOTING
Check TP1 of SW400
No
TP1 Signal is OK? Replace Mobile SW (SW400)
Yes
Check TP2 of U400
Control Signal No
Is (TP3, 4, 5) Check MT6255(U101)
OK ?
Yes
No
TP6(High Band),
TP7(Low Band) Signal is OK ? Replace TX module (U400)
Yes
Mobile SW & TX Module is OK.

Off 0 0 0
RX 0 0 1 0
RX 1 0 1 1
GSM850/900 TX Mode 1 1 0
4. TROUBLE SHOOTING
4.3 TX Trouble
START
HP8960 : Test mode

62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
(1)Check
Crystal Circuit
(2) Check
Mobile SW &Tx module
(3) Check PLL Control
Redownload SW or
Do calibration again
4. TROUBLE SHOOTING
(1) Checking Crystal Circuit
TP1
Figure 4.2.1
W23
TXO_LB LowBand_Tx
W24
TXO_HB HighBand_Tx TP1
AA16
CLK_SEL X101
1 2
AC16 EARMIC_BIAS
XTAL1 4 3
AB16
XTAL2 VMIC_BIAS_P
TSX-3225 26MHZ_7_4PF
W15 26MHz
FREF
U23
MICBIAS1
P23
MICBIAS0
C132
1u
26 MHz No
Replace TP1
O.K?
Yes
Crystal is OK.
See next page to check PLL Circuit
4. TROUBLE SHOOTING
(2) Checking Mobile SW &Tx module
TP6
TP1
TP7
TP5
SW400
TP4 TP2
TP3
Figure 4.2.1
VBAT
TP2
Changed (9/10) TP5
C410 22u
TP4 Changed (7/27)
C408 0.1u
TP3
RF_ANT_SW2
(10V, X5R)
RF_ANT_SW1
C409 22p
RF_PA_EN
(50V) R407 10K
RF_TX_RAMP
C463 C464 C465

C407
(7/16) U400 : RF7180 -> RF7182 DNI DNI DNI

220p
R409
24K
TP1
11
10
9
8
7
VBATT
GPCTRL1
GPCTRL0
TX_ENABLE
VRAMP
Changed (11/6)
close to TXM
Shielding by GND
(7/17) 12
NC1 GND4
6
GND5 GND3
13 5 (50ohm)
C461 100p
SW400 C466 1.5n C467 2.7n
2 14
GND6 RFIN_LB
4
LowBand_Tx
1 15 U400 3 (50ohm)
C462 100p
G3 G4 16
NC2 RFIN_HB
2
HighBand_Tx
L411 GND1
3 4
C415 L456
1 (7/3) DC Blocking
GND_SLUG
DNI 1.2p 47n

GND7
GND8
GND9
NC3
RX1
RX0
C451 C452
17
18
19
20
21
22
23
DNI DNI
TP7
GSM1800,1900
(50ohm) GSM850,900
L451 12n
1 2 LB_RxN
10
(50ohm)
(12/28) Changed
GND4
L401
L402 2.2n Changed (9/10)
Changed (8/9) 1
9 33n
L452 12n
C457 2 8
1p
FL400 L454 3.9n
3 7
L405
4 6
GSM1800/1900_UnB GSM1800/1900_Bal1
2.7n L403
GND3
2 C460 6.8n Changed (9/25)

1p L455 3.9n
TP6
5
1 HB_RxN
Changed (9/26)
(7/27) (7/18) coil -> non_coil

(7/27) 0603 -> 1005
(12/28) Changed
4. TROUBLE SHOOTING
Check TP6 & TP7
No
TP6, TP7 Signal is OK ? Replace MT6255 (U101)
Yes
No
Control Signal is Check MT6255 (U101)
(TP3,4,5) OK ?
Yes
Check TP1 of U400 ?
No
TP1 Signal is OK? Replace TX module (U400)
Yes
No
TP8 signal same as TP1? Replace SW400
Yes
Mobile SW & TX module is OK.

Off 0 0 0
RX 0 0 1 0
RX 1 0 1 1
GSM850/900 TX Mode 1 1 0
4. TROUBLE SHOOTING
4.4 Power On Trouble
TP1 (U101)
TP2 1K Ω
Figure 4.4.1
U9
GND_20
U2
GND_21
E18
SIM2_CLK SCLK2
D20
SIM2_DATA SIO2
C20
SIM2_RST SRST2
D19
SIM_CLK SCLK
E19
SIM_DATA SIO
D18
SIM_RST SRST
TP2 1K Ω
Close to IC TP1 (U101)
H20
RST_N RESETB
R108 1K G21
END_KEY PWRKEY
1 C126 1u 2 F20
C125 VREF
F21
AVSS43_VRF
330p
J22
PMU_TESTMODE
G20
VCDT
H22
CHRLDO
G22
Figure 4.4.2
4. TROUBLE SHOOTING
START
No
Check Battery Voltage Charge or Change Battery
> 3.30V
Yes
Push power-on key No

Check the contact of power key
And check the level change
Or dome-switch
into high of PWRKEY
Yes
Check the voltage of No

resistors at R107 when pushing power Replace TP1 (U100)
key
Yes
No
Logic level at PWRON of TP2 Re-download software
= HIGH(above 1.2V)?
Yes
No
Is the phone power on? Replace TP1 (U100) and
Re-download software
Yes
Does it work properly?
Yes
No
The phone will Properly operate. Replace the main board
4. TROUBLE SHOOTING
4.5 Charging Trouble
TP2
TP1
RT9536 CN201
USB Connector
Figure 4.5.1
VUSB_LDO_4V9 VBUS_USB VBAT VIO_1V8

R271
100K
11
PGND
1 10
VIN BATT
2 9
TP2 3
ISET U204 PGB
8
4
GND1 CHGSB
7
EOC
LDO GND2
5 6
IEOC EN_SET CHG_EN
C289
R276
R277
R274
C275
DNI
820
3K
0.1u 0.1u
50V internal voltage (10/31)
4. TROUBLE SHOOTING
VBUS_USB
AVDD_2V8
Line Width: 2mm
Added for low voltage surge (12/3)

CN201(TP1)
R275
Changed (8/28) 240K C269 C268 Changed (10/12)
D202
1u 22pF CN201
6
7
8
Changed (8/27) 25V --> 50V (9/10) Line Width: 2mm 1
2
USB_DM
3
USB_DP
4
ACC_ID 5
D201 9
4
C295 C272 10
ID
DP
DM
VBUS
11
MTK recommend (9/10) 0.1u 22p
GND1
GND2
5
Changed for Low voltage surge (12/3)
4. TROUBLE SHOOTING
START
Change the battery
Yes
Battery is charged? Charging is properly operating
No
No
Is I/O Connector(TP1)
Re-solder the TP1 (Pin 1 : VBUS_USB)
well-soldered ?
Yes
No
Check the voltage at
The TA is out of order Change the TA
Pin 1 of TP2 = 5V?
Yes
No
Is the voltage
at C275 of TP2 = 4.9V Replace the U501
Yes
No
Battery is charged? Replace the main board
Yes
Charging is properly operating
4. TROUBLE SHOOTING
4.6 Vibrator Trouble
TP3
TP1
Vibrator PAD
VIBRATOR
TP 2
Figure 4.6
VIBR_3V0
Location is changed for RSE (11/9)

TP1
VB300 Vibrator PAD
L301 22n
1 TP 2
(10/12) Changed
2
VA330 D301 L302

C307
1u 270n
TP3
Changed (9/10) Added (9/10)
4. TROUBLE SHOOTING
SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu
START
No
Is the vibrator connection Check the state of
Correct? Connection & replace vibrator
Yes
No
Short happened at TP3(C307)? Check the state of TP3(C307)
Yes
No
Voltage applied at TP1 Replace the L301
Yes
Replace the vibrator
Vibrator Working well !
4. TROUBLE SHOOTING
4.7 LCD Trouble
TP2
TP1
TP4
TP3 TP5
Figure 4.7.1
4. TROUBLE SHOOTING
VIO_1V8
VBAT
R307 2
TP1
DNI 1 C305
35
2.2u
LCD_LED_CA1
FL300
TP5 LCD_LED_CA2
LCD_LED_CA3
34
33
Added (10/31)
LCD_WR_N 1 INOUT_A1 INOUT_B1 9 32
LCD_RS 2 INOUT_A2 INOUT_B2 8 IF_MODE[1:0] = 01 --> 00 R308 100K 31 VIO_1V8

D[15:0] 16 bit --> D[7:0] 8 bit mode
LCD_CS_N 3 INOUT_A3 INOUT_B3 7 Changed (9/10)
30 1 2
4 INOUT_A4 INOUT_B4 6 IM0 29 R312
IM1
LCD_VSYNC 28 100K
G1
G2
R367
27
LCD_RD_N
10K
5 10 26
7.5pF
25
24
LCD_RST_N
23
22
Added (9/10)
TP4
VA327 VA328
FL301 21
C322
20
1u
G1
G2
Changed (9/10) 14
5 10
7.5pF 13
12
11
LNAND_D_[06] 1
FL302
INOUT_A1 INOUT_B1 9
TP3 10
9
VIO_1V8 VIO_2V8
8
7
6
5
G1
G2
R311 100K 4
LCD_ID 3
5 10
7.5pF VA329
2
VA332 VA331
Added (9/10) 1 C308 C309
CN301
1u 1u
Added (10/30)
LCD Charge Pump

Changed (8/8)
VMMC_3V3
VFM_2V8
VIO_1V8
Changed (10/30)

VBAT
VBAT
TP2
2.2u
C360
2
2.2u
R351
C351
1 1K
21
11
14
12
3
SLUG_G
AGND
PGND
LDO2
LDO1
NC2
15
NC1 ENA
10 9
AVIN
U302 13
VOUT
20
19 6
LCD_LED_CA2 LED2
18
17 8
16
LED4 SCL
7
I2C_SCL2
C2N
C1N
C2P
C1P
NP0 --> X7R (8/27)

2
2.2u
2.2u
C352 C353 2
2
33p
C354 C355
C356
C357
1u
1
1 (10V)
1u 1u
4. TROUBLE SHOOTING
Graph 4.7.1. LCD Backlight Control Signal Waveform
LCD_RS
RS
LCD_CS
CS
LCD_WR
WR
DAT
Graph 4.7.2. LCD Data Waveform
4. TROUBLE SHOOTING
START
No
Is the connection of
Reassemble LCD connector
TP1 with LCD connector ok ?
Yes
No
Check the Voltage Level of
Resoldering or Replace U302
TP5 is about Battery voltage ?
Yes
No
Check the Waveform of
Re-download & check the State of U101
EMI filter ?
Yes
No
Does LCD work properly ? Replace LCD module
Yes
LCD working well !
4. TROUBLE SHOOTING
4.8 Camera Trouble
Camera module(TP1)
TP2
Figure 4.8.1
4. TROUBLE SHOOTING
VCAMD_IO_1V8
VCAM_2V8
Beads are deleted (12/3)
VCAM_IOVDD
VCAM_DVDD
VCAM_AVDD
CN302 VCAMD & VIO are merged to VCAMD_IO_1V8 (10/31)
1 24
CAM_DATA07 2 23 I2C_SCL1
CAM_DATA06 3 22 I2C_SDA1
CAM_DATA05 4 21
CAM_DATA04 5 20 CAM_VSYNC
CAM_DATA03 6 19 CAM_HSYNC
CAM_DATA02 7 18 CAM_F_MCLK
CAM_DATA01 8 17
CAM_DATA00 9 16
CAM_F_PCLK 10 15
CAM_RESET 11 14
0.1u
0.1u
0.1u
CAM_PD 12 13
1u
1u
1u
2 2 2 2
(DIF_D8) 1 VA312 VA313
C315
C325
C316
C324
C317
C326
1 1 1 1
2
TP2
Camera(TP1) VDD28_CAM
(VIO_1V8)
CMHSYNC
CMVSYNC
CMMCLK
CMPCLK
CMDAT7
CMDAT6
CMDAT5
CMDAT4
CMDAT3
CMDAT2
CMDAT1
CMDAT0
CMPDN
CMRST
NCEB
W1
W6
W5
W3
W2
U3
B5
V4
V3
V6
V5
Y3
V2
Y4
Y1
CAM_VSYNC
CAM_RESET
NAND_RE_N
NAND_CS_N
CAM_DATA07
CAM_DATA06
CAM_DATA05
CAM_DATA04
CAM_PCLK
CAM_HSYNC
CAM_DATA03
CAM_DATA02
CAM_DATA01
CAM_DATA00
CAM_MCLK
CAM_PD
Figure 4.8.2
4. TROUBLE SHOOTING
START
No
Is state of the camera Replace the Camera
Module correct?
Yes
Check No
the each voltage Level of Check the state of
TP1(1.8V), TP2(2.8V), U101 (MT6255)
is right ?
Yes
No
Check the Waveform of Re-download & Check
I2C_CLK, I2C_DATA ? the state of U101
Yes
No
Check the Waveform of Re-download & Check
CAM_MCLK(24MHz) ? the state of U101
Yes
No
Check the Waveform Re-download & Check
Of Data pins the state of U101
Yes
No
Re-download & Check
Check the Waveform of filter ?
the state of U101
Yes
No
Does Camera work properly ? Replace the Camera or Change the board
Yes
Camera working well !
4. TROUBLE SHOOTING
4.9 Speaker Trouble
TP1
TP2
Figure 4.9.1
2
TP1
DNI C264
CN200
1
1
1 1
39pF
39pF
2 (6/20) 1810, 3T, spring

2 2
VA203
VA204
C215
C216
4. TROUBLE SHOOTING
VBAT
C200
2 C201
2.2u 0.1u Place 0.1uF close to AMP
1
TP2 DCR 60ohm --> 600 ohm (10/31) 2
D4
Changed (12/3)
DNI C264
Swapped (10/31) 1
SVDD
C5 FB201 600
OUT+
2 1 D5 FB202 600
OUT-
C204 2.2u C2
HS_R IN1-
C205 2.2u C1
HS_L IN1+
2 1 A2
C207 1u D2
IC401 HPL
A1
HS_OUT_L
IN2- HPR HS_OUT_R
C208 1u D1
IN2+
39pF
39pF
C206 1u D3
SPEECH_N IN3- 2
C211 1u C3 B5
SPEECH_P IN3+ CPVDD C266 C267
A3
C215
C216
CPVSS 0.1u 0.1u
1
A4 C214 2.2u
CP 2
1
A5
CN
HPVDD
BIAS
GND
R205 R206
SDA
SCL
VIO_1V8
C203 C217
1 20 20
B3
B2
B1
C4
B4
2.2u 2.2u 2
I2C_SCL2
2.2u
2.2u
I2C_SDA2
C218
C219
START < Cal l > START < Mp3>
No No Check the state of

Check the state of Replace/ Change TP2 (IC401)
TP2 (IC401)
Yes
Yes
No No
Check the state of Check the state of
Replace/ Change TP1 (SPK)
TP1 (SPK)
Yes
Yes
Speaker
Speaker Working well!!
Working well!!
4. TROUBLE SHOOTING
4.10 Earphone Trouble
TP1(J200)
TP2
Figure 4.10.1
4. TROUBLE SHOOTING
Close to Pin (8/8) Changed (12/3)
FM_ANT
C202 VA224
VIO_1V8 L200
8p 100n
(7/3) VA224 : need to check less than 5pF
R224
220K
Value changed (11/12)
R251
TP2 2 1800 1
JACK_DET
1K
FB200
close to 3.5pi conn

M6-GND
R208 5.6 FB210 1800 6
HS_OUT_R 1 2 M1-R
R209 1
TP1(J200)
5.6 FB211 1800
HS_OUT_L M4-DETECT
4D
(7/19) VA202 M4-L

VA200
C212 C213 1 VA2011 4
M5-MIC
56p 56p 5 J200
2 2
RS/CS (12/28)
(6/28)
C368
FB207
1800
VA205
Changed (10/31) 10n
Changed (9/25)
1 2
R256
Changed (12/3)
150
4. TROUBLE SHOOTING
START
No
Check connected Properly? Please, Reconnect The earphone
Yes
No
Is the TP2 (JACK DETECT) Check the state of soldering TP1
LOW?
Yes
Set the test instrument or

Play Continuous wave
No
Can you hear
Change the earphone and try again
the sound?
Yes
Set the test instrument

to echo mode
No
Can you hear
Change the earphone and try again
Your voice?
Yes
Earphone working well
4. TROUBLE SHOOTING
4.11 Receiver Trouble
TP1
TP2
Figure 4.11.1
2
TP1
DNI C264
CN200
1
1
1 1
39pF
39pF
2 (6/20) 1810, 3T, spring

2 2
VA203
VA204
C215
C216
4. TROUBLE SHOOTING
VBAT
C200
2 C201
1
TP2 DCR 60ohm --> 600 ohm (10/31) 2
D4
Changed (12/3)
DNI C264
Swapped (10/31) 1
SVDD
C5 FB201 600
OUT+
2 1 D5 FB202 600
OUT-
C204 2.2u C2
HS_R IN1-
C205 2.2u C1
HS_L IN1+
2 1 A2
C207 1u D2
IC401 HPL
A1
HS_OUT_L
IN2- HPR HS_OUT_R
C208 1u D1
IN2+
39pF
39pF
C206 1u D3
SPEECH_N IN3- 2
C211 1u C3 B5
SPEECH_P IN3+ CPVDD C266 C267
A3
C215
C216
CPVSS 0.1u 0.1u
1
A4 C214 2.2u
CP
2
1
A5
CN
HPVDD
BIAS
GND
R205 R206
SDA
SCL
VIO_1V8
C203 C217
1 20 20
B3
B2
B1
C4
B4
2.2u 2.2u 2
I2C_SCL2
2.2u
2.2u
I2C_SDA2
C218
C219
SETTING : After initialize Agilent 8960,Set the speech option at continuous wave.
Set the receiving volume of mobile as Max.
START
No
Check the state of Replace/ Change
TP2 (IC401)
Yes
No
Can you hear
Check the state of TP1
the sound?
Yes
Receiver will
work properly.
4. TROUBLE SHOOTING
4.12 Microphone Trouble
TP2 C228
TP1 C222
TP3
MIC200
Figure 4.12.1
4. TROUBLE SHOOTING
VMIC_BIAS_P
R216
1K
2
TP1
BB side place
2 C222 R218
10u
MIC side place
1 2.2K
1 2
TP2 Added (7/26)

TP3
C228 R220 L201 100n 11/5 Changed to 39pF
MIC_P
0.1u 100 1
2 C229 C263
2
47p 39p
C230
1 R222 L202 100n
(7/2)
MIC_N 1 2 MIC200
0.1u 100
2 VA206 VA207
R223 C231 C232
2.2K
Changed (7/26)
DNI DNI
1
Changed (12/28)
11/5 Added 1k
R286
1K
SETTING : After initialize Agilent 8960, set the speech option at loopback.
START
Check microphone sound hole
No
Make a phone call,
Check mic bias signal line
then check TP1 mic bias
Yes
No
Check the TP2 Change the microphone
Signal While talking to mic ( TP3, MIC200)
Yes
Microphone will work properly.
4. TROUBLE SHOOTING
4.13 SIM Card Interface Trouble

4.13.1 SIM1 Card Interface Trouble
TP1
J204
TP2
U202
4. TROUBLE SHOOTING
VSIM_4

TP1 J204
J204 R240
1 4 DNI
C1 C5
2 5 1 2
SIM_4_RST C2 C6
3 6
SIM_4_CLK
7
C3 C7
10
SIM_4_DATA
GND1 GND4
8 9
VA208 GND2 GND3
2 C241
VA209
2 C242 2 C243 2 C244 VA210
DNI DNI 1u DNI

1 1 1 1
VIO_1V8 VBAT VSIM_1VSIM1 VSIM_2 TP2

VSIM_3 VSIM_4 VSIM2
R284
R285
0
C239 C2372 2 C238

2.2u 2.2u 1u
1 1
1u
1u
2 2
U202
C259
C260
RST_N
1u
1u
C257
C258
1 1
SIM2 (SW)
23
19
Close to IC (10/12)
4
SYSRSTB
VIO
VBAT
R278 0
SIM_1_CLK
R279 0
SIM_1_RST VSIM1
R280 0 5
SIM2 (SW)
6
15 7
SIO1/GPIO3
8
SIM_1_DATA
14
VSIM2
3
SIM3 (SW)
13 2
SRST2/GPIO5
1
SIM_2_RST
SIO2/GPIO6
28
SIM_2_DATA
16
U202 VSIM3
27
SIM1 (SW) SIM4 (SW)
17 24
25
SIM_3_RST
R281 0 18 26
SIM_4_CLK
SIM_4_RST 20
CE0 VSIM4
9
R283 0
SIM1 (SW)
10
I2C_SCL2 21
SCL SRST4/GPIO11
11
SIM_4_RST
SIO4/GPIO12
12
SIM_4_DATA
I2C_SDA2 SDA
GND
22
29
In case of dual SIM

U202, C237, C238, C239, C257, C258, C259, C260 : DNI
In case of quad SIM

R278, R279, R280, R281, R282, R283, R284, R285 : DNI
4. TROUBLE SHOOTING
START
No
Does the SIM card Change the SIM Card.
Support 1.8V or 3V ? This phone supports 1.8V or 3V SIM card.
Yes
No
Is Voltage at the TP1 Is Voltage at the TP2
1.8V or 3V? 1.8V or 3V?
Yes
Resolder U202
Change the No No
Redownload SW.
SIM Card and try again.
Does it work Change the main board
Does it work
Properly?
Properly?
Yes Yes
SIM card is properly working SIM card is properly working.
4. TROUBLE SHOOTING
TP1
J201
TP2
U202
4. TROUBLE SHOOTING
VSIM_1

TP1 J201
J201
R267
1 4 DNI
C1 C5
2 5
SIM_1_RST C2 C6
3 6
7 10
GND1 GND4
8 9
VA228 GND2 GND3
VA229 C280 VA233
C279 C276 2 C277
DNI DNI 1u DNI
1
TP2
VIO_1V8 VBAT VSIM_1VSIM1 VSIM_2 VSIM_3 VSIM_4 VSIM2

R284
R285
0
C239 C2372 2 C238

2.2u 2.2u 1u
1 1
1u
1u
2 2
U202
C259
C260
RST_N
1u
1u
C257
C258
1 1
SIM2 (SW)
23
19
Close to IC (10/12)
4
SYSRSTB
VIO
VBAT
R278 0
SIM_1_CLK
R279 0
SIM_1_RST VSIM1
R280 0 5
SIM2 (SW)
6
15 7
SIO1/GPIO3
8
SIM_1_DATA
14
VSIM2
3
SIM3 (SW)
13 2
SRST2/GPIO5
1
SIM_2_RST
SIO2/GPIO6
28
SIM_2_DATA
16
U202 VSIM3
27
SIM1 (SW) SIM4 (SW)
17 24
25
SIM_3_RST
R281 0 18 26
SIM_4_CLK
SIM_4_RST 20
CE0 VSIM4
9
R283 0
SIM1 (SW)
10
I2C_SCL2 21
SCL SRST4/GPIO11
11
SIM_4_RST
SIO4/GPIO12
12
SIM_4_DATA
I2C_SDA2 SDA
GND
22
29
In case of dual SIM

U202, C237, C238, C239, C257, C258, C259, C260 : DNI
In case of quad SIM

R278, R279, R280, R281, R282, R283, R284, R285 : DNI
4. TROUBLE SHOOTING
START
No
Yes
No
Is Voltage at the TP1 1.8V or 3V? Is Voltage at the TP2 1.8V or 3V?
Yes
Resolder U202
Change the No No
Redownload SW.
SIM Card and try again.
Does it work Change the main board
Does it work
Properly?
Properly?
Yes Yes
4. TROUBLE SHOOTING
U202
TP1
TP2
J202
4. TROUBLE SHOOTING
VSIM_2

J202
TP1 J202
R268
1 4 DNI
C1 C5
2 5
SIM_2_RST C2 C6
3 6
SIM_2_CLK
7
C3 C7
10
SIM_2_DATA
GND1 GND4
8 9
VA234 GND2 GND3
VA235 C283 VA236
C281 C282 C284
DNI DNI 1u DNI
VIO_1V8
TP2 VBAT VSIM_1VSIM1 VSIM_2 VSIM_3 VSIM_4 VSIM2
R284
R285
0
C239 C2372 2 C238

2.2u 2.2u 1u
1 1
1u
1u
2 2
U202
C259
C260
RST_N
1u
1u
C257
C258
1 1
SIM2 (SW)
23
19
Close to IC (10/12)
4
SYSRSTB
VIO
VBAT
R278 0
SIM_1_CLK
R279 0
SIM_1_RST VSIM1
R280 0 5
SIM2 (SW)
6
15 7
SIO1/GPIO3
8
SIM_1_DATA
14
VSIM2
3
SIM3 (SW)
13 2
SRST2/GPIO5
1
SIM_2_RST
SIO2/GPIO6
28
SIM_2_DATA
16
U202 VSIM3
27
SIM1 (SW) SIM4 (SW)
17 24
25
SIM_3_RST
R281 0 18 26
SIM_4_CLK
SIM_4_RST 20
CE0 VSIM4
9
R283 0
SIM1 (SW)
10
I2C_SCL2 21
SCL SRST4/GPIO11
11
SIM_4_RST
SIO4/GPIO12
12
SIM_4_DATA
I2C_SDA2 SDA
GND
22
29
In case of dual SIM

U202, C237, C238, C239, C257, C258, C259, C260 : DNI
In case of quad SIM

R278, R279, R280, R281, R282, R283, R284, R285 : DNI
4. TROUBLE SHOOTING
START
No
Yes
No
Is Voltage at the TP1 1.8V or 3V? Is Voltage at the TP2 1.8V or 3V?
Yes
Resolder U202
Change the No No
SIM Card and try again. Redownload SW.
Does it work Does it work Properly? Change the main board
Properly?
Yes Yes
4. TROUBLE SHOOTING
U202
TP2
TP1
J203
4. TROUBLE SHOOTING
VSIM_3

TP1 J203
J203 R269
1 4 DNI
C1 C5
2 5 1 2
SIM_3_RST C2 C6
3 6
SIM_3_CLK
7
C3 C7
10
SIM_3_DATA
GND1 GND4
8 9
VA237 GND2 GND3
2 C285
VA238
2 C286 2 C287 2 C288 VA239
DNI DNI 1u DNI

1 1 1 1
VIO_1V8
TP2 VBAT VSIM_1VSIM1 VSIM_2 VSIM_3 VSIM_4 VSIM2
R284
R285
0
C239 C2372 2 C238

2.2u 2.2u 1u
1 1
1u
1u
2 2
U202
C259
C260
RST_N
1u
1u
C257
C258
1 1
SIM2 (SW)
23
19
Close to IC (10/12)
4
SYSRSTB
VIO
VBAT
R278 0
SIM_1_CLK
R279 0
SIM_1_RST VSIM1
R280 0 5
SIM2 (SW)
6
15 7
SIO1/GPIO3
8
SIM_1_DATA
14
VSIM2
3
SIM3 (SW)
13 2
SRST2/GPIO5
1
SIM_2_RST
SIO2/GPIO6
28
SIM_2_DATA
16
U202 VSIM3
27
SIM1 (SW) SIM4 (SW)
17 24
25
SIM_3_RST
R281 0 18 26
SIM_4_CLK
SIM_4_RST 20
CE0 VSIM4
9
R283 0
SIM1 (SW)
10
I2C_SCL2 21
SCL SRST4/GPIO11
11
SIM_4_RST
SIO4/GPIO12
12
SIM_4_DATA
I2C_SDA2 SDA
GND
22
29
In case of dual SIM

U202, C237, C238, C239, C257, C258, C259, C260 : DNI
In case of quad SIM

R278, R279, R280, R281, R282, R283, R284, R285 : DNI
4. TROUBLE SHOOTING
START
No
Yes
No
Is Voltage at the TP11.8V or 3V? Is Voltage at the TP2 1.8V or 3V?
Yes
Resolder U202
Change the No No
SIM Card and try again. Redownload SW.
Does it work Does it work Properly? Change the main board
Properly?
Yes Yes
4. TROUBLE SHOOTING
4.14 KEY backlight Trouble
TP6 TP3
TP1 TP4
C300
TP2 TP5
KEY BACKLIGHT
VBAT
2 C301 TP1 TP3 TP5

2 C300 C300
1u
1u
1
1 LD300 LD301 LD302 LD303 LD304 LD305
R357
R360
R361
R362
R363
R364
47
47
47
47
47
47
Changed (8/8) TP4 TP6

TP2
KEY_BL0
C319
1u
4. TROUBLE SHOOTING
START
No
VBAT = C300 ? Replace the main board
Yes
No
TP1, TP2,TP3,TP4,TP5,TP6
Check the state of LED or U100
is Lower than C300?
Yes
Backlight will work properly.
4. TROUBLE SHOOTING
4.15 Micro SD Trouble
TP2
TP1
4. TROUBLE SHOOTING
VIO_2V8
J301
1 8
2 7
3 6
MSD_CMD CMD VSS (7/3) R221 : 1Mohm
4 5 1M
9
VDD CLK
11
MSD_CLK
Changed (10/30) GND1 POL
10 12
VMMC_3V3 GND2 DET MSD_DET_N
C265
1u
VA324 VA325 VA326 VA321 VA322 VA323

Changed (12/29)
1u
1u
C270
C235
TP2
LCD Charge Pump

Changed (8/8)
VMMC_3V3
VFM_2V8
VIO_1V8
Changed (10/30)

VBAT
VBAT
2.2u
C360
2
2.2u
R351
C351
1 1K
21
11
14
12
3
SLUG_G
AGND
PGND
LDO2
LDO1
NC2
15
NC1 ENA
10 9
AVIN
U302 13
VOUT
20
19 6
LCD_LED_CA2 LED2
18
17 8
LED4 SCL I2C_SCL2
TP1
16 7
C2N
C1N
C2P
C1P
NP0 --> X7R (8/27)

2
2.2u
2.2u
C352 C353 2
2
33p
C354 C355
C356
C357
1u
1
1 (10V)
1u 1u
4. TROUBLE SHOOTING
START
No No
Micro SD Detect Is voltage of the TP1 VBat ?
OK?
Yes
Yes
Check the state of
Battery Voltage
No
Is voltage of the TP2 3.3V ?
Yes
Check the state of
U101
and Replace U302
Re-download SW
No
Is MC_CLK & Data Timing Correct? Re-download SW
Yes
Change the Micro SD Card
Micro SD Card will

work properly
4. TROUBLE SHOOTING
4.16 Bluetooth Trouble
TP1
TP2
FL402
4. TROUBLE SHOOTING
ANT100
B15
XOUT
A15
XIN
C15 X102
TESTMODE
VCO_MONITOR_BT
DVDD28_IO 1 2
SALNA_IN_N_FM
SALNA_IN_P_FM
(VIO_2V8) 32.768KHz
LNA_IN_N_FM
LNA_IN_P_FM
FC-135
TRXIQ_N_BT
TRXIQ_P_BT
RF2G_N_BT
RF2G_P_BT
2 C144 2 C145
RBIAS_BT
BPI_BUS0
BPI_BUS1
BPI_BUS2
BPI_BUS3
BPI_BUS4
BPI_BUS5
22p 22p
1 1
BT ANTENNA
AC10
AC11
G10
AA13
AB12
AB14
AB10
AB11
C11
U14
A12
B12
B11
Y13
V14
F11
(8/17) Removed
Changed (11/6) ANT100
FM_ANT CHANGED 1/2
L103 2.2n
1 3 C169 0.5p 1 2
IN OUT FEED GND
GND
(50ohm)
RF_ANT_SW1
RF_ANT_SW2
RF_PA_EN
C165 C166
C168
2.5p
R117
FL402 DSBTPTR2010
2
15K
DNI DNI
FL402 ANT100
component changed (9/10) CHANGED 7/27
TP1
TP2
(6/26)
1u
W11
C170
AVDD28_FM VFM_2V8
600
AA10
TP3
FB101
AVSS28_FM_1
AA11
changed (12/3)
AVSS28_FM_2
TP3
U13
GND_BT_1
T14
GND_BT_2
V13
GND_BT_3
W13
Close to IC
GND_BT_4 C101 0.1u
Y14
GND_BT_5 (X5R)
AA14
GND_BT_6 C102 10p
TP4
(X5R)
TP4
AC12
AVDD33_PA_BT VBT_3V1
C103 0.1u
V12 (X5R)
AVDD33_DC2DC_IN_BT VBT_3V1
- 104 -
W12
AVDD13_OUT_BT
AC14
AVDD13_SXAFE_BT C104 1u
AA12 (X5R)
AVDD13_TRX_BT
Close to IC
AB17
TEST4
AA17
W12,AC14,AA12: Star Connection

TEST3
Y17
TEST2
W17
TEST1
W22
AVDD28_HF VRF_2V8
C110 1n
AC15
Close to IC
AVDD28_LF VTCXO_2V8
C111 0.1u
AA15
DVDD28_IO VIO_2V8
C112 0.1u

4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
START
Check of BT Ant condition
No
A condition is good? Replace ANT100
Yes
Check condition of
matching components
(TP1, TP2)
No
A condition is good? Give the additory solder in TP1,TP2
Yes
No
Check Bias Voltage
Replace U101
VBAT at TP3, TP4
Yes
BT will
work properly
4. TROUBLE SHOOTING
4.17 FM Radio Trouble
J200
TP2
TP1
Close to Pin (8/8) Changed (12/3)
FM_ANT
C202 VA224
L200
8p 100n
(7/3) VA224 : need to check less than 5pF
TP1 TP2
2 1800 1
FB200
M6-GND
FB210 1800 6
1 2 M1-R
FB211 1800 1
M4-DETECT
VA202
4D
M4-L
J200
4
M5-MIC
5 J200
RS/CS (12/28)
(6/28)
C368
FB207
1800
VA205
10n
Changed (9/25)
1 2
R256
Changed (12/3)
150
G11
VDD28_FSRC VIO_2V8
B14
XOSC32_ENB
(B14)
GND
P18
AVSS28_ABB

AVDD_2V8
1u
(X5R)
C114
(Priority 2)
Close to IC
R21
AVDD28_ABB
Internal 32k : B14 -> VRTC

TP3
TP4
M20
AVDD18_AUD VIO_1V8
C105 2.2u
K22 (X5R)
AVSS12N_AUD
(Priority 2)
Close to IC
K21 C106 2.2u
AVSS18_AUD
(X5R)
(Priority 1)
Close to IC
TP4
TP3
U100
(6/26)
1u
W11
C170
AVDD28_FM VFM_2V8
600
AA10
FB101
AVSS28_FM_1
AA11
changed (12/3)
AVSS28_FM_2
U13
GND_BT_1
T14
GND_BT_2
V13
External 32k : B14 -> GNDGND_BT should connect together and then connect to main GND
GND_BT_3
W13
Close to IC
GND_BT_4 C101 0.1u
Y14
GND_BT_5 (X5R)
- 107 -
U100
AA14
GND_BT_6 C102 10p
(X5R)
AC12
AVDD33_PA_BT VBT_3V1
C103 0.1u
V12 (X5R)
AVDD33_DC2DC_IN_BT VBT_3V1
W12
AVDD13_OUT_BT
AC14
AVDD13_SXAFE_BT C104 1u
AA12 (X5R)
AVDD13_TRX_BT
Close to IC
AB17
TEST4
AA17

TEST3
Y17
TEST2
W17
TEST1
W22
AVDD28_HF VRF_2V8
C110 1n
AC15
Close to IC
AVDD28_LF VTCXO_2V8
C111 0.1u
AA15
DVDD28_IO VIO_2V8
C112 0.1u
V23
GND_RF_24
R15
GND_RF_1
R16
GND_RF_2
R17
GND_RF_3
R18
GND_RF_4
R19
GND_RF_5
T15

V23: need through hole to main GND

4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
START
Check of ear_jack condition
No
A condition is good? Replace J401
Yes
Check condition of
matching components
(TP1, TP2)
No
Give the additory
A condition is good? solder in TP1, TP2
Yes
No
Check Bias Voltage
Replace U101
TP3, TP4
Yes
FM_radio will work properly
5. DOWNLOAD
5. DOWNLOAD
TOOL INFORMATION
TOOL VERSION DLL NAME USB DRIVER
[LGFLASHv151]LGA395_20130319_ LG United Mobile Driver Version 3.6 Package
[LGFLASHv151]
Download Release 2011.11.01
Please Check the Version to “B2B”
H/W
Name Part No. SW
D/L Cable Micro 5P (56-open-910K) USB DLC RAD32167835 IM
5. DOWNLOAD
[LGFLASHv151]
A395
MS695
A395
MS695
5. DOWNLOAD
A395
MS695
[LGFLASHv151]LGA395_20130319_Download
[LGFlashTool1.3.77.21]LGMS695_20120208_Download
A395
[LGFLASHv151]
5. DOWNLOAD
5. DOWNLOAD
LGA395
5. DOWNLOAD
5. DOWNLOAD
5. DOWNLOAD
RAD32167835
5. DOWNLOAD
5. DOWNLOAD
5. DOWNLOAD
5. DOWNLOAD
5. DOWNLOAD
A395
5. DOWNLOAD
[LGFLASHv151]]LGA395_20130319_Download
LGA395_20130319.dll
LGMS695_20120208.dll
LGA395_130319
LGMS695_20120208
A395
MS695
[LGFLASHv151]LGA395_20130319_Download
A395-011-V10c-310-410-OCT-19-2011+0.im
MS695
A395
MS695
5. DOWNLOAD
LGA395 A395
LGA395 LGA395
A395
MS695
A395
MS695
5. DOWNLOAD
5. DOWNLOAD
5. DOWNLOAD
5. DOWNLOAD
A395
MS695
A395
MS695
5. DOWNLOAD
A395
MS695
A395
MS695
6. BLOCK DIAGRAM
6.Block diagram
A395 Block Diagram
A20_A395 1.3M FF Camera

Speaker/Rcv
Block Diagram HS_OUT MAIN PCB
SPK_RCV
Ear Jack
Audio Subsystem QUAD SIM

(Wolfson) RGB_LED_EN Indicator LED
VBAT
I2C Interface
I2C Interface
CAM I/F
FM_AUDIO
VIBBRATOR
SPEECH
HS
VBUS
Single Charger
MICRO
RT9536 1700/1500mAh
USB
JACK_HOOK_DET
FM_ANT
(LGC)
HP_MIC
Micro SD
USB_DM_UART_RX LCD(2.2”)
VUSB_LDO_4V9
USB_DP_UART_TX
MSD I/F
BLED_CA(0~3)
Charger
Pump LCD
(RichTek) INTERFACE
FM RADIO 27pin
LCD I/F
JTAG
JTAG I/F LNAND_D_[00~07]

RST_N
UART MT6255 (Tianma)
SIM 1 I/F Main MIC
BT_IN_OUT
SIM 2 I/F
SIM 1
KP_LED
DCXO KEY_COL(0~7)
HighBand_Rx
LowBand_Rx
HighBand_Tx
LowBand_Tx
KEY_ROW_(0~7)
SD I/F , LNAND I/F
26MHz End Key

32.768KHz MT6306
(Murata)
SIM 2
Filter
Crystal
BACKLIGHT
(MTK)
KEY
BT Antenna
Balun
Antenna SIM 3
SIM 4
RF Module MEMORY
NAND 1Gbits
DDRAM 256Mbits
(Hynix)
6. BLOCK DIAGRAM
■ A395 Block Diagram “RF/BT/FM”

A395 Block Diagram “Audio”
6. BLOCK DIAGRAM
A395 Block Diagram “Power”

■ A395 Block Diagram “Power”
AVDD_2V8 VTCXO_2V8
VA VTCXO
BATT_TEMP AVDD_2V8
BATON VA
VCORE_1V2
VCORE
VIO_1V8
VIO18
MT6255
VBAT AVDD43_VCORE
VIO_2V8
Battery Battery AVDD43_VRF VIO28
1500mAh Connector AVDD43_VA VRF_2V8
AVDD43_VD1 VRF
AVDD43_SPK VBT_3V1
AVDD43_LDOS VBT
VUSB_3V3
AVDD43_DRV AVDD33_USB
AVDD43_VCORE
DVSS43_SPK
VMEM_1V8 MCP
VCCIO18_EMI
1Gb NAND Flash
256Mbit DDR
VUSBLDO_4V9 VCHG
VBUS_USB VBAT
5pin u-USB
Connector
VMC_3V3 Micro SD
Single Charger VMC
RT9536
LCD
VIBR VIBR_3V0
MOTOR
VBAT
KEY LED KEY_BL
KPLED MICBIAS0 VMIC_BIAS_P
MIC
MT6255 VBAT
VBAT
Audio
Sub System
VSIM1 VSIM I2C P/U IC401
VIO_1V8
3.5Phi
SIM
Controller VIO18 Ear Jack
MT6203
MT6255
VFM_2V8 FM Radio
Backlight Charge Pump
VBAT RT9367 VCAMD
RLED_EN
ISINK0
GLED_EN
Message
Blinker BLED_EN
ISINK1
RF Module Camera
ISINK2
VCAMA VCAMA Module
VCAMIO_1V8 VCAMIO_1V8
6. BLOCK DIAGRAM
A395 Block
A395 BlockDiagram
Diagram “I2C” “I2C”
I2C_SCL2 DAIPCMIN
SIM I2C_SDA2
Controller DAIRST
MT6203
SCL I2C_SCL1
Camera
SDA I2C_SDA1
Module
MT6255
I2C_SCL2
Backlight Charge Pump
RT9367
I2C_SDA2
Audio I2C_SCL2
Sub System
IC401
I2C_SDA2
6. BLOCK DIAGRAM
■ A395 Block Diagram “LCD”

A395 Block Diagram “LCD”
LNAND_D_[00]
NLD0
LNAND_D_[01]
NLD1 EMI FILTER
LNAND_D_[02] SFEY0012501
NLD2
LNAND_D_[03]
NLD3
LNAND_D_[04]
NLD4 LNAND_D_[05]
NLD5
LNAND_D_[06] EMI FILTER
NLD6 SFEY0012501
LNAND_D_[07]
NLD7
LCD_RS
LPA0
LCD_CS_N LCD
LPCE0B
MT6255 LWRB
LCD_WR_N
EMI FILTER
SFEY0012501 - 2.2” QVGA
LCD_VSYNC
LPTE
LCD_ID
LSA0
LCD_RD_N
RLDB
LCD_RST_N
LRSTB
6. BLOCK DIAGRAM
■ A395 Block Diagram “Camera”

A395 Block Diagram “Camera”
CAM_VSYNC CAM_VSYNC
CMVSYNC EMI FILTER
SFEY0015501
CAM_HSYNC CAM_HSYNC
CMHSYNC
CAM_DATA[0] CAM_DATA[0]
CMDAT0
CMDAT1 CAM_DATA[1] EMI FILTER CAM_DATA[1]
CAM_DATA[2] SFEY0015501 CAM_DATA[2]
CMDAT2
CMDAT3
CMDAT4
CMDAT5
CAM_DATA[6] EMI FILTER
MT6255 CMDAT6 CAM_DATA[6]
SFEY0015501 1.3M Camera
CMDAT7
I2C_SCL1
SCL
I2C_SDA1
SDA
CAM_PWDN
CMPDN
CAM_MCLK
CMMCLK
CAM_PCLK
CMPCLK
CAM_RST_N
CMRST
7. CIRCUIT DIAGRAM
7. CIRCUIT DIAGRAM
MT6255 MEMORY
VCAMD_IO_1V8
Name changed (10/30)
VFM_2V8
VCORE_1V2
VTCXO_2V8
AVDD_2V8
VMMC_3V3
VBT_3V1
VBT_3V1
VRF_2V8
VIO_1V8
VIO_1V8
VIO_1V8
VIO_1V8
VIO_2V8
VIO_1V8
VIO_2V8

VIO_1V8 Changed to Memory Hynix 1G/256Mb (9/25)
VBAT
Close to IC Close to IC
Close to IC
FB101 Close to IC U100
(Priority 2) Close to IC
(Priority 2)
(7/3) FB102 -> delete (Priority 1) changed (12/3) Close to IC
A8 J4
2.2u
0.1u
SD_A_[00]
0.1u
0.1u
VDD1 A0
1u
10p
2.2u
2.2u
C114 C155 2.2u C1 K1
600 SD_A_[01]
0.1u
Close to IC VDD2 A1
1u
Close to IC
0.1u
0.1u
C156 0.1u G1 K2
C107
C160
1u
1n
SD_A_[02]
C101
C102
C103
1u VDD3 A2
(X5R)
(X5R)
(X5R)
(X5R)
(X5R)
C104
(X5R)
2
C105
G10 K3
(X5R)
(X5R) V23: need through hole to main GND C157 0.1u
C106
SD_A_[03]
C150
C170 deleted (12/28) VDD5 A3
(X5R)
C108
C110
C111
C112
C158 0.1u L1 B2
C109
(X5R)
1u VDD4 A4 SD_A_[04]
0.1u
2.2u
FB103 (6/26) N8 C2
VDD6 A5 SD_A_[05]
(6.3V,X5R)
GND D1
220 A6 SD_A_[06]
C151
B9 C3
C115
VDDQ1 A7 SD_A_[07]
C10 D2
AC12
AC14
AC15
AC23
AC24
AA10
AA11
AA14
AA12
AB17
AA17
AA15
W11
W13
W12
W17
W22
W18
W20
SD_A_[08]
M20
AC2
G14
G12
AA6
G11
VDDQ6 A8
R21
U13
R15
R16
R17
R18
R19
U15
U16
U17
U18
U19
U21
U22
B24
B14
P18
K22
K21
V13
Y14
V12
Y17
V23
V15
V19
V20
Y16
Y18
Y20
A19
A20
F15
T14
T15
T17
T19
M9
G6
H6
N6
R6
U1
B1
V8
V7
K6
P6
F6
D9 C4
J6
Close to IC VDDQ5 A9 SD_A_[09]
E10 J3
1u
NC5
NC6
VCCK12_CORE_1
VCCK12_CORE_2
VCCK12_CORE_3
VCCK12_CORE_4
VDD28_CAM
VDD33_MC1
VDD33_MC2
VDD18_IO
VDD18_LCD
VCCIO18_EMI_1
VCCIO18_EMI_2
VCCIO18_EMI_3
VCCIO18_EMI_4
VCCIO18_EMI_5
VCCIO18_EMI_6
GND_23
VDD28_FSRC
XOSC32_ENB
AVSS28_ABB
AVDD28_ABB
AVDD18_AUD
AVSS12N_AUD
AVSS18_AUD
AVDD28_FM
AVSS28_FM_1
AVSS28_FM_2
GND_BT_1
GND_BT_2
GND_BT_3
GND_BT_4
GND_BT_5
GND_BT_6
AVDD33_PA_BT
AVDD33_DC2DC_IN_BT
AVDD13_OUT_BT
AVDD13_SXAFE_BT
AVDD13_TRX_BT
TEST4
TEST3
TEST2
TEST1
AVDD28_HF
AVDD28_LF
DVDD28_IO
GND_RF_24
GND_RF_1
GND_RF_2
GND_RF_3
GND_RF_4
GND_RF_5
GND_RF_6
GND_RF_7
GND_RF_8
GND_RF_9
GND_RF_10
GND_RF_11
GND_RF_12
GND_RF_13
GND_RF_14
GND_RF_15
GND_RF_16
GND_RF_17
GND_RF_18
GND_RF_19
GND_RF_20
GND_RF_21
GND_RF_22
GND_RF_23
SPK_P
SPK_N
NC7
NC8
NC9
VDDQ4 A10 SD_A_[10]
F9 E2
A23 VDDQ10 A11 SD_A_[11]
NC3 H10 E1
VDDQ9 A12 SD_A_[12]
C121
(10V,X5R)
1u
1u
1u
A24
RTC Cap NC4 J9 H3

2 2 SD_BA_[0]
(10V,X5R)
(10V,X5R)
VDDQ2 BA0
(10V,X5R)
A1 K9 J2
NC1 VDDQ8 BA1 SD_BA_[1]
A2 R4 L10
C149
C118
C120
1 1 NC2 EA0 SD_A_[00] VDDQ7
(B14) U4 M9 K4
VRTC_2V8 STAR GND
A18
VCCIO_EMI EA1
T5
SD_A_[01] VDDQ3 DQ0 SD_D_[00]
External 32k : B14 -> GNDGND_BT should connect together and then connect to main GND K5
F24
AVDD43_VCORE
Internal 32k : B14 -> VRTC (VIO_1V8) EA2
R5
SD_A_[02] DQ1 SD_D_[01]
AVDD43_VRF EA3 K6
F23 G5
SD_A_[03] DQ2 SD_D_[02]
AVDD43_VA EA4 A2 K7
B22 H5
SD_A_[04] NC27 DQ3 SD_D_[03]
AVDD43_VD1 EA5 D4 J8
R103 D24 U5
SD_A_[05] NC20 DQ4 SD_D_[04]
AVDD43_VD2 EA6 D6 K8
B20 H4
SD_A_[06] NC21 DQ5 SD_D_[05]
1K DVDD43_SPK EA7 E3 J7
E21 J4
SD_A_[07] NC9 DQ6 SD_D_[06]
AVSS43_LDOS EA8 E4 J5
A16 H3
SD_A_[08] NC19 DQ7 SD_D_[07]
Local GND with C141 GND (7/27) AVSS43_DRV EA9 E5 E6
C18 P3
SD_A_[09] NC8 DQ8 SD_D_[08]
AVSS43_VCORE EA10 E7 C5
B19 K4
SD_A_[10] NC11 DQ9 SD_D_[09]
C172 C173
DVSS43_SPK EA11 E8 D8
L3
SD_A_[11] NC12 DQ10 SD_D_[10]
1u DNI
EA12 F1 C6
L10 L1
SD_A_[12] NC17 DQ11 SD_D_[11]
GND_1 EA13 F3 C8
Changed (7/27) L11 N4 SD_A_[13] NC18 DQ12 SD_D_[12]
GND_2 EA14_RD_B F4 C7
L12 P4
SD_BA_[0] NC7 DQ13 SD_D_[13]
GND_3 EA15 F5 B8
L13
SD_BA_[1] NC16 DQ14 SD_D_[14]
GND_4 F6 B7
L14 T3 NC25 DQ15 SD_D_[15]
GND_5 ED0 F7
L15 T2
SD_D_[00] NC6
GND_6 ED1 G3 G8
SD_D_[01]
U101
M10 R2 NC10 CLK# SD_CLKN
RTC BATTERY 22uF --> 44uF (10/30) GND_7 ED2 G4 F8
M11 T1
SD_D_[02] NC5 CLK SD_CLKP
10V --> 6.3V (12/28) GND_8 ED3 G5 D3
44uF --> 1uF (1/29) M13 R3
SD_D_[03] NC13 CKE SD_CKE
GND_9 ED4 G6 H2
M15 P1
SD_D_[04] NC14 CS# SD_CS_N
GND_10 ED5 G7 F2
N10 P2
SD_D_[05] R156: memory dependant NC4 RAS# SD_RAS_N
GND_11 ED6 H4 G2
N12 N1
SD_D_[06] NC2 CAS# SD_CAS_N
GND_12 ED7 H5 J1
N14 K2
SD_D_[07] NC24 WE# SD_WR_N
GND_13 ED8 SD_A_[13] H6 D7
N15 K3
SD_D_[08] NC22 UDQM SD_DQM_1
GND_14 ED9 J6 H8
P10 J2
SD_D_[09] NC23 LDQM SD_DQM_0
GND_15 ED10 L3 D5
P11 J3
SD_D_[10] NC15 UDQS SD_DQS_1
GND_16 ED11 L4 H7
P12 G1
SD_D_[11] VIO_1V8 NC3 LDQS SD_DQS_0
GND_17 ED12 SD_D_[12] Name changed (12/28)
P13 H1
GND_18 ED13 SD_D_[13]
P14 G2
Added (8/13) GND_19 ED14 SD_D_[14]
U9 H2 C153 2.2u A5 M1
VUSB_LDO_4V9
VUSB_LDO_4V9
GND_20 ED15 SD_D_[15] VCC1 IO0 LNAND_D_[00]

U2 C154 0.1u M5 M2
GND_21 VCC2 IO1 LNAND_D_[01]
N2 M3
EDQM0 SD_DQM_0 IO2 LNAND_D_[02]
E18 K1 L5
SIM2_CLK SCLK2 EDQM1 SD_DQM_1 IO3 LNAND_D_[03]
D20 P5 N7
SIM2_DATA SIO2 EDQS0 SD_DQS_0 IO4 LNAND_D_[04]
C20 K5 L6
SIM2_RST SRST2 EDQS1 SD_DQS_1 IO5 LNAND_D_[05] Name changed (12/28)
D19 M5 A9 M6
SIM_CLK SCLK EDCLK_ECCLK SD_CLKP VSS1 IO6 LNAND_D_[06]
E19 L5 B1 L8
SIM_DATA D18
SIO EDCLK_B_FB_CLK
L4
SD_CLKN VSS4 IO7 LNAND_D_[07] VIO_1V8
SRST ECKE B5 N2
SIM_RST M2
SD_CKE VSSn2 IO8 LNAND_D_[08]
Close to IC
ECAS_ADV_B B10 N3
R105 R106 H20 M4
SD_CAS_N VSSQ5 IO9 LNAND_D_[09]
RESETB ERAS_WAIT_B C9 M4
RST_N G21 L2
SD_RAS_N VSSQ4 IO10 LNAND_D_[10]
R108 1K
PWRKEY EWR_B D10 N4
END_KEY SD_WR_N VSSQ9 IO11 LNAND_D_[11]
7.5K 330k 1 C126 1u 2 F20 M3 E9 N5
VREF ECSM0_B SD_CS_N VSSQ8 IO12 LNAND_D_[12]
C125 F21 N3 F10 M7 R151 : 47K ???
4.7K
4.7K
AVSS43_VRF ECSBOOTM1_B VSSQ3 IO13 LNAND_D_[13]
330p
J22 G9 L7
PMU_TESTMODE VSS2 IO14 LNAND_D_[14]
H1 M8
LNAND_D_[15]
R151
R152
VBAT G20 VSS3 IO15
H9
VTCXO_2V8
C124 R107 VCDT VSSQ10

C123
VCAM_2V8
AVDD_2V8
H22 J10 A6
CHRLDO TP100
VRF_2V8
G22 VSSQ1 CE# NAND_CS_N

220p VDRV K10 A3 TP101
2.2u 51K J21 VSSQ2 RE# NAND_RE_N
Close to IC ISENSE L2 A7 TP102
H23 AB21 VSS5 WEn# NAND_WR_N
BATON LB_P L9 A4 TP103
Close to IC BATT_TEMP J20 AB20 LB_RxP VSSQ6 CLE NAND_CLE_N
BATSNS LB_N M10 B4 TP104
C159 1u AB22 LB_RxN VSSQ7 ALE NAND_ALE_N
HB_P N6 B3
HB_RxP
NC26
NC28
NC29
VSSn1 WP# NAND_WP_N
NC1
E22 AA22 N9 B6
VRF HB_N HB_RxN VSS7 R/B# NAND_BSY_N
G23
VTCXO
G24
N1
N10
A1
A10
Name changed (10/30) VA
F22 W23
VCAMA TXO_LB LowBand_Tx
VCAMD_IO_1V8
W24
TXO_HB HighBand_Tx
B16
2.2u
2.2u
VCORE_1V2
ISINK5
1u
1u
VUSB_3V3
C16 AA16
VRTC_2V8
ISINK4 CLK_SEL
VMC_3V3
VIBR_3V0
X101
VBT_3V1
VIO_2V8
VIO_1V8
Close to IC D15
C127
C128
C129
C130
ISINK3
VSIM2
VSIM1
(X5R) E17 AC16 1 2

EARMIC_BIAS
BLED_EN ISINK2 XTAL1 4 3
D16 AB16
GLED_EN ISINK1 XTAL2 VMIC_BIAS_P
E16 TSX-3225 26MHZ_7_4PF
RLED_EN ISINK0
C17 W15 26MHz
KEY_BL0 KPLED FREF
D101
Close to IC L102 B18 U23
2.2u
VCORE MICBIAS1
D17 P23
VCORE_FB MICBIAS0
VCORE_FB is connected 7/25 C132
D21
E23
D22
VBT
VIO18
N20
1u JTAG, UART Debug Interface
VIO28 AU_VIN1_P HP_MIC_P
TP107 A21 N19
VMC AU_VIN1_N HP_MIC_N
D23 P22
VUSB AU_VIN0_P MIC_P
C23 P21
VCAMD AU_VIN0_N MIC_N
C21
VSIM
B21 M24
39p
39p
39p
39p
VSIM2 AU_HSP SPEECH_P
B23
VIBR AU_HSN
M23 VIO_1V8
L23 SPEECH_N
AU_HPL HS_L
C133
C134
C135
C136
C22 L24
VRTC AU_HPR HS_R CN101
1u C142
VBAT
AA3 L20
C138 C131 C171 C163 C137 C139C140 C141 EINT0 AU_FLYP 1 14
AA2 K20 (X5R)
Changed (8/8) AB1 EINT1 AU_FLYN
0.1u 1u 1u 1u 1u 2.2u 1u 4.7u Close to IC
BATT_ID_PU EINT2 Priority1 2 13
AB3
Changed (10/12) EOC EINT3
Close to IC AB2 P20 JTAG_TCK JTAG_TMS
JACK_DET EINT4 VDD18_IO APC RF_TX_RAMP 3 12
V11 P24
BATT_ID EINT5 (VIO_1V8) ACCDET HOOK_DET
Added (10/12) JTAG_TDO JTAG_TRST_B
Local GND with C121 GND (7/27) Changed (8/8) 4 11
A9
UART_RX URXD1
B9 U24 JTAG_TDI JTAG_RTCK
UART_TX UTXD1 AUXIN6 PCB_REV 5 10
E10 R20 Changed (8/27)
VUSB_3V3 VCAMD_IO_1V8 UCTS1 AUXIN7 ACC_ID
C9
Name changed (10/30) URTS1 6 9
F10 T24
URXD2 DVDD28_IO XM
G9 T23 UART_TX
MSD_DET_N UTXD2 (VIO_2V8) XP 2.2K 7 8
R23
600
YM
F2 T22 R113 RST_N UART_RX
R115 R116 USB_DP USB_DP YP 2.2K VIO_1V8
E2 VA101
USB_DM
FB104
USB_DM AB4
deleted (12/28) UART added (8/15)
2.2K 2.2K R114
DAICLK
F4
AVDD33_USB
VDD18_IO DAIPCMOUT
AC3
G3
GND_22
(VIO_1V8) DAIPCMIN
AB5
I2C_SCL2
1u
AC4
DAIRST I2C_SDA2
Y2 Y6
I2C_SCL1 SCL VDD28_CAM DAISYNC
C143
AA1
I2C_SDA1 SDA (VIO_2V8) B15
XOUT
NAND_WP_N
W9
WATCHDOG
VDD18_IO XIN
A15
(VIO_1V8) TESTMODE
C15 X102
B10 DVDD28_IO
VCO_MONITOR_BT
SPI_CS_N VDD28_CAM VDD18_IO VDD33_MC1 VDD33_MC2 DVDD28_IO 1 2
D10 (VIO_2V8)
SALNA_IN_N_FM
SALNA_IN_P_FM
SPI_SCK (Y5:KCOL0)
A10 (VIO_1V8) (VIO_1V8) (VMC_3V3) (VIO_1V8) (VIO_2V8) 32.768KHz
LNA_IN_N_FM
LNA_IN_P_FM
Not pull-down, just floating or PU FC-135
PCB REV.1.0 (12/28) SPI_MOSI
TRXIQ_N_BT
TRXIQ_P_BT
RF2G_N_BT
RF2G_P_BT
C10
VDD18_LCD (VIO_1V8) 2 C144 2 C145
MC1CK_FB
ADC table is changed (12/28)

CMHSYNC
CMVSYNC
SPI_MISO
RBIAS_BT
BPI_BUS0
BPI_BUS1
BPI_BUS2
BPI_BUS3
BPI_BUS4
BPI_BUS5
AVDD_2V8
CMMCLK
JTRST_B
MC1CM0
MC2CM0
CMPCLK
CMDAT7
CMDAT6
CMDAT5
CMDAT4
CMDAT3
CMDAT2
CMDAT1
CMDAT0
MC1RST
MC1DA0
MC1DA1
MC1DA2
MC1DA3
MC2DA0
MC2DA1
MC2DA2
MC2DA3
22p 22p
LPCE2B
LPCE1B
LPCE0B
CMPDN
KROW5
KROW4
KROW3
KROW2
KROW1
KROW0
CMRST
MC1CK
MC2CK
KCOL6
KCOL5
KCOL4
KCOL3
KCOL2
KCOL1
KCOL0
LRSTB
JRTCK
NLD17
NLD16
NLD15
NLD14
NLD13
NLD12
NLD11
NLD10
1 1
NWEB
LWRB
NRNB
NREB
NCEB
LRDB
NCLE
LSCK
LSDA
NALE
JTMS
JTDO
NC10
NLD9
NLD8
NLD7
NLD6
NLD5
NLD4
NLD3
NLD2
NLD1
NLD0
LPTE
JTCK
LSA0
LPA0
JTDI
OJ100 OJ101 OJ102OJ103 OJ104

BT ANTENNA 1 1
W1
W6
W5
W3
W2
W7
W8
W10
AC1
AC6
AC7
AC9
AC10
AC11
AA5
AB6
AB7
AB8
AA7
AA8
AA4
AB9
AA9
G13
G10
D9
C8
C7
C6
D2
C3
D1
D7
D4
C1
D6
C2
D3
C5
C4
U3
AA13
AB12
AB14
AB10
AB11
C14
D13
C13
C12
D12
C11
U14
B8
E9
E7
B7
A7
B6
A6
E4
E6
E1
B3
B2
E5
B4
A4
A3
B5
V4
V3
V6
V5
Y3
V2
Y4
Y1
Y5
Y7
Y9
Y10
E15
E13
B13
A13
E12
A12
B12
B11
Y13
V14
F8
F9
F5
F13
F14
F12
F11
(8/17) Removed
R161
150K
R1
Changed (11/6) ANT100
Deleted Added FM_ANT CHANGED 1/2
(10/12) (10/12) L103 2.2n
PCB_REV 1 3 C169 0.5p 1 2
LCD_RD_N
LCD_WR_N
LCD_CS_N
LCD_RST_N
IN OUT
LCD_VSYNC
LCD_RS
FEED GND
LCD_ID
TP105
TP106
GND
CAM_VSYNC
(50ohm)
CAM_RESET
KEY_COL0
NAND_BSY_N
NAND_CLE_N
NAND_ALE_N
NAND_WR_N
NAND_RE_N
NAND_CS_N
CAM_DATA07
CAM_DATA06
CAM_DATA05
CAM_DATA04
CAM_PCLK
CAM_HSYNC
CAM_DATA03
CAM_DATA02
CAM_DATA01
CAM_DATA00
CAM_MCLK
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_ROW1
KEY_ROW0
KEY_COL4
KEY_COL3
KEY_COL2
KEY_COL1
JTAG_RTCK
JTAG_TRST_B
RF_ANT_SW1
RF_ANT_SW2
RF_PA_EN
JTAG_TCK
JTAG_TDI
JTAG_TMS
JTAG_TDO
CHG_EN
C168
R162
150K
R2 (1%)
CAM_PD
C165 C166
LNAND_D_[15]
LNAND_D_[14]
LNAND_D_[13]
LNAND_D_[12]
LNAND_D_[11]
LNAND_D_[10]
LNAND_D_[09]
LNAND_D_[08]
LNAND_D_[07]
LNAND_D_[06]
LNAND_D_[05]
LNAND_D_[04]
LNAND_D_[03]
LNAND_D_[02]
LNAND_D_[01]
LNAND_D_[00]
R117
FL402 DSBTPTR2010 2.5p
2
15K
MSD_CMD
MSD_CLK
MSD_D[0]
MSD_D[1]
MSD_D[2]
MSD_D[3]
DNI DNI
(PWM)
component changed (9/10) CHANGED 7/27
7. CIRCUIT DIAGRAM
AUDIO SUBSYSTEM
MAIN MICROPHONE 3.5phi HEADSET
VBAT
(10/29) U200 : TPA2058 -> WM9093

C200 Close to Pin (8/8) Changed (12/3)
2 C201
FM_ANT
1
VMIC_BIAS_P
C202 VA224
VIO_1V8 L200
DCR 60ohm --> 600 ohm (10/31) 2 8p 100n
D4
Changed (12/3) (7/3) VA224 : need to check less than 5pF
DNI C264
Swapped (10/31) 1 CN200 1
SVDD
1
R216
1K
C5 FB201 600
OUT+
D5
R224
220K
2 1 OUT-
FB202 600
2 2 Value changed (11/12)
C204 2.2u C2
HS_R IN1-
C205 2.2u C1
HS_L 2 1
IN1+
A2 BB side place
C207 1u D2
IC401 HPL
A1
HS_OUT_L 2 C222 R218 MIC side place R251 2 1800 1
IN2- HPR HS_OUT_R 10u JACK_DET
C208 1u D1 2.2K 1K
IN2+ 1 1 2 FB200
1 1
39pF
39pF
C206 1u D3
SPEECH_N IN3- 2 (6/20) 1810, 3T, spring Added (7/26)
C211 1u C3 B5
SPEECH_P IN3+ CPVDD C266 C267 2 2 C228 11/5 Changed to 39pF
A3
VA203
VA204
L201 100n
C215
C216
R220
CPVSS 0.1u 0.1u
1 MIC_P close to 3.5pi conn
A4 C214 2.2u
CP 0.1u 100 1 M6-GND
2
1
A5 2 C229 C263 R208 5.6 6
CN
HPVDD
FB210 1800
47p
2 HS_OUT_R 1 2 M1-R
39p R209 1
BIAS
GND
5.6 FB211 1800
HS_OUT_L
SDA
R205 R206
SCL
C230 M4-DETECT
VIO_1V8 1 R222 L202 100n
(7/2) 4D
MIC_N 1 2 MIC200
C203 C217
1 20 20
0.1u 100 (7/19)
VA200 VA201 VA202 M4-L
B3
B2
B1
C4
B4
2 VA206 VA207 C212 C213 1 1 4
M5-MIC
R223 C231 C232 56p 56p 5
2.2u 2.2u 2 2.2K J200
I2C_SCL2 Changed (7/26) 2 2
2.2u
2.2u DNI DNI

1 RS/CS (12/28)
I2C_SDA2 Changed (12/28) (6/28)
C218
C219
C368
FB207
1800
VA205
Changed (10/31) 10n
Changed (9/25)
1 2
11/5 Added 1k
R286
1K
Changed (7/26)
EARMIC_BIAS
R256
Changed (12/3)
150
BB side place 2 C292
39p
R217
1.5Kohms
1
C223 R254
HP_MIC_N 1 2
0.1u 1
2 C224 2
USB IO
R219
BATTERY CONNECTOR
39p 2.2Kohms
C225
1 R255 1 R266
HP_MIC_P 1 2 HOOK_DET
0.1u 1 1K
VBUS_USB C226
2 C293 2.2u
VBAT 39p Changed (7/26)

AVDD_2V8 1
Line Width: 2mm
Added for low voltage surge (12/3)

R275 CHANGED (8/21)
(7/19) ZD300 : 150mW->500mW ???
Changed (8/28) 240K C269 C268 Changed (10/12) Changed (7/26)
D202
1u 22pF CN201
6
2
7
AVDD_2V8 ZD300
8 C304 C365
Changed (8/27) 25V --> 50V (9/10) Line Width: 2mm 1
C297 C321
USB_DM 2 33u 33u 22p 100p 1

3
USB_DP R300
SIM
(1%, F)
SIM connectors are changed to a new part (10/31)
4 D2
ACC_ID 5
240K
R320 4
D201 9 VSIM_1
BATT_TEMP
4
C272 CHANGED (10/12)

C295 1K 3
10
ID
DP
DM
VBUS
R272 2
11 C318 C296
MTK recommend (9/10) 0.1u 22p VA241 BATT_ID 1
100
GND1
GND2
VA240
D1
1u 39p
R273
CN300
4.7K
component changed (9/10) J201
5
R267
1 4 DNI
C1 C5
2 5
BATT_ID_PU SIM_1_RST C2 C6
3 6
Changed for Low voltage surge (12/3)
7 10
BATTERY ID CIRCUIT (8/8) 8
GND1 GND4
9
VA228 GND2 GND3
VA229 C280 VA233
C279 C276 2 C277
DNI DNI 1u DNI
1
4.2V & 4.35V Single Charger Quad SIM Controller Deleted for Dual SIM
VSIM_2
Changed for Quad SIM (10/12)
Added for Dual SIM (10/12) Changed for Dual SIM (11/9) SIM3 (SW must be careful)
(10/12) changed from MINIABB to single charger VIO_1V8 VBAT VSIM_1VSIM1 VSIM_2 VSIM_3 VSIM_4 VSIM2
J202
R268
1 4 DNI
C1 C5
2 5
SIM_2_RST C2 C6
R284
R285
3 6
0
C239 C2372 2 C238 SIM_2_CLK
7
C3 C7
10
SIM_2_DATA
2.2u 2.2u 1u GND1 GND4
8 9
1 1 VA234 GND2 GND3
VA235 C283 VA236
C281 C282 C284
1u
1u
2 2
C259
C260
RST_N DNI DNI 1u DNI
1u
1u
C257
C258
1 1
SIM2 (SW)
23
19
Close to IC (10/12)
4
SYSRSTB
VIO
VBAT
R278 0
SIM_1_CLK
R279 0
VUSB_LDO_4V9 VBUS_USB VBAT VIO_1V8 SIM_1_RST VSIM1
R280 0 5
SIM_1_DATA SCLK1/GPIO1 SIM_1_CLK VSIM_3
SIM2 (SW)
6
15 7
SIO1/GPIO3
8
SIM_1_DATA
14
VSIM2
3
SIM_DATA
R271
100K
11 SIMIO1/GPI15 SCLK2/GPIO4 SIM_2_CLK

SIM3 (SW)
PGND 13 2
1
VIN BATT
10 SRST2/GPIO5
1
SIM_2_RST J203 R269
DNI
2
ISET U204 PGB
9 SIO2/GPIO6
28
SIM_2_DATA 1
C1 C5
4
3 8 SIM2_CLK SIMCLK2/GPI16 2 5 1 2
4
GND1 CHGSB
7
EOC 16
U202 VSIM3
SIM_3_RST
3
C2 C6
6
LDO GND2
SIM2_RST
27 SIM_3_CLK C3 C7 SIM_3_DATA
5 6 SIMRST2/GPI17 SCLK3/GPIO7 SIM_3_CLK 7 10
CHG_EN
SIM1 (SW) SIM4 (SW)
IEOC EN_SET 17 24 GND1 GND4
25
SIM_3_RST 8
GND2 GND3
9
VA237 VA238
2 C287 VA239
C289 18 26 2 C285 2 C286 2 C288
R276
R277
R274
C275 R281 0
SIM_4_CLK
DNI
820
3K
0.1u 0.1u R282 0 Added for Quad SIM (10/12) DNI DNI 1u DNI
SIM_4_RST 20
CE0 VSIM4
9 1 1 1 1
R283 0
SIM1 (SW)
10
I2C_SCL2 21
SCL SRST4/GPIO11
11
SIM_4_RST
SIO4/GPIO12
12
SIM_4_DATA
50V internal voltage (10/31) I2C_SDA2 SDA
GND
22
VSIM_4
29
J204 R240
In case of dual SIM 1 4 DNI
C1 C5
R278, R279, R280, R281, R282, R283, R284, R285 : Install 2 5 1 2
SIM_4_RST C2 C6
U202, C237, C238, C239, C257, C258, C259, C260 : DNI 3 6
SIM_4_CLK
7
C3 C7
10
SIM_4_DATA
GND1 GND4
In case of quad SIM 8 9
GND2 GND3
R278, R279, R280, R281, R282, R283, R284, R285 : DNI VA208 VA209
2 C243 VA210
U202, C237, C238, C239, C257, C258, C259, C260 : Install 2 C241 2 C242 2 C244
DNI DNI 1u DNI
1 1 1 1
7. CIRCUIT DIAGRAM
LCD Charge Pump LCD INTERFACE CONNECTOR

SD Header Socket VIBRATOR Changed (8/8)
VMMC_3V3
VFM_2V8
(6/20) Current circuit is designed from QCIF of A2.
VIO_1V8
Changed (10/30)

Must check QVGA pinmap
SD Header socket changed (10/31)
VBAT
VBAT
POL pin function check!!
VIBR_3V0
2.2u
C360
2
2.2u VIO_1V8
VIO_2V8 R351
C351
1 1K VBAT
J301 Location is changed for RSE (11/9)
1 8
2 7 VB300
3 6
(7/3) R221 : 1Mohm
L301 22n R307 2
MSD_CMD CMD VSS
1M
1
4 5
MSD_CLK
21
11
14
12
VDD CLK (10/12) Changed
3
Changed (10/30) 9 11
GND1 POL 2
DNI 1
SLUG_G
AGND
PGND
LDO2
LDO1
10 12
VMMC_3V3 GND2 DET MSD_DET_N NC2
C305
15 2.2u
VA330 D301 NC1 ENA 35
C265 C307 L302
10 9 LCD_LED_CA1
AVIN 34 Added (10/31)
1u 1u 270n
U302 13 FL300 LCD_LED_CA2
VOUT 33
20 LCD_LED_CA3
VA324 VA325 VA326 VA321 VA322 VA323 LCD_LED_CA1 LED1 PVIN LCD_WR_N 1 INOUT_A1 INOUT_B1 9 32
19 6
Changed (12/29) LCD_LED_CA2 LCD_RS 2 8 IF_MODE[1:0] = 01 --> 00 R308 100K VIO_1V8
1u
1u
LED2 INOUT_A2 INOUT_B2 31

18 D[15:0] 16 bit --> D[7:0] 8 bit mode
LCD_LED_CA3 LED3 SDA I2C_SDA2 LCD_CS_N 3 INOUT_A3 INOUT_B3 7
Changed (9/10)
30 1 2
17 8
LED4 SCL I2C_SCL2 4 INOUT_A4 INOUT_B4 6 IM0 29 R312
C270
C235
Changed (9/10) Added (9/10) 16 7 IM1

LCD_VSYNC 28 100K
G1
G2
C2N
C1N
C2P
C1P
NP0 --> X7R (8/27)
R367
27
LCD_RD_N
10K
5 10 26
7.5pF
2.2u
2.2u
25
C352 C353 2 24
2 LCD_RST_N
33p 23
C354 C355
C356
C357
1u
1 22
1 (10V) VA327 VA328 Added (9/10)
FL301 21
C322
1u 1u 20
1u
SIM Indicator KEY BACKLIGHT

G1
G2
Changed (9/10) 14
5 10
7.5pF 13
12
11
FL302
VBAT 10
VIO_2V8
VBAT 9
VIO_1V8
Quad SIM Setting is TBD (10/12) LNAND_D_[06] 1 INOUT_A1 INOUT_B1 9
8
SIM1 = BLED_EN LNAND_D_[02] 3 INOUT_A3 INOUT_B3 7
7
SIM2 = RLED_EN LNAND_D_[00] 4 INOUT_A4 INOUT_B4 6
6
5
SIM3 = GLED_EN
G1
G2
R311 100K 4
SIM4 = TBD LCD_ID 3
LD307 5 10
2 C300 7.5pF
4
2
2 C301 1u
VA329 VA332 VA331
1u Added (9/10) 1 C308 C309
1 CN301
1u 1u
1
2 G
1 R
3 B
LD300 LD301 LD302 LD303 LD304 LD305

R353 1
RLED_EN
R357
R360
R361
R362
R363
R364
Added (10/30)
47
47
47
47
47
47
R354 1
GLED_EN 1 2 Changed (8/8)
R355 1
BLED_EN 1 2
KEY_BL0
C319
VA318
VA319
VA320
1u
Changed for ESD (8/21)
KEYPAD INTERFACE END

Camera (1.3M) needs to be checked
SW1 key (KCOL0, KROW0 pin) for emergency download KB307
SW1 SW2 END_KEY
VCAMD_IO_1V8
KB300
KB301 VA303
VCAM_2V8
1 2
R301
1 2
KEY_ROW0
680
VA301
NUM 1 NUM 2 NUM 3 UP DOWN

KB302 KB303 KB304 KB305 KB306
Beads are deleted (12/3)

R302
KEY_ROW2
680
VA302
NUM 4 NUM 5 NUM 6 LEFT
VCAM_IOVDD
RIGHT
VCAM_DVDD
VCAM_AVDD
KB308 KB309 KB310 KB311 CN302 VCAMD & VIO are merged to VCAMD_IO_1V8 (10/31)
KB312
SIM Selection KEY

1 24
R303
KEY_ROW3
680 CAM_DATA07 2 23 I2C_SCL1 R358
CAM_MCLK 1 2 CAM_F_MCLK
VA304 10
Changed (12/29)
NUM 7 NUM 8 NUM 9 OK CAM_DATA06 3 22 I2C_SDA1
2 C361 2 C362
KB313 KB314 KB315 KB316 CAM_DATA05 4 21 DNI 7.5p
1 1
SW300
R316 1 2 R365
KEY_ROW4 KEY_ROW4 S1 CAM_DATA04 5 20 CAM_VSYNC
680 680 3
VA305
4
VA314 CAM_DATA03 6 19 CAM_HSYNC
STAR NUM 0 SHARP SEND 5
(10/12) Changed CAM_PCLK 1
R359
2 CAM_F_PCLK
6
KB317 KB318 KB319 KB320 CAM_DATA02 7 18 CAM_F_MCLK 10
C364 C363
S2 CAM_DATA01 8 17
R304 7.5p DNI
KEY_ROW1
680 R366 CAM_DATA00 9 16
VA306
KEY_COL4 7/25
Changed (12/29) 680
CAM_F_PCLK 10 15
VA307 VA309 VA310 VA308
VA311
Added for ESD (8/21) 1 VA315 CAM_RESET 11 14
0.1u
0.1u
0.1u
2 CAM_PD 12 13
1u
1u
1u
R309
2 2 2 2
680
R305
R306
R317
680
680
680
R318
680
(DIF_D8) 1 VA312 VA313 C315
C325
C316
C324
C317
C326
1 1 1 1
2
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
7. CIRCUIT DIAGRAM
RF Part Changed (9/10)

VBAT
C410 22u
Changed (7/27)
(7/18) IFMA -> Metal-stamping C408 0.1u

RF_ANT_SW2
(10V, X5R)
RF_ANT_SW1
C409 22p
RF_PA_EN
(50V) R407 10K
ANT401 ANT402 RF_TX_RAMP
DAISY CHAIN
C463 C464 C465
C407
(7/16) U400 : RF7180 -> RF7182 DNI DNI DNI

220p
R409
24K
11
10
9
8
7
VBATT
GPCTRL1
GPCTRL0
TX_ENABLE
VRAMP
C405 Changed (11/6)
100p close to TXM
Shielding by GND
C417
(7/17) 12
NC1 GND4
6
100p GND5 GND3
13 5 (50ohm)
C461 100p
SW400 C466 1.5n C467 2.7n
C411 12p 2 14
GND6 RFIN_LB
4
LowBand_Tx
1 15 U400 3 (50ohm)
C462 100p
Daisy_Chain
G3 G4 16
NC2 RFIN_HB
2
HighBand_Tx
C413 L411 GND1
3 4
C415 L456
1 (7/3) DC Blocking
GND_SLUG
DNI 1.2p 47n
27n Changed (1/29)
GND7
GND8
GND9
NC3
RX1
RX0
C451 C452
Deleted (9/26)
17
18
19
20
21
22
23
DNI DNI
Changed (7/27)
GSM1800,1900
(50ohm) GSM850,900
L451 12n
1 2 LB_RxN
10
(50ohm) (12/28) Changed
GND4
L401
L402 2.2n Changed (9/10)
Changed (8/9) 1
9 33n
L452 12n
C457 2 8
1p
FL400 L454 3.9n
3 7
L405
4 6
GSM1800/1900_UnB GSM1800/1900_Bal1
2.7n L403
GND3
2 C460 6.8n Changed (9/25)
1p L455 3.9n
5
1 HB_RxN
Changed (9/26)
(7/27) (7/18) coil -> non_coil

(7/27) 0603 -> 1005
(12/28) Changed
8. BGA PIN MAP
8. BGA PIN MAP

8.BGA PIN MAP
BGA IC pin check (U101)
MT6255TFBGA
BGA IC pin12.5mm x 12.5mm, 382ball
check (U101)
MT6255TFBGA 12.5mm x 12.5mm, 382ball
: not in use
: not in use
1 / 131
8. BGA PIN MAP
8. BGA PIN MAP
BGA ICBGA
pin IC pin check
check (U100)
(U100)
130bal 8.0X9.0 MCP(x16 SLC NAND + x16 DDR400)
130bal 8.0X9.0 MCP(x16 SLC NAND + x16 DDR400)
2 / 131
NC : not in use Only for training and service purposes
9. PCB LAYOUT
9. PCBLAYOUT
ANT100 : BT antenna
No BT working
C168
ANT100
LD307
KB305
0
KB
30
KB
30
1
KB311
KB312
KB316
LD300,301,302,303,304,305
LD
LD
30
- no Key backlight on
30
2
5
64
61
R3
R3
07
KB
3
32
KB
KB306
0
KB302 KB303 KB304
LD303
C301
R362
KB308 KB309 KB310
KB313 KB314 KB315

R360
LD301
R363
LD304
KB317 KB318 KB319
LG-A395_EAX65163601_1.0_MAIN_TOP
9. PCB LAYOUT
MIC200 : Main MIC ANT401 / ANT402 : Main Antenna Pad

- Can’t make TX voice signal MIC200 - no Service
ANT401
ANT402
VB300 : Vibrator
VB300
C405
- no Vibration
C417
C413
L411 C411
L301
D301
C410
C408
C409
C463
C464
C465
C407
R409
U400 : TX Module
C263
SW400
VA330
C307
C232
L201
C231
L202
R407
- no Service
C222
J201,J202,J203,J204 : SIM connector
R222
R223
R220
R218
C461
U400
C466
C288 C229 R216 C467 C452
R286
C145
L456
- no SIM recognition
VA239
C230
C228
R269
C462
VA238 J203
C286 L402 C457
L405
C451
FL400 : GSM RX Balun Filter
C460
VA237 C163 R107 R106 FL400
VA303
R108
C140
C126
C125
R105
C136
C285
C132
C171 C123 C124
C319 C135
- no service
L451
L452
L455
L454
C172
C138
R103
C118
C149
C130
C131
C139
C127
C137
C120
C159
C128
C106
C142
C110
C129
C114
C287 L403 L401
C173 C151
C115 FB103
C141 C121
X101
D101
C134
C133 L102
C111
C104
C112
R117 U101 : MT6255
U101
C144
- no Service,
X102
FL402
C103
C284
C145
C102
FB104
VA236
C101
- no BT,No FM
R268 C170
FB101
C143
C108
R282 C109
R161
VA235 J202 C105 R162
R316 VA305
C281
R304 VA306
VA234
R318 VA310
C283
R302 VA302
R303 VA304
C155 C107 R309 VA311
C153 C160 R306 VA309
C154 R317 VA308
C150
C361
R358
U100
C362 R305 VA307
R151 R301 VA301
R152 R115
R113
R116
C225
C223
R114
U202 : Dual SIM Controller

C224
R255
C292
R266
C293
R254
C259
- no SIM
R219
C157
C156
C158
R256
R217
C258
C226
C238
C239
U202
C237
R284
VA328
VA327
R307
R367
C322
C257
R251 R224
VA210
R278
VA202 FB200 R279 R312
C260
R285
R281
VA233
R282
R283
R267
R280
C277
R308
VA210
VA210
FL300 FL301 FL302
C244
SW300
CN301 : LCD Connector
CN301
J201
- no LCD display
R366
VA315
VA314
J204
R365
VA240
VA228
C279
C280
R272
R273
VA329 C305 VA332
VA331
VA241
VA229
R320
C318
C296
R275
R300
C272
C276
C295 R311 C308
C357
R355 R354 R353
C351 C360
C309
VA209
VA208
C241
C242
C243
C364
VA101
VA313
R351
U302
VA312 R359
C352
C353
C356
C354
C324 C317 CN101 C265
C355
VA101
R221
C270
C235
C316 C326
IC401 : Audio subsystem CN300 CN302 : Camera Connector
C325
CN302
- Abnormal operation - no Camera display
C315
VA326
- no SPK/HPH sound
VA325
J301
D202
ZD300
CN201
VA324
C297
C321
R206
C205
C218
C204
C211
C208
D201
C207
C267
R205
VA323
C206
IC401
C304
C365
C200 C266
C268
C269
U204
C289
VA322
R271 C201 C203
U204 : Single Charger R274

VA319
FB202
FB201
VA318
VA320
C219
C217
C275
C214
VA321
R276 R209
C212
R277
R208
- no charging C202
J301 : SD card socket

VA201
L200
VA224
VA204
- no SD memory detect
C216
FB211
C264
CN200
VA200
C165
C213
C215
C166
VA203 L103
CN200 : SPK & RCV PAD

C368
VA205
J200
C169
- no SPK&RCV
FB210
LG-A395_EAX65163601_1.0_MAIN_BOT
10. ENGINEERING MODE

Engineering mode is designed to allow a service man/engineer to view and test the basic functions
provided by a handset. The key sequence for switching the engineering mode on is “3845#*395#
“Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to
select a menu and press ‘select’ key to progress the test. Pressing ‘back key will switch back to the
original test menu.
[1] Device Test
[1-1]All Auto Test - Partial
[1-2]All Auto Test Result - Partia [3]SW sanity Test
l [3-1]FPRITest
[1-3]All Auto Test-Ful [3-2] E Serial NO
[1-3-1]All Auto Test [3-3] UA String
[1-3-2]All Auto Test Result [3-4] UA Profile
[1-3-3]All Auto Detect [3-5] Unlock SIM
[1-3-4]Key Press Test [3-6]DB Check
[1-3-5]Camera Test
[3-6-1]Copy to User Disk
[1-3-6]LCD & LED Test
[3-6-2]Copy to Ext Disk
[1-3-7]Sound Test
[3-6-3]CRC
[1-3-8]Vibrator Test
[1-3-9]BT Test
[1-3-10]FM Radio Test [4]Factory Reset
[1-3-11]Acoustic Loopback
[1-3-12]LCD Backlight
[1-3-13]Keypad Backlight [5]Version
[1-3-14]Vibrator Duration
[6]Call Timer
[2]ELT TEST
[2-1]automatic
[7]Engineer mode
[2-1-1]1 Time
[7-1]Battery Test
[2-1-2]2 Times
[7-2]BattFakeMode
[2-1-3]3 Times
[7-3]Network setting
[2-1-4]4 Times
[7-3-1] Network info
[2-1-5]5 Times
[7-3-2] Band selection
[2-1-6]25 Times
[7-3-3] PLMN list preference
[2-1-7]100 Times
[7-4] Device
[2-1-7]Infinite Times
[7-4-1] Set UART
[2-2]Manual [7-4-2] GPIO
[7-4-3] Eint
[2-2-1]LCD Backlight [7-4-4] Set default level
[2-2-2]Ringtones [7-4-5] Sleep mode
[2-2-3]Vibrator [7-4-6] DCM mode
[2-2-4]Camera [7-4-7] Vedio setting
[2-2-5]Audio Loopback [7-4-8] Memory info
[7-4-9] FM radio
[7-4-10] TST output mode
[7-4-11] PMU register setting
118 / 131

[7-7] Packet Data Connection
[7-5] Audio
[7-13] Enable Fake Lang
[7-5-1] Set mode
[7-5-2] Normal mode
[7-5-3] LoudSp mode
[7-5-4] Headset mode
[7-14] Heap free size
[7-5-5] Ring tone
[7-5-6] Speech enhancement
[7-5-7] Debug info
[7-5-8] Auto record setting
[7-6] GPRS act

[7-6-1] Attach
[7-6-2] 1st PDP
[7-6-3] 2nd PDP
[7-7] Packet Data Connection
[7-8] Misc
[7-8-1] RAM test
[7-8-2] Memory dump
[7-8-3] Internet application
[7-8-4] Java
[7-8-5] MRE
[7-8-6] Power on CFU query
[7-9] Bluetooth
[7-9-1] General test
[7-9-2] Bluetooth RF test
[7-9-3] Bluetooth UPF test
[7-9-4] A20 BT test
[7-10] Profiling
[7-11] RF test tool
[7-12] Conf test mode

[7-12-1] Real NW
[7-12-2] CTA
[7-12-3] FTA
[7-12-4] IOT
119 / 131
11. CALIBRATION
11. CALIBRATION
CAL INFORMATION
S/W VERSION
[TachyonV43] LGA395 20130417 ALL file Calibration
Please Check the Version to “B2B”
H/W
Name Part No.
PIF PIF200(All Type) BJAY0024021
USB Cable USB Cable RAD32247898
Power Cable DC Power Cable RAD32247878
I/O Cable MS-156C BJAY0024004
RF Cable_Main 5P E-SATA_DC_Plug RAD32167861
Power Supply_PIF Power Supply 5.3V
Power Supply_Phone Power Supply 5.0V
RF Test Equipment E5515C(8960)
1. Use the Battery (Refer to Attached image)

1) Phone states: Power off
NOTICE 2) If do not use the battery, GSM 850 TX fails.
2. Port Setting (Refer to Attached image)
1) Uart Port1 : Use the “LGE CDMA USB Serial Port”
11. CALIBRATION
11. CALIBRATION
A395
MS695
[TachyonV43] LGA395 20130417 ALL file Calibration

[Tachyon36]LGMS695_20120213_Calibration
A395
11. CALIBRATION
11. CALIBRATION
LGA395
11. CALIBRATION
A395
MS695
LGA395
LGA395
A395
MS695
A395
MS695
A395
MS695
A395
MS695
A395
MS695
11. CALIBRATION
LGA395
11. CALIBRATION
11. CALIBRATION
5.3V
5 0V
5.0V
11. CALIBRATION
MS-156C
BJAY0024004
MS-156C
5.3V
RAD32167861
BJAY0023732
11. CALIBRATION
11. CALIBRATION
11. CALIBRATION
11. CALIBRATION
Tachyon 36
Tachyon_36
11. CALIBRATION
5.3V
5.0V
11. CALIBRATION
11. CALIBRATION
11. CALIBRATION
A395
MS695
LG-A395
MS695
LG-A395
MS695 LGA395
MS695
LGA395
MS695
LGA395
LGA395
MS695
LGA395
MS695
11. CALIBRATION
A395
MS695
11. CALIBRATION
A395
MS695
A395
MS695
RF900
12. HIDDEN MENU
12.HIDDEN MENU
Hidden Menu Start

Start shortcut keys: 3845#*395#
Hidden Menu
Start the desired menu: Menu, OK button click
Version Info
Shows SW Version Info
12. HIDDEN MENU
Factory Reset
Factory Reset : Reset as default Factory Settings
Device Test
Classified into
-> All Auto Test – partial
-> All Auto Test Result – partial
-> All Auto Test - Full
All Auto Test Result

-> You can check Test Results for all the test cases
12. HIDDEN MENU
Auto Detect Test
Key Press Test

Check below Items
Up/Down key : Hard Key
Power key : Hard Key
Menu key : Hard Key
Home key : Hard Key
Back key : Touch Key
Camera Test – Snapshot

Captured image after clicking Ok
12. HIDDEN MENU
Camera Test - Cam cording

Video of 5 seconds is playing after captured
LCD Display Test

Check Black and White color
Sound Test
Click the “PASS” or “FAIL” icon
12. HIDDEN MENU
Vibrator Test
Click the “PASS” or “FAIL” icon
BT Test
Bluetooth Scanning is PASS : OK
Acoustic Loopback
Receiver mode is activated
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.1 EXPLODED VIEW(SBOM)

MJN01
ACQ02
ACQ00 EBR00
EAJ00 ABA00 ACQ01
EBP00
EAB00
MJN00
SJMY00
MKC00
EAC00
AEX00
ABM00
ADB00 EAA00
MBL00
GMEY00
Location Description Location Description Location Description

ACQ00 Cover Assembly,Front SJMY00 Motor,DC MJN01 Tape
AEX00 Keypad Assembly,Main EBR00 PCB Assembly,Main EAC00 Rechargeable Battery,Lithium Ion
MKC00 Window,LCD EBP00 Camera Module ACQ02 Cover Assembly,Battery
MJN00 Tape,Window ADB00 Dome Assembly,Metal
ACQ01 Cover Assembly,Rear ABM00 Can Assembly,Shield
EAA00 PIFA Antenna,Multiple ABA00 Bracket Assembly
EAB00 Speaker,Dual Mode EAJ00 LCD Module
MBL00 Cap GMEY00 Screw,Machine
13.2 Replacement Parts Note: This Chapterisused for reference,Part order is ordered
by SBOM standard on GCSC
<Mechanic component>
Level LocationNo. Description PartNumber Spec Remark
1 AGQ000000 Phone Assembly AGQ87069001 LGA395.ABRASV SV:SILVER SILVER -
Label COMPLEX GU280 OREBK ZZ:Without Color

2 MEZ002100 MLAA0062320
Approval COMPLEX, (empty), , , , ,
Cover Assembly
2 ACQ100400 ACQ86559001 LGA395.ABRASV SV:SILVER SILVER -
EMS
Cover Assembly LGA395.ABRASV ZZ:Without Color A395 Cover

3 ACQ00 ACQ86327002
Front Assy, Front (SV)
Keypad Assembly
4 AEX00 AEX74117401 LGA395.ABRABK ZZ:Without Color -
Main
Tape
4 MJN061100 MJN68371801 COMPLEX LGA395.ABRABK ZZ:Without Color -
Protect
Window CUTTING ACRYL LGA395.ABRABK ZZ:Without

4 MKC00 MKC64502601
LCD Color -
Tape
Decor
Tape
Window
4 MHK000000 Sheet MHK63977201 COMPLEX LGA395.ABRABK ZZ:Without Color -
4 MDJ000000 Filter MDJ63626301 COMPLEX LGA395.ABRABK ZZ:Without Color -

4 ACQ033200 ACQ86470002
Front(Sub) Assy Front sub (SV)
INSERT
5 MET099500 MICE0016905 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
NUT
Cover MOLD PC LGA395.ABRASV ZZ:Without Color

5 MCK032700 MCK67570002
Front A395 Cover Front (SV)
Damper
4 MCQ043300 MCQ67200401 COMPLEX LGA395.ABRABK ZZ:Without Color -
LCD
4 MCR000000 Decor MCR64979701 MOLD PC LGA395.ABRABK ZZ:Without Color -
Cover Assembly
3 ACQ01 ACQ86410901 LGA395.ABRABK ZZ:Without Color -
Rear
Cover Assembly LGA395.ABRABK ZZ:Without Color Cover Assy

4 ACQ105800 ACQ86470301
Rear(SVC) Rear SVC
Damper
Speaker
Damper
Speaker
5 MDJ000000 Filter MDJ63608701 COMPLEX LGA395.ABRABK ZZ:Without Color -
Tape
Camera
Window CUTTING ACRYL LGA395.ABRABK ZZ:Without

5 MKC009400 MKC64521701
Camera Color -
Label COMPLEX C2000 CGRSV WA:White C2000

5 MEZ000900 MLAB0001102
After Service USASV DIA 4.0 PRINTING,
Button
5 MBG071300 MBG64748101 MOLD PC LGA395.ABRABK ZZ:Without Color -
Side
5 MBL00 Cap MBL65404001 MOLD PC LGA395.ABRABK ZZ:Without Color -
Damper
Camera
Cover
5 MCK063300 MCK67570101 MOLD PC LGA395.ABRABK ZZ:Without Color -
Rear
MOLD SILICON LGA395.ABRABK ZZ:Without

5 MBL000001 Cap MBL65444901
Color -
COMPLEX LG-VX6000 ZZ:Without Color PID Label

5 MEZ000000 Label MLAZ0038301
4 Array PRINTING,
5 MEV000000 Insulator MEV64301201 COMPLEX LGA395.ABRABK ZZ:Without Color -
5 MJN000000 Tape MJN68427501 COMPLEX LGA395.ABRABK ZZ:Without Color -
Dome Assembly
5 ADB00 ADB73979401 LGA395.ABRABK ZZ:Without Color -
Metal
Can Assembly
5 ABM00 ABM73937601 LGA395.ABRABK ZZ:Without Color -
Shield
Can PRESS STS 0.3 LGA395.ABRABK ZZ:Without

6 MBK070300 MBK63553001
Shield Color A395 Can Shield
COMPLEX LGA395.ABRABK ZZ:Without Color

6 MEV000000 Insulator MEV64373901
A395 Insulator Can Shield
5 ABA00 Bracket Assembly ABA74432301 LGA395.ABRABK ZZ:Without Color -
6 MAZ000000 Bracket MAZ63736901 MOLD PC LGA395.ABRABK ZZ:Without Color -
6 MCQ000001 Damper MCQ67200501 COMPLEX LGA395.ABRABK ZZ:Without Color -
6 MCQ000000 Damper MCQ67238901 COMPLEX LGA395.ABRABK ZZ:Without Color -
Tape
Camera
Screw GMEY0014301 BH + 1.4mM 3.5mM MSWR NI PLT

3 GMEY00 GMEY0014301
Machine N - KUMGANG SCREW CO., LTD
3 MJN01 Tape MJN68409101 COMPLEX LGA395.ABRABK ZZ:Without Color -
LGA395.ABRABK ZZ:Without Color LG-A395(A20)

1 AGF000000 Package Assembly AGF76805101
Brazil Package
1 AAD000000 Addition Assembly AAD86314801 LGA395.ABRASV SV:SILVER SILVER -

2 ACQ02 ACQ86529702
Battery Battery Assy (SV)
Cover MOLD PC LGA395.ABRASV ZZ:Without Color

3 MCK004100 MCK67570202
Battery A395 Cover Battery (SV)
Label COMPLEX LGE400F.AVIVBK ZZ:Without Color

3 MEZ000900 MEZ64503701
After Service E400F BRAZIL SAC LABEL
13.2 Replacement Parts Note: This Chapterisused for reference, Part order is ordered
by SBOM standard on GCSC
<Main component>
PIFA Antenna ACD-00113 MULTI -5DB 5 C+S - Main Carrier

4 EAA00 EAA62933001
Multiple MOBITECH CORPORATION
BRS-181031P08-P Nd-Fe-B 700mW 8OHM 92DB

Speaker
4 EAB00 EAB62688401 850HZ 1810 3t spring, front side SPRING BUJEON
Dual Mode
ELECTRONICS CO., LTD
Motor DM-YK407-6F2 3V 80mA 0A 11KRPM 0RPM 0SEC

4 SJMY00 SJMY0007905
DC 0GF.CM 0OHM DONGYANG CHENGJI CO.
PCB Assembly
3 EBR00 EBR77167101 LGA395.ABRASV 1.0 Main
Main
PCB Assembly
4 EBR071800 Main EBR76750701 LGA395.ABRABK 1.0 Main
SMT
PCB Assembly
5 EBR071600 Main EBR76751701 LGA395.ABRABK 1.2 Main
SMT Bottom
Capacitor(High GRM1555C1H1R2C_H 1.2pF 0.25PF 50V C0G -

Frequency) 55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
6 C415 EAE62882701
Ceramic W:0.5+-0.05 T:0.5+-0.05 MURATA
Chip MANUFACTURING CO.,LTD.
HK1005 27NJ 27NH 5% - 300mA 0.7OHM 1.6GHZ

Inductor
6 C413 ELCH0005005 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
Multilayer,Chip
YUDEN CO.,LTD
C105
C106
C107
C115
C127
C130
C139
C153
C155 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
Capacitor
6 C203 ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTRO-
Ceramic,Chip
C204 MECHANICS CO., LTD.
C205
C214
C217
C218
C219
C226
C239
C360
Capacitor C1005JB0J104KT000F 0.1uF 10% 6.3V X5R -

6 C138 ECCH0002001
Ceramic,Chip 30TO+85C 1005 R/TP - - TDK CORPORATION
C108
C114
C128
C129
C170
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
C265 Capacitor
6 ECCH0004904 1005 R/TP - MURATA MANUFACTURING
C308 Ceramic,Chip
CO.,LTD.
C309
C315
C316
C317
C322
Capacitor C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -

6 C141 ECCH0006201
Ceramic,Chip 55TO+85C 1608 R/TP - TDK CORPORATION
C124
C200
C237 CL05A225MP5NSNC 2.2uF 20% 10V X5R -
Capacitor
6 C305 ECCH0007804 55TO+85C 1005 R/TP 0.5MM - SAMSUNG
Ceramic,Chip
C351 ELECTRO-MECHANICS CO., LTD.
C356
C357
C1005C0G1H010CT 1pF 0.25PF 50V NP0 -

C457 Capacitor
6 ECZH0000802 55TO+125C 1005 R/TP - TDK KOREA
C460 Ceramic,Chip
COOPERATION
C1005X5R1A105KT000F 1uF 10% 10V X5R -

C300 Capacitor
C301 Ceramic,Chip
COOPERATION
C154
C156
C157
C158
C201
C223
C225
GRM36X7R104K10PT 100nF 10% 10V X7R -
C228 Capacitor
6 ECZH0003103 55TO+125C 1005 R/TP - MURATA
C230 Ceramic,Chip
MANUFACTURING CO.,LTD.
C266
C267
C275
C295
C324
C325
C326
1005GC2T3N9SLF 3.9NH 0.3NH - 300mA

L454 Inductor
6 ELCH0001057 0.22OHM 4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
L455 Multilayer,Chip
R/TP PILKOR ELECTRONICS LTD.
LQG15HS2N7S02D 2.7NH 0.3NH - 300mA - -

C467 Inductor
6 ELCH0003815 0.15OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO.,LTD.
1005GC2T2N2SLF 2.2NH 0.3NH - 300mA - -

Inductor
6 L402 ELCH0004721 0.16OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
Multilayer,Chip
R/TP PILKOR ELECTRONICS LTD.
R161 MCR01MZP5F1503 150KOHM 1% 1/16W 1005

6 Resistor,Chip ERHZ0000222
R162 R/TP - ROHM.
VA205
EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD
6 VA206 Varistor SEVY0005202
R/TP AMOTECH CO., LTD.
VA207
VA200
VA201
VA203
VA204
VA240
VA241
VA303 ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD
6 Varistor SEVY0005402
VA314 R/TP INNOCHIPS TECHNOLOGY
VA315
VA318
VA319
VA320
VA331
VA332
C1608X5R1A105KT000E 1uF 10% 10V X5R -

Capacitor
6 C172 ECZH0001420 55TO+85C 1608 R/TP - TDK KOREA
Ceramic,Chip
COOPERATION
RCLAMP3624T.TCT 5V 11V max. (Pins 2,3,4) 12V

6 D201 Diode,TVS EAH61534001 6A - SLP1710P4T R/TP 6P 4 SEMTECH
INTERNATIONAL AG
PESD12VS1UA 12V 13.3V min. 19V 22.5A 360mW

6 D202 Diode,TVS EAH61872601
SOD323 R/TP 2P 1 NXP Semiconductors
HK1005 1N5S-T 1.5NH 0.3NH - 300mA 0.1OHM

Inductor
6 C466 ELCH0001033 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Multilayer,Chip
TAIYO YUDEN CO.,LTD
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM

Inductor
6 L200 ELCH0001444 1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
Multilayer,Chip
R/TP COILCRAFT SINGAPORE PTE LTD.
LQG15HS47NJ02D 47NH 5% - 200mA 0.72OHM

Inductor
6 L456 ELCH0003827 1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Multilayer,Chip
MURATA MANUFACTURING CO.,LTD.
MCR01MZP5J151 150OHM 5% 1/16W 1005 R/TP -

6 R256 Resistor,Chip ERHZ0000420
ROHM.
R254
R255
MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP -
ROHM.
R354
R355
FB101
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
FB104
6 Filter,Bead SFBH0008101 ohm 0.3A SMD R/TP 2P 0 MURATA
FB201
FB202
MCH153CN103KK 10nF 10% 16V X7R -

Capacitor
6 C368 ECCH0000155 55TO+125C 1005 R/TP - ROHM Semiconductor
Ceramic,Chip
KOREA CORPORATION
C1005C0G1H120JT000F 12pF 5% 50V NP0 -

Capacitor
Ceramic,Chip
COOPERATION
C365
C405 C1005C0G1H101JT 100pF 5% 50V C0G -
Capacitor
Ceramic,Chip
C461 COOPERATION
C462
VA202 ESD9B5.0ST5G 5V 5.8V min. 12.5V 1A - SOD-923

6 Diode,TVS EDTY0010101
VA224 R/TP 2P 1 SCG HONG KONG SAR LTD.
R271
R308 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP
R311 - ROHM.
R312
C101
C103
C111
GRM155R61A104K 0.1uF 10% 10V X5R -
C112 Capacitor
6 ECCH0000182 55TO+85C 1005 R/TP - MURATA
C150 Ceramic,Chip
C151
C160
C408
CL10A105KB8NNNC 1uF 10% 50V X5R -

Capacitor
6 C269 EAE62505701 55TO+85C 1608 R/TP 0.9T max. - SAMSUNG
Ceramic,Chip
ELECTRO-MECHANICS CO., LTD.
R151
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP
6 R152 Resistor,Chip ERHY0000254
- ROHM.
R273
R103
R108
R216
R251 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -
R266 ROHM.
R286
R320
R351
R220
MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
R272
C144
C145
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
C268 Capacitor
6 ECCH0000115 1005 R/TP - ROHM Semiconductor KOREA
C272 Ceramic,Chip
CORPORATION
C304
C409
C1005X7R1H331KT000F 0.33nF 10% 50V X7R -

Capacitor
6 C125 ECCH0000137 55TO+125C 1005 R/TP - TDK KOREA
Ceramic,Chip
COOPERATION
R113
R114
R115
- ROHM.
R218
R219
R223
H9DA1GH25HBMMR-4EM NAND/1G
SDRAM/256M 1.7VTO1.95V 9.0*8.0*1.0 TR 130P
NAND+DDR SDRAM FBGA 1Gb
6 U100 IC,MCP,NAND EAN62576001
NAND(32n,Mono,2KB,x16,SLC,4bit)+256Mb
DDR400(44n,Mono,x16) HYNIX
SEMICONDOCTOR
GRM1555C1H7R5D 7.5pF 0.5PF 50V C0G -

C362 Capacitor
6 ECCH0010501 55TO+125C 1005 R/TP - - MURATA
C364 Ceramic,Chip
R301
R302
R303
R304
R305
R306 MCR01MZP5J681 680OHM 5% 1/16W 1005 R/TP -
R309 ROHM.
R316
R317
R318
R365
R366
C133
C134
C135
C136
C215 MCH155A390J 39pF 5% 50V NP0 -55TO+125C
Capacitor
6 C216 ECCH0000120 1005 R/TP - ROHM Semiconductor KOREA
Ceramic,Chip
C224 CORPORATION
C263
C292
C293
C296
IC,Digital
MT6255 ARM9 416MHz, 3.0Mp, 8bit-ECC FBGA
6 U101 Baseband EAN62452701
P/TR 354P MEDIATEK INC.
Processor,GSM

- ROHM.
D101 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW

6 Diode,Switching EDSY0011901
D301 EMD2 R/TP 2P 1 AUK CORP
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C

Capacitor
Ceramic,Chip
CORPORATION
GRM188R60J106M 10000000
Capacitor
6 C222 ECCH0005604 pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA
Ceramic,Chip
IC,Audio Sub WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -

6 IC401 EUSY0403901
System WOLFSON MICROELECTRONICS PLC
LQG15HS12NJ02D 12NH 5% - 300mA - - 0.28OHM

L451 Inductor
6 ELCH0003819 3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
EDZTE615.1B 4.98V 4.98TO5.2V 80OHM 150mW

6 ZD300 Diode,Zener EDNY0013602 EMD2 R/TP 2P 1 ROHM Semiconductor KOREA
CORPORATION
R358 MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP

R359 - ROHM.
FL300
ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H
6 FL301 Filter,EMI/Power SFEY0011401
SMD R/TP INNOCHIPS TECHNOLOGY
FL302
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -

Capacitor
Ceramic,Chip
COOPERATION
RT9536GQW 4.3V to 5.5V 4.2V or 4.35V 0W DFN

6 U204 IC,Charger EAN62677301
R/TP 10P - RICHTEK TECHNOLOGY CORP.
CL21B104KBCNNNC 0.1uF 10% 50V Y5V -

Capacitor
6 C289 ECCH0000368 30TO+85C 2012 R/TP - - SAMSUNG ELECTRO-
Ceramic,Chip
MECHANICS CO., LTD.
CL21A226MPCLRNC 22uF 20% 10V X5R -

Capacitor
6 C410 EAE62542701 55TO+85C 2012 R/TP 0.95T max. - SAMSUNG
Ceramic,Chip
ELECTRO-MECHANICS CO., LTD.
MCR01MZP5J224 220KOHM 5% 1/16W 1005 R/TP

- ROHM.
MCH155A080DK 8pF 0.5PF 50V NP0 -55TO+125C

Capacitor
Ceramic,Chip
CORPORATION
LFB21914MDZ3D384 914.5/1897.5MHz
6 FL400 Filter,Saw,Dual EAM62531301 2.1*1.25*0.7 SMD R/TP 10P MURATA
R208 MCR01MZSJ5R6 5.6OHM 5% 1/16W 1005 R/TP -

R209 ROHM.
GB042-24S-H10-E3000 24P 0.40MM STRAIGHT

6 CN302 Connector,BtoB ENBY0034201
SOCKET SMD R/TP 1M - LS Mtron Ltd.
C1005C0G1H560JT000F 56pF 5% 50V NP0 -

C212 Capacitor
C213 Ceramic,Chip
COOPERATION
1005GC2T33NJLF 33NH 5% - 200mA 1OHM

Inductor
6 L401 ELCH0004730 1.3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Multilayer,Chip
PILKOR ELECTRONICS LTD.
MT6306 3.2~4.3V 999 ANALOG

6 U202 IC,Multiplexer EAN62228101 SWITCH/MULTIPLEXER QFN R/TP 28P SIM
Controller MEDIATEK INC.
LFB212G45CG7D227 BPF 2.45KHZ 100Hz SMD

6 FL402 Filter,Ceramic EAM62250401
R/TP 3P MURATA MANUFACTURING CO.,LTD.
MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -

ROHM.
Capacitor C0603C0G1H330JT00NN 33pF 5% 50V C0G -

6 C352 ECCH0009104
Ceramic,Chip 55TO+125C 0603 R/TP - TDK CORPORATION
RT9367C QFN,20,R/TP,4CH,2LDO,3X3,IC,Sub
6 U302 IC,Charge Pump EUSY0344402 PMICIC,Sub PMIC RICHTEK TECHNOLOGY
CORP.
F981A336MSA 33uF 20% 10V 3.3UA -55TO+125C

C297 Capacitor 6OHM 2.0X1.25X0.8MM NONE SMD R/TP 0.9T
6 ECTH0002002
C321 TA,Conformal max. NICHICON CORPORATION, EAST JAPAN
SALES OFFICE
1040320821 SD 8P STRAIGHT SMD T/REEL -

6 J301 Card Socket EAG63411001
HANKOOK MOLEX
R275 MCR01MZP5F2403 240KOHM 1% 1/16W 1005

R300 R/TP - ROHM.
04-6293-635-005-829+ 35P 0.30MM FPC ANGLE

Connector
6 CN301 ENQY0013901 BOTH SMD R/TP LOCKING FLIP TYPE
FFC/FPC/PIC
KYOCERA ELCO KOREA SALES CO.,LTD.
MCR01MZP5F3303 330KOHM 1% 1/16W 1005

R/TP - ROHM.
MCR01MZP5F5102 51KOHM 1% 1/16W 1005

R/TP - ROHM.
J201
J202 Socket HSSC-6P-27_N 6P STRAIGHT STANDARD SMD
6 EAG63373601
J203 DIMM/SIMM T/REEL - HAN SHIN TERMINAL CO., LTD.
J204
Connector KQ03LV1-4R 4P 2.50MM STRAIGHT SMD T/REEL

6 CN300 EAG63371001
Terminal Block - HIROSE KOREA CO.,LTD
20549-001E NONE STRAIGHT SOCKET SMD

6 SW400 Connector,RF EAG63293301
R/TP AU 50OHM 400mDB I-PEX CO., LTD
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

Capacitor
Ceramic,Chip
CORPORATION
X1E000021043400 26MHZ 10PPM 0F NONE SMD

6 X101 Crystal EXXY0027401
R/TP EPSON TOYOCOM CORP
LQG15HS2N2S02D 2.2NH 0.3NH - 300mA - -

Inductor
6 L103 ELCH0003832 0.12OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
Multilayer,Chip
R/TP MURATA MANUFACTURING CO.,LTD.
GU074-5P-SD-E1500 5P 0.65MM ANGLE

6 CN201 Connector,I/O ENRY0009601
RECEPTACLE DIP R/TP - LS Mtron Ltd.
RC1005F821CS 820OHM 1% 1/16W 1005 R/TP -

SAMSUNG ELECTRO-MECHANICS CO., LTD.
LL1608-FSLR27J 270NH 5% - 150mA - - 3.5OHM

Inductor
6 L302 ELCH0001556 470MHZ 8 SHIELD NONE 1.6X0.8X0.8MM R/TP
Multilayer,Chip
TOKO, INC.
MCR01MZP5J243 24KOHM 5% 1/16W 1005 R/TP

- ROHM.
C1005X7R1H221KT000F 0.22nF 10% 50V X7R -

C123 Capacitor
6 ECCH0000133 55TO+125C 1005 R/TP - TDK KOREA
C407 Ceramic,Chip
COOPERATION
MCR01MZP5F3001 3KOHM 1% 1/16W 1005 R/TP

- ROHM.
LQM2HPN2R2MG0L 2.2UH 20% - 1.3A - -

Inductor,Wire
6 L102 ELCP0009409 0.08OHM - - SHIELD 2.5X2X1MM NONE R/TP
Wound,Chip
R367 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP

R407 - ROHM.
RF7182 0DBM 0DB 0% 0A 0A 0DB 0DBM 0DBM

6 U400 Module,Tx Module EAT61833501 22P 6.63x5.24x0.975MM GPRS TxM with SP4T RF
MICRO DEVICES INC
FB200
BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25%
FB207
6 Filter,Bead SFBH0008105 1.4 ohm 0.1A SMD R/TP 2P 0 MURATA
FB210
FB211
FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM

6 X102 Crystal EXXY0018701
12.5PF 32*15 SMD R/TP SEIKO EPSON CORP
HK1005 R10J 100NH 5% - 150mA 1.5OHM

L201 Inductor
6 ELCH0005009 600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
TAIYO YUDEN CO.,LTD
Microphone SOB410S44VRC 44DB 2.2KOHM OMNI 1.5TO4V

6 MIC200 EAB62291401
Condenser 4pi 1.2t SMD BSE CO., LTD.
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

Capacitor
Ceramic,Chip
CORPORATION
LL1005-FHL22NJ 22NH 5% - 300mA 0.7OHM

Inductor
6 L301 ELCH0001413 2.5GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
Multilayer,Chip
TOKO, INC.
MCR01MZP5F1502 15KOHM 1% 1/16W 1005

R/TP - ROHM.
LS12M2E 1C1P 12VDC 0.02A HORIZONTAL

6 SW300 Switch,Tact EBF61515301 1.57GF R/TP Side tact s/w CITIZEN
ELECTRONICS CO.,LTD.
R205 MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP -

R206 ROHM.
MCR01MZP5F7501 7.5KOHM 1% 1/16W 1005

R/TP - ROHM.
1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM

Inductor
6 L403 ELCH0001049 3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Multilayer,Chip
PILKOR ELECTRONICS LTD.
KJA-PH-4-0176 5P 2P ANGLE R/TP 3.5M BLACK

6 J200 Jack,Phone EAG63070601
5P - KSD CO., LTD
BLM18KG221SN1D 220 ohm 1.6X0.8X0.8 25%

6 FB103 Filter,Bead EAM62071001 0.05 ohm 2.2A SMD R/TP 2P 0 MURATA
5 SAD010000 Software,Mobile SAD33685701 - - Base A39510B - BRAZIL MTK -
PCB Assembly
5 EBR071700 EBR76750901 LGA395.ABRABK 1.0 Main
Main,SMT Top
GRM1555C1H2R5C_H 2.5pF 0.25PF 50V C0G -

Capacitor(High
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
6 C168 Frequency) EAE62883001
W:0.5+-0.05 T:0.5+-0.05 MURATA
Ceramic,Chip
6 EAX010000 PCB,Main EAX65163601 LGA395.ABRABK B FR-4 SBL 6 1 Main
C1005X5R1A105KT000F 1uF 10% 10V X5R -

C300 Capacitor
C301 Ceramic,Chip
COOPERATION
LD300
LD301
19-217/UTD-S887-2/TR8 WHITE 2.7~3.1 30mA
LD302
6 LED,Chip EDLH0015102 90~180mcd x, y 110mW 1608 R/TP 2P -
LD303
EVERLIGHT ELECTRONICS CO., LTD.
LD304
LD305
R357
R360
R361 RC1005F470CS 47OHM 1% 1/16W 1005 R/TP -
6 Resistor,Chip ERHY0008207
R362 SAMSUNG ELECTRO-MECHANICS CO., LTD.
R363
R364
Chip Antenna DSBTPTR2010 DUAL -2DB 3:1 Planar Inverted F

6 ANT100 EAA62809101
Bluetooth Type - - - PARTRON
19-237/R6GBB6C-B01/2T RED/GREEN/BLUE 3
6 LD307 Numeric Displays EDLS0002001 3.3V 25A 360mCD 95mW COMMON ANODE R/TP
4P EVERLIGHT ELECTRONICS CO., LTD.
PCB Assembly
4 EBR071500 EBR77128401 LGA395.ABRASV 1.0 Main
Main,Insert
5 RAA050100 Resin,PC BRAH0001301 UF2040 or 3075BHF . . NONE
CW1351 CW1351 1.3M Hynix 1/6", 7x7x4.1t, FPCB

5 EBP00 Camera Module EBP61722001 3.5mm, 90deg. COWELL ELECTRONICS
CO.,LTD
TM022HDH50 QVGA 2.2INCH 240X320 300CD

5 EAJ00 LCD Module EAJ62349401 COLOR 50% 4/3 300 60Hz Inverter N LED 2D -
Wuhan Tianma Micro-Electronics Co., Ltd.
KT02GMSIASMBG7 2GBYTE 2.7VTO3.6V MICRO

IC
SD CARD 11.0x15.0x1.0MM TR 8P 2GB MicroSD
3 EAN011400 Memory Card EAN62634801
Card (SEC 21nm 16Gb TLC x 1) KINGMAX
MICRO SD
DIGITAL INC.
13.3 Accessory Note: This Chapterisused for reference,Part order is ordered

by SBOM standard onGCSC
BL-44JN-WWU-LGC PRISMATIC 3.7V 1.5AH

Rechargeable
300mAH 61x44x4.4 65x44x4.8 BLACK Bar type,
2 EAC00 Battery EAC61679601
Top cap Screw joint 444461, 1500mAh, Bar Type
Lithium Ion
(Top cap screw joint), WW, Up LG Chem,LTD.
Accessory KCA-ET-8-0020 KCA-ET-8-0020 Micro USB, 1.2M

2 EBX000001 SGDY0016701
Data Cable KSD CO., LTD
EMB-LGE001STKE ,BLACK,4 POLE PLUG,3.5

2 EAB010200 Earphone,Stereo SGEY0003219
4,Earphone,Stereo CRESYN CO.,LTD
STA-U12BR 90Vac~264Vac 5.1V 700mA 5060

2 EAY060000 Adapters SSAD0036001 GOST NONE NONE - SUNLIN ELECTRONICS
CO.,LTD
Manual Assembly
2 AFN053800 AFN75934801 LGA395.ABRABK ZZ:Without Color -
Operation
Manual PRINTING LGA395.ABRABK ZZ:Without Color

3 MFL053800 MFL67787701
Operation Brazil PORTUGUESE -

Service Manual: Internal Use Only

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Service Manual: Internal Use Only

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Internal Use Only

Date: April, 2013 / Issue 1.0

1.2 Regulatory Information

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

which is also grounded.

• Use a suitable, grounded soldering iron.

APC Automatic Power Control

BER Bit Error Ratio

CC-CV Constant Current – Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

PSRAM Pseudo SRAM

STMR Side Tone Masking Rating

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

Item Feature Comment

Standard Battery Lithium Ion, 3.7V 1500mAh

Stand by TIME >993 hr., Min.@PP9

Stand by time >1145 hr., Min.@PP5

>8.0hr., Min.@GSM900, PL=5

Charging time Approx. 3 hours 30 min.

RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm

GSM, EGSM: 32.3dBm(Level 5),

GPRS compatibility Class 10

SIM card type 3V Small

Display MAIN : TFT 320 × 240(QVGA) pixel 262K Color

KEY TOTAL 22EA

EAR Phone Jack Yes(3.5Ø)

Speech coding EFR/FR/HR

Data and Fax Yes

Loud Speaker Yes

Voice Recoding Yes

Item Feature Comment